SolidWorks Flow Simulation

SolidWorks® 2013 SolidWorks Flow Simulation: Electronics Module © 2012 Dassault Systèmes SolidWorks Corporation. Not for resale.

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Document Number: PMT1348-ENG

SolidWorks 2013

Contents

Lesson 1: Introduction to Electronics Module Objectives . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Electronic Module. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Case Study: Computer Box. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Project Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Stages in the Process. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Default Outer Wall Thermal Condition . . . . . . . . . . . . . . . . . . . . . 4 Printed Circuit Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Perforated Plates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Two-Resistor Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Heat Pipes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Mesh Considerations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Conclusions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

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SolidWorks 2013

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Lesson 1 Introduction to Electronics Module

Objectives

Upon successful completion of this lesson, you will be able to: I

Utilize the Electronic Module to design efficient cooling systems for electronics.

I

Properly define two-resistor and heat pipe components.

I

Properly specify the PCB composite laminate.

1

Lesson 1

SolidWorks 2013

Introduction to Electronics Module

Electronic Module

The Electronics module features new capabilities for the simulation of heat pipes, two-resistor components and Joule heating by electric current in solids. Additionally, the engineering database is enhanced with multiple materials, two-resistor components, heat pipes and other entries specific to the design and simulation of electronics products.

Case Study: Computer Box

In this lesson, we will introduce some of the features of the Electronic module in Flow Simulation and learn how to post-process the results and make judgments on the design of the computer box. It is expected that the student is familiar with the Flow Simulation software. The lesson will not teach the basic aspects of the Flow Simulation project definition and postprocessing. It is recommended to refer to the Flow Simulation documentation for further details on the theory behind the solver.

Project Description

A computer box containing CPU, chipset (northbridge and southbridge), heat sink, two heat pipes and some peripheral connectors is placed in a room with ambient temperature of 20°C. The air at room temperature enters the box through the vents located on the sides, on the top and on the bottom of the box. The air is forced out of the box by the internal fan located on the back side of the box next to the heat sink. The objective of this lesson is to ensure that the temperature of the critical electronics components, namely CPU and the chipset remains below the maximum operating temperatures listed in the table below.

2

Component

Maximum operating temperature

CPU

80°C

Northbridge

85°C

Southbridge

95°C

SolidWorks 2013

Lesson 1 Introduction to Electronics Module

Stages in the Process

I

Create the project.

The project will be created using the Wizard. I

Define PCB.

PCB composite will be defined in the engineering database and specified. I

Apply boundary conditions.

Proper boundary conditions will be applied to simulate the air inlets and outlets. Additionally, a wall condition will be used to simulate the heat loss due to convection to the outside. I

Specify perforated plates.

Custom perforated plates will be defined in the engineering database and applied to the model. I

Apply two-resistor components.

Two-resistor components will be applied to accurately model CPU and the chipset (northbridge and southbridge). I

Define heat pipes.

Heat pipe features of the Electronic module will be specified. I

Define contact resistances.

Material contact resistances will be specified for the interface between the heat pipes and the electronic components. Furthermore, infinite contact resistances will be applied to the exposed external faces of the heat pipes. I

Define simulation goals and initial mesh.

I

Run the analysis.

I

Post-process the results.

Maximum temperatures on the critical components will be determined. 1

Open an assembly file. Open Electronics Assembly from the Case Study\Computer box

folder. 2

Activate configuration.

Activate configuration Simulation. This simplified configuration was prepared specifically for the flow simulation. Notice that all peripheral components are modeled as boxes and shapes of some of the electronic components are simplified.

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Lesson 1

SolidWorks 2013

Introduction to Electronics Module

3

Create a project.

Create a new study using the Wizard with the following settings: Configuration name

Use current: “Simulation”

Project name

“Cooling”

Unit system

SI (m-kg-s)

Change the units for Temperature to °C. Analysis Type

Internal

Physical Features

Select Exclude cavities without flow conditions. Select the Heat conduction in Solids check box. Select the Gravity box. The Y component of -9.81 m/s^2 is the correct direction and value for this analysis.

