G630-U10 Simplified Maintenance Manual
Issue
01
Date
HUAWEI TECHNOLOGIES CO., LTD.
Copyright © Huawei Technologies Co., Ltd. 2014. All rights reserved. No part of this document may be reproduced or transmitted in any form or by any means without prior written consent of Huawei Technologies Co., Ltd.
Trademarks and Permissions and other Huawei trademarks are trademarks of Huawei Technologies Co., Ltd. All other trademarks and trade names mentioned in this document are the property of their respective holders.
Notice The purchased products, services and features are stipulated by the contract made between Huawei and the customer. All or part of the products, services and features described in this document may not be within the purchase scope or the usage scope. Unless otherwise specified in the contract, all statements, information, and recommendations in this document are provided "AS IS" without warranties, guarantees or representations of any kind, either express or implied. The information in this document is subject to change without notice. Every effort has been made in the preparation of this document to ensure accuracy of the contents, but all statements, information, and recommendations in this document do not constitute a warranty of any kind, express or implied.
Huawei Technologies Co., Ltd. Address:
Huawei Industrial Base Bantian, Longgang Shenzhen 518129 People's Republic of China
Website:
http://www.huawei.com
Email:
[email protected]
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About This Document
About This Document Author Prepared by
Date
2014-02-28
Reviewed by
Date
2014-02-28
Approved by
Date
2014-02-28
Change History Date
Version
Description
2014-02-28
V1.0
Released the first issue.
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Contents
Contents About This Document .................................................................................................................... ii 1 Overview......................................................................................................................................... 1 1.1 Applicable Scope .............................................................................................................................................. 1 1.2 Brief Introduction ............................................................................................................................................. 1 1.3 How to Obtain Product and Maintenance Information .................................................................................... 1
2 Product Overview ......................................................................................................................... 2 2.1 Appearance ....................................................................................................................................................... 2 2.2 Specifications ................................................................................................................................................... 2
3 Exploded View and Components on the PCBA ...................................................................... 4 3.1 Exploded View ................................................................................................................................................. 4 3.2 Components on the PCBA and BOM ............................................................................................................... 6
4 Software Upgrade ......................................................................................................................... 9 4.1 Selecting the Operation Type and the BIN File to Load................................................................................... 9 4.2 Home Screen .................................................................................................................................................. 11 4.3 Screen Element Description ........................................................................................................................... 11 4.3.1 Title Bar ................................................................................................................................................ 11 4.3.2 Scan && Download Button .................................................................................................................. 11 4.3.3 Remove Devices Button........................................................................................................................ 13 4.4 Procedure ....................................................................................................................................................... 14 4.5 (Important) Be Cautious to Allow a Second-time Upgrade............................................................................ 14 4.6 Software Downloading Types ........................................................................................................................ 14 4.7 Using the microSD Card for an Upgrade ....................................................................................................... 15 4.8 Troubleshooting Upgrade Failures ................................................................................................................. 19
5 Maintenance Tools ...................................................................................................................... 20 6 Disassembly Procedure .............................................................................................................. 22 7 Assembly Procedure ................................................................................................................... 27 8 Troubleshooting Common Faults ............................................................................................ 31 8.1 Startup Failure ................................................................................................................................................ 31 8.2 Charging Failure ............................................................................................................................................. 36 8.3 Camera Failure ............................................................................................................................................... 37 Issue 01 (2014-04-01)
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8.4 Connection Failure Between the Phone and Computer .................................................................................. 38 8.5 Call Receiving Failure .................................................................................................................................... 39 8.6 Call Sending Failure ....................................................................................................................................... 40 8.7 Vibration Failure ............................................................................................................................................ 41 8.8 Ringtone Failure ............................................................................................................................................. 42 8.9 LCD Display Failure ...................................................................................................................................... 43 8.10 Key Failure ................................................................................................................................................... 44 8.11 No Sound Coming from the Headset During a Call ..................................................................................... 45 8.12 T-Flash Card Detection Failure .................................................................................................................... 46 8.13 GPS Signal Reception Failure ...................................................................................................................... 47
9 Functional Tests........................................................................................................................... 49 9.1 MMI Test ........................................................................................................................................................ 49 9.2 Wi-Fi Test ....................................................................................................................................................... 59 9.3 Voice Call Test................................................................................................................................................ 60
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1 Overview
1
Overview
1.1 Applicable Scope The G630-U10 Maintenance Manual (Template) is available in the simplified and advanced versions. The two versions are respectively applicable to common service centers and advanced service centers authorized by Huawei. The simplified version (this document) provides maintenance and repair instructions for technicians at common service centers to conduct services of level 1 and level 2. Being Huawei proprietary, this document is accessible only for authorized service centers. Although every effort was made to ensure the accuracy of the document, errors may still exist. If you find any errors or have any suggestions, please report them through Huawei service platform ComPartner.
1.2 Brief Introduction This document introduces the product features, mechanical parts, assembly and disassembly procedures, and common troubleshooting methods. You will be able to clear common faults of the product with this document.
