GUL_DER_ZXSDR B8200 Product Description
Short Description
GUL Product Description ZTE. GSM, UMTS and LTE technology...
Description
ZXSDR B8200 Product Description UniRAN 14/GUL Multi-Mode
ZXSDR B8200 Product Description
ZXSDR B8200 Product Description Version
Date
Author
Reviewer
Notes
First release. It supports 3GPP R11, BPN2
V1.00
2015-12-25
Dong
Chen Yong, Yang
Chuanghong
Xu, Xin Shengli
are introduced, CCE1/SA/SE support GUL multi-mode, 32 dry contacts are available, CCE1
UMTS
CNBAP
processing
capability=3000/s. V1.10
2016-03-30
Dong
Chen Yong, Yang
Chuanghong
Xu, Xin Shengli
Add FS5A/PM5.
© 2016 ZTE Corporation. All rights reserved. ZTE CONFIDENTIAL: This document contains proprietary information of ZTE and is not to be disclosed or used without the prior written permission of ZTE. Due to update and improvement of ZTE products and technologies, information in this document is subjected to change without notice.
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1
ZXSDR B8200 Product Description
TABLE OF CONTENTS 1 1.1 1.2 1.3
2
Overview Overview ................................. ................................................. ................................. .................................. ................................. ......................... ......... 5 Introducti Introduction on ................................. .................................................. .................................. .................................. ................................. ...................... ...... 5 Benefits Benefits............................... ............................................... ................................. .................................. .................................. ............................... .............. 5 Application Scenarios ................ ................... .......... .................. ................... ................... .................. ................... .................. ........ 6
2 2.1 2.2 2.2.1 2.2.2
Product Architecture ......................................................................................... 8 Physical Structure ................................................................................................ 8 Hardware Structure .............................................................................................. 9 Control & Clock Board (CC) ................................................................................. 9 Baseband Processing Board .............................................................................. 13
2.2.3 2.2.4 2.2.5 2.2.6 2.2.7
Fabric Switch Board (FS) ................................................................................... 18 Site Alarm Board (SA/SE) .................................................................................. 20 Universal Ethernet Switch Board (UES) ............................................................. 22 Universal Clock Clock Interface Board (UCI/UCI-C)................... ......... ................... .................. ................... ................ ...... 23 Tower mounted Amplifier control Module (TAM) ................................................ 24
2.2.8 2.2.9 2.3 2.4
Power Module (PM) ........................................................................................... 25 Fan Array Array Module Module (FAM).................. ......... ................... ................... ................... ................... .................. .................. ................... .......... 26 Software Architecture ......................................................................................... 27 Functiona Functionality lity................................ ................................................. .................................. .................................. .................................. .................... ... 28
3 3.1 3.2 3.3 3.3.1 3.3.2
Technical Specifications ................................................................................. 30 Physical Indices ................................................................................................. 30 Capacity Indices ................................................................................................ 30 Power Power Indices Indices ................................ ................................................. .................................. ................................. ................................. ................... 31 Power Power Supply Supply............................................ ............................................................. .................................. ................................. ....................... ....... 31 Power Consumption ........................................................................................... 31
3.4 3.5 3.6 3.7
Interface Indices ................................................................................................ Environment Indices .......................................................................................... Electromagnetic Compatibility Indices ................................................................ Reliability Indices ...............................................................................................
