1
2
3
DESIGN INFORMATION
4
5
6
7
8
9
10
11
DESIGN AND FABRICATION TABLE
PRINTED CIRCUIT BOARD MANUFACTURING PROCESS
MANUFACTURING DRAWINGS SHOULD INCLUDE A DESIGN AND FABRICATION TABLE AS SHOWN BELOW. THE DRAWING SHALL CONTAIN DIMENSIONS REFERENCING NPTH AND PTH HOLES TO AN ORIGIN OR DATUM. FOR FULL DETAILS ON DIMENSIONING AND TOLERANCING OF PRINTED BOARDS REFER IPC-D-300G.
LAND SIZE
A
TRACK TO PAD
HOLE SIZE
MULTI- LAYER BOARDS ONLY
CUSTOMER PAD TO PAD
TRACK WIDTH
NPTH
ACCOUNTS
- GERBER FILES
STORE MATERIAL ISSUE
SUPPLIERS
A
Copies of this table are available from Morris Productions in a DXF file or Protel formats.
DESIGN INFORMATION
ELECTRICAL TEST
PREFERRED INPUTS NEEDED
12
- EG. BURIED VIAS
BOARD TECHNOLOGY :
TRACK TO TRACK
BOARD SIZE :
- PROTEL PCB FILE TRACK TO BOARD EDGE
IMAGE
- 1:1 PHOTOPLOTS
EXTERNAL SIGNAL LAYERS FEATURE
SPECIAL
+0.50mm +0.70mm 0.20mm 0.20mm 0.53mm 0.53mm
ON APPLICATION 0.125mm 0.125mm 0.53mm 0.53mm
* PTH - LAND SIZE * NPTH - LAND SIZE TRACK WIDTH TRK/PAD TO PAD/TRK TRK TO EDGE (min) ** TRK TO NPTH (min) **
B
FEATURE
STANDARD
* PTH
STANDARD
SPECIAL
+0.50mm
ON APPLICATION 0.125mm 0.125mm 0.50mm 0.50mm
- LAND SIZE
0.20mm 0.20mm 0.50mm 0.50mm
TRACK WIDTH TRK/PAD TO PAD/TRK TRK TO EDGE (min) ** TRK TO NPTH (min) **
ORDER ACCEPTANCE
- MANUFACTURING DRAWINGS SHOWING ALL DIMENSIONS & SPECIFICATIONS
INTERNAL SIGNAL LAYERS
PCB DESIGN
- NC DRILL AND ROUT FILES - TECHNICAL STANDARDS (DESIGN RULES USED)
Land size, minimum = a + 2b +c
- PERFORM DESIGN RULE CHECKS
where: a = Maximum diameter of the finished hole b = Minimum annular ring requirements ( see 9.1.2)
- STEP UP ARTWORK TO DESIRED FORMAT SIZE
** Min. distance between conductive area and the edge of a board is calculated by adding 0.4mm to the minimum electrical clearance as determined in IPC-2221, IPC-2222. Table 6-1. For 0-100 Volts a spacing of 0.13mm is required for a PCB with external conductors. (Thus 0.4mm + 0.13mm = 0.53mm). For 0-100 Volts a spacing of 0.10mm is required for a PCB with internal conductors. (Thus 0.4mm + 0.1mm= 0.5mm).
- PRODUCE DRILL AND ROUT FILES
Lands for surface mounting are covered extensively in this Standard and IPC - SM - 782A, as well as the various recommendations laid down by component manufacturers.
- PRODUCE ELECTRICAL TEST JIG FILES
FEATURE
LAND SIZE
AIR GAP
WEB
PRODUCTION TOOLING
- CHECK REGISTRATION - ENSURE DRILL PATTERN ON TEST BOARD MATCHES ARTWORK
INNER LAYER(S)
- LAMINATE DRY FILM (PHOTO SENSITIVE RESIST)
AIR GAP
PRESSING
INNER LAYER(S)
NORMALISE
LAY-UP
PREPARATION
- REMOVE UNWANTED COPPER
- REMOVE PHOTO RESIST
- BLACK OXIDE (IMPROVES ADHESION AT BONDING STAGE)
- INSPECT ( Q.C)
- VISUAL INSPECTION
- PUNCH REGISTRATION HOLES
- CONDITION ( REMOVE MOISTURE)
(MIN. TRACKS/PADS/CLEARANCE IN 0.025mm (0.001")
- ALL LAYERS LAID TOGETHER, INTERLEAVED WITH PREPREG, MOULD RELEASE FILM AND PRESS PLATES.