1.3 How to Obtain Product and Maintenance Information To obtain product and maintenance information, visit Huawei service website. You are recommended to install the ComPartner to download maintenance required software tools and the phone version software. To obtain the ComPartner installation package, log in to http://support.huaweidevice.com/service/, search for ComPartner. You will find the installation package.
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2 Product Overview
2
Product Overview
2.1 Appearance Error! Reference source not found. shows the appearance of the HUAWEI G630-U10 mobile phone (G630-U10 for short). Figure 2-1 G630-U10
2.2 Specifications Table 2-1 lists the G630-U10 specifications.
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Table 2-1 G630-U10 specifications No.
Description
Mobile phone model
Touchscreen smartphone
Dimensions (H x W x D)
143 mm x 71.8 mm x 8 mm
Weight
About 155 g (including the battery)
Working band
GSM: 850/900/1800/1900M UMTS: 900/2100M
External ports
Standard micro USB port, microSD card slot, 3.5 mm headset jack
UIM card interface
Two standard 6-pin UIM card slots
microSD card
32 GB
USB interface
USB 2.0, high speeds of up to 480 Mbit/s
Battery
Capacity: 2000 mAh
Display
5-inch HD display, 720x1280 resolution
Antenna
Built-in antenna
Camera
Rear camera: 8 MP pixels; Front camera: 1 MP
Sensors
Accelerator, proximity sensor, and ambient light sensor
Test the Bluetooth.
Bluetooth v2.1 + EDR
Wi-Fi
802.11b/g/n, Wi-Fi routing
GPS
GPSone
Power supply
100–240 V, 50/60 Hz, 1 A
Temperature Humidity
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Operating temperature: 0°C to +40°C Storage temperature: –40°C to +70°C Working humidity: 5% to 95% RH
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3 Exploded View and Components on the PCBA
Exploded View and Components on the PCBA
3.1 Exploded View Figure 3-1 shows the exploded view of the G630-U10. Figure 3-1 Exploded view
Table 3-1 lists components in the exploded view. Table 3-1 Components in the exploded view No.
Name
1
Receiver decoration
2
TP
3
LCD
4
Proximity sensor rubber
5
Front cover assembly
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No.
Name
6
Proximity sensor FPC
7
Proximity sensor support
8
Speaker FPC
9
Receiver
10
Front camera
11
Rear camera
12
PCBA assembly
13
CPU shielding cover
14
RF shielding cover
15
Side key FPC
16
Motor
17
Battery
18
Speaker
19
Battery support assembly
20
Back cover assembly
21
Main antenna
22
GPS antenna
23
Wi-Fi antenna
24
Phone label
25
NFC antenna
26
Battery cover assembly
27
Two screws for fastening the battery steel plate
28
15 screws for fastening the phone
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3.2 Components on the PCBA and BOM Figure 3-2 Layout of components and relevant failures (top) HD1G630P proximity sensor FPC Fault symptom: Proximity/Ambient light sensor fault
LED2201 tri-color indicator
Fault symptom: Indicator fault
J1901 headset jack
Fault symptom:
J2404 6-pin connector
Headset fault
Fault symptom: Volume key fault, key startup failure, motor fault
U2202 gravity sensor
Fault symptom: Gravity sensor fault
J2102 front camera slot
Fault symptom: Front camera fault
X201 19.2M oscillator
Fault symptom: Startup failure
U201 power management chip
Fault symptom: Startup failure U701 CPU chip
Fault symptom: Startup failure
J2101 rear camera slot
Fault symptom: Rear camera fault
U1500 EMM+DDR chip
Fault symptom: Startup failure
U2002 backlight IC
Fault symptom: LCD fault U3801 WTR2605-RF chip U2003 LCD positive/negative voltage IC
Fault symptom: RF fault
Fault symptom: LCD fault
U3301 RF PA
Fault symptom:
U3201 RF IC
Fault symptom:
RF fault
RF fault
J1701 speaker spring
Fault symptom: Speaker fault
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MIC1801 main microphone
Fault symptom: No voice transmitted or noice transmitted
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Figure 3-3 Layout of components and relevant failures (bottom) J5003 5004 WLAN/BT antenna spring Fault symptom: WLAN/BT fault
J5001 J5002 GPS antenna spring
Fault symptom: GPS fault
U4701 WLAN/BT/FM IC
J2501 TP connector
Fault symptom:
Fault symptom: TP failure
WLAN/BT/FM fault
MIC1802 secondary microphone
J1601 battery connector
Fault symptom:
Fault symptom:
No voice transmitted, or noise transmitted
Startup failure
J2401 motor
J2302 TF card slot
Fault symptom:
Fault symptom:
No or weak vibration
TF card detection failure
LED2101 flashlight
J2303 SIM card slot
Fault symptom:
Fault symptom:
Flashlight fault