4
Configurations Principles ............................................................................... 35
5
Glossary Glossary.................................. .................................................. ................................. ................................. ................................. ........................ ....... 37
31 33 33 33
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ZXSDR B8200 Product Description
FIGURES Figure 1-1
B8200 in the GSM/UMTS/LTE Network ............................................................. 5
Figure 1-2
B8200 Application Scenario ............................................................................... 7
Figure 2-1
Baseband Unit -- ZXSDR B8200........................................................................ 8
Figure 2-2
B8200 Hardware Structure ................................................................................ 9
Figure 2-3
CC Panel ........................................................................................................... 9
Figure 2-4
UBPG/UBPG3 Panel ........................................................................................13
Figure 2-5
BPK_e1/BPK_e/BPK_d Panel ..........................................................................14
Figure 2-6
BPL1A/BPL1/BPN0A/BPN0 Panel ....................................................................15
Figure 2-7
BPN2 Panel ......................................................................................................17
Figure 2-8
FS Panel ...........................................................................................................18
Figure 2-9
SA Panel...........................................................................................................20
Figure 2-10
SE Panel.........................................................................................................21
Figure 2-11
UES Panel ......................................................................................................22
Figure 2-12
UCI/UCI-C Panel ............................................................................................23
Figure 2-13
TAM Panel ......................................................................................................24
Figure 2-14
PM Panel ........................................................................................................25
Figure 2-16
FAM Panel ......................................................................................................26
Figure 2-17
B8200 Software Structure ...............................................................................27
TABLES Table 2-1
Board List of ZXSDR B8200................................................................................ 8
Table 2-2
Key Indices of CC Boards ..................................................................................10
Table 2-3
CC2/CC16B Panel Interfaces.............................................................................11
Table 2-4
CCE1 Panel Interfaces.......................................................................................11
Table 2-5
Key Indices of BPK_e1/BPK_e /BPK_d ..............................................................14
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ZXSDR B8200 Product Description
Table 2-6
Key Indices of BPL1A/BPL1/BPN0A/BPN0 ........................................................16
Table 2-7
BPL1A/BPL1/BPN0A/BPN0 Panel interfaces .....................................................16
Table 2-8
Key Indices of BPN2 ..........................................................................................17
Table 2-9
BPN2 Panel interfaces .......................................................................................18
Table 2-10
Key Indices of FS boards .................................................................................19
Table 2-11
FS Panel Interfaces .........................................................................................20
Table 2-12
SA Panel Interfaces .........................................................................................21
Table 2-13
SE Panel Interfaces .........................................................................................22
Table 2-14
UES Panel Interfaces .......................................................................................22
Table 2-15
UCI/UCI-C Panel Interface ...............................................................................23
Table 2-16
TAM Panel Interfaces.......................................................................................24
Table 2-17
PM Panel Interfaces.........................................................................................26
Table 3-1
Physical Indices .................................................................................................30
Table 3-2
BS8200 Capacity ...............................................................................................30
Table 3-3
B8200 Power Supply .........................................................................................31
Table 3-4
ZXSDR B8200 Power consumption ...................................................................31
Table 3-5
ZXSDR BS8200 Interface Indices ......................................................................31
Table 3-6
B8200 Working Environment Characteristics .....................................................33
Table 3-7
ZXSDR B8200 Electromagnetic Compatibility Characteristics............................33
Table 3-8
B8200 Reliability Characteristics ........................................................................34
Table 4-1
B8200 Configuration ..........................................................................................35
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ZXSDR B8200 Product Description
1
Overview
1.1
Introduction This document provides a high level description of the distributed baseband processing Unit (BBU) ZXSDR B8200 (hereinafter B8200) that used in ZTE multi-mode wireless solutions. The baseband unit B8200, can be inserted into the integrated macro base station, or connected to RRU in distributed base station. It is responsible for processing the baseband signals. Based on ZTE SDR platform, it supports GSM, UMTS and FDD LTE single-mode or multi-mode by software configuration. It enables operators to deploy one unified radio access network rather than independent GSM, UMTS or LTE network, which brings simplicity and convenience with low CAPEX and OPEX. Figure 1 sho ws the position of the ZXSDR B8200 in the typical multi-mode network.
Figure 1-1
B8200 in the GSM/UMTS/LTE Network
This document is structured as follows. Chapter 1 provides an overview of the characteristics of B8200, its key benefits and application scenarios. Chapter 2 gives the architecture, functionality, services and multi-system cooperation. Chapter 3 covers system capabilities, and chapter 4 introduces configuration principles of each kind of boards used in B8200.
1.2
Benefits
Multi-mode Baseband Unit
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ZXSDR B8200 Product Description
B8200 supports all kinds of wireless access technologies simultaneously, including GSM, UMTS and LTE, which share the common control function and transmission totally. It fully satisfies operators’ need with the minimum hardware change .
Large Capacity To adapt to the rapid expansion of network development and the prosperity of multi-mode network, the latest BBU boards are released with higher processing capacity. The capacity indices of new boards surpass legacy ones, including RRC connected user number, cell number and data throughput. The increase in the board capacity improves the overall capacity of BBU. In addition, the new boards can be used together with the legacy ones, which provide flexibility during upgrade.
Plug-in Design for Shelf, Zero Footprint, Convenient Deployment B8200 adopts Plug-in design with 19-inch, 2U in height and 8.75 kg (with full configuration) in weight. It can be conveniently mounted on the wall, ground, or in the 19-inch rack, etc.
Flexible Networking B8200 provides GE/FE interfaces and IP networking. It supports RRU in different networking modes, like star and chain networking to satisfy the requirements of operators in different environments and under different transmission conditions.