CIRCUIT TYPE :
PWR/GND TO BOARD EDGE
DS
PTH
ML
No. OFF _____ AS SHOWN
No. OFF TOTAL 4 LAYER BOARD AS EXAMPLE
VIAS :
18um Foil
- DEVELOP
NONE
ONE SIDE
FEED THROUGH
TENTED
UNIQUE DRILL
MIXED
TWO SIDES
BURIED LAYER SEQ ____________
B
BLIND LAYER SEQ ____________
PREPREG (0.35mm)
PHOTO RESIST
- ADD VENTING, LOGOS CODING ETC.
PHOTO RESIST
BASE COPPER TYP. 18/35um
FR4 SUBSTRATE (TYP. 0.71mm)
REMOVE UNWANTED COPPER
LAYER CONSTRUCTION PER :
ARTWORK :
FR4 SUBSTRATE (TYP. 0.71mm)
- ENSURE ARTWORK MEETS MANUFACTURING REQUIREMENTS
TRACK
PAD
PAD
TRACK
LAMINATION SEQUENCE
AS SHOWN
PREPREG (0.35mm)
18um Foil
- PREPARE FINAL NC TOOLING FILES
SPECIAL
+0.50mm +0.55mm +0.90mm +1.00mm 0.25mm 0.25mm 1.27mm 0.50mm
ON APPLICATION " " " " " 0.50mm
PAD
TRACK
MANUAL
CAD
TYPE
ARTWORK/PATTERN MASTER LIST
REFER TO MORRIS' STANDARD MULTI-LAYER COMBINATIONS FOR DETAILS ON TYPICAL LAYUPS USING MATERIALS COMMONLY HELD IN STOCK.
DESCRIPTION
DRAWING No./CAD FILE REF.
ISS
ARTWORK/FILM REF
GERBER FILE REF
ISS
AFTER PRESSING AND TRIMMING OF THE BOARD, THE MANUFACTURING PROCESS IS THE SAME AS FOR DOUBLE SIDED BOARDS.
DOUBLE SIDED AND MULTI-LAYER BOARDS
MATERIAL : C
GLASS FIBRE EPOXY RESIN NEMA GRADE FR4 (IPC - 4101)
REFLOW SOLDER PROCESS
OTHER THICKNESS : NI/GOLD PLATE EDGE CONTACTS
** Min. distance between conductive area and the edge of a board is calculated by adding 0.4mm to the minimum electrical clearance as determined in IPC-2221, IPC-2222. Table 6-1. For 0-100 Volts a spacing of 0.1mm is required for a PCB with internal conductors. (Thus 0.4mm + 0.1mm = 0.5mm). However, for PWR/GND to board edge a clearance of 1.27mm is preferred. It is not necessary to have a land around a pin which does not make connection to anything on that plane. If a land is placed around a component lead, it increases the chance of a short occuring if a small slither of copper bridges the land and a plane
PWR AND GND TO NPTH
SS
FINGER CONNECTOR DIM PER :
TOLERANCE :
REFLOW SOLDER
SOLDER MASK
INSPECT
1.2mm
1.6mm
2.4mm
IN A/W IPC - D - 300G CLASS
3.2mm
OTHER + / -
IN A/W IPC - D - 300G CLASS
AS SHOWN
COPPER (FINISHED) :
STRIP SOLDER EDGE CONTACTS
CLEAN
0.8mm
BOW AND TWIST :
- LAB TEST LAND SIZE
(REFER ALSO PROFILING INFORMATION)
(MINIMUM ANNULAR RING 0.05mm (0.002")
- HIGH PRESSURE/ TEMPERATURE VACUUM CURING CYCLE - CONTROLLED COOLING CYCLE
- IMAGE (EXPOSE WITH NEGATIVE PHOTOTOOL)
- PROVIDES STRESS RELIEF AND AIDS DIMENSIONAL STABILITY
* For further details on land size calculations refer IPC -2221 IPC-2222. This standard is also endorsed as Military Standard. Typically, web size is determined by dividing 60% of the minimum land size by the number of webs required. If a larger land size is used, the web size is reduced to allow adequate soldering dwell time. (Ensure that the web size is not thinner than the minimum
FIN HOLE SIZE (D)
NPTH
INNER LAYER(S)
STRIP DRY FILM
- PREPARE WORK INSTRUCTIONS
STANDARD
LAND SIZE * D=3.0mm CLEAR. PAD *D=3.0mm WEB (CONDUCTOR) * AIR GAP PWR/GND TO BRD EDGE ** PWR/GND TO NPTH **
- SPECIFIED MATERIAL CUT TO REQUIRED FORMAT SIZE
ETCH
- GENERATE PRODUCTION
INTERNAL POWER AND GROUND LAYERS
FIN HOLE SIZE (D)
ENGINEERING PLANNING
- CHECK CUSTOMER DOCUMENTATION, DATA, GERBER FILES / ARTWORK SPECIFICATIONS
Refer to IPC-2221 Section 9.0 - Holes/Interconnections. This standard is also endorsed as Military Standard.