SIM card detection failure
U2801 NFC module
J2301 SIM card slot
Fault symptom:
Fault symptom:
SIM card detection failure
NFC malfunctional
J5005 J5006 main antenna spring
J2001 LCD connector to the peer board
Fault symptom: No or weak signal
Fault symptom: LCD display fault J3201 RF connector
J1602 USB connector
Fault symptom:
Fault symptom:
RF fault
No charging or USB communication fault
Table 3-2 is provided for your reference only. It is subject to changes without notice. Obtain the latest BOM information from Huawei TCS system. For details about how to query a BOM code, see the simplified version. Table 3-2 lists the BOM information about key components on the PCBA. Table 3-2 BOM code list Position
BOM
Description
X201
1202021 5
Crystal Unit,19.2MHz,7pF,+/-10ppm,70ohm,2.5*2.0*0.9mm,NTC internal,Terminal Dedicated
U201
3920057 2
Power Management IC(PM8110),3.0~4.4V,118WLNSP(pb-free),Terminal Dedicated
U701
3920057 4
Terminal Baseband process IC,WCDMA/GSM dualmode baseband processor,1.2V/1.8V/2.85V,488NSP,Terminal Dedicated
U1500
4006054 3
MCP,4GB(x8) eMMC,52MHz,1024KB,3.3V/1.8V,FBGA162,8Gb(x32) LPDDR2,Terminal Dedicated
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Position
BOM
Description
U3801
3920043 9
Terminal Baseband process IC,RF Transceiver WTR2605 -2.2V/1.8V/1.3V-62-WLNSP-Terminal Dedicated
J1601
1424057 6
Card Block Connector,BTF Connector,3*2,Female,1.3mm,Terminal Dedicated
J1701
5162102 3
108-5785,Ground Spring,U1250
MIC1801
2205009 9
Microphone,-42dB.,3.76*2.95*1.1mm,silicon
J2102
1424049 6
BTB Connector,Female,24Pin,0.4mm,SMT,Mating Height 0.8mm,Terminal Dedicated
J2404
1424078 0
Card Socket,Spring Contact,6PIN,Horizontal,Center Line Spacing 1.6mm,Pin Tail Length 0.4mm,SMT,Terminal Dedicated
U2101
3911080 0
Switching Regulators,1.5A LED Flash Driver IC,2.5V~5.5V,1.5A,4MHz,CSP-9,Terminal Dedicated
U2201
3814009 8
Semiconductor Sensor,Accelerometer,LGA,3axis,Terminal Dedicated
J2101
1424057 9
BTB Connector,BTBconnector,34PIN,0.4mm,0.8mm,SMT,female,Terminal Dedicated
J2501
1424083 1
FPC Connector,8,0.5mm,0.5mm,Back Lock&Double Touch,0.8mm,Terminal Dedicated
J1901
1424083 0
Earphone Connector,12.66*6.7*4.2,6Pin,Arc,SMT,Reverse plate (pin inside plate distance to the flat top surface 1.65mm),Terminal Dedicated
J5004
5162498 9
Edge mini Groung Spring
U4701
3921016 0
Connectivity IC,Wireless Connectivity WCN3620,2.05V~2.17V,62-WLNSP,Terminal Dedicated
J2302
1424070 8
Card Connector,MicroSD card Connector,8PIN,Horizon,1.1mm,hinge type,without post,Terminal Dedicated
J2301
1424077 2
Card Socket,Micro SIM Socket,8Pin,Horizontal,2.54mm,Without Hold Peg,PUSH-PULL,height 1.3mm,Terminal Dedicated
J2001
1424057 9
BTB Connector,BTBconnector,34PIN,0.4mm,0.8mm,SMT,female,Terminal Dedicated
J3201
1424000 4
Coaxial Connector,RF Switch,Straight,Female,SMT,Terminal Dedicated
J5001
5162498 9
Edge mini Groung Spring
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4 Software Upgrade
4
Software Upgrade
4.1 Selecting the Operation Type and the BIN File to Load After WH62406270ML01Ver1006 is run, the following dialog box is displayed. Figure 4-1 Entering the login password
Enter the password (initial password: Huawei) and click OK.
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Figure 4-2 Selecting the BIN file and configuration file
In this dialog box, you can select whether to allow a second-time upgrade and select the BIN (Firmware) file and the configuration file to be loaded. 1.
Select the operation type. Under Be cautious to select, select or deselect Allow upgrade for the Second time to allow or prohibit a second phone board upgrade. If the board software is burned and then mounted, do not select this option, and ensure that the board has just loaded with the BOOT file with the JTAG tool and does not have APP. In a normal upgrade after printing rear labels, select this option; otherwise, file loading will fail. Selection or deselection of this option may affect the NV data status of the phone. Be cautious to confirm the operation in the displayed dialog box.
2.
Select the file to load. Under Please Select File, the browse button is unavailable and the file path is cleared if the check boxes are deselected.
3.
Once selecting a check box, an Open dialog box is displayed, asking you to select a BIN file. After you select a file, its path information will be displayed in the text box and the browse button will be available. When the check box is selected and the browse button is available, you can click the button to change the file path.
