Planning and Installation Guide for Tri-GP v2 Systems

Triconex General Purpose v2 Systems

Planning and Installation Guide

Assembly Number 9700122-003 June 2011

Information in this document is subject to change without notice. Companies, names and data used in examples herein are fictitious unless otherwise noted. No part of this document may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, without the express written permission of Invensys Systems, Inc. © 2010-2011 by Invensys Systems, Inc. All rights reserved. Invensys, the Invensys logo, Foxboro, I/A Series, Triconex, Tricon, Trident, and TriStation are trademarks of Invensys plc, its subsidiaries and affiliates. All other brands may be trademarks of their respective owners.

Document Number 9720122-003 Printed in the United States of America.

Contents

Preface

ix Summary of Sections. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ix Related Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . x Product and Training Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . x Technical Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . x We Welcome Your Comments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xi

Chapter 1

Introduction

1

Controller Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Fault Tolerance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 System Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Controller Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 TriStation 1131 Software . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Theory of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Main Processor Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Bus Systems and Power Distribution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Logic Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Controller Communication . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 System Diagnostics and Status Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Analog Input Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Analog Input/Digital Input Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Analog Output Modules. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Digital Input Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Digital Output Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Pulse Input Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Solid-State Relay Output Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 International Certifications and Qualifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Canadian Standards Association. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Factory Mutual. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 TÜV Rheinland . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 European Union CE Mark . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Chapter 2

System Description

23

Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 General Environmental and EMC Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Typical Weight of Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Cable Flame Test Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Planning and Installation Guide for Triconex General Purpose v2 Systems

iv

Contents

Ground Systems. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Standard Tri-GP Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Main Processor Components. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 MP Module Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 MP Baseplate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 Communication Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 Logic Power Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 CM Baseplate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 I/O Modules Common Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 Wiring Terminals. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 Logic Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 Field Power. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 Analog Input Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 AI Module 3351S2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 AI Baseplate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 AI External Termination Baseplate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 RTD/TC/AI External Termination Panel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 AI Hazardous Location External Termination Panel . . . . . . . . . . . . . . . . . . . . . . . . . . 65 AI HART Baseplates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 Analog Input/Digital Input Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 AI/DI Module 3361S2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 AI/DI Baseplate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 AI/DI External Termination Baseplate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 AI/DI Hazardous Location External Termination Panels . . . . . . . . . . . . . . . . . . . . . 81 Analog Output Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82 AO Module 3481S2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83 AO Module 3482S2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85 AO Baseplate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87 AO External Termination Baseplate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90 AO HART Baseplates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93 AO Hazardous Location External Termination Panel . . . . . . . . . . . . . . . . . . . . . . . . . 97 Digital Input Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101 DI Module 3301S2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102 DI Module 3311S2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104 DI Baseplate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107 DI External Termination Baseplate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109 Solid State Relay Input External Termination Panel . . . . . . . . . . . . . . . . . . . . . . . . . 112 DI Hazardous Location External Termination Panel . . . . . . . . . . . . . . . . . . . . . . . . . 115 Digital Output Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119 DO Module 3401S2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 DO Module 3411S2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122 DO Baseplate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125 DO High-Current Baseplate. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 DO Low-Current Baseplate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131 Planning and Installation Guide for Triconex General Purpose v2 Systems

Contents

v

DO External Termination Baseplate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134 Relay Output External Termination Panel. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137 DO Hazardous Location External Termination Panel . . . . . . . . . . . . . . . . . . . . . . . . 142 Pulse Input Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 146 PI Module 3382S2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 148 PI Baseplate. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151 PI Hazardous Location Baseplate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 158 Solid-State Relay Output Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165 SRO Module Schematic. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165 SRO Baseplate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 167 Interconnect Assemblies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170 I/O Extender Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 171 I/O Bus Cables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 172 I/O Bus Terminators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 172 End Caps . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 173 MP Baseplate End Caps . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 173 I/O Baseplate and I/O Extender Module End Caps . . . . . . . . . . . . . . . . . . . . . . . . . 173 Covers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 174

Chapter 3

Installation and Maintenance

175

System Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 176 System Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 176 Determining Logic Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 177 General Cooling Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 177 Determining Cooling Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 177 Installation Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 179 General Installation Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 179 Plant Power and Grounding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 179 Tri-GP Field, Power, and Ground Wiring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 180 Application-Specific Installation Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 182 Component Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 185 Mounting a Panel. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 185 Installing Baseplates on a Column . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 191 Connecting Columns with I/O Extender Modules . . . . . . . . . . . . . . . . . . . . . . . . . . 192 Installing Modules on Baseplates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 195 Installing the Module Address Plug . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 196 Installing Other Components. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 197 Enclosing the Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 197 Controller Grounding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 198 Grounding Baseplates to Protective Earth . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 198 Grounding Logic Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200 Grounding Field Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 201 Connecting Shields to Earth . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 202 Alarm Wiring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 203

Planning and Installation Guide for Triconex General Purpose v2 Systems

vi

Contents

Implementation and Maintenance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 204 Disabling Output Voter Diagnostics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 204 Checking Controller Power Sources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 205 Enabling “Disabled” Output Voter Diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 205 Toggling Field I/O Points . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 206 Verifying Spare Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 206 Module Replacement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 207 Guidelines for Replacing Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 207 Replacing a Main Processor Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 208 Replacing a Communication Module. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 209 Replacing an I/O Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 210

Chapter 4

Fault and Alarm Indicators

211

Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 212 Fault and Alarm Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 212 Main Processor Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 213 MP Status Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 214 MP System Mode Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 215 MP Alarm Indicators. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 216 MP Communication Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 217 Communication Module Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 218 CM Status Indicators. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 219 CM Communication Indicators. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220 Analog Input Module Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 221 AI Status Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 222 AI Field Power Indicator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 223 Analog Input/Digital Input Module Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 224 AI/DI Status Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 225 AI/DI Field Power Indicator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 226 Analog Output Module Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 227 AO Status Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 228 AO Field Alarm Indicator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 229 Digital Input Module Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 230 DI Status Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 231 DI Field Power Indicator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 232 DI Point Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 232 Digital Output Module Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 233 Status Indicators on DO and SDO Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 235 Power/Load Indicator on DO and SDO Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . 236 Point Indicators on DO and SDO Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 236 Load Indicators on SDO Modules. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 236 Pulse Input Module Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 237 PI Status Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 238 PI Field Fault Indicator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 239

Planning and Installation Guide for Triconex General Purpose v2 Systems

Contents

vii

PI Point Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 239 Solid-State Relay Output Module Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 240 SRO Status Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 241 SRO Point Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 242

Appendix A Pin-Outs for Cables and Connectors

243

Ethernet Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 244 10BaseT and 100BaseTX Ethernet Connectors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 244 AUI 10 Megabit Ethernet MAU Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 244 MII Ethernet MAU Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 245 Serial Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 247 RS–232 Pin-Outs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 247 RS–485 Pin-Outs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 248 Ethernet Cables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 250 Cross-Over Cable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 250 Straight-Through Cable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 250 Serial Cables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 251 RS-232 Serial Cable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 251 RS-485 Serial Cables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 251 Diagread Cables and Debug Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 255 Diagread Cable. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 255 Debug Connector for MP and Left-Position CMs. . . . . . . . . . . . . . . . . . . . . . . . . . . . 255 Debug Connector for I/O and Right-Position CMs . . . . . . . . . . . . . . . . . . . . . . . . . . 255

Appendix B Non-Incendive Circuit Parameters

257

MP and CM Non-Incendive Circuit Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 258 Hazardous Location HART Baseplate Non-Incendive Circuit Parameters . . . . . . . . . . . 259

Appendix C HART Communication

261

Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 262 Triconex 4850 Hart Multiplexer. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 265 Installing the Triconex 4850 HART Multiplexer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 266 Triconex 4850 HART Multiplexer Indicators. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 267

Appendix D Warning Labels

269

General Hazard . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 269 Hazardous Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 270 Hot Surface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 270

Appendix E Recommended Parts for Replacement

271

Appendix F Panel Labels

273

Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 274 AI/DI Hazardous Location External Termination Panels . . . . . . . . . . . . . . . . . . . . . . . . . 275 RTD/TC/AI External Termination Panels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 276 Planning and Installation Guide for Triconex General Purpose v2 Systems

viii

Contents

SSR Input External Termination Panels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 277

Glossary

279

Index

287

Planning and Installation Guide for Triconex General Purpose v2 Systems

Preface

This guide includes information on planning and installing a version 2.x Triconex® General Purpose System. Throughout the rest of this guide, the Triconex General Purpose System also may be referred to as the Tri-GP.

Summary of Sections •

Chapter 1, Introduction — Describes the theory of operation supporting the controller.

•

Chapter 2, System Description — Provides descriptions, illustrations, specifications, and simplified schematics for components of the controller.

•

Chapter 3, Installation and Maintenance — Provides guidelines for the person responsible for installing and maintaining a controller.

•

Chapter 4, Fault and Alarm Indicators — Provides information on responding to alarm conditions.

•

Appendix A, Pin-Outs for Cables and Connectors — Provides pin-out information for standard cables and adapters used with the controller.

•

Appendix B, Non-Incendive Circuit Parameters — Describes the parameters to be used for non-incendive communication circuits in the field.

•

Appendix C, HART Communication — Describes HART™ communication through Tri-GP systems.

•

Appendix D, Warning Labels — Provides a physical description of warning labels required for systems in which certain hazards may occur.

•

Appendix E, Recommended Parts for Replacement — Lists the parts recommended by Invensys to replace existing parts and to customize your system.

•

Appendix F, Panel Labels — Shows how to apply external termination panel (ETP) labels.

•

Glossary — Provides information for terms and topics used throughout the guide.

Planning and Installation Guide for Triconex General Purpose v2 Systems

x

Preface

Related Documents •

Communication Guide for Triconex General Purpose v2 Systems

•

Product Release Notice for Triconex General Purpose v2.x Systems

•

Safety Considerations Guide for Triconex General Purpose v2 Systems

•

TriStation 1131 Developer’s Guide

•

TriStation 1131 Libraries Reference

Product and Training Information To obtain information about Invensys® products and in-house and on-site training, see the Invensys website or contact your regional customer center. Web Site http://www.iom.invensys.com

Technical Support Customers in the U.S. and Canada can obtain technical support from the Invensys Global Customer Support (GCS) center at the numbers below. International customers should contact their regional Invensys support office. Requests for support are prioritized as follows: •

Emergency requests are given the highest priority

•

Requests from participants in the System Watch Agreement (SWA) and customers with purchase order or charge card authorization are given next priority

•

All other requests are handled on a time-available basis

If you require emergency or immediate response and are not an SWA participant, you may incur a charge. Please have a purchase order or credit card available for billing. Telephone Toll-free number 866-746-6477, or Toll number 508-549-2424 (outside U.S.) Fax Toll number

508-549-4999

Web Site http://support.ips.invensys.com (registration required)

Planning and Installation Guide for Triconex General Purpose v2 Systems

Preface

xi

We Welcome Your Comments To help us improve future versions of Invensys documentation, we want to know about any corrections, clarifications, or further information you would find useful. When you contact us, please include the following information: •

The title and version of the guide you are referring to

•

A brief description of the content you are referring to (for example, step-by-step instructions that are incorrect, information that requires clarification or more details, missing information that you would find helpful)

•

Your suggestions for correcting or improving the documentation

•

The version of the Triconex® hardware or software you are using

•

Your name, company name, job title, phone number and e-mail address

Send e-mail to us at: [email protected] Please keep in mind that this e-mail address is only for documentation feedback. If you have a technical problem or question, please contact the Invensys Global Customer Support (GCS) center. See Technical Support on page x for contact information. Or, you can write to us at: Attn: Technical Publications - Triconex Invensys 26561 Rancho Parkway South Lake Forest, CA 92630 Thank you for your feedback.

