Huawei LTE overview.pptx

Security Level: Confidential

Huawei LTE Overview www.huawei.com

HUAWEI TECHNOLOGIES CO., LTD.

Huawei Confidential

Agenda LTE Market Update Advancing LTE Commercialization Leading LTE Solution HUAWEI TECHNOLOGIES CO., LTD. HISILICON SEMICONDUCTOR

Page 2

Increasingly Global LTE Commitments Global LTE Commitments

6X

increase in past 18 months

•

156 operators in 64 countries are investing in LTE › ›

113 LTE network commitments in 46 countries, 43 additional pre-commitment LTE trials 22 expected launch by end of 2010, and at least 55 LTE networks are anticipated to Source: GSA, Oct. 2010 be in commercial service by end 2012

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Page 3

Widely Available Spectrums for LTE Deployment -- By Introducing new spectrums or refarming spectrums

North NorthAmerica: America:    

Major MajorininAWS/700M AWS/700M PCS(1900M), PCS(1900M),850M 850Mrefarming refarming

Europe: Europe:    

Major Majorinin2.6G/800M 2.6G/800M 1.8G 1.8GRefarming Refarming

C.I.S C.I.S    

China: China:

2.6G 2.6G 1.8G 1.8GRefarming Refarming

   

Major MajorininTD, TD,2.3 2.3oror2.6G 2.6G TD/FDD TD/FDDConvergence Convergence

Latin LatinAmerica: America:

Japan: Japan:

Africa: Africa:

Asia AsiaPacific: Pacific:

   

   

Major Majorinin2.6G/AWS 2.6G/AWS Roaming Roamingfor forU.S U.Sand andEU EU

Major Majorinin2.6G 2.6G 1.8G Reframing 1.8G Reframing

MENA: MENA:    

Major Majorinin2.6G 2.6G 1.8G Refarming 1.8G Refarming

HUAWEI TECHNOLOGIES CO., LTD. HISILICON SEMICONDUCTOR

 

License Issued

Auction in 2010

Auction after 2010

Spectrum License Progress • 2009: • 2010: • 2011:

10 countries, 38 Operators 20+ countries, 50+ operators 30+ countries, 60+ operators

Page 4

TBD

   

1.5G/800M/1.7G/2.1G 1.5G/800M/1.7G/2.1Gby by NTT/KDDI/SBM NTT/KDDI/SBM

2.6G 2.6G 1.8G, 1.8G,2.1G 2.1GRefarming Refarming

India: India:  

BWA BWA(TD-LTE) (TD-LTE)2.3G 2.3G

LTE Take-up Roadmap: From Data offload to Full Services Phase1 (2010/11)

Phase2 (2011/12)

Data Only

Phase3 (2012/13)

Data Only + CSFB

Phase4 (>2013)

IMS VoIP & SR-VCC

IMS G/U/L handsets launch

• LTE: Offload USB Dongle Traffic • UMTS: Full Services to Smart-phones • Migrating 2G Voice to 3G Voice HUAWEI TECHNOLOGIES CO., LTD. HISILICON SEMICONDUCTOR

Full multimedia

All-IP network

VoIP PCC & handsets QoS launch

• VoIP over IMS for Operator Voice • Internet VoIP (Skype alike) Prohibited, or provided with specific package • DPI/QoS solution for service differentiation Page 5

Commercially Available LTE Terminals Chipset Vendors

Terminal Vendors

Terminal USB LTE only

USB Multi-mode: GUL, CL

2009



2010

Multiple Commercial Devices: USB, MID, Netbook, etc.

Handset 2012

2011

Mainstreaming chipset and terminal vendors will launch commercial terminals since 2010, accelerating LTE commercial program dramatically. HUAWEI TECHNOLOGIES CO., LTD. HISILICON SEMICONDUCTOR

Page 6

LTE will be the Single Global Standard 700M

>1.2Gbps /80MHz

GSM GSM Spectral Efficiency

800M

CA CA

850M 900M

Title

UMTS UMTS

1500M 1700M 1800M

84Mbps /10MHz

CDMA CDMA

1900M 2100M 2300M

TD-SCDMA TD-SCDMA 21Mbps /5MHz

2600M ……

 LTE

42Mbps /5MHz

WiMAX WiMAX

64QAM

28Mbps /5MHz 2x2 MIMO

2x2 MIMO 64QAM

DC

150Mbps /20MHz

2x2 MIMO

2x2 MIMO

OFDM

64QAM

64QAM

300Mbps /20MHz

CoMP

FDD FDD LTE LTE

Relay 4x4 MIMO

4x4 MIMO

OFDM

OFDM

64QAM

64QAM

TDD TDD LTE LTE

will be the natural migration choice for mobile operators.