1.3
Application Scenarios As the baseband processing unit, B8200 is widely used in ZTE series of base stations, including indoor macro BS of ZXSDR BS8800, outdoor macro BS of ZXSDR BS8900A/BS8900B, distributed BS of ZXSDR BS8700 and outdoor compact BS of ZXSDR BS8906. Typical application scenarios of B8200 are shown in the following figure.
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ZXSDR B8200 Product Description
Figure 1-2
B8200 Application Scenario
RRU Installation
RRU
B8200 Accommodation
B8200
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ZXSDR B8200 Product Description
2
Product Architecture
2.1
Physical Structure The following figure shows the hardware appearance of B8200.
Figure 2-1
Baseband Unit -- ZXSDR B8200
1
3
4
5 2 6
1. Power module (PM) 2. Site alarm board (SA) 3. Fabric switch board (FS) 4. Baseband processing board (BP) 5. Fan array module (FAM) 6. Control & clock board (CC)
The baseband unit consists of control & clock board, fabric switch board, baseband processing board, site alarm board, site alarm extension board (optional), universal Ethernet switch (optional), tower mounted amplifier control module (optional), power module, and fan module.
Table 2-1
Board List of ZXSDR B8200 Board Name
8
Function Description
CC2/CC16B/CCE1
Control & Clock Board
FS3/FS3A/FS5/CR0
Fabric Switch Board
UBPG/UBPG3
Universal Baseband Processing board for GSM
BPK_e1/BPK_e/BPK_d
Base band Processing board for UMTS
BPL1A/BPL1/BPN0A/BPN0
Base band Processing board for LTE
BPN2
Baseband Processing board for GUL multi-mode
SA
Site Alarm Board
SE
Site alarm Extension Board
UES
Universal Ethernet Switch Board
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ZXSDR B8200 Product Description
2.2
UCI
Universal Clock Interface
TAM
Tower mounted Amplifier control Module
PM
Power Module
FAM
Fan Array Module
Hardware Structure B8200 hardware architecture is shown in Figure 2-2.
Figure 2-2
B8200 Hardware Structure
Baseband Unit
Antenna
Baseband Processing
FS (Optional
CPRI RRU/RSU
for LTE) SA/ E1
SE
CC Radio Unit
GE/FE Control Signaling Clock Data
B8200 can be configured in GSM/UMTS/LTE single mode or multi-mode.
2.2.1
Control & Clock Board (CC) CC is the control & clock board, used for control and management of baseband unit, providing Ethernet and system clock. There are mainly 3 types of CC boards in order to meet different application requirements, illustrated in the following figures.
Figure 2-3
CC Panel
CC2:
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ZXSDR B8200 Product Description
CC16B:
CCE1:
Note: The boards are differentiated by the label attached on the panel, not included in the above figures. The product you receive is subject to the actual object.
Their key indices are specified in the following table.
Table 2-2
Key Indices of CC Boards
CC Type Mode
CC2
CC16B
CCE1
G/U single mode
G/U/L single mode or
GUL multi-mode or
or dual-mode
multi-mode
LTE single mode
400/s
1500/s
3000/s
N/A
10800
10800
Processing
RRC_connected users
RRC_connected users
Capability
UL: 900Mbps/ DL:
UL: 1.8Gbps/ DL:
900Mbps
3.6Gbps
UMTS CNBAP Processing Capability LTE
Note: 1. The above table describes the maximum hardware capability. The actual capability is up to the licenses configured. 2. There is the GPS module embedded in CC16B/CCE1 but not i n CC2.
The panel interfaces are specified in the following table.
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ZXSDR B8200 Product Description
Table 2-3
CC2/CC16B Panel Interfaces
Interface Name
Description External communication port, connected to external
EXT
receiver for clock synchronization or cascading. Connected to GPS signal interface, or 2 MHz BITS signal
REF
interface.
USB (CC16B only)
Used for software upgrade Ethernet interface for Abis/Iub/S1/X2, self-adaptive
TX RX
100M/1000M optical interface. Ethernet interface for Abis/Iub/S1/X2, self-adaptive
ETH0
10M/100M/1000M electrical interface.
DEBUG/CAS/LMT
Ethernet interface used for cascading, debugging or local maintenance, adapting interface of 10M/100M/1000M.
Note: Interfaces of ETH0 and TX RX are mutually exclusive.