Planning and Installation Guide for Triconex General Purpose v2 Systems

xii

Preface

Planning and Installation Guide for Triconex General Purpose v2 Systems

1 Introduction

Controller Features

2

Fault Tolerance

3

System Configuration

4

Theory of Operation

5

International Certifications and Qualifications

16

Planning and Installation Guide for Triconex General Purpose v2 Systems

2

Chapter 1

Introduction

Controller Features The Tri-GP version 2.x controller is a state-of-the-art programmable logic and process controller that provides a high level of system fault tolerance. To ensure the highest possible system integrity at all times, the Tri-GP controller includes these features: •

Provides Triple Modular Redundant (TMR) architecture whereby each of three identical system channels independently executes the control program, and specialized hardware/software mechanisms “vote” all inputs and outputs.

•

Withstands harsh industrial environments.

•

Enables field installation and repair to be done at the module level while the controller remains online. Replacing an I/O module does not disturb field wiring.

•

Supports I/O modules (analog and digital) and an optional Communication Module that interfaces with Modbus masters and slaves, other Triconex controllers in Peer-toPeer networks, and external host applications on Ethernet networks.

•

Support for: — 25 I/O baseplates maximum — 416 AI points maximum (13 AI baseplates, 13 AI/DI baseplates, or any combination that does not exceed 416 total AI or AI/DI points) — 20 AO points maximum (5 baseplates) — 640 DI points maximum (20 DI baseplates, 13 AI/DI baseplates, or any combination that does not exceed 640 total DI points) — 320 DO points maximum (20 baseplates) — 30 PI points maximum (5 baseplates) — 640 SRO points maximum (20 baseplates)

•

Integrates the I/O module with the termination assembly.

•

Executes control programs developed and debugged with TriStation™ 1131 software. (For software compatibility, see the Product Release Notice for Tri-GP v2.x, available on the Invensys Global Customer Support (GCS) website.)

•

Allows normal maintenance while the Tri-GP controller is operating, without disturbing the controlled process.

•

Provides TriStation 1131 and Modbus communication from the Main Processor (MP) or from the Communication Module (CM).

•

Provides a dedicated co-processor which controls the input and output modules to reduce the workload of the MP. Each I/O module is supported by custom applicationspecific integrated circuits (ASICs), which scan inputs and perform diagnostics to detect hardware faults. Output module ASICs do the following: — Supply information for voting of output data. — Check I/O loop-back data from the output terminal for final validation of the output state. — Perform diagnostics to detect hardware and field-wiring problems.

Planning and Installation Guide for Triconex General Purpose v2 Systems

Fault Tolerance

3

•

Provides integral online diagnostics with adaptive-repair capabilities.

•

Supports hot-spare I/O modules for critical applications where prompt service may not be possible.

•

Provides integral support for redundant field and logic power sources.

Fault Tolerance Fault tolerance, the most important capability of the Tri-GP controller, is the ability to detect transient and steady-state error conditions and take appropriate corrective action online. With fault tolerance, there is an increase in safety and an increase in the availability of the controller and the process being controlled. The Tri-GP controller provides fault tolerance through Triple Modular Redundant (TMR) architecture. The controller consists of three identical channels, except for the Power Modules which are dual-redundant. Each channel independently executes the control program (also referred to as the TriStation 1131 application) in parallel with the other two channels. Hardware voting mechanisms qualify and verify all digital inputs and outputs from the field; analog inputs are subject to a mid-value selection process. Because each channel is isolated from the others, no single-point failure in any channel can pass to another. If a hardware failure occurs in one channel, the faulty channel is overridden by the other channels. Repair consists of removing and replacing the failed module in the faulty channel while the controller is online and without process interruption. The controller then reconfigures itself to full TMR operation. Extensive diagnostics on each channel, module, and functional circuit immediately detect and report operational faults by means of indicators or alarms. All diagnostic fault information is accessible by the control program and the operator. If faults are detected, the operator can use the diagnostic information to modify control actions or direct maintenance procedures. Because the triplicated system operates as one control system, the Tri-GP controller can be programmed with one control program that terminates sensors and actuators at a single wiring terminal.

Planning and Installation Guide for Triconex General Purpose v2 Systems

4

Chapter 1

Introduction

System Configuration Physically, a basic Tri-GP version 2 controller consists of Main Processors, I/O modules, an optional Communication Module, the baseplates on which the modules are mounted, field wiring connections, and a PC running the TriStation 1131 software. This section briefly describes these components. A typical Tri-GP system is configured into one or more vertical I/O columns guided by DIN rails and mounted on a sheet-metal panel. Tri-GP modules are field-replaceable units consisting of an electronic assembly housed in a metal spine. Each module has a protective cover that ensures no components or circuits are exposed even when a module is removed from the rail. Offset backplane connectors make it impossible to plug a module in upside down, and keys on each module prevent the insertion of modules into incorrect slots. The Tri-GP controller supports digital and analog input and output points, as well as pulse and thermocouple inputs and multiple communication protocols.

Controller Configuration A basic Tri-GP system consists of one MP assembly, an optional CM assembly, and I/O assemblies. Assemblies are configured into a system on a mounting plate using interconnect assemblies, extenders, I/O bus cables, and I/O bus terminators. I/O modules communicate with the MPs by means of a triplicated, RS-485, bi-directional communication bus, called the I/O bus. For more information, see System Specifications on page 176.

TriStation 1131 Software TriStation 1131 software is required to develop and download the control program that runs on the Tri-GP controller. TriStation 1131 software provides three programming languages which comply with the IEC 61131-3 standard: Function Block Diagram, Ladder Diagram, and Structured Text. An optional language, CEMPLE (Cause and Effect Matrix), can be purchased separately. For software compatibility, see the Product Release Notice for Tri-GP v2.x, available on the Invensys Global Customer Support (GCS) website.

Planning and Installation Guide for Triconex General Purpose v2 Systems

Theory of Operation

5

Theory of Operation The Tri-GP controller is designed with a Triple Modular Redundant (TMR) architecture, which is a fully triplicated architecture throughout, from the input modules through the Main Processors, to the output modules. Each module houses the circuitry for three independent channels. Each channel on the input modules reads the process data and passes that information to its respective Main Processor. The three Main Processors communicate with each other using a proprietary high-speed bus system called the TriBus. Output Module

Input Module Hot Spare

Hot Spare

Channel A I/O Bus

Input Channel A

Output Channel A IOP A (IOX)

Channel B IO/ Bus

MP B (SX)

Input Channel C

Output Channel B

IOP B (IOX)

Field Output

Output Channel C

Channel C I/O Bus

MP C (SX)

Figure 1

Diagnostic Channel

Input Channel B

TriBus &TriTime

Field Input

Output Voter

MP A (SX)

IOP C (IOX)

Triplicated Architecture of the Tri-GP Controller

Once per scan, the Main Processors synchronize and communicate with their neighbors over the TriBus. The TriBus sends copies of all analog and digital input data to each Main Processor, then compares output data from each Main Processor. The Main Processors vote the input data, execute the control program, and send outputs generated by the control program to the output modules. The Tri-GP controller votes the output data on the output modules as close to the field as possible to detect and compensate for any errors that could occur between the TriBus voting and the final output driven to the field. Each I/O slot can contain two identical I/O modules which means if a fault is detected on one module, control is automatically switched to the healthy module. A faulty module can also be replaced online when only one module is installed in the slot. In this case, a healthy module is inserted in the spare slot and the control is switched to this module, which allows the faulty module to be pulled and sent for repair.

Planning and Installation Guide for Triconex General Purpose v2 Systems

6

Chapter 1

Introduction

Main Processor Modules A Tri-GP controller contains three Main Processors. Each Main Processor controls a separate channel of the system and operates in parallel with the other Main Processors. A dedicated I/O Processor on each Main Processor manages the data exchanged between the Main Processor and the I/O modules. A triplicated I/O bus, located on the baseplates, extends from one column of I/O modules to another column of I/O modules by means of I/O bus cables. As each input module is polled, the appropriate channel of the I/O bus transmits new input data to the Main Processor. The input data is assembled into a table in the Main Processor and is stored in memory for use in the hardware voting process. The individual input table in each Main Processor is transferred to its neighboring Main Processors over the TriBus. During this transfer, hardware voting takes place. The TriBus uses a direct memory access programmable device to synchronize, transmit, vote and compare data among the three Main Processors. If a disagreement occurs, the signal value found in two out of three tables prevails, and the third table is corrected accordingly. One-time differences which result from sample timing variations are distinguished from a pattern of differing data. Each Main Processor maintains data about necessary corrections in local memory. Any disparity is flagged and used at the end of the scan by the controller’s fault analyzer routines to determine whether a fault exists on a particular module. Program Processor

I/O Processor Dual 24 V Power Inputs

Redundant Alarm Relays

Alarm 1 Alarm 2

System Alarm

Debug (RJ-12)

+3.3 V +5 V

Dual-Power Regulators

3.6 V Battery and Monitor

Program Alarm

Debug (RJ-12) I/O Bus

Modbus (DB-9) MPC860A

Reserved (DB-9) Ethernet Network (RJ-45)

Clock/NVRAM 8 KB

Shared Memory 128 K

36-Bit Bus

Flash 4/8 MB

Tribus (to other MPS)

Figure 2

TriBus FPGA

36-Bit Bus

DRAM 16 MB

Up Stream

Down Stream

Up Stream

Down Stream

Diagnostic Bus Channels (to other MPs)

MPC860A

Main Processor Architecture

Planning and Installation Guide for Triconex General Purpose v2 Systems

DRAM 16 MB

Theory of Operation

7

The Main Processors send the corrected data to the control program. Each Main Processor executes the control program in parallel with the neighboring Main Processor. The control program generates a table of output values which are based on the table of input values according to customer-defined rules built into the control program. The I/O Processor on each Main Processor manages the transmission of output data to the output modules by means of the I/O bus. Using the table of output values, the I/O Processor generates smaller tables, each corresponding to an individual output module in the system. Each small table is transmitted to the appropriate channel of the corresponding output module over the I/O bus. For example, Main Processor A transmits the appropriate table to Channel A of each output module over I/O Bus A. The transmittal of output data has priority over the routine scanning of all I/O modules. The I/O Processor manages the data exchanged between the Main Processors and the Communication Module using the communication bus which supports a broadcast mechanism. Each Main Processor provides a 16-megabyte DRAM for the control program, sequence-ofevents (SOE) and I/O data, diagnostics, and communication buffers. The control program is stored in flash EPROM and loaded in DRAM for execution. The Main Processors receive power from redundant 24 VDC power sources. If an external power failure occurs, all critical retentive data is stored in NVRAM. A failure of one power source does not affect controller performance. If the controller loses power, the control program and all critical data are retained indefinitely.