HUAWEI TECHNOLOGIES CO., LTD. HISILICON SEMICONDUCTOR

Page 7

Agenda LTE Market Update Advancing LTE Commercialization Leading LTE Solution HUAWEI TECHNOLOGIES CO., LTD. HISILICON SEMICONDUCTOR

Page 8

Persistent Investment on LTE Global LTE Patent Share

Worldwide LTE R&D Centers

Stockholm Moscow Core algorithm RF technology ASIC, algorithm Dallas San Diego

Beijing Chengdu Shanghai Terminal, chipset eNodeB, RF, eNodeB, SAE, Terminal, ASIC



7 R&D centers dedicated to LTE



2500 engineers dedicated to LTE R&D

HUAWEI TECHNOLOGIES CO., LTD. HISILICON SEMICONDUCTOR

1

Source: ETSI (Oct. 2010)



No.1 LTE patents share among infrastructure vendors, holding 270+ essential patents



5800+ LTE/SAE standard proposals to 3GPP Page 9

Leading Position in LTE Field

补充

图片 Best Contribution to Research & Development for LTE 

LTE World Summit 2010 

Significant Progress for a Commercial Launch of LTE



Best Contribution to R&D for LTE in North America

Huawei is leading in INNOVATION and COMMERCIALIZATION of LTE HUAWEI TECHNOLOGIES CO., LTD. HISILICON SEMICONDUCTOR

Page 10

Huawei LTE Global References 70+ Trials

20 Commercial Contracts (as of Nov. 2010) Spain Norway

Norway , Serbia

Sweden

Belgium

Spain

Chili

Austria

Australia

Germany

Malaysia

Poland

Singapor e

Italy Germany

Germany

Latvia

Austria

Uzbekistan & Armenia

(*) 8 commercial contracts are not listed due to NDA with customers.

Portugal

Philippine

Greece

Saudi Arabia

Switzerland

World’s 1st LTE commercially launched network World’s 1st GL 900MHz and 1st LTE RAN Sharing network World’s 1st LTE 800M commercial network World’s 1st LTE 1800M and LTE TDD commercial network HUAWEI TECHNOLOGIES CO., LTD. HISILICON SEMICONDUCTOR

USA

UAE

USA

South Africa Kenya

China China HK

…

Page 11

Saudi Arabia

Nigeria

TeliaSonera, the World’s 1st LTE Commercial Network

Oslo

Quality Proved Commercial Capability

DL data rate:

90.6 Mbps

Fastest MBB network since the beginning of launch  Twice than another in Stockholm, Sweden 

HUAWEI TECHNOLOGIES CO., LTD. HISILICON SEMICONDUCTOR



Significant performance enhancement : 10Mbps higher throughput after upgrade Page 12

World’s 1st LTE on Multi-Mode, Multi-Band and RAN Sharing 99% 99% national national LTE LTE coverage coverage with with GSM GSM Modernization Modernization

 World’s 1st GL Multi-Mode: GL900  World’s 1st LTE RAN Sharing: Telenor & Tele2  World’s 1st Multi-Band LTE: 2.6G & 900MHz

Co-site LTE on different frequency

GSM+LTE

Operator A

2.6GHz cell

Shared eRAN Operator B

RAN RAN sharing: sharing: MOCN MOCN

HUAWEI TECHNOLOGIES CO., LTD. HISILICON SEMICONDUCTOR

GSM

900MHz cell

LTE

Multi-Mode: Multi-Mode: LTE900 LTE900 & & GSM900 GSM900

Page 13

Multi-Band: Multi-Band: 2.6G 2.6G & & 900M 900M

Vodafone D2, the World’s 1st DD800 LTE Commercial Network Challenges and Needs • Commitment to German Government for universal broadband coverage with DD800M in rural area • Reducing OPEX (energy, leasing and rental cost, Q&M, etc.) • Minimizing Complexity with “One Site, One Vendor” strategy • All IP Network for MBB service booming 3M RRU: LTE 800MHz