Table 2-4
CCE1 Panel Interfaces
Interface Name ETH0
ETH1
DEBUG/LMT
TX ETH2 RX
TX ETH3 RX
REF USB EXT
Description Ethernet interface for Abis/Iub/S1/X2, self-adaptive 10M/100M/1000M electrical interface. Ethernet interface used for cascading, adapting interface of 10M/100M/1000M electrical interface. Ethernet interface used for debugging or local maintenance, adapting interface of 10M/100M/1000M. Ethernet interface for Abis/Iub/S1/X2, self-adaptive 1000M/10000M optical interface. Ethernet interface for Abis/Iub/S1/X2, self-adaptive 1000M/10000M optical interface. Connected to GPS signal interface, or 2 MHz BITS signal interface. Used for software upgrade External communication port, connected to external receiver for clock synchronization or cascading.
Their main functions are listed as follows:
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ZXSDR B8200 Product Description
Accomplishes LTE control plane protocol processing, including S1AP, X2AP, RRC, etc.
Supports Ethernet switching function and implements data switching for service and control flow within the system
Processes Abis/Iub/S1/X2 interface protocol
Manages software versions of boards and programmable components, and supports local and remote software upgrade
Reads various hardware management marks in the system, including the rack number, backplane type number, slot number, board function type, board version, and board function configuration mark
Monitors, controls and maintains the base station system with LMT interface
Supervises the running status of each board within the system
Supports primary/slave switchover
Synchronizes with various external reference clocks, including clock and the clock provided by BITS(2MHz
IEEE1588, GPS
2Mbits). The CC can select one
、
according to the actual configuration
Generates and delivers the clock signal demanded by each part
Provides GPS receiver interface and manages the GPS receiver
Provides a real-time clock for system operation and maintenance and calibrates the real-time clock
Supports MicroTCA protocol based module management function
Supports 2 CC boards for different modes: one for GU dual-mode and the other for LTE mode
In addition, CC16B/CCE1 has the following functions:
12
Supporting Synchronous Ethernet clock
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ZXSDR B8200 Product Description
2.2.2
Providing USB interface for software upgrade
Baseband Processing Board There are 3 categories of baseband processing boards in order to meet different application requirements: 1.
UBPG /UBPG3
Both UBPG and UBPG3 are GSM baseband processing boards, processing the physical layer protocol and frame protocol specified by 3GPP, illustrated in the following figure.
Figure 2-4
UBPG/UBPG3 Panel
Note: The boards are differentiated by the label attached at the left-bottom corner, not included in the above figures. The product you receive is subject to the actual object.
UBPG supports 12 TRXs and UBPG3 supports 24 TRXs. Their main functions are listed as follows:
Supports rate adaptation, channel coding, interleaving, encryption, TDMA shock burst generation, GMSK/8PSK modulation, and IQ baseband digital signals output
Supports
uplink IQ
data receiving,
receiver diversity combination,
digital
demodulation (GMSK&8PSK, equilibrium), decryption, deinterleaving, demodulator, rate adaptation, and transmits signals from GE Ethernet interfaces to CC board for processing
Synchronizes radio link and processes transmission frame
Measures parameters required in power control and handover
Supports diversified transmission and receiving
Communicates with CC via Ethernet interface
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ZXSDR B8200 Product Description
Reads all the hardware management identifiers, including the backplane type number, slot number, board function type, board version, board function configuration identifier, and the CPU serial number
2.
BPK_e1/BPK_e/BPK_d
BPK_e1, BPK_e and BPK_d are all UMTS baseband processing boards, processing the
physical layer protocol and frame protocol specified by 3GPP, illustrated in the following figure.
Figure 2-5
BPK_e1/BPK_e/BPK_d Panel
Note: The boards are differentiated by the label attached at the left-bottom corner, not included in the above figures. The product you receive is subject to the actual object.
They provide the same functions but with different CE, cell processing capability and data throughput. The key indices are specified in the following table.
Table 2-5
Key Indices of BPK_e1/BPK_e /BPK_d
Board
BPK_e1
BPK_e
BPK_d
CSs
6
6
12
CE No.
DL192CE/UL19
DL384CE/UL384CE
DL768CE/UL768CE
2CE Data
DL129.6Mbps/
DL259.2Mbps/
DL518.4Mbps/
Throughput
UL34.5Mbps
UL69Mbps
UL138Mbps
Note: The above table describes the maximum hardware capability. The actual capability is up to the licenses configured.