Planning and Installation Guide for Triconex General Purpose v2 Systems

8

Chapter 1

Introduction

Bus Systems and Power Distribution This figure depicts the three triplicated I/O bus systems which are carried baseplate-tobaseplate using Interconnect Assemblies, I/O Extender Modules, and I/O bus cables. The redundant logic power distribution system is carried using Interconnect Assemblies and I/O Extender Modules. Power Supply #1

Power Supply #2

~~~

I/O Bus Channel A Channel B Channel C

EM CM

I/O Communication Bus Interconnect Assembly

I/O Bus

I/O

I/O Bus MP I/O

I/O Power Bus

Power Bus

EM

Figure 3

EM

Tri-GP Bus Systems and Power Distribution

TriBus Operation The TriBus, which is local to the MP Baseplate, consists of three independent serial links operating at 25 megabits per second. The TriBus synchronizes the Main Processors at the beginning of a scan, and performs either of these functions: •

Transfers I/O, diagnostic, and communication data.

•

Compares data and identifies disagreements with the output data and program memory from the previous scan.

An important feature of Tri-GP controller architecture is the use of a single transmitter to send data to both the upstream and downstream Main Processors which ensures the same data is received by the upstream processor and downstream processor.

Planning and Installation Guide for Triconex General Purpose v2 Systems

Theory of Operation

9

I/O Bus Operation Field signal distribution is local to each I/O baseplate. Each I/O module transfers signals to or from the field through its associated baseplate assembly. Two positions on the baseplate tie together as one logical slot. Each field connection on the baseplate extends to both positions, which means that both the active module and the hot-spare module receive the same information from the field termination wiring. The triplicated I/O bus transfers data between the I/O modules and the Main Processors at 2 megabits per second. The I/O bus is contained within an I/O column and can be extended to another I/O column by using a set of three I/O bus cables (one for each TMR channel.)

Communication Bus Operation The communication bus runs between the Main Processors and the Communication Modules at 2 megabits per second.

Power Distribution Power for the modules on each DIN rail is distributed using two independent power rails. Each module along the DIN rail draws power from both power rails through dual power regulators. There are four sets of power regulators on each input and output board: one set for each channel (A, B, and C) and one set for the status indicators.

Planning and Installation Guide for Triconex General Purpose v2 Systems

10

Chapter 1

Introduction

Logic Power

+24V #1 +24V #2 RTN

Each module is designed to operate directly from redundant 24 VDC power sources. Logic power is carried baseplate-to-baseplate, allowing a single logic power connection per column. The power conditioning circuitry is protected against over-voltage, over-temperature, and overload conditions. Integral diagnostic circuitry checks for out-of-range voltages and overtemperature conditions. A short on a channel disables the power regulator rather than affecting the power sources.

~

+6.5V +6.5V

Typical I/O Module Leg A REG

Vcc

Vcc Isolated DC – DC Converter

DC – DC Converter REG

Leg B REG

Vcc

Vcc Isolated DC – DC Converter

DC – DC Converter REG

Logic (System) Functional Earth

REG

Vcc

Vcc Isolated DC – DC Converter

Field Functional Earth

~

~~

~~~ Power Bus

~ ~

Field Functional Earth

Leg C REG

~~

Field Functional Earth

Isolation Barrier

Figure 4

Logic Power Distribution

Controller Communication The controller can communicate directly with a PC running TriStation 1131 software and other devices through the Main Processor and the Communication Module.

Main Processor Modules Each MP can provide direct TriStation 1131 and Modbus communication, including: •

One TriStation 1131 (Ethernet) port for downloading an application to the controller and uploading diagnostic information.

•

One Modbus RS-232/RS-485 serial port which acts as a slave to an external host computer. Typically, a distributed control system (DCS) monitors—and optionally updates—the controller data directly though an MP.

Planning and Installation Guide for Triconex General Purpose v2 Systems

Theory of Operation

11

Communication Module The Communication Module (CM) provides an optional, three-to-one interface to the Main Processors that supports serial and Ethernet communication protocols. A single controller supports up to two CMs on one CM Baseplate with each CM operating independently. Two CMs can provide redundant communication connections or independent communication ports. Each CM provides three RS-232/485 serial ports and two Ethernet ports. These ports support a variety of communication protocols and physical media types that enable the controller to communicate with external host computers, distributed control systems, open networks, network printers, and other Tri-GP, Trident™, and Tricon™ v9–v10 controllers. For CM specifications, see Chapter 2, System Description. For details about communication protocols, see the Communication Guide for Triconex General Purpose v2 Systems.

Physical Communication Interfaces This table lists the physical communication interfaces included with the MP and CM. Interfaces

MP

CM

RS-232/RS-485 Modbus Serial Port





10BaseT Ethernet Port





10BaseT/100BaseTX Auto-negotiable Ethernet Port



Attachment unit interface (AUI) for media access unit (MAU)



Media independent interface (MII) for MAU



Debug port





Communication Protocols This table lists the protocols supported by serial and network ports on the MP and CM. Protocols

Port Type

MP

CM

Modbus Slave (ASCII or RTU)

Serial





Modbus Master (RTU)

Serial



Modbus Master or Slave (TCP)

Network



TriStation 1131

Network





TCP/IP

Network





Triconex System Access Application (TSAA) (UDP/IP)

Network



Triconex System Access Application (TSAA) with IP Multicast (UDP/IP)

Network



Triconex Time Synchronization via DLC

Network



Triconex Time Synchronization via UDP/IP or SNTP

Network



Planning and Installation Guide for Triconex General Purpose v2 Systems

12

Chapter 1

Introduction

Protocols

Port Type

MP

CM

Triconex Peer-to-Peer via UDP/IP

Network



Triconex Peer-to-Peer via DLC

Networka



Hewlett-Packard JetDirect® Network Printer Server Data Link Control (DLC)/Logical Link Control (LLC)

Network



a. NET 1 only

System Diagnostics and Status Indicators The Tri-GP controller incorporates online diagnostics and specialized fault monitoring circuitry which are able to detect and alarm all single-fault and most multiple-fault conditions. The circuitry includes—but is not limited to—I/O loop-back, watch-dog timers, and loss-of-power sensors. Using the alarm information, the response of the system can be customized to the specific fault sequence and operating priorities of the application. Each module can activate the system integrity alarm, which consists of normally closed (NC) relay contacts on each MP. Any failure condition, including loss or brownout of system power, activates the alarm to summon plant maintenance personnel. Each controller module can activate the system integrity alarm. The alarm consists of a normally closed or normally opened (NC or NO) relay contact on each Power Module. Any failure condition, including loss or brownout of system power, activates the alarm to summon plant maintenance personnel. The front panel of each module provides LED (light-emitting-diode) indicators that show the status of the module or the external systems to which it is connected. Pass, Fault, and Active are common indicators. Other indicators are specific to each module.

Figure 5

Front Panel Indicators

Maintenance consists of replacing plug-in modules. A lighted Fault indicator shows that the module has detected a fault and must be replaced. The control circuitry for the indicators is redundant and is isolated from each of the three channels. All internal diagnostic and alarm status data is available for remote logging and report generation. This reporting can be done through a local or remote PC running TriStation 1131 software, or through a host computer. For more information, see the TriStation 1131 Developer’s Guide.

Planning and Installation Guide for Triconex General Purpose v2 Systems

Theory of Operation

13

Analog Input Module For Analog Input Modules, each of the three channels asynchronously measures the input signals and places the results into a table of values. Each of the three input tables is passed to its associated Main Processor using the I/O bus. The input table in each Main Processor is transferred to its neighbors across the TriBus. The middle value is selected by each Main Processor and the input table in each Main Processor is corrected accordingly. In TMR mode, the mid-value data is used by the control program; in DUAL mode, the average is used. AI Modules continuously execute Forced Value Diagnostics (FVD) which is a self-test diagnostic that detects and signals an alarm for all stuck-at and accuracy fault conditions typically in less than 500 milliseconds. This safety feature allows unrestricted operation under a variety of multiple-fault scenarios. Each AI Module is guaranteed to remain in calibration for the life of the controller. Periodic manual calibration is not required. For specifications, see Analog Input Components on page 49.

Analog Input/Digital Input Module The Analog Input/Digital Input Module has 16 digital input points (points 1–16) and 16 analog input points (points 17–32). The AI/DI Module has three isolated sets of electronics, called channels, which independently process field data input to the module. Sensing of each input point is performed in a manner that prevents a single failure on one channel from affecting another channel. For analog input points, each channel receives variable voltage signals from each point, converts them to digital values, and transmits the values to the three MPs on demand. For digital input points, an ASIC on each channel scans each input point, compiles data, and transmits it to the MPs on demand. For all points, the MPs vote the data before passing it to the control program. In TMR mode, the data passed is mid-value. In DUAL mode, the data passed is the average. AI/DI Modules sustain complete, ongoing diagnostics for each channel. If the diagnostics detect a failure on any channel, the Fault indicator turns on and activates the system alarm. The Fault indicator identifies a channel fault, not a complete module failure. AI/DI Modules are guaranteed to operate properly in the presence of a single fault and may continue to operate properly with multiple faults. AI/DI Modules include the hot-spare feature which allows online replacement of a faulty module. The AI/DI Module is mechanically keyed to prevent improper installation in a configured baseplate. For specifications, see Analog Input/Digital Input Components on page 72.

Planning and Installation Guide for Triconex General Purpose v2 Systems

14

Chapter 1

Introduction

Analog Output Modules For Analog Output Modules, each of the three channels includes a proprietary ASIC that receives its output table from the I/O communication processor on its corresponding Main Processor. AO Modules use special shunt circuitry to vote on the individual output signals before they are applied to the load. Voter circuitry ensures only one output channel (A, B, or C) is driving the field load. The shunt output circuitry provides multiple redundancy for all critical signal paths, guaranteeing safety and maximum availability. AO Modules continuously execute Forced Switch Diagnostics (FSD) on each point. By carefully forcing error conditions and observing proper behavior of the voting circuitry, high reliability and safe operation is ensured. This safety feature allows unrestricted operation under a variety of multiple-fault scenarios. Each AO Module is guaranteed to remain in calibration for the life of the controller. Periodic manual calibration is not required. For specifications, see Analog Output Components on page 82.

Digital Input Module For Digital Input Modules, each of the three channels reside on the same module, however, the circuitry is completely isolated from each other and operates independently. This isolation means a fault on one channel cannot pass to another. In addition, each channel contains a proprietary ASIC which manages communication with its corresponding Main Processor, and supports run-time diagnostics. Each of the three input channels asynchronously measures the input signals from each point on the baseplate, determines the respective states of the input signals, and places the values into separate input tables A, B and C respectively. Each input table is regularly interrogated over the I/O bus by the I/O Communication Processor located on the corresponding Main Processor. For example, Main Processor A interrogates Input Table A over I/O Bus A. DI Modules continuously execute Forced Value Diagnostics (FVD) which is a self-test diagnostic that detects and signals an alarm for all stuck-at fault conditions typically in less than 500 milliseconds. This safety feature allows unrestricted operation under a variety of multiplefault scenarios. DI Module diagnostics are specifically designed to monitor devices which hold points in one state for long periods of time. The diagnostics ensure complete fault coverage of each input circuit even if the actual state of the input points never changes. For specifications, see Digital Input Components on page 101.

Digital Output Module For Digital Output Modules, each of the three channels includes a proprietary ASIC which receives its output table from the I/O communication processor on its corresponding Main Processor. All DO Modules use the patented Quad Voter circuitry, which is a quadruplicated output circuitry which votes on the individual output signals just before they are applied to the load. This voter circuitry is based on parallel-series paths which pass power if the drivers for

Planning and Installation Guide for Triconex General Purpose v2 Systems

Theory of Operation

15

Channels A and B, or Channels B and C, or Channels A and C command them to close—in other words, 2-out-of-3 drivers voted On. The quadruplicated output circuitry provides multiple redundancy for all critical signal paths, guaranteeing safety and maximum availability. During Output Voter Diagnostics (OVD) execution, the commanded state of each point is momentarily reversed on one of the output drivers, one after another. Loop-back circuitry on the module allows each ASIC to read the output value for the point to determine whether a latent fault exists within the output circuit. The output signal transition is guaranteed to be less than 2 milliseconds (500 microseconds is typical) and is transparent to most field devices. For devices that cannot tolerate a signal transition of any length, OVD can be disabled on a per-point basis. DO Module diagnostics are specifically designed to monitor outputs which remain in one state for long periods of time. The OVD diagnostics ensure complete fault coverage of each output circuit even if the actual state of the output points never changes.