4.
The default configuration file PhoneMultiUpgradeDefaultCfg.xml (Windows phones and some other products possibly cannot use the default configuration file, and therefore a customized configuration file needs to be provided) and the software executable file WH62406270ML01Ver1003(SmartPhone).xml are in the same directory level.
5.
Select Next to navigate to the Home screen.
6.
To cancel or exit the software, select Cancel.
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4.2 Home Screen After you click Next, the screen shown in Figure 4-3 is displayed. Figure 4-3 Home screen
4.3 Screen Element Description 4.3.1 Title Bar The title bar displays the software name, version, feature code, and compilation date from left to right. The feature code is automatically generated by the software based on the configuration file, and is intended only for check by R&D personnel.
4.3.2 Scan && Download Button After clicking the Scan && Download button (before loading a file, ensure that ports have been correctly mapped; otherwise, loading will fail), the application scans for the mapped ports (the names of ports to search for are specified in the configuration file) in Device Manager and start loading software. The port numbers of the found ports are displayed on the list. You can click Scan && Download several times until the ports of all the UEs are found.
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Figure 4-4 During an upgrade process
During the software upgrade, do not close the application; otherwise the dialog box shown in Figure 4-5 will be displayed. Figure 4-5 Closing the application during an upgrade
Do not terminate the application forcibly during an upgrade through measures such as the Windows Task Manager. Otherwise, the tested boards may get damaged.
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Figure 4-6 Restoring NV after loading (not required for some products)
Figure 4-7 Successful downloading
4.3.3 Remove Devices Button You can click Remove Devices to remove phones only after all phones are upgraded. The Remove Devices button will clear all current screen display, preparing for the next upgrade.
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4.4 Procedure Prepare the required environment and ensure that ports for all phones have been correctly mapped in Device Manager. Then, click the Scan && Download button. If not all ports are found after a click, perform several more clicks. During an upgrade, the upgrade progresses of different phones may be different. When stable phone hot swapping is supported, especially if several phones need to be hot swapped (unstable hot swapping may cause problems such as computer down), first remove phones that have been upgraded successfully without affecting phone being upgraded. This process releases ports for accessing new phones to be upgraded. After the ports of the new phones are correctly mapped, click the Scan && Download button again to upgrade the new phones, without affecting other phones being upgraded.
4.5 (Important) Be Cautious to Allow a Second-time Upgrade
Under Be cautious to select, select or deselect Allow upgrade for the Second time to allow or prohibit a second phone board upgrade. That is, once is selected, a phone to which phone software has been downloaded can be upgraded for a second time. If this downloading tool needs to be used for software loading for a phone that is loaded with a BOOT file with a JTAG tool and with applications with a USB flash driver, do not select the Allow upgrade for the Second time option. In addition, before using this tool, ensure that the board has just loaded with the BOOT file with the JTAG tool and does not have APP; otherwise, downloading will fail and a message Refuse Download In AMSS Fail will be displayed. If this operation is incorrectly selected in this case, it may result in faulty phones in subsequent work stations. In a normal upgrade after printing rear labels, select this option; otherwise, the software upgrade will fail and a message Refuse Download In AMSS Fail is displayed. Before a software upgrade, the phone software automatically backs up the NV data in the current phone. After the software upgrade, the phone software will automatically restore the NV data from the backup data. After a later USG upgrade or SD upgrade, the NV data will also be restored from the backup. The backup data is restored in the NV backup backup area of the phone. Pay attention to the message in the dialog box that is displayed after you selecting or deselecting this option, and be cautious to confirm your operation.
4.6 Software Downloading Types Two software upgrade types are available: software is burned (not supported for smart phones), and software upgrade. The screens for the two types are similar except for the messages displayed during interchanges with phones. Differentiate the phones for which software needs to be burned and the phones for which software needs to be upgraded; production line stoppage or even accidents may result if the phones are not correctly differentiated. (The software should be initially started by a PE. Operators must not start it without permission. If no exception occurs during software downloading, this software does not need to be shut down.)
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4.7 Using the microSD Card for an Upgrade To upgrade the phone using a microSD card: Step 1 Format the microSD card using FAT32. Step 2 Create a dload folder in the microSD card's root directory. Figure 4-8 shows the dload folder under the root directory. Figure 4-8 dload folder under the microSD card's root directory
Step 3 Copy the upgrade file UPDATE.APP to the dload folder. Step 4 Insert the microSD card into the phone, power on the phone, and enter *#*#2846579#*#* on the dialing screen. Touch ProjectMenu > Upgrade > SD card upgrade > Confirm.
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Figure 4-9 Operation procedure
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The upgrade progress is displayed on the phone screen, as shown in Figure 4-10.