Database of Fluids

In the Fluids list, under Gases, double-click Air to add it to the Project Fluids.

Solids

Default solid should be set to Aluminum.

Wall conditions

Select Heat transfer coefficient as the Default outer wall thermal condition. Enter 10 W/m^2/K and 20.05°C as the Heat transfer coefficient and Temperature of external fluid, respectively. The default Roughness value of 0 micro meter is acceptable for this analysis.

Initial conditions

Default conditions.

Results & Geometry Resolution

Set the Result resolution to 3.

Default Outer Wall Thermal Condition

In this lesson, we specified a Default Outer Wall Thermal Condition as a convection coefficient and ambient temperature. This defines the thermal condition outside of the computer box. We assume that the external air has a temperature of 20.05°C and moves slowly due to the gravity effects only (convective coefficient of 10 W/m^2/K). 4

Apply solid materials.

Under Input Data, right-click Solid Materials and select Insert Solid Material. Select Copper under Metals and apply it to the heatsink component. Click OK.

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SolidWorks 2013

Lesson 1 Introduction to Electronics Module

Note

The rest of the components are modeled using the special features of the Electronics module, (two-resistor components for CPU and the chipset parts, for example). Solid materials are not assigned to these components.

Printed Circuit Boards

PCB composite laminates exhibits anisotropic material behavior. The electronics module allows users to enter the detailed layup of various PCB composites and store it in the Engineering database. Flow Simulation then automatically calculates the effective material properties (conductivities in all directions, for example). 5

Define PCB composite.

Under Flow Simulation, Tools open Engineering Database. Under Database tree, expand Printed Circuit Boards and select the User Defined folder. Click New Item and enter the following properties for conducting and dielectric layers.

Material constants for conducting and dielectric layers

Effective composite constants

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Lesson 1

SolidWorks 2013

Introduction to Electronics Module

When finished, click the Tables and Curves tab and input the composite layup, as shown in the figure.

The Layer Thickness implies the thickness of the conducting layer defined by the thickness of the conductive material in each lamina. The Percentage Cover parameters indicate the volume fraction of the conducting material in the body of each conducting layer.

Note

Click Save and close the Engineering Database window. The effective properties of the PCB composite are automatically computed and shown in the table (see the Engineering Database figure). 6

Assign PCB material. Under Input Data, right-click Printed Circuit Boards and select Insert Printed Circuit Board.

From the User Defined folder, select 6S2P composite created in the previous step. Select the PCB assembly part. Click OK.

6

SolidWorks 2013

Lesson 1 Introduction to Electronics Module

7

Note

Specify pressure boundary conditions. Define Environment Pressure boundary condition on four lids of the Base. Use the internal faces of the lids.

The inlet is defined by the opening in the side walls of the Base rather than the perforated area of the Cover. Define Static Pressure boundary condition on the bridge opening. Use the internal face of the lid.

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Lesson 1

SolidWorks 2013

Introduction to Electronics Module

Specify Environmental Pressure boundary condition on the lid covering the main four slits on the top of the Cover.

Flow Simulation will automatically detect four slits and correctly apply the boundary condition.

Note

Specify Environmental Pressure boundary condition on the inside face of the fan outlet lid.

8

Define internal fan.

Under Input Data, right-click Fans and select Insert Fan. Under Type select Internal Fan. Under Faces Fluid Exits Fan and Faces Fluid Enters Fan select the two faces as shown in the figure. Note that the air is forced out of the enclosure. Under Fan select Axial, Papst, Papst 405 from the Pre-Defined folder. Keep the rest of the parameters at their default values. Click OK.