Supervised Digital Output Modules Supervised Digital Output Modules provide both voltage and current loopback, allowing complete fault coverage for both energized-to-trip and de-energized-to-trip conditions. In addition, a Supervised Digital Output Module verifies the presence of the field load by doing continuous circuit-continuity checks. Any loss of field load causes an open-load field error and the load indicator to illuminate.

Pulse Input Module For Pulse Input Modules, each of the three channels independently receives pulse input voltages from each point and converts the values to frequency (RPM) data. Special algorithms, optimized for accurately measuring the speed of rotating machinery, are used to compensate for the irregularly spaced teeth on timing gear or for periodic acceleration or de-acceleration. The results are placed into a table of values. Each input table is passed to its associated Main Processor using the corresponding I/O bus. The input table in each MP is transferred to its neighbors across the TriBus. The middle value is selected by each MP and the input table in each MP is corrected accordingly. In TMR mode, the mid-value is used by the control program; in DUAL mode, the average is used. Special self-test circuitry is provided to diagnose the health state of all input points, even when an active signal is not present. Each Pulse Input Module is guaranteed to remain in calibration for the life of the controller. Periodic manual calibration is not required. For specifications, see Pulse Input Components on page 146.

Solid-State Relay Output Module For Solid-State Relay Output Modules, output signals are received from the Main Processors on each of three channels. The three sets of signals are voted and the voted data is used to drive the 32 individual relays. Each output has a loop-back circuit which verifies the operation of each relay switch independently of the presence of a load. Ongoing diagnostics test the operational status of the SRO Module.

Planning and Installation Guide for Triconex General Purpose v2 Systems

16

Chapter 1

Introduction

The SRO Module is a non-triplicated module for use on non-critical points which are not compatible with high-side, solid-state output switches; for example, interfacing with annunciator panels. For specifications, see Solid-State Relay Output Components on page 165.

International Certifications and Qualifications The Tri-GP controller has been certified as complying with multiple internationally recognized standards by the following internationally recognized certification agencies, these certifications have qualified the Tri-GP for use around the world in safety critical applications. Test reports from the various certification agencies are available upon request. Topics include: •

Canadian Standards Association on page 16

•

Factory Mutual on page 17

•

TÜV Rheinland on page 18

•

European Union CE Mark on page 20

Canadian Standards Association CSA has certified that the Tri-GP v2.x controller is in full compliance with the following internationally recognized electrical safety standards and is qualified for general use in North American and other jurisdictions requiring compliance with these standards. Standard Number

Title

CAN/CSA-C22.2 No.0-M91

General Requirements-Canadian Electrical Code, Part II

CSA Std C22.2 No.0.4-M1982

Bonding and Grounding of Electrical Equipment (Protective Grounding)

CAN/CSA C22.2 No 1010.1-92

Safety Requirements for Electrical Equipment for Measurement, Control, and Laboratory Use, Part 1: General Requirements

UL 3121-1 1998-07-14

Electrical Equipment for Laboratory Use, Part 1: General Requirements

Planning and Installation Guide for Triconex General Purpose v2 Systems

International Certifications and Qualifications

17

Factory Mutual FM has certified that the Tri-GP v2.x controller is in full compliance with the following internationally recognized standards and is qualified for use in Class I, Division 2 Temperature T4, Groups A, B, C, and D hazardous indoor locations. In North America, the field signals used with ATEX-compliant external termination panels are certified for Class I, Division 2, Groups C and D. Standard Number

Title

3611

Electrical Equipment for use in Class I-Division 2; Class II-Division 2; and Class III-Divisions 1 and 2, Hazardous Locations

3810

Electrical and Electronic Test, Measuring and Process Control Equipment

3600

Electrical Equipment for Use in Hazardous (Classified) Locations-General Requirements

Note

For hazardous location applications, redundant power sources should be used for system power. Also, any signal going to or through a hazardous atmosphere must use hazardous location protection, such as an IS Barrier.

Planning and Installation Guide for Triconex General Purpose v2 Systems

18

Chapter 1

Introduction

TÜV Rheinland TÜV has certified that the Tri-GP v2.x is in full compliance with the internationally recognized standards listed below, and thus is qualified for use in the following applications and jurisdictions. •

Emergency safety shut-down or other critical control applications requiring SIL 1-2 certification per the functional safety requirements of IEC 61508.

•

Emergency safety shut-down or other critical control applications in the process sector requiring SIL 1–2 certification per the functional safety requirements of IEC 61511.

•

Burner management applications requiring certification per the requirements of EN 50156-1:2004

•

Burner management applications requiring certification per the requirements of NFPA 85:2007

•

Fire detection and fire alarm applications requiring certification per the requirements of EN 54-2:1997/A1:2006a

Standard Number

Title

IEC 61508, Parts 1-7, 2000

Functional safety of electrical/electronic/programmable electronic safety-related systems

IEC 61511:2004

Functional safety - Safety instrumented systems for the process industry sector

IEC 61131-2:2007

Programmable Controllers Part 2: Equipment Requirements and Test. Overvoltage Category II is assumed.

IEC 61326-3-1:2008

Electrical equipment for measurement, control and laboratory use EMC requirements - Part 3-1: Immunity requirements for safetyrelated systems and for equipment intended to perform safety-related functions (functional safety) - General industrial applications

ANSI/ISA-84.00.01-2004 (IEC 61511-1 Mod)

Functional Safety: Safety Instrumented Systems for the Process Industry Sector - Part 1: Framework, Definitions, System, Hardware and Software Requirements

EN 50156-1:2004

Electrical equipment for furnaces and ancillary equipment. Requirements for application design and installation

EN 50178:1998

Electronic equipment for use in power installations

EN 54-2:1997/A1:2006a

Fire detection and fire alarm systems. Control and indicating equipment.

NFPA 72:2007

National Fire Alarm Code

NFPA 85:2007

Boiler and Combustion Systems Hazards Code, 2007 Edition

a. To comply with the requirements of EN 54-2:1997/A1:2006, the Tri-GP system must be installed in a metal enclosure with a sealed bottom and a closed door, connected to Safety Ground, as described in Enclosing the Controller on page 197, and it must be installed in an area with an access level greater than 2.

Planning and Installation Guide for Triconex General Purpose v2 Systems

International Certifications and Qualifications

Note

19

To comply with standards related to conducted disturbance, a Schaffner® FN 2410 line filter, or equivalent, must be installed between power supplies and baseplates.

For semiconductor manufacturing applications, compliance with these additional installation guidelines is highly recommended: •

Field and logic power supplies should be approved for use in safety extra-low-voltage (SELV) circuits according to the requirements of IEC 61010-1.

•

For installations with voltages greater than 30 Vrms/36 VDC, the controller and associated equipment must be installed in a locked cabinet restricting access to trained personnel only, with a hazardous-voltage warning label attached prominently.

•

For installations with ambient temperatures exceeding 94° F (35° C), the controller and associated equipment should be installed in a locked cabinet restricting access to trained personnel only, with a hot-surface warning label attached prominently.

•

For applications in which continuous, correct system operation must be assured, the controller and associated equipment should be installed in a locked cabinet restricting access to trained personnel only, with a general-hazard warning label attached prominently.

For a physical description of labels, see Appendix D, Warning Labels.

Planning and Installation Guide for Triconex General Purpose v2 Systems

20

Chapter 1

Introduction

European Union CE Mark Based upon the independent TÜV evaluation and test results, Invensys has certified the Tri-GP v2.x controller suitable to use in the European Union and all other jurisdictions requiring compliance with the European Union EMC Directive No. 2004/108/EC and Low Voltage Equipment Directive No. 2006/95/EC. See the EC Declaration of Conformity for details. To ensure maximum reliability and trouble-free operation, the Tri-GP and associated wiring must be installed per the guidelines outlined in this manual. To comply with the CE Mark requirement for emissions and radiated susceptibility, and EU directives, these guidelines must be followed: •

The entire Tri-GP system must be mounted in a metal enclosure with the door closed.

•

Field power supplies must be approved for use in safety extra-low-voltage (SELV) circuits according to the requirements of IEC 61010-1.

EC Declaration of Conformity The following declaration of conformity with the European Union directives for electromagnetic compatibility and low-voltage equipment is provided as a convenience. The declaration is the latest available at publication time and may have been superseded. For updates, contact the Invensys Global Customer Support (GCS) center.

Planning and Installation Guide for Triconex General Purpose v2 Systems

International Certifications and Qualifications

21

Invensys Operations Management, a business group of Invensys plc 26561 Rancho Parkway South Lake Forest, CA 92630 USA EC Declaration of Conformity EU Directives Covered by this Declaration •

2004/108/EC Electromagnetic Compatibility Directive

•

2006/95/EC Low Voltage Equipment Directive

Products Covered by this Declaration Triconex General Purpose System (Triple Modular Redundant Controller) Version 2.x—2101S2, 2201S2, 2301S2, 2302S2, 2302AS2, 2342S2, 2351S2, 2352S2, 2352AS2, 2361S2, 2381S2, 2381AS2, 2401S2, 2401LS2, 2402S2, 2402AS2, 2451S2, 2480AS2, 2481S2, 3101S2, 3201S2, 3301S2, 3311S2, 3351S2, 3361S2, 3381S2, 3382S2, 3401S2, 3411S2, 3451S2, 3481S2, 3482S2, 9764-510F, interconnect assemblies, extender modules, I/O bus cabling, and termination products

Basis on which Conformity is being Declared The product identified above complies with the requirements of the above EU Directives by meeting these standards. 1.

EN 61000-6-4:2007 EN 55011:2007 Gr. 1 Kl. A IEC 61131-2:2007 IEC 61000--6-4:2007 IEC 61131-2:2007

EMC - Emissions Conducted and radiated Radiated interference (class A) Radiated interference (class A) Conducted interference (class A)

2.

EN 61131-2:2007 IEC 61131-2:2007 - 9.5 IEC 61326-3-2:2008 EN 50130-4:2003 EN 61000-4-2:2008 EN 61000-4-3:2006 + A1:2008 + IS1:2009 IEC 61131-2:2007 - 9.8 IEC 61326-3-1:2008 IEC 61326-3-2:2008 EN 50130-4:2003 EN 61000-4-4:2004 IEC 61131-2:2007 - 9.9 IEC 61326-3-2:2008 EN 50130-4:2003 EN 61000-4-5:2006 IEC 61131-2:2007 EN 61000-4-12:2006 IEC 61326-3-1:2008 - Table 1 b-e EN 61000-4-16:1998 + A1:2004

EMC - Immunity Electrostatic discharge Electrostatic discharge Electrostatic discharge Electrostatic discharge Radiated HF fields Fast transient bursts Fast transient bursts Fast transient bursts Fast transient bursts Fast transient bursts High-energy surges High-energy surges High-energy surges High-energy surges Damped oscillatory wave (Ringwave) Damped oscillatory wave (Ringwave) Conducted common mode voltage Conducted common mode voltage

3.

EN 61131-2:2007 EN 61010-1:2007

Product Safety Overvoltage Category II

The technical documentation required to demonstrate that the product meets the requirements of the above directives has been compiled by the signatory below and is available for inspection by the relevant enforcement authorities. The CE mark was first applied in: 2010.