Solutions and Benefits

UMTS 2100MHz



LTE 2600MHz



• E2E LTE 800MHz solution to support the MBB business • Fast deployment with world's smallest and lightest RF unit (Huawei 3MRRU) • Leading SingleRAN solution to reduce OPEX greatly • One Site for 3 technologies (GUL) and 5 frequency bands (800/900/1800/2100/2600MHz) HUAWEI TECHNOLOGIES CO., LTD. HISILICON SEMICONDUCTOR

fiber

BBU GSM 900MHz

GSM 1800MHz

Page 14

MMMMMM RRRRRR FFFFFF UUUUUU

World’s 1st LTE 1800MHz and LTE TDD Commercial Network Challenges and Needs • New mobile operator in Poland telecom market, finding differentiated services to compete with existing operators • Fast growing data service requirement and saturated voice service market • Making best use of 19.8MHz available bandwidth on 1800M

Solutions and Benefits

RRU: SDR capable RF modules supporting software upgrade from GSM 1800 to LTE 1800 

• The world’s 1 LTE 1800 commercial network • E2E LTE1800 solutions to meet MBB requirement • LTE1800 RAN sharing ensures fast deployment with lower TCO • Deploy the world’s 1st LTE TDD 2.6G commercial network st

HUAWEI TECHNOLOGIES CO., LTD. HISILICON SEMICONDUCTOR



Page 15

LTE 1800 USB

World’s 1st TD-LTE Field Trial Network Sole vendor to cover the whole out field areas of Shanghai Expo  End-to-End TD-LTE Solution  High performance TD-LTE services 

TD-LTE covers the whole expo campus

20MHz bandwidth in 2.3GHz • Peak rate: DL 75Mbps/UL 25Mbps • Avg. rate: DL 40Mbps/UL 15Mbps •



Delivering large varieties of mobile broadband services

17 eNodeBs, 5.28km2

End-to-End TD-LTE Solution RRU BBU

HD video-ondemand

HD video conference

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HD video monitoring

TD-LTE CPE Page 16

TD-LTE eNodeB

SAE

Agenda LTE Market Update Advancing LTE Commercialization Leading LTE Solution HUAWEI TECHNOLOGIES CO., LTD. HISILICON SEMICONDUCTOR

Page 17

Leading LTE Solution Challenges Spectrum

E2E Readiness

Backhaul Performance Interoperability Network operation

Smooth Evolution

Performan ce Enhancem ent

Device availability …

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Cost Effectiveness Page 18

End-to-End LTE Readiness Terminal

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Backhaul

Radio

Page 19

Core

End-to-End LTE Solution Terminal

eRAN

EPC

Backhaul

Distributed MME IP Backhaul or MSTP

SGW/PGW HSS

Outdoor Macro

Terminal

PCRF

Indoor Macro

SingleRAN

SingleBackhaul

SingleEPC

 Self-developed

 Unified Platform

 Multiple Access Interface

 Unified Platform

 Various Types

 Flexible Installation

 Future Oriented Platform

 Intelligent Capability

 Customized Multi band

 Green Base Station

 Cost-efficient Transport

 Highest Throughput

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Page 20

LTE Product Portfolio Common Modules

1 RRU

RFU

BBU3900

3

2

Distributed eNodeB DBS3900

Common Platform • Well-proven SingleRAN platform • Common platform for G/U/L • Common platform for FDD & TDD

Indoor Macro eNodeB BTS3900/L

4

Micro eNodeB Outdoor Macro eNodeB BTS3900A

Common Modules • One RF module for MIMO • Flexible bandwidth: 1.4M/3M/5M/10M/15M/20MHz • Full 3GPP bands: 2.6G/2.1G/1800M/900M/800M/AWS/700M, etc.

orld 1st LTE Commercial Release in Q2’09, 1 Year Ahead in Industry! HUAWEI TECHNOLOGIES CO., LTD. HISILICON SEMICONDUCTOR

Page 21

Huawei LTE Terminal Roadmap Commercial

USB Modem E2701

USB Modem E398

LTE CPE - B593 • LTE/HSPA/EDGE multimode • FE/WIFI 802.11n,b,g • Commercial: Jun. 2011

LTE CPE - B390 • LTE/HSPA/EDGE multimode • For friendly trial

• LTE/HSPA/EDGE multimode • USB rotator with inner antenna • Commercial Phase 1: Dec. 2010 • Commercial Phase 2: Apr. 2011