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SolidWorks 2013

Lesson 1 Introduction to Electronics Module

Note

The air is forced out of the enclosures. Make sure that the faces for Faces Fluid Exits Fan and Faces Fluid Enters Fan are selected correctly and the direction of the feature arrows points as shown in the figure.

Note

A reasonable simplification would be the outlet fan type defined directly on the enclosure face. The current solution represents more accurate position of the fan with respect to the heatsink.

Perforated Plates

The perforated plates feature is used to model inlet and outlet flows through thin perforated walls where a typical 3D mesh would result in an excessive number of cells. The perforated plate condition must be applied in conjunction with the environmental pressure boundary conditions. 9

Define perforated places.

Similar to step 5, open the Engineering Database. Expand the Perforated Plates folder. Under the User Defined folder define the following two perforated plate features.

Note

The parameters of the Plate 1 and Plate 2 features correspond to the perforated plates at the fan outlet and the four side air inlets, correspondingly.

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Lesson 1

SolidWorks 2013

Introduction to Electronics Module

10 Assign perforated plates. Under Input Data, right-click Perforated Plates and select Insert Perforated Plate.

From the User Defined folder, select Plate 1. Select the inside face of the fan outlet lid. Click OK.

Note

The perforated plate feature requires existing environmental pressure or fan boundary condition. The selected face must therefore be the same as the one used in the definition of the pressure condition in step 7.

Note

To automatically select the correct face you may choose to click the corresponding environmental pressure boundary condition in the Flow Simulation analysis tree. Similarly, assign Plate 2 perforated plate feature to the four lids of the Base.

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SolidWorks 2013

Lesson 1 Introduction to Electronics Module

Two-Resistor Components

Two-resistor components are used to model thermal behavior of the small electronic components such as CPU, chipsets, memories etc. Rather than using a single body, two-resistor component simplifies the complex shape with two parallelepiped parts. The Junction is the lower part directly in contact with the PCB. The upper part is then referred to as the Case. Package Adiabatic walls

Case

Adiabatic walls

ΘJC ΘJB

Junction

PCB board

Both parts are isolated at their sides forcing the heat to travel in the direction normal to the plane of the parallelepiped. The thermal properties are expressed using Junction-to-Case (ΘJC) and Junction-toBoard (ΘJB) thermal resistances of the infinitely thin plates at the respective interfaces.

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Lesson 1

SolidWorks 2013

Introduction to Electronics Module

Electronic module has an extensive library of two-resistor components. The figure shows parameters for PBGAFC_40x40mm_2R consisting of the parallelepiped dimensions (thickness and two planar dimensions), and two thermal resistances. Caution must be paid to the geometry of the parallelepiped components in the SolidWorks model. Their physical dimensions must agree with the dimensions in the engineering database. 11 Specify two-resistor components. Right-click the Two Resistor Components icon and select Insert Two-Resistor Component.

Select cpu 2r case as the Case Body and cpu 2r junction as the Junction Body. Under Component select PBGAFC_40x40mm_2R. Under Source enter 14W for the Heat Generation Rate. Click OK.

Following the same procedure, specify the remaining two-resistor components for the chipset (northbridge and southbridge).

12

Northbridge

Southbridge

Case

northbridge 2r case

southbridge 2r case

Junction

northbridge 2r junction

southbridge 2r junction

Component

PBGAFC_37_5x37_5mm_2R

LQFP_256_28x28mm_2R

Heat Rate

4.3 W

2.5 W

SolidWorks 2013

Lesson 1 Introduction to Electronics Module

Heat Pipes

A heat pipe is an efficient heat transfer mechanism between two solid interfaces. It combines the principles of both thermal conductivity and phase transition. To define a heat pipe component, a solid body and two faces (one for cold, one for hot interfaces) are required. 12 Specify heat pipes. Right-click the Heat Pipes icon and select Insert Heat Pipe.

Select cpu heat pipe as the Components to Apply Heat Pipe.