Their main functions are listed as follows:
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ZXSDR B8200 Product Description
Achieves downlink baseband signal processing, including downlink data coding, multiplexing, rate adaptation, channel mapping, spread spectrum and scrambling power regulation and channel compositing
Achieves uplink baseband signal processing, including uplink data RAKE receiving, demodulator, and transmits data to lub interface for processing
Supports A-RAKE receiving and UL interface cancellation
Supports radio link synchronization and frame processing
Measures parameters required in power control and handover
Supports softer handover and carrier diversity
Communicates with the CC via the Ethernet interface
Reads all the hardware management identifiers, including the backplane type number, slot number, board function type, board version, board function configuration identifier, and the CPU serial number
3.
BPL1A/BPL1/BPN0A/BPN0
BPL1A/BPL1/BPN0A/BPN0 are all LTE baseband processing boards, processing the
physical layer protocol and frame protocol specified by 3GPP, illustrated in the following figure.
Figure 2-6
BPL1A/BPL1/BPN0A/BPN0 Panel
BPL1A/BPL1:
BPN0A/BPN0:
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ZXSDR B8200 Product Description
Note: The boards are differentiated by the label attached at the left-bottom corner, not included in the above figures. The product you receive is subject to the actual object.
They provide the same functions but with different CPRI interfaces, cell processing capability and data throughput. The key indices are specified in the following table.
Table 2-6
Key Indices of BPL1A/BPL1/BPN0A/BPN0
Board
BPL1A
BPL1
BPN0A
BPN0
CPRI Interfaces
3 pairs
3 pairs
6 pairs
6 pairs
RRC_connected
3600
3600
3600
3600
3
6
3
6
Cells (20MHz, 4T4R)
N/A
3
N/A
3
Data Throughput
DL450Mbps/
DL600Mbps/
DL450Mbps/
DL600Mbps/
UL225Mbps
UL300Mbps
UL225Mbps
UL300Mbps
Users Cells (20MHz, 2T2R/2T4R)
Note: The above table describes the maximum hardware capability. The actual capability is up to the licenses configured.
The panel interfaces are specified in the following table.
Table 2-7
BPL1A/BPL1/BPN0A/BPN0 Panel interfaces
Board Type
Interface
BPL1A/BPL1
TX0 RX0 ~ TX2 RX2
BPN0A/BPN0
TX0 RX0 ~ TX5 RX5
Description 3 pairs of CPRI optical/electrical interfaces, connected to RRU/RSU 6 pairs of CPRI optical/electrical interfaces, connected to RRU/RSU
Their main functions are listed as follows:
16
Processes physical layer protocol
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ZXSDR B8200 Product Description
Provides uplink/downlink I/Q signal
Supports MAC, RLC and PDCP protocol
4.
BPN2
BPN2 is a GSM/UMTS/LTE multi-mode baseband processing board, integrating all the functions provided by the G/U/L single mode BP boards. It can be configured as G/U/L single mode or multi-mode, illustrated in the following figure.
Figure 2-7
BPN2 Panel
Note: The boards are differentiated by the label attached at the left-bottom corner, not included in the above figures. The product you receive is subject to the actual object.
They provide the same functions but with different processing capabilities. The key indices are specified in the following table.
Table 2-8
Key Indices of BPN2 Board
BPN2
CPRI Interfaces
6 pairs
GSM
72 TRXs
UMTS
12 CSs(1024CEs) DL 518.4Mbps/UL 138Mbps 12 2T2R/2T4R Cells or 6 4T4R Cells
LTE
7200 RRC_connected Users DL 1200Mbps/UL 600Mbps 12 TRXs + 12 CSs(768CEs)
GU dual-mode
24 TRXs + 9 CSs(640CEs) 36 TRXs + 6 CSs(512CEs) 48 TRXs + 6 CSs(256CEs)
GL dual-mode
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36 TRXs + 6 Cells
17
ZXSDR B8200 Product Description
Board
BPN2
UL dual-mode
6 CSs(512CEs) + 6 Cells
GUL multi-mode
12 TRXs + 6 CSs(256CEs) + 6 Cells 24 TRXs + 3 CSs(128CEs) + 6 Cells
Note: The above table describes the maximum hardware capability. The actual capability is up to the licenses configured.
The panel interfaces are specified in the following table.
Table 2-9
BPN2 Panel interfaces
Board Type BPN2
2.2.3
Interface TX0 RX0 ~ TX5 RX5
Description 6 pairs of CPRI optical/electrical interfaces, connected to RRU/RSU
Fabric Switch Board (FS) FS is fabric switch board which provides the optical interface between BBU and RRU and processes the IQ signal. There are 5 types of FS boards, illustrated in the following figure.