C
MATERIALS PURCHASING
- DIMENSIONED OUTLINE DRAWING
* Land-to-hole relationship is established by the following equation:
GND AND PWR CLEARANCE PAD
MATERIAL CUT
(mm)
X
TRACK TO NPTH
OUTER :
18um
35um
70um
INNER SIG :
18um
35um
70um
INNER PWR :
18um
35um
70um
STRUCTURE :
STANDARD 'MORRIS PRODUCTIONS' LAYUP AS PER DRAWING
AS SHOWN
DRILLING : PAD TO RESIST
VIEWED FROM :
D
ELECTROLESS NICKEL / IMMERSION GOLD PROCESS
PAD TO RESIST:(LIQUID PHOTOIMAGEABLE) (EPOXY SCREEN PRINT) MASK TO MASK BLOCKOUT
NPTH :
0.05mm (min) 0.25mm 0.15mm
STRIP SOLDER HOLE PREPARATION
DRILLING
Vias which are to be tented &/or filled with resist must be specified in your documentation. Note also, vias which are to be tented (covered) with solder resist, must have a maximum finished hole size no greater than 0.6mm. A unique hole size should be used for these vias so that they can be identified during manufacture.
VIA (MASKED)
- HIGH PRESSURE WATER RINSE
INSPECT
CLEAN
- 2ND COPPER PLATE (BUILD UP COPPER TO FINAL THICKNESS)
- DESMEAR/ ETCHBACK
- 1ST COPPER PLATE
- IMAGE (EXPOSE WITH POSITIVE PHOTOTOOL)
- TIN/LEAD PLATE
SOLDER MASK
ETCH
- PHOTOIMAGEABLE SOLDER MASK
- REMOVE UNWANTED COPPER (TIN/LEAD PROTECTS COPPER PATTERN)
- REMOVE PHOTO RESIST
SCREEN PRINT LEGEND
ELECTROLESS NICKEL / IMMERSION GOLD
PROFILING
PATTERN MASTER LIST
ETCHING
REFER PATTERN MASTER LIST
NONE
COMP.
SOLD.
- Q.C
WHITE
SOLDER RESIST :
- VISUAL INSPECTION
COLOUR :
YELLOW
OTHER
LIQUID PHOTOIMAGEABLE GREEN
BLUE
MATTE
GLOSS
SCREEN PRINT
YLW/GRN
OTHER
SOLDER RESIST
HOT AIR LEVEL (SMOBC) PROCESS
TRACK FINISH :
SELECTIVE SOLDER
REFLOW TIN/LEAD
ELECTROLESS Ni/Au - 0.1 / 0.2um GOLD OVER 3.0um NICKEL
DEPOSITION OF ELECTROLESS COPPER NOM. THK 2.0 um
PHOTO RESIST AND UNWANTED COPPER REMOVED
PHOTO RESIST
REFER PATTERN MASTER LIST SCREEN PRINT LEGEND
DRY FILM TENTS(COVER) NPTH
INSPECT
CLEAN
HOT AIR LEVEL
SOLDER MASK
- PHOTOIMAGEABLE SOLDER MASK
TIN/LEAD OVER COPPER
Typical colours available are white, yellow and black ; and made SOLDER REMOVED
NOTES. 1: LAB TEST INCLUDES ALL TESTS THAT ARE REQUIRED TO PROVE PROCESS CAPABILITIES, BUT ALSO THOSE TESTS (SUCH AS MICROSECTIONS), AND DOCUMENTATION NEEDED TO MEET CUSTOMER REQUIREMENTS INCLUDING IPC CERTIFICATION LEVELS AND MILITARY SPECIFICATIONS.