Special Measures and Limitations which Must be Observed The product must be installed and operated as described in the Planning and Installation Guide for Triconex General Purpose v2 Systems. Signed:

Gary Hufton, Director, Control H/W Development Invensys Operations Management 14 September 2010

Planning and Installation Guide for Triconex General Purpose v2 Systems

22

Chapter 1

Introduction

Planning and Installation Guide for Triconex General Purpose v2 Systems

2 System Description

Overview

24

Main Processor Components

35

Communication Components

43

I/O Modules Common Specifications

47

Analog Input Components

49

Analog Input/Digital Input Components

72

Analog Output Components

82

Digital Input Components 101 Digital Output Components 119 Pulse Input Components 146 Solid-State Relay Output Components 165 Interconnect Assemblies 170 I/O Extender Modules 171 End Caps 173 Covers 174

Planning and Installation Guide for Triconex General Purpose v2 Systems

24

Chapter 2

System Description

Overview This chapter describes the hardware components available for Tri-GP v2.x systems. Physically, a Tri-GP system consists of field-replaceable modules, the baseplates upon which modules are mounted, field wiring connections, and a PC used to run the TriStation 1131 software. This section briefly describes these major elements and provides general specifications. A basic Tri-GP system consists of one MP assembly, an optional CM assembly, and I/O assemblies. Assemblies consist of a one or two modules on a baseplate. Assemblies are installed on a mounting plate using interconnect assemblies, extenders, I/O bus cables, and I/O bus terminators. I/O modules communicate with the MPs by means of a triplicated, RS-485, bidirectional communication bus, called the I/O bus. The I/O bus cable can be used to join I/O columns. Each module is fully enclosed to ensure that no components or circuits are exposed—even when a module is removed from the baseplate. Offset baseplate connectors make it impossible to plug a module in upside down, and keys on each module prevent the insertion of modules into incorrect slots. Topics include: •

General Environmental and EMC Specifications on page 24

•

Typical Weight of Components on page 25

•

Cable Flame Test Ratings on page 26

•

Ground Systems on page 26

•

Standard Tri-GP Products on page 28

General Environmental and EMC Specifications The Tri-GP fully meets the requirements of IEC 61131, Part2: Programmable Controllers, Equipment requirements and tests, for environmental withstand and immunity, and electromagnetic compatibility. This table outlines the general environmental and EMC specifications for the Tri-GP controller. For details, see IEC 61131. Specifications

Parameters

Operating temperature

–4° F to +158° F (–20° C to +70° C) ambient (which is the air temperature measured at the bottom of each baseplate), per IEC 60068-2-14, tests Na and Nb

Storage temperature

–40° F to +185° F (–40° C to +85° C) per IEC 60068-2-2, test Bb, IEC 60068-2-1, test Ab, and IEC 60068-2-30, test Db

Relative humidity

5% to 95%, non-condensing

Corrosive environment

Class G3 Level as defined in ISA Standard S71.04, based on exposure testing according to EIA Standard 364-65A, Class III

Planning and Installation Guide for Triconex General Purpose v2 Systems

Overview

Specifications

Parameters

Sinusoidal vibrations per axis

1.75 mm displacement @ 5 to 8.4 Hz (continuous)

25

0.5 g acceleration @ 8.4 to 150 Hz (continuous) 3.5 mm displacement @ 5 to 8.4 Hz (occasional) 1.0 g acceleration @ 8.4 to 150 Hz (occasional) All tests per IEC 60068-2-6, test Fc Shock

15 g, 11 ms, half-sine, 3 axis, per IEC 60068-2-27, test Ea

Electrostatic discharge

IEC 61000-4-2, 4 kV contact, 8 kV air

Conducted susceptibility

IEC 61000-4-4, Fast Transient/Burst, 2 kV power & unshielded AC I/O, 1 kV signal and communication lines IEC 61000-4-5, Surge Withstand, 2 kV CM2/1 kV DM2 AC power and I/O, 1 kV CM2 I/O, shielded and communication, 0.5 kV CM2/0.5 kV DM2 DC power IEC 61000-4-6, RFI, 0.15-80 MHz, 10 V IEC 61000-4-18, Damped Oscillatory Wave, 0.5 kV CM shielded, 2.5 kV CM/1 kV DM unshielded AC I/O & power, 1 kV CM/0.5 kV DM I/O

Radiated susceptibility

IEC 61000-4-3, Radio Frequency Electromagnetic Fields, 80–1000 MHz: 10 V/m, 1.4–2.0 GHz: 3 V/m, 2.0–2.7 GHz: 1 V/m

Conducted emissions

CISPR 11, Group 1, Class A: 0.15–0.5 MHz: 79 dB(µV) quazi-peak/66 dB(µV) average 0.5–30 MHz: 73 dB(µV)quazi-peak/60 dB(µV) average when installed following the guidelines in this manual.

Radiated emissions

CISPR 11, Class A: 30–230 MHz: 40 dB(µV/m) @ 10 m 230–1000 MHz: 47 dB(µV/m) @ 10 m when installed following the guidelines in this manual.

Power interruptions

IEC 61000-4-29, 1 ms battery, 10 ms DC power supply

Typical Weight of Components This table lists the typical weight of components. The baseplate weight is based on baseplate only, not including modules. Component

Weight in Pounds

Weight in Kilograms

Analog Input Module

3.0

1.4

Analog Input Baseplate

2.4

1.1

Analog Output Module

3.1

1.4

Analog Output Baseplate

2.1

1.0

Communication Module

3.3

1.5

Planning and Installation Guide for Triconex General Purpose v2 Systems

26

Chapter 2

System Description

Component

Weight in Pounds

Weight in Kilograms

Communication Baseplate

2.8

1.3

Digital Input Baseplate

2.4

1.1

Digital Input Module

3.0

1.3

Digital Output Baseplate

2.1

1.0

Digital Output Module

3.2

1.4

Main Processor Baseplate

2.7

1.2

Main Processor Module

3.4

1.5

Pulse Input Module

3.0

1.4

Pulse Input Baseplate

2.8

1.3

Relay Output Baseplate

2.3

1.0

Solid-State Relay Output Module

2.9

1.3

I/O Extender Module

0.4

0.2

Cable Flame Test Ratings You can order standard Triconex interface cables and I/O bus cables that meet flame test ratings as described in this table. Cable

Rating

Interface cables

FT4 Vertical Flame Test-Cables in Cable Trays per C.S.A. C22.2 No. 0.3-92 Para 4.11.4a

(connect external termination panels to baseplates) I/O bus cables (connect columns of baseplates)

FT6 Horizontal Flame & Smoke Test-per C.S.A. C22.2 No. 0.3-92 Appendix Bb

a. Cables will be marked with FT4 or CMG rating, but they all actually meet the more stringent FT4 rating. b. Cables will be marked with FT6 or CMP rating, but they all actually meet the more stringent FT6 rating.

Ground Systems The Tri-GP has the following four, separate ground systems: •

Protective earth

—an AC safety ground

•

Field ground

F—a functional earth –

•

Logic ground

L—a functional earth

•

Shield ground

S—a functional earth

Planning and Installation Guide for Triconex General Purpose v2 Systems

Overview

27

The logic and field portions of each module use separate, isolated signal return paths. Each is connected to its own functional earth. The metallic portions of the safety ground act as an electrostatic shield for the internal circuitry. Communication cable shields are terminated to the safety ground. The metallic portions of the Tri-GP controller are connected to the protective earth. For installation procedures, see: •

Grounding Baseplates to Protective Earth on page 198

•

Grounding Logic Power on page 200

•

Connecting Shields to Earth on page 202

Planning and Installation Guide for Triconex General Purpose v2 Systems

28

Chapter 2

System Description

Standard Tri-GP Products The following table lists all of the standard Tri-GP products. Table 1

Standard Tri-GP Products

Model

Product Name

Qty

Description

Consists of

5101S2

Main Processor TriPak

3

Main Processor Module

3101S2

1

Main Processor Baseplate Kit

2101S2

1

Communication Module

3201S2

1

Communication Module Baseplate Kit

2201S2

1

Analog Input Module

3351S2

1

Analog Input Baseplate Kit

2351S2

Analog Input/Digital Input TriPak

1

Analog Input/Digital Input Module

3361S2

1

Analog Input/Digital Input Baseplate Kit

2361S2

Analog Input Tripak, RTD/TC/4-20 mA

1

Analog Input Module

3351S2

1

Analog Input Baseplate, RTD/TC/4-20 mA

2352S2

Analog Input TriPak, HART

1

Analog Input Module

3351S2

1

Analog Input Baseplate Kit, HART,

2354S2

1

Triconex 4850 HART Multiplexer

1600106-001

1

Analog Input Module

3351S2

1

Analog Input Baseplate Kit, HART, Hazardous Location

2354AS2

1

Triconex 4850 HART Multiplexer

1600106-001

5201S2 5351S2 5361S2 5352S2 5354S2

5354AS2

5481-1S2 5482-1S2 5301S2 5311S2 5312S2 5302S2 5401S2 5401LS2 5411HS2

Communication Module TriPak Analog Input TriPak

Analog Input TriPak, HART, Hazardous Location

Analog Output TriPak

1

Analog Output Module

3481S2

1

AO Module Baseplate Kit

2481S2

Analog Output Tripak, HighCurrent

1

High-Current Analog Output Module

3482S2

1

AO Module Baseplate Kit

2481S2

Digital Input TriPak

1

Digital Input Module

3301S2

1

Digital Input Baseplate Kit

2301S2

Digital Input TriPak, High Resolution

1

Digital Input Module, High Resolution

3311S2

1

Digital Input Baseplate Kit

2301S2

Digital Input TriPak, High Resolution, High Voltage

1

Digital Input Module, High Resolution

3311S2

1

Digital Input Baseplate Kit, High Voltage

2302S2

Digital Input TriPak, High Voltage

1

Digital Input Module

3301S2

1

Digital Input Baseplate Kit, High Voltage

2302S2

Digital Output TriPak

1

Digital Output Module

3401S2

1

Digital Output Baseplate Kit

2401S2

Digital Output TriPak, Low Current

1

Digital Output Module

3401S2

1

Digital Output Baseplate Kit, Low Current

2401LS2

Digital Output TriPak, Supervised, High Current

1

Digital Output Module, Supervised

3411S2

1

Digital Output Baseplate Kit, High Current

2401HS2

Planning and Installation Guide for Triconex General Purpose v2 Systems

Overview

Table 1

29

Standard Tri-GP Products (continued)

Model

Product Name

Qty

Description

Consists of

5402S2

Digital Output TriPak, High Voltage

1

Digital Output Module

3401S2

1

Digital Output Baseplate Kit, High Voltage

2402S2

5451S2 5382-1S2 5382AS2 5483S2

5483AS2

2101S2

2281

2291

2292

2301S2

Solid-State Relay Output TriPak Pulse Input TriPak, Enhanced Pulse Input TriPak, Enhanced, Hazardous Location Analog Output TriPak, HART

Analog Output TriPak, HART, Hazardous Location

Main Processor Baseplate Kit

I/O Bus Extender Module Kit

I/O Bus Termination Kit, I/O Baseplate

I/O Bus Termination Kit, MP Baseplate

Digital Input Baseplate Kit

1

Solid-State Relay Output Module

3451S2

1

Solid-State Relay Output Baseplate Kit

2451S2

1

Pulse Input Module, Enhanced

3382S2

1

Pulse Input Baseplate Kit

2381S2

1

Pulse Input Module, Enhanced

3382S2

1

Pulse Input Baseplate Kit, Hazardous Location

2381AS2

1

Analog Output Module

3481S2

1

Analog Output Baseplate Kit, HART

2483S2

1

Triconex 4850 HART Multiplexer

1600106-001

1

Analog Output Module

3481S2

1

Analog Output Baseplate Kit, HART, Hazardous Location

2483AS2

1

Triconex 4850 HART Multiplexer

1600106-001

1

MP Baseplate

3000671-110

1

MP Interconnect Assembly

2920

1

Triconex General Purpose Systems User Documentation (hardcopy)