Figure 2-8
FS Panel
FS3:
FS3A:
FS5:
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ZXSDR B8200 Product Description
FS5A:
CR0:
Note: The boards are differentiated by the label attached at the left-bottom corner, not included in the above figures. The product you receive is subject to the actual object.
Their key indices are specified in the following table.
Table 2-10
Key Indices of FS boards
FS Type
Mode
FS3
FS3 A
FS5
FS5A
CR0
G/U
G/U
G/U/L
G/U/L
When LTE
single
single
single
single
is included
mode or
mode or
mode or
mode or
and Cloud
dual-mod
dual-mod
multi-mode
multi-mode
Radio (CR)
e
e
6
12
12
12
12
30
48
54
54
54
is required
Max. CSs, working with one UMTS BP board Max. CSs, working with UMTS BP boards per BBU
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ZXSDR B8200 Product Description
CPRI Interface Data Rate (Gbps)
1.2288/2.
1.2288/2.
4576
4576
1.2288/2.45
1.2288/2.45
1.2288/2.45
76/3.072/6.
76/3.072/6.
76/3.072/6.
144
144/9.8304
144/9.8304
The panel interfaces are specified in the following table.
Table 2-11
FS Panel Interfaces
Interface Name
Description
TX0 RX0 to TX5 RX5
6 pairs of optical/electrical interfaces, connected to RRU/RSU
ETH (CR0 only)
10GE Ethernet interface, connected to BBU
Their main functions are listed as follows:
Receives the signal from the rear board in the downlink and retrieves the data and timing.
Multiplexes the received data and retrieves I/Q signal
Supports I/Q mapping in the downlink and multiplexes I/Q signal to the optical signals
2.2.4
Receives the I/Q in uplink and de-multiplexes/maps into I/Q signal
Transmits the multiplexed I/Q signal to baseband processing board
Exchanges the CPU interface signaling through HDLC interface with RU module
Site Alarm Board (SA/SE) 1.
Site Alarm Board (SA)
SA is a site alarm board, illustrated in the following figure.
Figure 2-9
20
SA Panel
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ZXSDR B8200 Product Description
Note: The product you receive is subject to the actual object.
There are two types of SA boards with different number of interfaces, as specified in the following table.
Table 2-12
SA Panel Interfaces
Interface Name -
SA0
SA3
8 E1/T1 interfaces
4 E1/T1 interfaces
6+2 dry contacts (6 input, 2
14+2 dry contacts (14 input, 2
bidirectional)
bidirectional)
1 RS485 interface
1 RS485 interface
1 RS232 interface
1 RS232 interface
The SA has the following functions:
Provides E1/T1 transmission interfaces
Provides site alarm monitoring interfaces
Provides FAM's alarm and rate control
Supports signal monitoring and interface lightning protection
The last E1 used for E1 transmission or BITS-2MHz/BITS-2Mbps clock input
2.
Site alarm Extension Board (SE)
SE is site alarm extension board, and shares the bottom-right slot with baseband processing board. It is used to extend the interface number if SA cannot fulfill the requirements. The SE panel is illustrated in the following figure.
Figure 2-10
SE Panel
Note: The product you receive is subject to the actual object.
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ZXSDR B8200 Product Description
There are two types of SE boards with different number of interfaces, as specified in the following table.
Table 2-13
SE Panel Interfaces
Interface Name -
SE0
SE2
8 E1/T1 interfaces
4 E1/T1 interfaces
6+2 dry contacts (6 input, 2
14+2 dry contacts (14 input, 2
bidirectional)
bidirectional)
1 RS485 interface
1 RS485 interface
1 RS232 interface
1 RS232 interface
The SE board provides the following functions:
2.2.5
E1/T1 transmission interfaces
Site alarm monitoring interfaces
Universal Ethernet Switch Board (UES) UES is used for synchronized Ethernet and the panel is illustrated in the following figure.
Figure 2-11
UES Panel
Note: The product you receive is subject to the actual object.
Description of UES panel interfaces is specified in the table below:
Table 2-14
UES Panel Interfaces
Interface Name
Description
X1 ~ X2
The electrical interfaces for cascaded connection.
X3/UPLINK
A compatible electrical interface for both cascaded connection and uplink connection for link aggregation.
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ZXSDR B8200 Product Description
Interface Name
Description
UPLINK
An electrical or optical interface.
X4/UPLINK
A compatible optical interface for both cascaded connection and uplink connection for link aggregation.