CONDUCTOR WIDTH : - To obtain minimum design conductor width refer tables such as those in IPC - 2221, IPC-2222 for the relevant current ratings. To allow for processing effects such as pits, nicks, undercut etc, artwork track width should be drawn 0.05mm (0.002") wider for 35um (1oz) foil.
AS SHOWN
- LAB TEST
STRIP SOLDER
ARTWORK ALLOWANCES
REMOVE PADS
BOTH
BOARD FINISH :
NI/GOLD PLATE EDGE CONTACTS
EDGE BOARD CONTACTS :
- LAB TEST
LEGEND TO BOARD EDGE
PADS REMOVED
2nd DRILL
COLOUR :
- DEVELOP
COMPONENT HOLE 0R VIA
D
OTHER
DESPATCH
- INSPECT (Q.C)
0.15mm 0.15mm 1.00mm 0.25mm 0.25mm
NC_DRILL FILES
20um
TENTED
LEGEND / SCREEN PRINT :
NICKEL / GOLD
MINIMUM
LINE THICKNESS TEXT THICKNESS TEXT HEIGHT LEGEND TO PAD LEGEND TO EDGE
LEGEND TO PAD
- VISUAL CHECK
- LAMINATE DRY FILM (PHOTO SENSITIVE RESIST)
NPTH (LANDLESS OTHERWISE 2ND DRILLING)
FEATURE
SECOND PLATE
- CHEMICAL DEPOSITION OF COPPER TO ALL DRILLED HOLES
- LAB TEST
LEGEND TEXT HEIGHT
IMAGE
STRIP DRY FILM
FINAL ACCEPTANCE TESTING
- LAB TEST
THICKNESS LINES AND TEXT
R1
FIRST COPPER PLATE
SOLDER REMOVED
Morris Productions uses solder resist that complies with MIL-I-46058 and meets the requirements of IPC-SM-840. Available in both liquid imageable and screen print, typical thickness is 15-20um and 20-25 um respectively. Photoimageable solder resists are preferred for surface mount applications. UL approved resists are also available. Typical colours available are green, green / yellow, and blue : other
E
WIRING SIDE
AS SHOWN
PTH MINIMUM COPPER THICKNESS :
MASK TO MASK BLOCKOUT
VIA (TENTED)
REFERENCE :
STANDARD
FEATURE
COMPONENT SIDE
ELECTRICAL TEST
SOLDER RESIST
OTHER
E
1.3um HARD GOLD OVER 5.0um NICKEL HARD FINISH GOLD PLATE
OTHER
LEGEND
STRIP SOLDER EDGE CONTACTS
AS SHOWN
REFER
- SOLDER APPLIED TO BARE COPPER (PADS, VIAS ETC)
COPPER
- Q.C
ELECTROLESS NICKEL / GOLD
USE PROFILE/ROUT TAPE SUPPLIED REFER PATTERN MASTER LIST
SOLDER RESIST
SQUARE CUT
- LAB TEST
PROFILING : TIN/LEAD
SELECTIVE SOLDER
AS DIMENSIONED , MEASURED AND CUT FROM SPECIFIED DATUM. REFER PCB BLANK
PHOTO RESIST
ACCEPTABILITY :
2 : THE PROCESSES SHOWN IN THIS DIAGRAM ARE TYPICAL OF MOST PCB MANUFACTURERS. PLEASE CHECK WITH YOUR MANUFACTURER WITH REGARD TO SPECIAL REQUIREMENTS.
DWG No.