Select the face of the cpu heat pipe in contact with the CPU as Heat In Faces. Select the two faces of the cpu heat pipe in contact with the heatsink as Heat Out Faces. Under Effective Thermal Resistance, enter 0.3 °C/W. Click OK. Note

The Effective Thermal Resistance parameter represents the resistance of the heat pipe to the flow. This value is typically very small as heat pipes are very efficient. Following the same procedure, specify the remaining heat pipe between the northbridge and the heatsink components. Use the same Effective Thermal Resistance.

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Lesson 1

SolidWorks 2013

Introduction to Electronics Module

13 Specify contact resistances for heat-in faces. Right-click the Contact Resistances icon and select Insert Contact Resistance.

Select the heat in faces on both heat pipes (see the figure). Identical faces were used as Heat In Faces in the definition of the heat pipes in the previous step. Under Type select Resistance and under Interface Materials select the Bond-Ply 660 @ 25 psi from the Pre-Defined, Interface Materials, Bergquist, Bond-Ply folder.

Note

14

The Flow Simulation engineering database with the Electronics module license features extensive list of the available interface materials.

SolidWorks 2013

Lesson 1 Introduction to Electronics Module

14 Specify contact resistances for exposed heat pipe faces.

Heap pipes are very efficient heat conductors with minimum thermal resistance. To simplify the calculation we will assume that no heat is flowing from the heat pipes into the surrounding air. This will be done by specifying infinite contact resistance. Right-click the Contact Resistances icon and select Insert Contact Resistance. In the FeatureManager tree, using the CTRL key, click both bodies of the cpu heat pipe and heat pipe short components. Flow Simulation will select all outside faces into the Faces to apply the contact resistance selection window. Click the Filter Faces icon to open the filter dialog, select Keep outer and fluidcontacting faces and run the filter by clicking the Filter button. Under Type select Resistance. Under Thermal Resistance select Infinite resistance (Pre-Defined folder). Click OK.

15 Specify volume goals. Under Input Data, right-click Goals and select Insert Volume Goal.

Under Selection select cpu 2r case and cpu 2r junction components. Under Parameter specify Av and Max for Temperature (Solid). Edit the Name Template to CPU VG . Click OK. Continue with the definition of the volume goals for the chipset components (northbridge and southbridge) and the heatsink.

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Lesson 1

SolidWorks 2013

Introduction to Electronics Module

16 Specify surface goal.

Following similar procedure, define a separate Mass Flow Rate surface goal for each air inlet and outlet. Note

A definition can be conveniently done with a single command using the Create goal for each surface option.

Mesh Considerations

As in any simulation project, mesh plays important role in the quality of the solution. Proper mesh generation requires iterative approach while adjusting various mesh parameters until the desired optimum discretization is achieved. In the current model, it is advisable to discretize the interface between the PCB and the two-resistor components with cells terminating at this interface. We will achieve this by placing one control plane at the said interface (figure in the next step). Also, to mesh the thin features of the PCB and the two-resistor components, we will adjust the cell Ratio values accordingly. Lastly, local mesh controls for the thermally important components, heatsink and the two-resistor components, will be defined as well. 17 Specify initial mesh. Right-click Input Data and select Initial Mesh.

Clear the Automatic settings checkbox. Under Basic Mesh, Control Intervals, click the Add Plane button to open the Create Control Planes window. Select plane parallel to ZX, Reference Geometry, and click the vertex on the PCB face defining the plane of interface with the two-resistor components (see the figure). Click OK to close the Create Control Planes window.

Back in the Initial Mesh window, under Basic Mesh, enter the Ratio values of 2 and -3 for Y1 and Y2 intervals, respectively.

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SolidWorks 2013

Lesson 1 Introduction to Electronics Module

Note

With Ratio values as specified, the cells adjacent to PCB will be smaller, growing in size with the distance. Under Number of cells, enter the basic mesh parameters as indicated in the figure below.