• LTE DD800 • WLAN 802.11n,b,g • Commercial: 2011Q2

Test UE

LTE FDD 2.0 • DL/UL: 150/75 Mbps • DL 4*2 MIMO

Test UE FDD 1.0 •DL/UL: 50/50Mbps •DL 2*2 MIMO

2009 HUAWEI TECHNOLOGIES CO., LTD. HISILICON SEMICONDUCTOR

LTE TDD 2.0 • DL: 135Mbps, UL: 45Mbps • DL 4*2 MIMO • 2.3G, 2.6G

2010

2011 Page 22

Performance Enhancement Improving cell throughput  Increasing cell edge user data rate  Heterogeneous architecture 

Capacity

+

Seamless service Experienc experience e  Service continuity + solution 

Coverage  UL/DL coverage enhancement solution + 

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Multi-band combination to enlarge LTE coverage

Page 23

MIMO, the Key to Improve Cell Throughput eNode B

UE 1

Macr o L LL TTT EEE

eNode B

2x2 MIMO

Throughput (Mbps)

-- System1x2 Gain: 2X2 MIMO over SIMO SIMO

Capacity +

18.15% 20

16.4

15

28.34% 12.09

14.23 12.36

9.42

10 5

ISD:500m Speed:3km/h

xx.xx%: Gain Throughput (Mbps)

46.94%

In typical urban area: 15%~28% gain over SIMO @

15.12%

13.88

UE 1

Micro

SIMO MIMO

xx.xx%: Gain

ISD:500m Speed:30km/h

ISD:1732m Speed:3km/h

SIMO MIMO

46.40% 35.18

34.15

56.68%

30

26.87 23.24

24.03

20

17.15

10

Macro ~50% gain over SIMO @ Micro Outdoor-to-Indoor Speed: 3km/h

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Page 24

Outdoor-to-Outdoor Speed: 3km/h

Outdoor-to-Outdoor Speed: 30km/h

More Gains through Higher-order MIMO UL 2×4 MU-MIMO

DL 4×4 MIMO

eNodeB

UE 1

eNodeB

UE 1

UE 2



4x4 MIMO v.s. 2x2 MIMO: ~ 50% gain in average 23%~90% increasing in edge cell user throughput throughput

HUAWEI TECHNOLOGIES CO., LTD. HISILICON SEMICONDUCTOR



2x4 MU-MIMO v.s. 1x2 SIMO: 23%~90% increasing in edge user ~50% gain in average cell throughput throughput Page 25

Capacity +

Mobility Velocity (km/h)

Adaptive MIMO Increasing Cell Throughput Cell Center

Cell Edge

Open Loop DL:OL-SM UL:MUMIMO

DL:SFBC UL:Rx Diversity

Benefits: Different MIMO modes fit different scenarios

DL:CL-Tx Diversity UL:Rx Diversity

SFBC and CL Tx Diversity (rank=1) increase link reliability and coverage OL SM and CL-SM (rank=2) increase throughput

Channel Quality (SINR)

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Adaptive MIMO Adjust MIMO mode according to channel quality and user’s velocity

Closed Loop DL:CL-SM UL:MUMIMO

Capacity +

10% gain in average cell throughput over non-adaptive MIMO. Page 26

Increasing Cell Edge User Data Rate with IRC and ICIC IRC – Interference Rejection Combining Interfering

ICIC – Inter-Cell Interference Coordination 4

Cell 1,4,7

Power

2 2 76

Victim cell

antenna 1

Frequency

3 3 1 1

Interfering cell

Noise Evaluated

Capacity +

6 5

Cell 2,5,8

Power

48

Frequency

5 9 combining

7

Power

Cell 3,6,9 Frequency

antenna 2

Noise Evaluate d



3dB gain in uplink coverage



15% higher uplink capacity



50% higher throughput for cell edge users

HUAWEI TECHNOLOGIES CO., LTD. HISILICON SEMICONDUCTOR

Different subband allocated for different cell edge users among cells



Reducing the DL inter-cell interference among neighbor cells



30~50% throughput increased for cell edge users (10 MHz)

Hot spot

DD 1800MHz 800MHz 2.6GH z

L-2600 (20 MHz) L-800 (5, 10, 15 MHz) L-900 (5 MHz)