N.C. ROUT
BLANK
MATERIALS AND WORKMANSHIP FOR ALL PRINTED WIRING BOARDS MUST MEET OR EXCEED THE REQUIREMENTS OF : CLASS
IPC - 6011, IPC - 6012 SOLDER RESIST
V- GROOVE
1
2
3
U.L CERTIFICATION MIL -P- 55110D
CONDUCTOR SPACING : - Refer electrical conductor spacing table as published in IPC -2221, IPC-2222 . To ensure minimum spacing allow 0.05mm (0.002") on artworks with 35um (1oz) copper.
OTHER __________________
ADDITIONAL REQUIREMENTS :
RECOMMENDED MULTILAYER LAYUP COMBINATIONS
To aid our Pre-production Engineers the designer should ensure that the following is adhered to : -
These layups are for 1.6mm nominal thickness. For thicker or thinner PCB's, please contact our Sales Engineer or PCB Designer. Foil lamination uses a 0.05mm maximum thickness resin backed foil.
8 LAYER BOARD
* SHEETS PREPREG
CORE THK(mm)
* SHEETS PREPREG
Cu (um) PER SIDE
Conventional Build CORE THK(mm)
Foil Foil
18/00
.25
.71
G
18/00
35/35
35/35
Foil
18/00
.25
35/35
.18
35/35
2xA
.18
35/35
2xA
Foil
18/00
* SHEETS PREPREG
Conventional Build CORE THK(mm)
Cu (um) PER SIDE
Foil
18/00
.38
0
CORE THK(mm)
Cu (um) PER SIDE
.15
18/00
.25
35/35
* SHEETS PREPREG
.25
35/35
.25
35/35
Foil
35/35
18/00
Cu (um) PER SIDE
SHEETS PREPREG
.15
18/00
* Overall thickness of the board can be altered by varying the quantity & type of prepreg. Morris standard prepreg types are as follows: A = 1 piece of 1080 prepreg with an approximate finished thickness of 0.07mm B = 1 piece of 7628 prepreg with an approximate finished thickness of 0.175mm. Note - approximate finished thickness can vary with the amount of copper area.
.15
35/35
Cu (um) PER SIDE
.15
35/35
.15
35/35
.15
35/35
.15
35/35
.15
35/35
2xA
2xA
2xA
1xB
.15 .15
2xA Foil
35/35
.15
18/00
35/35
2
3
2.4mm +/- 0.1mm TYP ROUTER DIA
2.4mm +/- 0.1mm TYP ROUTER DIA
Capabilities - netlist testing - analyse and create netlist for PCB's upto 24 layers - high complexity designs - Fine Pitch SMD to 0.25mm pitch and below - low volume work - high speed discharge test - Ball Grid Array - Fault Finding capability for Netlist Testing
2.0 +/- 0.2mm
V - Groove Detail Test Parameters
Test Method - 12 volt digital Voltage Test - 12 volt Resistance Test - breakpoint 70 kOhms
Test Method - Analogue Voltage Test - 0.5 to 500 VDC (programmable) Resistance Tests - 1Ohm to 500MOhms (programmable)
Board Dimensions 0.8mm = 0.16mm * Min Size = 80 x 80mm 1.6mm = 0.50mm 2.4mm = 0.80mm Max Size = 400 x 400mm * - not applicable to panelised boards
Card Size (Maximum)
Tolerances V-Groove depth = +/- 0.1mm V-Groove to V-Groove = +/- 0.2mm V-Groove to Board Edge = +/- 0.2mm
4
- 863 x 609mm
5
4 NPTH HOLES 0.6 to 0.8 DIA EQUALLY SPACED
0.8 +/- 0.1mm
Board Thickness
V -Groove Width 0.5 mm Min Track or Pad
3.5 mm Min
45
+/- 5
PHYSICAL Plating adhesion Conductor Peel Strength Solderability Thermal Stress (solder float test)
ELECTRICAL Continuity Current Carrying Capacity Co-Planer and layer to layer insulation. Dielectric withstanding voltage test to IPC -6011, IPC-6012 class 3 (1 KV DC for 30
MICROSECTION Plating Thickness Plating Quality Interconnection hole/inner layer Hole Quality Annular Ring (internal) Layer Registration Copper thickness (inner) Dielectric Separations Pre-production Integrity Checks Board Integrity following We recommend customers approve production tooling generated from their own information. This may reveal errors in design, manufacturability or potential design improvements. For large production runs, we also recommend that pre-production samples be obtained. Both Morris and our customers are then assured of the boards suitability for manufacture, and can see at first hand the quality expected. If either option is not requested the customer must accept responsibility for errors due to incorrect data supplied.