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Figure 4-10 Upgrade process
After the upgrade is complete, restore the phone to its factory settings and check whether the software version is correct. If the phone cannot be powered on, use either of the following methods to perform a forcible upgrade: Install the battery to the phone (if the phone screen flashes, remove the battery from the phone and install it again after 5 minutes). Press and hold the volume up and down keys, and then press the power key. The phone automatically starts a forcible upgrade. The upgrade process displayed on the phone screen is the same as that shown in Figure 4-9. Remove the battery from the phone. Press and hold the volume up and down keys, and connect the charger to the phone. The phone automatically starts a forcible upgrade. The upgrade process displayed on the phone screen is the same as that shown in Figure 4-9.
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4.8 Troubleshooting Upgrade Failures Table 4-1 Upgrade failures and solutions Failure
Solution
(Computer) Failed to detect the phone's presence
Check whether there is any other driver conflicting with the USB upgrade driver. Check whether the USB upgrade driver has been installed properly. Check whether the USB cable has been properly connected. Check whether the serial port settings are correct.
Failed to upgrade the phone using the USB cable.
Check whether the USB cable has been properly connected. Check whether the target firmware version is higher than the original one. Perform the upgrade again.
Fail to upgrade the phone using the microSD card.
Check whether the upgrade file is correct. Check whether the upgrade method is correct. Check whether the microSD card functions properly. Perform the upgrade again.
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5 Maintenance Tools
5
Maintenance Tools
Name: soldering iron Usage: solders components
Name: DC power supply Usage: supplies power
Name: soldering fixture Usage: secures PCBAs
Name: lead-free tin solder wire Usage: solders components
Name: digital multimeter Usage: measures parameters during maintenance
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Name: toolkit Usage: assembles and disassembles terminals
Name: electric screwdriver Usage: fastens and removes screws
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6 Disassembly Procedure
6
1. Ensure that the ESD wrist strap is properly grounded.
Disassembly Procedure
2. Hold the phone with your right hand, lever up the hand hole on the battery cover with your left thumb to open the battery cover.
3. Check the quantity and positions of screws on 4. Place the mobile phone on a flat panel, press the phone with your left hand, hold the electric the rear cover. There are 15 Phillips screws. screwdriver with your right hand, and remove all the 15 screws one after another.
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5. Check the position of the headset jack. Insert a finger or a spudger from the upper right corner into the headset jack, and slide your finger or the 6. Use your hands to hold both sides of the rear spudger clockwise to release all clips from the cover and remove the rear cover. rear cover.
7. After the rear cover assembly is removed.
9. Lever up the battery BTB connector with a crowbar and remove the battery BTB connector.
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8. Check the positions of the two screws that are used to connect the battery and the front cover, place the phone on a flat panel, press the phone with your left hand, hold the electric screwdriver with your right hand, and remove the two screws.
10. Lever up the battery steel plate with a crowbar and remove the battery assembly.
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11. Lever up the LCD BTB connector with a crowbar.
6 Disassembly Procedure
12. Remove the TP FPC ZIF. First, turn on the ZIF connector switch, use a plastic tweezers to clasp the FPC two ears, pull the FPC upwards, and remove the FPC.
13. Remove the rear camera. Use a finger or plastic 14. Hold the phone with your left hand, push tweezers to lever up the rear camera and finally to leftwards the PCBA with your right hand to release clip 1 at the bottom. separate the camera from the front cover.
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15. Hold the phone with your left hand, push 16. Shake the PCBA to release clip 3 on the right rightwards the PCBA neck position with your right side and finally to separate the PCBA and the front hand to release clip 2 on the left side. cover.
17. Use a finger or a crowbar to remove the rear camera. Firstly, unfasten the rear camera BTB and then remove the camera.
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18. Use a finger or a crowbar to remove the front camera. Firstly, unfasten the front camera BTB and then remove the camera.
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19. End.
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7 Assembly Procedure
7
Assembly Procedure
1. Ensure that the ESD wrist strap is properly grounded.
2. Connect the rear camera BTB male and female. Make sure the connectors are properly fastened and do not bump the surrounding components.
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7 Assembly Procedure
3. Connect the front camera BTB male and female. Make sure the connectors are properly fastened and do not bump the surrounding components.
4. Gently move the PCBA, aligning the positioning hole at the PCBA bottom with the positioning rod in the lower left corner of the front cover. Press the positioning hole area in the lower left corner of the PCBA with your left thumb to fit the positioning rod in the positioning hole. Press the board at the clip position to fit the board into the clip with your right thumb.
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5. Fasten the LCD BTB and TP BTB to the PCBA, without touching other components. Install the battery and engage it into the BTB connector.
6. Use an electric screwdriver to install screws for fastening the front cover and the battery.
7. Install the15 screws clockwise, starting from the headset jack.
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8. Use the tweezers to take the anti-dismantle label and attach it to its specified position on the rear cover. Use a cotton swab to gently press the anti-dismantle label, ensuring that the label is securely attached.
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9. Assemble the battery cover.
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8 Troubleshooting Common Faults
Troubleshooting Common Faults
Before you repair a G630-U10, back up the user data and restore the phone to its factory settings.