UES has the following functions:
2.2.6
Supports L2 Ethernet switch
Supports synchronous Ethernet clock
Universal Clock Interface Board (UCI/UCI-C) UCI is the RGPS clock interface board. There are two types of UCI boards: UCI and UCI-C. UCI/UCI-C panel is illustrated in Figure 2-12.
Figure 2-12
UCI/UCI-C Panel
Note: The boards are differentiated by the label attached at the left-bottom corner, not included in the above figures. The product you receive is subject to the actual object.
Description of UCI/UCI-C panel interfaces is shown in the following table:
Table 2-15
UCI/UCI-C Panel Interface
Interface Name TX RX
Description 125Mbps optical interface, connected to RGPS equipment for signal import. TX RX is only available on UCI.
EXT
HDMI interface, providing 1PPS+TOD clock signal for the CC board in the same BBU.
REF
GLONASS/GPS antenna interface, only available on UCI-C. Reserved on UCI.
DLINK0
HDMI interface, providing 2 outputs of 1PPS+TOD signals for CC boards in other BBUs.
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ZXSDR B8200 Product Description
Interface Name DLINK1
Description HDMI interface, providing 2 outputs of 1PPS+TOD signals for CC boards in other BBUs.
2.2.7
Tower mounted Amplifier control Module (TAM) TAM is used for tower mounted amplifier control when TMA is needed. Panel of TAM is shown as following figure.
Figure 2-13
TAM Panel
Note: The product you receive is subject to the actual object.
The panel interfaces are specified in the table below.
Table 2-16
TAM Panel Interfaces
Interface Name
Description
TA0
DC output voltage channel 0
TA1
DC output voltage channel 1
TA2
DC output voltage channel 2
TA3
DC output voltage channel 3
TA4
DC output voltage channel 4
TA5
DC output voltage channel 5
The TAM has the following functions:
Supports working status detection of tower amplifier and reports alarm signals to CC board
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ZXSDR B8200 Product Description
Provides power on and off for tower amplifier with +28V, +12V or +13V power supply
2.2.8
Realizes the communication with CC board
Implements conversion, protection and filtering of power supply
Provides anti-lightning for power supply circuit
Implements software remote downloading and current threshold setting
Power Module (PM) PM is the power module, including PM3 and PM5. PM5 has 50% more power supply than PM3 for full configuration of new high power consumption boards, shown in the following figure.
Figure 2-14
PM Panel
PM3:
PM5:
Note: The boards are differentiated by the label attached at the left-bottom corner, not included in the above figures. The product you receive is subject to the actual object.
The panel interfaces are specified in the following table.
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ZXSDR B8200 Product Description
Table 2-17
PM Panel Interfaces
Interface Name
Description
MON
Debugging interface, RS232 interface
-48V/-48VRTN
-48V input
ON/OFF (PM3 only)
Power switch, turning on/off 12V power to/from BBU
The PM has the following functions:
2.2.9
Provides 16 internal interfaces for +12 V, +13V or +28V load power;
Provides 16 internal interfaces for +3.3 V management power;
Supports EMMC management;
Supports measurement and protection of input over-voltage/under-voltage;
Supports output over-current protection and load power management.
Fan Array Module (FAM) FAM is fan array module. Its panel is illustrated in the following figure.
Figure 2-15
FAM Panel
Note: The product you receive is subject to the actual object.
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ZXSDR B8200 Product Description
The FAM has the follows functions:
2.3
Monitors and controls system temperature;
Monitors, controls, and reports the fan state.
Software Architecture The software architecture of the ZXSDR B8200 can be divided into three layers:
Application software layer
Platform software layer
Hardware layer
Figure 2-16
B8200 Software Structure
GSM/UMTS/LTE A
LMT
SCS
OAM
lication Software
DBS
BRS
OSS
OMC-B
Linux Hardware (BSP)
The application software layer provides functions as follows:
RNLC (radio network layer control) provides common and dedicated radio resource management and control functions for control plane
RNLU (radio network layer user) provides user plane function
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ZXSDR B8200 Product Description
SCHEDULER (scheduler sub-system) provides uplink/downlink MAC scheduling
PHY (physical layer) provides PHY function
The SDR platform software provides the functions of Operation Support Sub-system (OSS), Operating And Maintenance (OAM), Data Base Sub-system (DBS), Bearer Sub-system (BRS) and System Control Sub-system (SCS):
OSS is the support layer in this entire framework, which is a hardware independent platform for running software and provides basic functions like scheduling, timer, memory management, communication, sequencing control, monitoring, alarming and logging.