8910-6S2

1

Accessories Kit

8401

1

Top End Cap – I/O

2910

1

Top End Cap – MP

2912

1

Bottom End Cap – I/O

2911

1

Bottom End Cap – MP

2913

2

I/O Extender Module

3000678-100

3

2-ft. I/O Bus Cables

4000212-002

1

I/O Interconnect Assembly

2921

1

Top End Cap – I/O

2910

1

Bottom End Cap – I/O

2911

1

I/O Extender Module

3000678-100

1

I/O Interconnect Assembly

2921

1

I/O Bus Terminator Kit (Set of 3)

3900064-003

1

I/O Extender Module

3000678-100

1

MP Interconnect Assembly

2920

1

I/O Bus Terminator Kit (Set of 3)

3900064-003

1

I/O Baseplate

3000673-030

1

I/O Interconnect Assembly

2921

1

Slot Cover

2900

1

Terminal Cover

2901

Planning and Installation Guide for Triconex General Purpose v2 Systems

30

Chapter 2

Table 1

System Description

Standard Tri-GP Products (continued)

Model

Product Name

Qty

Description

Consists of

2302S2

Digital Input Baseplate Kit, High Voltage

1

I/O External Termination Baseplate

3000721-310

2

External Termination Panel (Solid State Relay Input)

3000762-110

1

I/O Interconnect Assembly

2921

1

Slot Cover

2900

2

Interface Cable, 10 ft

9105-310F

SSR Input Modules for use with SSR Input ETP 100 to 240 VAC (ordered separately) 2302AS2

2342S2

2342AS2

2351S2

2352S2

2352AS2

2354S2

2354AS2

1300447-001

1

I/O External Termination Baseplate

3000989-315

1

External Termination Panel Kit

9573-610F

1

I/O Interconnect Assembly

2921

1

Slot Cover

2900

1

Terminal Cover

2901

Analog Input/Digital Input Baseplate Kit, External Termination

1

I/O External Termination Baseplate

3000721-140

1

I/O Interconnect Assembly

2921

1

Slot Cover

2900

Analog Input/Digital Input Baseplate Kit, Hazardous Location

1

I/O External Termination Baseplate

3000989-145

1

I/O Interconnect Assembly

2921

1

Slot Cover

2900

1

AI/DI ETP Kit, Hazardous Location

9793-610F

Digital Input Baseplate Kit, Hazardous Location

1

I/O Baseplate

3000675-030

1

I/O Interconnect Assembly

2921

1

Slot Cover

2900

1

Terminal Cover

2901

Analog Input Baseplate Kit for TC, RTD, and 4-20mA (requires 2 of part number 9764-510F)

1

I/O External Termination Baseplate

3000721-110

1

I/O Interconnect Assembly

2921

1

Slot Cover

2900

Analog Input Baseplate Kit, Hazardous Location

1

I/O External Termination Baseplate

3000989-115

1

External Termination Panel Kit

9792-310F

1

I/O Interconnect Assembly

2921

1

Slot Cover

2900

1

I/O HART Baseplate

3000851-020

1

MP Interconnect Assembly

2920

1

Slot Cover

2900

1

Terminal Cover

2901

1

I/O HART Baseplate

3000851-120

1

MP Interconnect Assembly

2920

1

Slot Cover

2900

1

Terminal Cover

2901

Analog Input Baseplate Kit

Analog Input Baseplate Kit, HART

Analog Input Baseplate Kit, HART, Hazardous Location

Planning and Installation Guide for Triconex General Purpose v2 Systems

Overview

Table 1

31

Standard Tri-GP Products (continued)

Model

Product Name

Qty

Description

Consists of

2361S2

Analog Input/Digital Input Baseplate Kit

1

I/O Baseplate

3000675-040

1

I/O Interconnect Assembly

2921

1

Slot Cover

2900

1

Terminal Cover

2901

2381S2

2381AS2

2401S2

2401HS2

2401LS2

2402S2

Pulse Input Baseplate Kit

Pulse Input Baseplate Kit, Hazardous Location

Digital Output Baseplate Kit

Digital Output Baseplate Kit, High Current

Digital Output Baseplate Kit, Low Current

Digital Output Baseplate Kit, High Voltage

1

I/O Baseplate

3000719-110

1

I/O Interconnect Assembly

2921

1

Slot Cover

2900

1

Terminal Cover

2901

1

I/O Hazardous Location Baseplate

3000719-210

1

I/O Interconnect Assembly

2921

1

Slot Cover

2900

1

Terminal Cover

2901

1

I/O Baseplate

3000674-040

1

I/O Interconnect Assembly

2921

1

Slot Cover

2900

1

Terminal Cover

2901

1

I/O Baseplate

3000975-040

1

I/O Interconnect Assembly

2921

1

Slot Cover

2900

1

Terminal Cover

2901

1

I/O Baseplate

3000715-040

1

I/O Interconnect Assembly

2921

1

Slot Cover

2900

1

Terminal Cover

2901

1

I/O Baseplate

3000764-310

1

External Termination Panel (Relay Output ETP)

3000763-110

1

I/O Interconnect Assembly

2921

1

Slot Cover

2900

1

Interface Cable, 10 ft

9106-310F

Relay Output Modules for use with Relay Output ETP (ordered separately)

2402AS2

Digital Output Baseplate Kit, Hazardous Location

SSR, 2 A at 75 to 264 VAC

1300462-001

SSR, 2 A at 4 to 60 VDC

1300471-001

SSR, 1.5 A at 40 to 200 VDC

1300472-001

Power (Dry Contact) Relay; 440 VAC max, 125 VDC max

1300463-001

1

I/O External Termination Baseplate

3000764-310

1

External Termination Panel Kit

9671-610

1

I/O Interconnect Assembly

2921

1

Slot Cover

2900

Planning and Installation Guide for Triconex General Purpose v2 Systems

32

Chapter 2

Table 1

System Description

Standard Tri-GP Products (continued)

Model

Product Name

Qty

Description

Consists of

2451S2

Solid-State Relay Output Baseplate Kit

1

I/O Baseplate

3000676-320

1

I/O Interconnect Assembly

2921

1

Slot Cover

2900

1

Terminal Cover

2901

1

I/O External Termination Baseplate

3000764-510

1

External Termination Panel Kit

9863-610F

1

I/O Interconnect Assembly

2921

1

Slot Cover

2900

2480AS2

2481S2

2483S2

2483AS2

8401

9573-610F

9671-610F

Analog Output Baseplate Kit, Hazardous Location

1

I/O Baseplate

3000674-020

1

I/O Interconnect Assembly

2921

1

Slot Cover

2900

1

Terminal Cover

2901

1

I/O HART Baseplate

3000852-030

1

MP Interconnect Assembly

2920

1

Slot Cover

2900

1

Terminal Cover

2901

1

I/O HART Baseplate

3000852-130

1

MP Interconnect Assembly

2920

1

Slot Cover

2900

1

Terminal Cover

2901

4

MTL4546 Intrinsic Safety Barrier—Isolator

1600107-001

1

Set of Spare Fuses

2

Set of Address Plugs (1 through 10)

3000698-010

1

Set of Address Plugs (11 through 20)

3000698-020

1

Set of Address Plugs (21 through 32)

3000698-030

1

Set of Address Plugs (33 through 43)

3000698-040

1

Set of Address Plugs (44 through 54)

3000698-050

1

Set of Address Plugs (55 through 63)

3000698-060

Digital Input Termination Panel Kit, Hazardous Location (for use with Model 2302AS2)

2

External Termination Panel, DI

3000771-880

2

Interface Cable, 10 ft, DI

4000195-310

Digital Output Termination Panel Kit, Hazardous Location (for use with Model 2402AS2)

1

External Termination Panel, DO

3000769-390

1

Interface Cable, 10 ft, DO

4000196-310

Analog Output Baseplate Kit

Analog Output Baseplate Kit, HART

Analog Output Baseplate Kit, HART, Hazardous Location

Trident/Tri-GP Accessory Kit

Planning and Installation Guide for Triconex General Purpose v2 Systems

Overview

Table 1

33

Standard Tri-GP Products (continued)

Model

Product Name

Qty

Description

Consists of

9764-510F

RTD/TC/AI Termination Panel Kit (for use with Model 2352S2)

1

External Termination Panel, RTD/TC/AI

3000712-100

1

Interface Cable, 10 ft

4000189-510

Signal Conditioning Modules for use with 9764510F (ordered separately) 1600048-220

4–20 mA 320 F to 3920 F (00 C to 2000C), RTD

1600048-030

320 F

1600048-040

(00C

to

6000C),

RTD

320 F to 14000 F (00C to 7600C), Type J TC

1600048-110

320 F

1600048-120

320 F

9792-310F

to

11120 F

to

23720 F

to

7520 F

(00C

(00C

to

to

13000C),

4000C),

Type K TC

Type T TC

1600048-130

320 F to 16520 F (00C to 9000C), Type E TC

1600048-140

Shorting Plug

1600048-300

Analog Input Termination Panel Kit, Hazardous Location (for use with Model 2352AS2)

1

External Termination Panel, AI

3000771-710

1

Interface Cable, 10 ft, AI

4000197-510

Analog Input/Digital Input Termination Panels Kit, Hazardous Location (for use with Model 2342AS2)

1

External Termination Panel, AI

3000771-710

1

External Termination Panel, DI

3000771-880

1

Interface Cable, 10 ft, AI

4000197-510

1

Interface Cable, 10 ft, DI

4000195-310

Analog Output Termination Panel Kit, Hazardous Location (for use with Model 2480AS2)

1

External Termination Panel, AO

3000770-960

1

Interface Cable, 10 ft, AO

4000198-510

Triconex 4850

Triconex 4850 HART Multiplexer

1

Triconex 4850 HART Multiplexer

1600106-001

7254-13S2

TriStation 1131 Developer’s Workbench version 4.8.0 for Tri-GP

1

CD containing:

3000755-829

9793-610F

9863-610F

7255-13S2

8910-5S2

8747-11

TriStation 1131 Developer’s Workbench version 4.8.0 with CEMPLE for Tri-GP

Developer’s Workbench (software) TriStation 1131 Help Documentation (online) 1

TriStation 1131 v4.8.0 Documentation Set

3000760-930

1

CD containing:

3000755-828

Developer’s Workbench (software) TriStation 1131 Help Documentation (online) 1

TriStation 1131 v4.8.0 Documentation Set

3000760-930

Triconex General Purpose Systems User Documentation (hardcopy)

1

Planning and Installation Guide for Triconex General Purpose v2 Systems

9700122-003

1

Communication Guide for Triconex General Purpose v2 Systems

9700123-002

TriStation 1131 version 4.8.0 User Documentation (hardcopy)

1

TriStation 1131 Developer’s Guide

9700100-011

1

TriStation 1131 Libraries Reference

9700098-010

1

Safety Considerations Guide for Trident v2

9700112-005

1

Safety Considerations Guide for Tri-GP v2

9700124-003

1

Safety Considerations Guide for Trident v1

9700096-002

1

Safety Considerations Guide for Tricon

9700097-009

Planning and Installation Guide for Triconex General Purpose v2 Systems

34

Chapter 2

Table 1

System Description

Standard Tri-GP Products (continued)

Model

Product Name

Qty

Description

Consists of

7523-4

Triconex DDE Server 4.3.0

1

CD containing DDE Server software and documentation

3000723-303

1

DDE Server, v4.3.0 Documentation Set (hardcopy)

9700108-004

1

CD containing SOE Recorder and documentation

3000708-430

SOE Recorder, v4.3.0 Documentation Set (hardcopy)

9700081-008

1

CD containing Enhanced Diagnostic Monitor, v2.5.0 (software)

3000796-009

1

Enhanced Diagnostic Monitor, v2.5.0 Documentation Set (hardcopy)