Aging and storage of your PCB's impacts upon solderability and flatness therefore the following general guidelines should be applied: - clean, tidy environment, - avoid allowing the board to come into contact with silicones (hand creams, etc), sulphur -containing material which may degrade solderability. - avoid abrasive materials,moisture and handling edge contacts. - boards should be left in sealed and dessicated bags - should be stoved flat for a min. 6 hrs at 115 - 120 deg C in an air circulating oven immediately prior to assembly to remove moisture wicking (ingress of moisture absorbed by epoxy glass at board edge). Failure to perform this function and applying rapid heating (eg. hand soldering) can result in localised separation of the inner layer surfaces(delamination)..
NONE
8
PER ORDER
FOIL
LEGEND
MANUFACTURER'S CERTIFICATION :
2
F
3
REFER ______
OTHER __________
AS/NZS ISO 9001 PER ORDER
NONE
REFER ______
HOLE DATA SYMBOL SIZE (FIN) TYPE
HOLE SIZE TOLERANCE ON HOLE SIZE
SOLDER PASTE STENCILS
NPTH HOLES
0 TO 0.8 0.81 TO 1.6 1.61 TO 5.0
Morris can provide you with the stencil only, the stencil mounted in your frame, or, the stencil mounted in a frame by us. The frame will be custom designed to your
ORDER
DRAWN
CHKD
PL GR
PL PL
GR
PL
+ / - 0.05 + / - 0.05 + / - 0.10
G
Head Office : 2-12 Harp Street, P.O. Box 196, Campsie, N.S.W., Australia 2194 Telephone: (02) 97896200 Facsimile: (02) 97872529 Modem: (02) 97188671 Email :
[email protected] Web Site: www.morris.com.au
Quality, service and fast turn around have made us leaders in the Australian Market for Chemically milled Solder Paste and Glue Stencils. These are available with a shim thickness range of 0.010", .008" , .006", .005" and .004". . It is strongly recommended that you contact your printed circuit board assembler to determine the desired aperture size opening, fiducial marks, mounting position and the thickness of the stencil. Morris prefers to work from Gerber Files and aperture table. The ap erture size should be the same as for the lands used on your track artwork. There is no need to reduce the size of the lands on the solder paste artwork, as Morris must reduce your artwork to allow for etch factors. If the assembler requires a smaller aperture opening than the land size used, then Morris will allow for this as well. For Gerber files, it is preferred if you create your pads as flashes ( rather than as shape fills).
MORRIS CIRCUITS & MORRIS GRAPHICS CERTIFIED BY : -
PTH HOLES
+ / - 0.03 + / - 0.05 + / - 0.08
This publication is copyright and all rights are reserved. Other than as permitted under the Copyright Act, no part may be reproduced by any process without the written permission of Morris Productions Pty Limited. The information contained in this publication is based upon IPC standards. The information is advisory only and its use or adaption is entirely voluntary. Morris Productions Pty Limited and its servants or agents shall not be responsible for continued currency of the information or fo r any errors, omissions or inaccuracies in this publication arising from negligence or otherwise howsoever or for any consequense arising therefrom. EXAM
APPD
DATE
ISS
JF
GE
25.5.92
1
REDRAWN
JF
GE
6.3.95
2
REDRAWN
JF
GE
10.7.98
3
AMENDMENTS
MORRIS PRODUCTIONS H
MORRIS CIRCUITS
PRINTED CIRCUIT BOARD DESIGNERS GUIDE BLOCK DIAGRAM
0.1 max deviation
7
1
OTHER __________________
REQUIRED
PACKAGING AND HANDLING :
MIL - P - 55110D
IPC CLASS
QUANTITY
9
SHEET 1 OF 1
MD1001
AS/NZS ISO 9001 : 1994
Specific inspection, acceptability, packaging and handling methods are detailed in IPC-2221,
6
SAMPLE PLAN
MIL - P - 55110D
MANUFACTURER'S LOGO :
Handling & Storage of PCB's
INTERNAL BREAKOUT METHOD
STANDARD BRIDGE METHOD
Test Parameters
Card Size (Maximum) Single Sided Test - 488 mm x 406mm Double Sided Simultaneous Test - 325mm x 244mm (Top)
VISUAL General Appearance Cleanliness Plating Appearance Etched line widths and Spacings.