Click the Solid/Fluid Interface tab and reduce Small solid feature refinement level to 1. Also, make sure that the rest of the parameters are set as shown in the figure below.

Click OK.

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Lesson 1

SolidWorks 2013

Introduction to Electronics Module

18 Specify local initial mesh for two-resistor components. Under Input Data, right-click Local Initial Meshes and select Insert Local Initial Mesh.

With the help of the CTRL key, multiple select all two-resistor components. A total of six bodies should be selected. Clear Auto settings. Under Refining Cells, set both the Refine partial cells and Refine solid cells parameters to level 2. Click OK. 19 Specify local initial mesh for heatsink.

Using the same procedure, create another local initial mesh for the heatsink. Use the settings from step 18 for the parameters under the Refining Cells tab. Under the Narrow Channels tab, set the Characteristic number of cells across a narrow channel to 5 and Narrow channels refinement level to 2. 20 Generate mesh. Under the Flow Simulation menu, click: Solve, Run.

Uncheck the Solve checkbox. Make sure that the Mesh and the Load results options are checked. Click Run. Note

18

The above step will generate mesh only.

SolidWorks 2013

Lesson 1 Introduction to Electronics Module

21 Mesh plots.

Show the mesh on the plane parallel to the assembly Front plane, at the position -0.0595 m.

It can be seen that the cells terminate at the interface between the PCB and the two-resistor components, Also, cells are growing in size with distance from the PCB. Show the mesh on the plane parallel to the assembly Front plane, at the position -0.00381 m.

At this position, the plane is passing through the heatsink. We can see that only one full cell is discretizing the narrow channel. This mesh deficiency is caused purposely to reduce the computational time required to solve this simulation. For more accurate solution in the heatsink region, the Narrow channel refinement level specified in step 19 needs to be increased.

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Lesson 1

SolidWorks 2013

Introduction to Electronics Module

Show the mesh on the plane parallel to the assembly Right plane, at the position 0.0109 m.

At this position, the plane is passing through one of the heatsink narrow channels. The discretization seems fine in the direction. However, as we found out the discretization would have to increase somewhat to correctly mesh the width of the narrow channels. 22 Solve.

Similarly to step 20, execute the Solve, Run command. This time, uncheck Mesh. Check the Solve and the Load results checkboxes. Click Run. Note

20

The solve time should take up to thirty minutes.

SolidWorks 2013

Lesson 1 Introduction to Electronics Module

23 Show temperature results. Define a Surface Plot for all thermally important components: heatsink and all of the two-resistor components.

Make sure to set the plot legend limits to the plot rather than the global maximums.

The temperature of the electronic components must now be compared against the limits stated at the beginning of the lesson. We can immediately see that the CPU temperature of 81.5 °C exceeds the limit of 80 °C. The cooling system is therefore insufficient. The temperature of the other components can be checked easily with the help of the goals or surface parameters. 24 List temperature of the important components. Define a Goal Plot for all defined temperature goals and show the table

with the extremes for all important components.

The critical temperatures are marked in red. It is clear that the CPU overheats and the cooling must be redesigned. The chipset components (northbridge and southbridge) are thermally safe with sufficient margin of safety.

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Lesson 1

SolidWorks 2013

Introduction to Electronics Module

Conclusions

In this lesson, we evaluated a design of cooling for electronic computer box. Advanced features of the electronics module, namely heat pipes, two-resistor components, PCB composite interface were shown and practiced in detail. Two-resistor components are special features enabling users to model thin electronic components such as CPUs with greater level of fidelity. Heat pipes are efficient heat transporting devices employing both principles of the heat conduction and phase transition. Lastly, the PCB composite interface enables users to enter the layup composition of the PCBs and store them in the engineering database. Flow Simulation then automatically computes the effective material constants required for the simulation. In this lesson we found that with the proposed cooling the CPU unit overheats. Redesign of the cooling system is therefore necessary.

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