8.1 Startup Failure Most power-on failures are caused by power supply exceptions. Therefore, you can rectify power-on failures by troubleshooting power supply circuit faults. Power-on failures are divided into the following types:
No current: After you connect the phone to the DC power supply and power on the phone, the reading on the power supply ranges from 0 mA to 5 mA.
Weak current: After you connect the phone to the DC power supply and power on the phone, the reading on the power supply ranges from 5 mA to 100 mA.
Excessive current: After you connect the phone to the DC power supply and power on the phone, the reading on the power supply exceeds 300 mA.
If the G630-U10 fails to be powered on, observe the power-on current reading on the DC power supply to identify the fault.
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No current
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Figure 8-1 Troubleshooting startup failures with no current
Startup failure
Connect the phone to a fake battery and maintenance power supply, press the power key, and observe the current
No current
Y Is the key copper foil oxidized?
Clean the key
N N Is the VPH_PWR voltage between the range from 3.4 V to 4.2 V, and equal to the maintenance power voltage?
Check the U201
Y
Check the clock X201
This situation occurs when the main power circuit is short-circuited. Check whether VBUS and VPH_PWR circuits are short-circuited.
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Weak current
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Figure 8-2 Troubleshooting startup failures with weak current
Startup failure
Connect the phone to a fake battery and maintenance power supply,
press the power key, and observe the current Weak current
N Check whether U201 haspartialDC-DC
Check the U201
voltage output
Y
N Check whether U201 has partial L6/L17 voltage output
Resolder theU201
Y
N Check whether EMMC (U1500) is properly soldered
Replace the U1500
Y
Check whether other U201 outputs
are short-circuited
Y
Replace the U201
Replace theU701
If the VPH_PWR voltage is normal, but the U201 output is not, the other output of U201 is probably short-circuited, which results in the power output exception of the PMU. Check every output of the U201 to see whether they are short-circuited.
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Excessive current is usually caused by short-circuited power supply circuits (DC power supply) which may result in 500 mA or greater current leakage. Mostly this fault occurs when VBAT is short-circuited to ground. Figure 8-3 Troubleshooting startup failures with excessive current
Startup failure
Connect the phone to a fake battery and maintenance power supply, press the power key, and observe the current
Excessive current (>500 mA)
Y
Check whether pin 1 of J1601 is shortcircuited to the ground
Replace the J1601
N
Check whether the U201 voltage is normal N
Y Check whether the capacitor connected to the Vbat is shortcircuited
Repair the capacitor
N
Resolder or replace the U201
Startup failure summary: 1. Current leakage in case of excessive current: When the phone is connected to a regulated power supply, excessive power such as hundreds of mA current is generated upon a power-on. This problem usually occurs because the VBAT is generally short-circuited to the ground. It also may be because the VPH_PWR is short-circuited to the ground. It is earlier to troubleshoot VBAT short-circuit to the ground,
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since fewer components (PA, antenna switch, and capacitor) are connected to the VBAT. You can locate the fault by removing the components separately. If the voltage on the VPH_PWR circuit is short-circuited, the component removal method is not applicable. Instead, adjust the DC power output voltage to about 3 V, connect the negative end of the power supply to the PCB negative end, connect the positive end of the power supply to the detected short-circuit point, touch the PCB with your hand to locate the hot position after about 20s, and then remove the hot component. 2.
Current leakage in case of weak current:
If the power-on current is weak (generally less than 30 mA), usually the power management chip, PA, or an ESD protection tube is damaged. It may also be because the EMMC fails to start up and the program fails to run. 3.
No or weak current when you press the power key:
If no current is generated, first check whether the power key fails to work. Then, check the power supply line to the VBAT. If weak current is gated, measure each output voltage of the power supply IC. If all IC output voltage is 0, this fault is most possibly related to the PM. 4.
After you press the power key, the current sharply changes within a range or remains unchanged at a fixed value:
This problem is usually due to a CPU or PM communication fault.
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8.2 Charging Failure Figure 8-4 Troubleshooting charging failures Chargingfailure
N Is the charger functional?
Replace the charger
Y
Y Is J1602poorly soldered?
Resolder the J1602
N
N Are the battery connector and the battery are in good contact
Repair theJ1601
Y Is the battery damaged?
Y
Change the battery
N Check the U201
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8.3 Camera Failure Figure 8-5 Troubleshooting camera failures
Camera f ailure Is the problem solved af ter you reload the phone sof tware?
Y End
N Y Is the J2101 poorly soldered?
Re-solder or replace the J2101
N Is the problem solved af ter you replace the camera?
Y
End
N
Replace the U201
Y
End
N Replace the U701
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8.4 Connection Failure Between the Phone and Computer Figure 8-6 Troubleshooting connection failures between the phone and computer Connection failure between the phone and computer
Y Is the problem solved after you replace the USB cable?
End
N
Y
Is the 5-pin mini USB connector poorly soldered?
Resolder the USB connector
N
Y Is the problem solved after you reload the phone software?
End
N
Y Is there voltage at VCHG?