9700107-009

1

CD containing documentation in PDF format

7521-6

7260-7

Contact Invensys for current model number

SOE Recorder version 4.3.0

Enhanced Diagnostic Monitor, v2.5.0

Triconex Documentation Set

Planning and Installation Guide for Triconex General Purpose v2 Systems

Main Processor Components

35

Main Processor Components These Main Processor components are available with Tri-GP v2.x systems. Model

Description

3101S2

Main Processor Module, Tri-GP

2101S2

Main Processor Baseplate, Tri-GP

Each of the three Main Processor Modules control a separate channel and operate in parallel with the other two modules. They communicate with each other by using TriBus, which is a high-speed, fault-tolerant bus. A dedicated I/O control processor on each Main Processor manages the data exchanged between the Main Processor and the I/O modules. The I/O Bus operates at 2 megabits per second. Program Processor

I/O Processor Dual 24 V Power Inputs

Redundant Alarm Relays

Alarm 1 Alarm 2

System Alarm

Debug (RJ-12)

Dual-Power Regulators

+3.3 V +5 V 3.6 V Battery and Monitor

Program Alarm

Debug (RJ-12) I/O Bus

Modbus (DB-9) Clock/NVRAM 8 KB

MPC860A

Reserved (DB-9) Ethernet Network (RJ-45)

Shared Memory 128 K

36-Bit Bus

Flash 6 MB

Tribus (to other MPS)

Figure 6

TriBus FPGA

MPC860A

DRAM 16 MB

Up Stream

Down Stream

Up Stream

Down Stream

Diagnostic Bus Channels (to other MPs)

36-Bit Bus

DRAM 16 MB

Main Processor Architecture

Each Main Processor includes 16 megabytes of DRAM for the control program, sequence-ofevents (SOE) and I/O data, diagnostics, and communication buffers. The control program is stored in flash EPROM and loaded in DRAM for execution. The MP Modules receive power from redundant 24 VDC power sources. In the event of an external power failure, all critical retentive data is stored in NVRAM (Non-Volatile Random Access Memory).

Planning and Installation Guide for Triconex General Purpose v2 Systems

36

Chapter 2

System Description

MP Module Specifications This section includes specifications for the MP Modules, including: •

Control Program Processor on page 36

•

Input/Output Processor on page 37

•

Logic Power on page 37

Control Program Processor This table lists the specifications for the Control Program Processor on the MP Modules. Table 2

Control Program Processor Specifications

Feature

Specification

SX Processor

Motorola® MPC860, 32-bit, 50 MHz

Flash PROM

6 MB used for SX, IOX, and control application storage CRC-protected

DRAM

16 MB used for SX control application execution and program and SOE data Byte parity

NVRAM

8 KB, used for retentive variables CRC-protected

Clock calendar Accuracy during power on

1 sec/day typical 2.2 sec/day maximum

Accuracy during power off, with battery backed up

2.2 sec/day typical 9.2 sec/day maximum

Battery

½ AA lithium, 15-year predicted life

TriBus

25 megabits per second CRC-protected 32-bit + parity DMA

TriStation 1131 port

1 10BaseT Ethernet connector RJ-45 shielded connector on baseplate

Modbus port

1 RS-232/485 DTE DB-9-pin shielded connector on baseplate

Debug port

Used to access diagnostic information RJ-12 connector located on baseplate, shared with IOX debug port

Communication bus

RS-485 2 megabits per second HDLC

Alarm contacts

Redundant, normally closed

Planning and Installation Guide for Triconex General Purpose v2 Systems

Main Processor Components

WARNING

37

There is a danger of explosion if the battery on MP Modules is replaced incorrectly. To ensure a safe battery replacement, you must return MP Modules to Invensys for servicing.

Input/Output Processor This table lists the specifications for the Input/Output Processor on the MP Modules. Table 3

Input/Output Processor Specifications

Feature

Specification

IOX Processor

Motorola MPC860, 32-bit, 50 MHz

DRAM

16 MB, used for IOX execution; byte parity

Shared Memory

128 KB, used to communicate with SX; byte parity

Diagnostic Bus

2 megabits per second HDLC, used to communicate I/O module diagnostic information between MP channels

Debug Port

Used to access diagnostic information RJ-12 connector located on baseplate, shared with SX debug port

I/O Bus

RS-485 2 megabits per second HDLC

Logic Power This table lists the specifications for the logic power on the MP Modules. Table 4

Logic Power Specifications for MP Modules

Feature

Specification

Nominal input voltage

24 VDC

Operational voltage range

24 VDC –15% to +20% + 5% AC ripple (+19.2 to +30 VDC)

Logic power

8 W maximum

Absolute maximum input voltage

33 VDC

Absolute maximum reverse input voltage

–0.6 VDC

Input power interruption time from nominal

1 ms minimum

Repetition rate

1 sec maximum

Reverse current isolation input to input

500 μA maximum

In-rush current per input

2.4 A maximum, 1.2 A for 50 ms, typical

Short circuit current limit per input

2.4 A maximum

Functional-earth-to-logic-ground isolation

0 V, no isolation

Planning and Installation Guide for Triconex General Purpose v2 Systems

38

Chapter 2

System Description

Table 4

Logic Power Specifications for MP Modules (continued)

Feature

Specification

Protective-to-functional-earth isolation

500 VDC

MP Baseplate This figure depicts a front view of the model 2101S2 Main Processor Baseplate, which includes connections for alarm contacts and logic power and communication ports. For details, see Baseplate Connections and Ports on page 39.

Figure 7

Model 2101S2 MP Baseplate

Planning and Installation Guide for Triconex General Purpose v2 Systems

Main Processor Components

39

Baseplate Connections and Ports This figure depicts the connections for alarm contacts, logic power, and communication ports on the MP Baseplate. For specifications, see: •

Alarm Connections on page 40

•

Communication Ports on page 41

•

Logic Power Connections on page 42

Logic Power 1 Fuse Logic Power 2 Fuse Logic Power 1

DSP1

Logic Power 1 Blown Fuse Indicator

Logic Return 1

DSP2

Logic Power 2 Blown Fuse Indicator

ñ

Logic Power 2 Logic Return 2

+ DSP3 FUSE

DSP4

Safety FUSE

Alarm 1

Alarm 1 Blown Fuse Indicator Alarm 1 Fuse Alarm 2 Blown Fuse Indicator Alarm 2 Fuse

Alarm 2 Left Serial Port

Middle Serial Port

Right Serial Port

Left TriStation Port

Left Debug Port

Middle TriStation Port

Middle Debug Port Right Debug Port

Right TriStation Port

1

Figure 8

Node Address

MP Baseplate Connectors and Ports

Planning and Installation Guide for Triconex General Purpose v2 Systems

40

Chapter 2

System Description

Alarm Connections Alarms are asserted when the controller detects either a system alarm or a program alarm. Each MP contains a set of redundant alarm solid-state relays. The relays are normally closed and are connected in series between MP Modules. •

A system alarm indicates a fault in the controller, its power supplies, or field input.

•

A program alarm indicates a problem detected by the control program.

MP Baseplate

MP A

MP B

MP C

Alarm 1/NC Alarm 1/C

Alarm 2/NC Alarm 2/C

This table lists the alarm contacts on the MP Baseplate. Table 5

Alarm Contact Specifications for MP Baseplates

Feature

Specification

Alarm contacts

2, redundant pair, isolated

Rated voltage

±24 VAC/VDC

Operational voltage range

0–30 VDC

Maximum switch voltage

33 V

Maximum switching power

15 W resistive

Maximum off-state leakage

16 VDC (1 A minimum) 210 Ω @ >20 VDC (1 A minimum) 295 Ω @ >24 VDC (1 A minimum) 340 Ω @ >28 VDC (1 A minimum)

Over-range protection

36 VDC, continuous with thermal de-rating 0 VDC, continuous

Switch time on leg failure

1 ms, typical 3 ms, maximum

Functional-to-protective-earth isolation

500 VDC, minimum

Functional-to-functional-earth (logic) isolation

800 VDC, minimum

Planning and Installation Guide for Triconex General Purpose v2 Systems

Analog Output Components

87

AO Baseplate This figure depicts a front view of the Model 2481S2 AO Baseplate.

Planning and Installation Guide for Triconex General Purpose v2 Systems

88

Chapter 2

System Description

This figure is a simplified schematic of the Model 3481S2 or Model 3482S2 AO Module and Model 2481S2 AO Baseplate. 4-Point AO Module

AO Baseplate

Loop Power

Field Power (PS1) + Field Power (PS2) +

A Selector Logic DAC

To Other Points

Load +

B Selector Logic DAC

C Selector Logic

Load – Field Power (PS1) – Field Power (PS2) –

DAC

Figure 34

3481S2 or 3482S2 AO Module and 2481S2 AO Baseplate Schematic

Planning and Installation Guide for Triconex General Purpose v2 Systems

Analog Output Components

89

Typical Field Connections This figure depicts typical field connections for the Model 2481S2 AO Baseplate. +24 V #1

~

+24 V #2

~

RTN

~

Safety

~

+ –

Unused Output Jumper *

1

1

Typical Point (1 of 4 Points Shown)

2

2

3

3

~ ~

4

5

5

6

6

Field Load

7

7

8

8

~ ~

9 10 11 12 13 14 15 16

–

**

4

9 10 11 12 13 14 15 16

+

F

2

~~~~ * Short unused outputs ** Use points 1 through 4 to wire field devices to the baseplate

Figure 35

2481S2 AO Baseplate Typical Field Connections

Planning and Installation Guide for Triconex General Purpose v2 Systems

90

Chapter 2

System Description

AO External Termination Baseplate The AO External Termination Baseplate is used with the Model 9863-610F AO Hazardous Location ETP. The baseplate contains ELCO connectors, which allows connection of External Termination Panels. This figure depicts a front view of the Analog Output External Termination Baseplate, which is available for use with all Tri-GP systems.

2

Planning and Installation Guide for Triconex General Purpose v2 Systems

Analog Output Components

91

This figure is a simplified schematic of the Model 3481S2 AO Module and the AO External Termination Baseplate. 4-Point AO Module

AO External Termination Baseplate

Loop Power Field Power (PS1) Field Power (PS2)

A Selector Logic V+ DAC

B Selector Logic

To External Termination Panel

DAC

C Selector Logic DAC

Figure 36

Field Power (PS1) Field Power (PS2)

3481S2 AO Module and AO External Termination Baseplate Schematic

Planning and Installation Guide for Triconex General Purpose v2 Systems

92

Chapter 2

System Description

Typical Field Connections This figure depicts typical field connections for the AO External Termination Baseplate. +24 V #1

~

+24 V #2

~

24 V Return

~

Shield

~

Safety

–

+

~

S F

~ ~~ ~ ~ Figure 37

6

AO External Termination Baseplate Typical Field Connections

Planning and Installation Guide for Triconex General Purpose v2 Systems

Analog Output Components

93

AO HART Baseplates The Model 2483S2 AO HART Baseplate and the Model 2483AS2 AO HART Hazardous Location Baseplate are used with Model 3481S2 AO Modules. The Triconex 4850 HART Multiplexer mounts directly onto the Model 2483S2 and 2483AS2 baseplates (the Multiplexer is supplied in the Model 5483S2 and 5483AS2 TriPaks). The Model 2483AS2 AO HART Hazardous Location Baseplate should be used in hazardous locations.

CAUTION

The Model 2483S2 AO HART Baseplate and the Model 2483AS2 AO HART Hazardous Location Baseplate can be used only with Model 3481S2 AO modules. Using it with other modules will destroy some of the baseplate components.

For more information, see Appendix C, HART Communication and the Triconex 4850 HART Multiplexer Instruction Manual.

Planning and Installation Guide for Triconex General Purpose v2 Systems

94

Chapter 2

System Description

This figure is a simplified schematic of the Model 3481S2 AO module and the Model 2483S2 AO HART Baseplate with the Triconex 4850 HART Multiplexer. 4-Point AO Module

AO HART Baseplate Triconex 4850 HART To RS232-to-RS485 Converter Connection

Loop Power RS485

A

PWR

Selector Logic

Address

To Address Plug Connection

Field Power (PS1) +

DAC

Field Power (PS2) + B Selector Logic

To Other Points Load +

DAC HART Filter

C Selector Logic

Load – Field Power (PS1) –

DAC

Field Power (PS2) –

Figure 38

3481S2 AO Module and 2483S2 AO HART Baseplate Schematic

This figure is a simplified schematic of the Model 3481S2 AO module and the Model 2483AS2 AO HART Hazardous Location Baseplate with the Triconex 4850 HART Multiplexer. 4-Point AO Module

AO HART Hazardous Location Baseplate Triconex 4850

Safe Area

HART To RS232-to-RS485 Converter Connection

Loop Power RS485

A

PWR

Selector Logic

Address

To Address Plug Connection

Field Power (PS1) +

DAC

30V zener

Field Power (PS2) +

B Selector Logic

Safe Area Hazardous Area

To Other Points Load +

DAC

IS Isolator

HART Filter

C Selector Logic

Load

Load – Field Power (PS1) –

DAC

Field Power (PS2) –

Figure 39

3481S2 AO Module and 2483AS2 AO HART Hazardous Location Baseplate Schematic

Planning and Installation Guide for Triconex General Purpose v2 Systems

Analog Output Components

95

Typical Field Connections

PWR GND

TDA (–)

TDB (+)

This figure depicts typical field connections for the Model 2483S2 AO HART Baseplate.

24V DC

+24 V #1

~

+24 V #2

~

RTN

or

*** To other HART Baseplates or terminated with 100W resistor

S

~

Safety

~

Typical Point (1 of 4 Points Shown)

SHLD

TA

TA

TB

~

TB

J22 SHLD

Shield

RS232/RS485 Converter

J18

J27

~ ~

1 2

*

3 4

~ ~

Field Load

5 6

PWR

7

HOST

8

HART

FAULT

9

Unused Output Jumper **

10 11 12 13 14 15 16

4850 TRICONEX

S

F J19