5.0 +/- 0.2mm
Typical routing breakout methods
Probot - Flying Probe Testing
2.5 +/- 0.2mm
Capabilities - testing to known good board or netlist - analyse and create netlist for PCB's upto 24 layers - high complexity designs - Fine Pitch SMD to 0.5mm pitch and below - high volume work - Fault Finding capability for Netlist Testing - Simultaneous Double sided Testing
Morris can provide customers with a range of Quality Assurance Certifications dependent on need. Certificates of Conformance can be attained to customer's own specification, IPC-6011, IPC -6012 or Military Standards such as MIL-P-55110D. Microsectioning is the means by which Quality Assurance can be tested but requires the destruction of a good board. Rather than destroying a good board, Test Coupons (refer IPC-2221, IPC -2222 Section 12.4.3.1) positioned alongside and/or between pairs ( or as a "popout" within the board outline) will exhibit all the basic qualities of the production board. Tests and Inspections that can be carried out are as follows:-
- the smallest rout bit diameter should be equal to or greater than the board thickness - rout bit tolerance(+/-0.1mm) should be taken into consideration when determining finished board size especially panelised boards - if panelised then breakout point positioning and number must taken into consideration to aid in the mechanical strength of the PCB. Typically the distance between breakouts is 50 - 80 mm. Refer to drawing below. - preferred router bit size is 2.0mm
Holes greater than 6.50mm are either stitched drilled, hand machined or routed, and preferably nonplated.
35/35
2xA
The fibreglass core thickness does not include the foil (copper thickness). The required board thickness should be stated as the finished size (after plating and addition of solder resist), however, in critical areas, such as edge connectors, the thickness tolerance may be more stringent . Overall board thickness tolerances in general, (including double and single boards) should be in as per IPC - D - 300G, and typically + / - 0.2mm.
1
CORE THK(mm)
18/00
1xB
2xA
Foil
CORE THK(mm)
Conformance Testing
Morris stocks a full range of both drill and router bits. Stock drill bit sizes range from : 0.35 to 3.20mm in 0.05 increments and 3.30 to 6.5mm in 0.10 increments. Stock rout bit sizes range from : 0.8, 1.0, 1.2, 1.5, 1.6, 1.8, 2.0, 2.4, 3.0 & 3.175mm.Other sizes available on request.
BARE BOARD TESTING Viking Digital Bed of Nails Testing
1xB .25
35/35
Conventional Build
2xA
4xA .38
2xA
* SHEETS PREPREG
35/35
1xB
PCBPRO7A
35/35
Note - phototools and their condition are vital to PCB manufacture. For example, the maximum layer to layer misregistration of pattern features should not exceed 0.003" (0.075mm) at full size. In this way Morris Pre-production engineers can perform a comprehensive design rule check, step and repeat artwork to a standard format size, add venting (to aid in the flow of prepreg for multilayer boards, and to give mechanical strength and stability) and most importantly, ensure the accuracy and stability of the diazo's (phototools) used in manufacture.
Morris Productions employs advanced, flexible and fully integrated Bare Board testing systems.