Replace the U201
N
Replace the
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USB
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8.5 Call Receiving Failure Figure 8-7 Troubleshooting call receiving failures No voice can be heard af ter a call is set up N Is the receiver volume properly set?
End
Y Y Is the insertion of the headset misjudged?
Replace the headset connector
N Is the problem solved af ter you replace the receiver?
Y
End
N Replace the U701
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8.6 Call Sending Failure Figure 8-8 Troubleshooting call sending failures No voice can be sent af ter a call is set up Is the problem solved af ter you reload the phone sof tware?
Y End
N N Is the MICBIAS voltage 1.8 V?
Check the U201
Y Is the problem solved af ter you replace the microphone?
Y
End
N Replace the U701
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8.7 Vibration Failure Figure 8-9 Troubleshooting vibration failures
No vibration
Is the problem solved af ter you reload the phone sof tware?
Y End
N Y
Is the problem solved af ter you replace the motor?
End
N Y Is the VIB_DRV_N voltage equal to the battery voltage?
Check the U201
N Check whether the voltage dif f erence meets the requirement f or the motor operating voltage
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8.8 Ringtone Failure Figure 8-10 Troubleshooting ringtone failures
No ringtone f or incoming calls N Is the ringtone volume properly set?
End
Y Is the problem solved af ter you reload the phone sof tware?
Y
End
N Is the problem solved af ter you replace the speaker?
Y End
N
N
Is the FPC in good contact?
Re-crimp or replace the FPC
Y
Is the problem solved af ter you replace the volume key sub-board?
Y
End
N Replace the U701
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8.9 LCD Display Failure Figure 8-11 Troubleshooting LCD display failures
No display on the LCD
Y
Is the problem solved af ter you re-load the phone sof tware?
End
N Y
Is the problem solved af ter you disassemble the phone can re-f asten the LCD BTB connector?
End
N Is the problem solved af ter you replace the LCD?
Y
End
N Is the to-ground-resistance of T2001/T2002/T2003 is not 0 ohm?
Y
Replace the U201
N Replace the U301
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8.10 Key Failure Figure 8-12 Troubleshooting key failures
Key failure
N Clean or replace the key dome sheets
Are the key dome sheets in good contact?
Y Y Is the problem solved after you replace the key FPC?
End
N Re-load the phone software
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8.11 No Sound Coming from the Headset During a Call Figure 8-13 Troubleshooting procedure for no sound coming from the headset during a call
No voice can be heard f rom the headset af ter a call is set up N Is the receiver volume properly set?
End
Y Y
Is the problem solved af ter you replace the headset?
End
N N Is the headset icon displayed on the status bar?
Replace the headset connector
Y Replace the U701
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8.12 T-Flash Card Detection Failure Figure 8-14 Troubleshooting T-Flash card detection failures T-Flash card detection failure
Y End
Is the problem solved after you replace the T-Flash card? N
Y Check whether any T-Flash card slot pins are tilted
Replace the slot
N Y
Replace the Z2302
End
N
Replace the U701
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8.13 GPS Signal Reception Failure Figure 8-15 Troubleshooting GPS signal reception failures GPS signal reception failure Is the GPS antenna in good contact with the spring?
N
Replace the GPS antenna or spring
Y Y Is the GPS channel poorly soldered?
Re-solder or replace the faulty component
N Re-load the phone software
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9 Functional Tests
9
Functional Tests
9.1 MMI Test To enter the MMI test mode: 1. Insert the TF card and SIM card (no SIM card insertion is required if the SIM card is integrated in the phone), install the battery, and power on the phone to enter the Home screen. 2. Enter *#*#2846579#*#* to drive the phone into MMI test mode. Press the volume down key to start the test. You can touch the menu key to skip the current test or touch the back key to return to the previous test. No.
Item
Step
Content
Test Method Insert the SD card and start a power-on test. If the SD card can be detected, this item passes the test.
1
Testing the SD card
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1
Test whether the SD card functions properly.
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No.
Item
Step
Content
9 Functional Tests
Test Method If the battery is in-position, this item passes the test.
2
Checking for the battery
2
Check whether the battery is in-position.
Press or touch all the keys. When a key is pressed or touched, the color of the corresponding key displayed on the screen will change. After all keys are tested, press the Volume down key to start the next test.
3
Key test
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3
Test the keys.
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No.
Item
Step
Content
9 Functional Tests
Test Method Press the volume down key to display the white screen.
Press the volume down key to display the black screen.
White screen 4
LCD test
4
Blank screen. Color screen
Press the volume down key to display triple color bars (red, green, and blue).
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No.
Item
Step
Content
Test Method
5
LCD backlight test
5
Test the LCD backlight.
If the LCD backlight repeatedly turns on and off, the LCD backlight is normal. Press the Volume down key to start the next test. Slide your figure along the touchscreen edges in a circle. The route that your finger passes should turn red. Press the volume down key to proceed.
6
Testing the touchscreen
6
Test the touchscreen.