Urban Sub-Urban

10d B

Rural

2600 MHz: LTE coverage in hotzones / cities  1800 MHz: migrate from GSM to LTE, covering Suburban • 1800M: 3~5dB Gain, 30%~50% Site Reduction  900MHz: LTE national coverage with L-900 when • DD 800: 10 dB Gain possible 800MHz:to LTEmeet nationalboth coverage Combination of lower and higher  bands coverage and Urba n

Wide Coverage

Distance



capacity challenges. HUAWEI TECHNOLOGIES CO., LTD. HISILICON SEMICONDUCTOR

Page 30

Seamless User Experience in High Speed Scenario

Experience+

Core algorithms guarantee performance: In shanghai HQ

Shanghai Meglev Train

8 eNodeBs, 11 cells, 20km

 AFC (Auto Frequency Correction) algorithm to eliminate Doppler effect  High speed scheduling algorithm to reduce the inter-cell interference

Excellent Performance in high-speed coverage:  RRU Co-cell to largely reduce

Cell coverage HUAWEI TECHNOLOGIES CO., LTD. HISILICON SEMICONDUCTOR

Data Rate for Single UE @ 120 Km/H

hand over  High speed: up to 431 Km/H  Handover success rate: >99.5%  Handover interruption latency. 100ms  Average DL rate for single UE: >20Mbps◎120Km/H Page 31

Service Continuity with Inter-RAT Interworking Solution PS connectivity

CS connectivity

LTE

LTE  

Heavy Load

Heavy Load 

CS Fall back (CSFB) SRVCC



Cell Reselection PS Handover Heavy Load

GSM/UMTS

GSM/UMTS

Service-based Service-based Handover Handover

Coverage-based Coverage-based Handover Handover Initial Phase HUAWEI TECHNOLOGIES CO., LTD.

Experience+

Load-based Load-based Handover Handover

Load-based Load-based Handover Handover

Coverage-based Coverage-based Handover Handover

Coverage-based Coverage-based Handover Handover

Developing Phase Huawei Confidential

Developed

Phase

Heavy Load

LTE Voice Service Continuity Initial Phase: Data only

Experience+

Migration Solution: CS Fall Back

Target Solution: VoIP + SRVCC Internet

Internet

Internet

VoIP Voice

IMS LTE Core LTE Core

2G3G PS Core

2G3G CS Core LTE Core 2G/3G Access

LTE Access PS Data

LTE Access

If Voice

Voice

LTE Access

HSPA Access

VoIP over LTE

CSFB

PS Data

2G/3G PS Core

VoIP Over HSPA

PS HO

Legend:

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VoIP

PS Data

SRVCC SRVCC

CS Voice

Page 33

2G3G CS Core 2G/3G Access Voice

Cost-Effectiveness Solution 1 Green

Site Solution

 Ultra coverage solution  Flexible site solution

2

Site Cost Saving

 Dynamic Tx ON/OFF  Dual-band Intelligent Shutdown  Dynamic PA Voltage Adjustment

Power Savin g

TCO Saving 4

LTE RAN Sharing  Dedicated Carrier RAN Sharing  Common Carrier RAN Sharing

HUAWEI TECHNOLOGIES CO., LTD.

Networ k Sharing

Operatio n Efficiency

Huawei Confidential

Green eNodeB

3

SON    

More Automatic Planning Self-Configuration Self-Optimization Self-Maintenance

Cost Saving with Flexible Site Solution Macro Site Solution

Distribute Site Solution

800/900MHz 1800/2100MHz 2.6GHz

RRU

RRU 2.6GHz GGGU UU 2100MHz LLLL LL

1800MHz

LLL GGG TTT 900MHz E E EUUU

800MHz

8XMacro:

BTS3900L

• 5 Bands, 3 Modes @ 1 cabinet • No combiner, no insert loss

HUAWEI TECHNOLOGIES CO., LTD. HISILICON SEMICONDUCTOR

+ Close to antenna

3MRRU • Multi-band/Multimode/MIMO • Smallest RRU: 15%

power consumption saving

Dual-band Intelligent Shutdown • Power on off F2 during low load when load increasing

>20%

power saving

F2: hot spot

F1: seamless at coverage hot

spot

•

voltage according to output power, modulation mode, etc. 5% PA Efficiency Improvement

eNodeB Power Consumption:

>10% Y-o-Y

Power Consumption

Dynamic PA Voltage Adjustment• Dynamically adjust PA

16% reduction 11%

2009

HUAWEI TECHNOLOGIES CO., LTD. HISILICON SEMICONDUCTOR

2010

Page 36

2011

SON Improving Operation Efficiency MISS



LTE SON Trial in T-Mobile Austria

•Minimize Configuration •Improve Network KPI •Shorten Expertise Education •Simplify Network management