Foil Lamination (Preferred)
2xA
2xA
DO NOT SCALE
.25
10 LAYER BOARD
Foil Lamination (Preferred)
H
35/35
2xA
1xB
6 LAYER BOARD
Quality Management Systems - AS/NZS ISO9001: 1994 (Certified by LRQA) Scope - "Design and Manufacture of single, double sided and multilayer printed circuit boards". Certification Number : 926131
The service provides a number of facilities dependent on your requirements : ** Schematic Capture and laser plots ** Bill of Materials ** Board Layout (From Schematic or Netlist) - Photoplots - Checkplots - Photoplot Files - Drill Files - Shape Based Routing ** Manufacturing Drawings ** Arrangement of Production ** Design advice ** Up to date information on current trends in manufacturing and specifications ** Extract gerber files from Protel generated PCB files and amend
Rout Design Rules
18/00
2xA
Cu (um) PER SIDE
18/00
1xB
2xA
2xB
CORE THK(mm)
.25 .18
.50
SHEETS PREPREG
2xA
2xA
2xB
Cu (um) PER SIDE
Morris Productions has a committment to Quality. As a means of continuous improvement in our manufacturing and technical capibilities Morris has gained the following certifications:
NONE NONE
QUALITY RELEASE REPORT ELEC. TEST :
Underwriters Laboratories UL approval to MP194V-0 and MP-2
2.4mm = 0.6 +/-0.1
Cu (um) PER SIDE
MICROSECTION :
Morris Productions offer our customers a PCB design service.
Laboratory (N.A.T.A certified) Registration Number : 365
Tenting (NPTH) It is common for PCB's to have a mix of Plated(PTH) and Non-plated holes(NPTH). To aid in the positional tolerance of PTH to NPTH, drilling can be done in one operation. It is then necessary to tent (cover) the NPTH with photosensitive film during processing. There must be sufficient surface area around the NPTH for the tent to hold so it is important to have no land around the hole nor should there be any copper pattern within 2 x the diameter of the hole. Maximum hole size for tenti ng NPTH is 4.5mm. If these design rules are not met, 2nd drilling will be necessary .
1.6mm = 0.5 +/-0.1
Foil Lamination (Preferred)
Conventional Build CORE THK(mm)
- separate file per artwork and layer sequence is specified.. - Gerber files, aperture file & drill file formats eg.2,4 inch format or 3,3 metric - Gerber 274X (Embedded Apertures) preferred - Gerber files are registered to one another ( has the same offset). - files should be viewed from the "component side " (primary side). - use design standards (such as IPC-2221, IPC-2222) and adequate allowances for processing. - each corner should have corner delineation marks. - NPTH less than 6.5mm dia should have pads removed to allow tenting of the hole during processing. - ensure that legend markings are 0.25mm (0.010") from lands and/or holes. - if you require gold edge connectors add a plating bar 5mm away from the fingers and extend the length of the connector. The thickness of the bar and connections to the fingers to be 0.5mm (0.020"). - to aid in routing, at least two(2) diagonally opposite NPTH holes should be provided at the board extremities, the diameter of which should be between 2.5 - 6.0mm. Preferred size is 3.175mm (1/8").
Certifications
- finished hole size should be specified rather than drill size - via hole size typically fall in the range of 0.3 to 0.7mm( via holes < 0.2mm should be avoided to ensure hole integrity) - if via hole size is < 0.2mm then land size should equal 0.5mm - aspect ratio should not exceed 1:8 ie. finished hole size divided by board thickness (Refer IPC - 2221, IPC - 2222) - preferred format for drill files is ASCII 2,4 inch leading zero's but will accept other formats (please specify) - separate drill fil es for Plated and Non-plated holes - number of different drill sizes should be minimised, but there are no limits on the number of drill changes
0.8mm = 0.4 +/-0.1
* SHEETS PREPREG
DIMENSIONS IN MILLIMETRES
Drill Design Rules
Artwork Design Rules
Foil Lamination (Preferred)
DESIGN SERVICE
CERTIFICATION :
Morris Productions produce PCB'S to 24 layers . Unless there is a need to specify certain dielectric separations(eg. Controlled Impedence), the thickness of core material or quantity of prepreg used between each successive conductive layer is best left to the manufacturer. Most boards should have a minimum of 0.09mm separation between conductive layers. The layup should be kept balanced i.e. the distribution of layers, copper thickness, and layer separations shou ld be symmetrical to prevent warping, however some designs require large copper areas on the outside layers. Ensure these areas are cross- hatched to reduce the possibility of blistering or warping in the soldering process. Listed below are Morris' most common multilayer layups using materials generally kept in stock. Other layups are available on request.
4 LAYER BOARD
QUALITY ASSURANCE
DRILLING, ROUTING & V-GROOVE
0.5 +/- 0.1mm
F mm
ARTWORK REQUIREMENTS
10
11
12 C
Copyright Morris Productions Pty. Limited 1998
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