7
Tri-color indicator test
7
Test the tri-color indicator.
The red, blue, and green indicator is lighted cyclically.
8
Testing the rear camera
8
Test the rear camera.
Touch the white frame until the white frame turns green. The preview focus test is successful.
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No.
Item
Step
Content
9
Testing the front camera
9
Test the front camera.
9 Functional Tests
Test Method
Touch the red text position. If the flashlight turns on, this item passes the test.
10
Flashlight test
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10
Test the rear camera flashlight function.
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No.
Item
Step
Content
9 Functional Tests
Test Method Place the light shielding plate approximately 4 mm above the light hole. If the portrait icon changes to an in-call icon, the function is normal.
11
Testing the proximity sensor
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11
Test the proximity and light sensor's proximity detection function.
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No.
Item
Step
Content
9 Functional Tests
Test Method Check whether data of environmental light is detected. If yes, the test is passed. When the test screen is displayed, orient the phone front side to the light and block the light sensor using your hand, the phone automatically detects the light changes and determines whether the test item passes. If the test item passes, the phone automatically proceeds to the next test item. If the phone fails to detect the light changes after you tried changing the light environment for the phone several times, touch the menu key to confirm the light sensor failure.
12
Ambient light test
12
Test whether the ambient light sensor is functional.
The motor will vibrate intermittently. Press the Volume down key to start the next test.
13
Testing the motor
14
Testing the speaker
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13
Test the vibration motor.
14
Test the speakers.
Automatically test the speaker. (Do not insert the headset.) If the speaker emits pleasant sound during the test, the test passes. Press the volume down key to start the next test.
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No.
Item
Step
Content
9 Functional Tests
Test Method
If the receiver plays the pre-stored audio file repeatedly, the test item passes. Press the volume down key to proceed.
15
Testing the receiver
15
Test the receiver.
Touch Record. Speak to the microphone, and then touch Play. If the microphone functions properly, you can hear the voice recording from the receiver.
16
Main microphone test
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16
Test the main microphone
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No.
Item
Step
Content
9 Functional Tests
Test Method Touch Record. Speak to the microphone, and then touch Play. If the microphone functions properly, you can hear the voice recording from the receiver. Test the secondary microphone and headset in the same way. Press the Volume down key to start the next test.
17
Microphone loopback test
17
Test the microphone.
After a headset is inserted, the phone will search for and play an FM channel. If you hear the program from the headset, the test passes. Press the Volume down key to start the next test.
18
FM test
19
Testing the headset wire control function
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18
Test the FM module
19
Test the control-by-wi re function of the headset.
When the headset is inserted into the phone, the in icon on the test screen turns green; when the headset is removed, the out icon turns green. In this case, the test item passes. Press the Volume down key to start the next test.
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No.
Item
Step
Content
9 Functional Tests
Test Method
Automatically test the Bluetooth functions. During the test, the phone will search for Bluetooth devices, and display the devices that have been found. Press the Volume down key to start the next test. (Note: This test requires another device with Bluetooth enabled.)
20
Bluetooth test
20
Test the Bluetooth.
The LCD displays the current acceleration in the X, Y and Z axes. If the phone can be placed in a position where the angles between the phone and the X, Y and Z axes are 45 degrees, the phone passes this test.
21
Tilt sensor test
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21
Test the gravity sensing function.
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No.
Item
Step
Content
9 Functional Tests
Test Method Automatically test the Wi-Fi functions. If the phone receives Wi-Fi signals properly, it passes the test. Ensure that the phone under test is within the coverage of a Wi-Fi hotspot.
22
Wi-Fi test
22
Test the Wi-Fi function.
If a SIM is inserted into the phone and functions properly, the test item passes. Press the volume down key to view the test results.
23
Testing the SIM card
23
Test the SIM card.
The MMI test is complete, and the test results are displayed on the LCD.
9.2 Wi-Fi Test To ensure a normal network, place the mobile phone within 15 meters away from the AP, and there must be no obstacle between the mobile phone and AP.
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Step 1 Configure the AP properly. Power on the phone and place it within the AP's transmission range. Step 2 Tap Settings > WIRELESS&SETTINGS > WLAN > turn WLAN on, and enable network notifications. Step 3 After the phone automatically finds the AP's SSID, touch the SSID and enter the password to establish a connection. Step 4 Change the distance between the phone and AP and check the change of the Wi-Fi signal strength. Step 5 In the normal network, launch a browser and access a website to test the network quality. Step 6 If no problems are found, finish the Wi-Fi test. If any problems are found, troubleshoot the phone or send it to an advanced service site for repair. ----End
9.3 Voice Call Test Step 1 Install a USIM card and battery on the mobile phone. Step 2 Press the power key to power on the phone. Step 3 Check whether the signal strength displayed on the LCD is normal. Step 4 Make a call to a fixed-line phone, and check the voice quality during the call. Step 5 If no problems are found during the test, finish the voice call test. If any problems are found, troubleshoot the phone or send it to an advanced service site for repair. ----End
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