~~~~ ~ HART AO Baseplate * Use points 1 through 4 to wire field devices to the baseplate ** On points 1 through 4, short any unused outputs *** For RS485 communication wiring, use twisted-shielded conductors run in metal conduit

Figure 40

2483S2 AO HART Baseplate Typical Field Connections

Planning and Installation Guide for Triconex General Purpose v2 Systems

96

Chapter 2

System Description

PWR GND

TDA (–)

TDB (+)

This figure depicts typical field connections for the Model 2483AS2 AO HART Hazardous Location Baseplate.

24V DC

+24 V #1

~

+24 V #2

~

RTN

*** To other HART Baseplates or terminated with 100W resistor

or S

~

Safety

~

Typical Point (1 of 4 Points Shown)

SHLD

TA

TA

TB

~

TB

J22 SHLD

Shield

RS232/RS485 Converter

J18

J27

~ ~

1 2

*

3 4

~ ~

Field Load

5 6

PWR

7

HOST

8

HART

FAULT

9

Unused Output Jumper **

10 11 12 13 14 15 16

4850 TRICONEX

Intrinsic Safety (IS) Isolators **** S

MTL CPS04 Backplane F J19

Safe Area

~~~~ ~

Hazardous Area

HART AO Baseplate * Use points 1 through 4 to wire field devices to the baseplate ** On points 1 through 4, short any unused outputs *** For RS485 communication wiring, use twisted-shielded conductors run in metal conduit **** For ATEX compliance, IS isolators must be used. Triconex tested ATEX compliance using MTL4546 Isolators.

Figure 41

2483AS2 AO HART Hazardous Location Baseplate Typical Field Connections

Planning and Installation Guide for Triconex General Purpose v2 Systems

Analog Output Components

97

AO Hazardous Location External Termination Panel The Model 9863-610F ETP is suitable for use in Zone 2, and Class 1, Division 2 field circuits. The ETP contains extra circuitry designed to limit power available to the field terminals. The circuits have been examined and certified by TÜV Rhineland as being nonincendive. This guarantees that if the field wires are accidentally opened, shorted, or grounded, and the Tri-GP is operating normally, the wiring and attached devices will not release sufficient energy to cause ignition in the specified flammable atmosphere. The Model 9863-610F ETP is compatible with the Model 3481S2 Analog Output Module. Each ETP has: •

Two, eight-position field terminals; support for eight points (only four points supported on the 3481S2 Module)

•

Two terminals per point: Out, Rtn (L+, L–)

•

A four-position terminal for redundant 24 VDC loop power

•

Two, one-position terminals for protective earth connection

The panel supports redundant 24 VDC power sources with diode ORing. However, recommended field power connections are on the AO External Termination Baseplate and routed to the ETP through the interface cable with ELCO connectors. Field energy will not be limited if it is connected to the ETP; it will be limited only if it is connected to the baseplate. Dimensions for Term Panel 9863-610F Width (across DIN rail)

Length (along DIN rail)

Height (out from DIN rail)

4.42 in (11.23 cm)

5.02 in (12.75 cm)

4.25 in (10.795 cm)

Specifications This table describes general specifications for 9863-610F. Table 20

General Specifications for Term Panel 9863-610F

Feature

Description

Panel type

Hazardous location, current output

Points

8

Planning and Installation Guide for Triconex General Purpose v2 Systems

98

Chapter 2

System Description

This table describes cable and load parameters for 9863-610F. Table 21

Cable and Load Parameters for Term Panel 9863-610F

Feature

IEC Symbol

ISA Symbol

Description for Zone 2 Group IIB

Operating temperature range

Tamb

Tamb

32° F to 140° F (0° C to 60° C)

Working voltage

Uw

Uw

30 V

Maximum voltage

Um

Um

32 V

Output Connection (F+) Specifications

Maximum output voltage

Uo

Voc

32 V

Maximum output current

Io

Isc

0.250 A

Maximum output power

Po

Po

1.72 W

C external, maximum

Co

Ca

1.18 µF

L external, maximum

Lo

La

4.95 mH

Planning and Installation Guide for Triconex General Purpose v2 Systems

Analog Output Components

99

Simplified Schematic This figure is a simplified schematic of the Model 9863-610F ETP and the Model3481S2 AO Module with an AO External Termination Baseplate. 4-POINT ANALOG OUTPUT MODULE

AO EXTERNAL TERMINATION BASEPLATE

ELCO CABLE

TERMINATION PANEL

Loop power A

0 ohm

PS1 +

Selector Logic Current loopback

to module

0 ohm

PS2 +

DAC PS1 –

B

Selector Logic

PS2 –

Current loopback

DAC

ATEX Filter

OUT2 Typical point

C

RTN2

Selector Logic Current loopback

DAC

Figure 42

Simplified Schematic of a 9863-610F Panel and a 3481S2 AO Module with an AO External Termination Baseplate

Planning and Installation Guide for Triconex General Purpose v2 Systems

100

Chapter 2

System Description

Typical Connections

C17 L12

SN

C15

C14

REV D

 L11 L5

C12

L4

C10

C5

C3

C2

L3

L1

TRICONEX

  

L15



L13

L14

L9

L10

L7

L8





C35

TB8

R1

TB1—TB4

R2

C44

C43

C42

C41

C40

C39

TB7

C38

C37

!

L2

J1

C19

C22

C7

C24

L17

C20

L18

C8

EXT TERM     7400270

        

This figure illustrates how to connect a 9863-610F to the field (1 of 4 module points shown).

J4

  C25

C27 C45

L-

P1

J5

P2

Typical unused point

Typical point (1 of 8 points shown)

Note: Field power is routed from the baseplate. Do not connect field power to the ETP.

Load

Energy limited

Figure 43

Field Wiring for 9863-610F with a 3481S2 AO Module

CAUTION Note

Not energy limited

• Unused points must be shorted together. • For more information about installing the Tri-GP in hazardous locations, see Application-Specific Installation Guidelines on page 182.

The Model 3481S2 AO Module has only four outputs, so points 5 through 8 on the ETP are not connected and are not required to be shorted together.

Planning and Installation Guide for Triconex General Purpose v2 Systems

Digital Input Components

101

Digital Input Components These Digital Input components are available with Tri-GP v2.x systems. For installation procedures, see Component Installation on page 185. Model

Description

Voltage

Type

3301S2

Digital Input Module

24 VDC

Commoned

3311S2

Digital Input Module, High Resolution

24 VDC

Commoned

2301S2

Digital Input Baseplate

Direct Termination

n/a

Digital Input External Termination Baseplate

External Termination

2302S2

High-Voltage DI Baseplate Kit, includes: Digital Input External Termination Baseplate, two Solid State Relay Input External Termination Panels, two 10-foot Interface Cables

9573-610F

Digital Input Hazardous Location External Termination Panel

Note

115 VAC

External Termination, Interposing Relays

External Termination

When ordering the High-Voltage DI Baseplate Kit, you can order interface cables in increments of 10 feet by specifying part number 4000195-3xx, where xx equals the length in feet. When ordering the 9573-610F ETP, you can order interface cables in increments of 10 feet by changing 9573-610F to 9573-6xx, where xx equals the length in feet. The maximum length for interface cables is normally 100 feet. Contact the Invensys Global Customer Support (GCS) center if you require cables longer than 100 feet.

Digital Input (DI) Modules have three independent channels which process all data sent to the module. An ASIC on each channel scans each input point, compiles data, and transmits it to the MPs upon demand. Input data is voted at the MPs before processing to ensure the highest integrity. DI Modules sustain complete, ongoing diagnostics for each channel. If the diagnostics detect a failure on any channel, the Fault indicator is activated, which in turn activates the system alarm. The Fault indicator points to a channel fault, not a complete module failure. The DI Module is guaranteed to operate properly in the presence of a single fault and may continue to operate properly with certain multiple faults. DI Modules continuously verify the ability of the system to detect transitions to the opposite state. The DI Module supports hot sparing for online replacement of a faulty module or continuous back-up to an active module. The DI Module is mechanically keyed to prevent improper installation in a baseplate.

Planning and Installation Guide for Triconex General Purpose v2 Systems

102

Chapter 2

System Description

DI Module 3301S2 This figure is a simplified schematic of the Model 3301S2 DI Module. Triplicated I/O Bus

Digital Input Module Typical Point (1 of 32)

ADC

ASIC

Isolated Bus Transceiver

A

ASIC

Isolated Bus Transceiver

B

ASIC

Isolated Bus Transceiver

C

Isolation Filtering

Individual Point Field Terminations

DAC

ADC

DAC

ADC

DAC

Figure 44

3301S2 DI Module Simplified Schematic

Planning and Installation Guide for Triconex General Purpose v2 Systems

Digital Input Components

103

This table lists the specifications for the Model 3301S2 DI Module. Table 22

3301S2 DI Module Specifications

Feature

Specification

Points

32, commoned

Nominal input voltage

24 VDC

Operational voltage range

19.2–30 VDC

Absolute maximum input voltage

33 VDC

Absolute maximum reverse input voltage

–0.6 VDC

Input delay

ON to OFF or OFF to ON Time constant = 2.86 msec, - 3dB @ 55hz

Input impedance

>30 kΩ without baseplate ≈3 kΩ with baseplate

Input power

0.2 W/pt, @ 24 VDC 0.5 W/pt, @ 33 VDC

Input threshold

0–5 VDC = Off region 6–14 VDC = transition region 15–30 VDC = On region

Diagnostic (loss of view)

Force-to-value diagnostic (FVD),