Planning Phase

ON

Deployment Phase

Automatic Network Planning Automatic Config. Planning Automatic Parameter Planning

Maintenance Phase

Optimization Phase

Automatic PCI/TA Optimization Automatic Neighbor Relation Inter-RAT ANR,MRO, System Load Balance, RACH Optimization

Self- configuration (Plug & Play) Auto Software Management

Inventory Management Sleeping Cell detection Antenna Fault Detection Cell/interface/sub. trace

Test scenari o

Handover success rate

Total automatic added neighbors

Round 1

91%

74

Round 2

97%

94

SON makes LTE network more efficient and solves new challenges when network architecture changes HUAWEI TECHNOLOGIES CO., LTD. HISILICON SEMICONDUCTOR

Page 37

Typical SON Features at Initial Stage ANR: Automatic Neighbor Relation

Self-Config.: Quick Deployment File Server S/W Config Config Config

EMS + DHCP

Config S/W

New

eNodeB

• Save cost & Improve exactness • Avoid first HO failure due to missing neighbor relation

MLB: Mobility Load Balancing

Cell A

CellBB Cell

Cell B

Cell C

parameters • Reduce call drop rate, handover failure rate, • Reduce unnecessary redirection

HUAWEI TECHNOLOGIES CO., LTD. HISILICON SEMICONDUCTOR

unnecessary HO Rate

HO successful rate

Cell C

• Optimizing cell reselection and handover

Plug & Play Installation Shorten deployment duration

MRO: Mobility Robust Optimization Value

Cell A

• •

• •

More reliable Improve network KPI by HO optimization

Page 38

40% Saving with RAN Sharing Solution Sweden

MOCN

Poland

eRAN Sharing

Dedicated Carrier RAN Sharing

Common Carrier RAN Sharing

f1 Mobyland

Tele2 Carrier Shared

f1/F2

f2

F1/F2 F1/F2

Centern et

Telenor



Independent Service Deployment



Independent PM/FM/CM (cell level)



Aggregated Spectrum for High Bandwidth



Site reduction for rural coverage



Shared FM/CM, partly Independent PM



Independent expansion



Shared optimization and expansion



Shared optimization



UE compliant to 3GPP R8



No requirement for UE

Supporting both MOCN and dedicated carrier RAN Sharing HUAWEI TECHNOLOGIES CO., LTD. HISILICON SEMICONDUCTOR Page 39

Smooth Evolution

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Page 40

SDR Facilitating Smooth Evolution  Spectrum for LTE

 Smooth Transition to LTE GSM+UMTS

LTE

2600MHz 2100MHz

UMTS

LTE

GSM

LTE

1800MHz

GSM UMTS

900MHz

2010 800M

900M

mRRU

GSM UMTS LTE HUAWEI TECHNOLOGIES CO., LTD. HISILICON SEMICONDUCTOR

MRFU

LTE

2011 1800M

LTE

GSM

SDR

LTE

800MHz

Technolo gy

SDR

SDR

2012 2100M

2.6G

SDR

GSM+LTE

 Spectrum refarming starts from 900M/1800M, which can be utilized for LTE deployment.  SDR technology supports flexible and smooth transition from 2G/3G to LTE. Page 41

GL Refarming Solution -- Supporting Smooth Evolution from GSM to LTE GSM GSM Software upgrade

MRRU • 900M/1800 M • 2*2 MIMO

GSM

GSM

• 900M/1800 M • 2*2 MIMO



LTE

LTE MIMO

G

G

G

S

S

S

M

M

M

Software upgrade

LTE

L

L

L

G

G

G

Software upgrade

L T E

LTE

GSM

L T E

L T E

LTE MIMO

F A N

LTE Board



Software upgrade

LTE GSM

MRFU

Multi-mode BBU GSM Board

LTE LTE

GSM+LTE GSM+LTE

GTMU

Power Power

Add LTE Board F A N

LBBP

GTMU LMPT

Power Power

Software Upgrade

F A N

LTE Board

Significant cost-saving without acquiring new spectrum license Software upgrade for smooth evolution from GSM to LTE, protecting investment

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Page 42

Power LBBP

LMPT

Power

Thank you www.huawei.com