OAM provides the configuration, alarm and performance measurement function for base station.
DBS is the database system.
BRS provides the IP communication function for inter-board and inter-network elements.
SCS provides the power control and system management function.
Board Support Package (BSP) is the software closely connected with the board hardware and supports Real Time Operation Support Sub-system (RT OSS) to work on the board.
2.4
Functionality B8200 implements the following basic functions on Abis/Um/Uu/S1/X2 and O&M interfaces:
28
Channel coding and decoding
Channel multiplexing and de-multiplexing
Baseband resource pooling function
Measurement and report
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ZXSDR B8200 Product Description
Power control
Spatial multiplexing, transmit diversity and receive diversity
Synchronization
Operation and Maintenance
DTX
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ZXSDR B8200 Product Description
3
Technical Specifications
3.1
Physical Indices Table 3-1
3.2
Physical Indices
Item
Indices
Size (H*W*D) (mm)
88.4*482.6*197
Weight (kg)
8.75 (full configuration)
Capacity Indices Table 3-2
BS8200 Capacity
Mode GSM
Capacity 312 TRXs
BBU Configuration 1CC16B+4BPN2+1UBPG3+1FS+2PM+ 1SA
54 CSs UMTS
4480 CEs UL/4480 CEs DL
1CC16B+4BPN2+1BPK_e+1FS+2PM+1 SA
621 Mbps UL /1000 Mbps DL 36x20MHz cells (2T2R/2T4R) LTE
10800 RRC_connnected users
1CCE1+3BPN2+2PM+1SA
1.8Gbps UL/3.6Gbps DL Note: 1. CC16B board supports GE/FE interface and thus limits the total data throughput to 1000Mbps in the physical layer (900Mbps in application layer for LTE single mode). 2. The above table describes the maximum hardware capacity. The actual capacity is up to the licenses configured.3. GUL multi-mode capacity can be calculated according the capacity of the configured CC boards and BP boards.
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ZXSDR B8200 Product Description
3.3
Power Indices
3.3.1
Power Supply B8200 power supply is shown in the following Table.
Table 3-3
B8200 Power Supply
Power Options DC: -48 V (-57 V – -40 V DC)
Description Supported by integrated PM modules
The power supply is already certified for the following markets.
3.3.2
Power Consumption The power consumption depends on traffic load, configuration and environment temperature. The following table provides power consumption of typical configuration.
Table 3-4
ZXSDR B8200 Power consumption Items
3.4
Power Consumption (W)
12 TRXs/1 UBPG
70
24 TRXs/1 UBPG3
75
6CS/3 BPK_e/BPK_e1
85
12CS/1 BPK_d
105
3 cells/1 BPL1
120
6 cells/1 BPN0
90
24 TRXs + 3 CSs(128CEs) + 6 Cells /1 BPN2
125
12 TRXs + 6 CSs(256CEs) + 6 Cells/1 BPN2
125
Interface Indices Table 3-5
ZXSDR BS8200 Interface Indices
Interface
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Item
Indices
Type
Standard
31
ZXSDR B8200 Product Description
Abis/Iub (CC2/CC16B)
E1/T1
8 pairs
ITU G.703/G.704
DB44
ANSI T1.403
1 10M/100M/1000M electrical
10/100/1000BASET IEEE 802.3
RJ45
Auto-Negotiation. Abis/Iub/S1/X2
Ethernet
(CC2/CC16B)
(either or)
compatible
Auto-MDI/MDIX 1000BASE-LX 1 1000M optical Or 1 100M optical
IEEE 802.3 SFP (LC)
compatible, 100BASE-FX IEEE 802.3 compatible
2 10M/100M/1000M electrical
10/100/1000BASET IEEE 802.3
RJ45
Auto-Negotiation.
compatible
Auto-MDI/MDIX Abis/Iub/S1/X2 (CCE1)
10GBASE-SR,10G Ethernet
BASE-SW,10GBAS E-LR,10GBASE-L
2 10G optical Or 2 1000M
SFP (LC)
optical
W IEEE 802.3 compatible, 1000BASE-LX IEEE 802.3 compatible
1 Cascading, Debugging or Local
10M/100M/1000M Ethernet
electrical
10/100/1000BASET IEEE 802.3
RJ45
Auto-Negotiation.
Maintenance
compatible
Auto-MDI/MDIX 6 pairs Baseband
Electrical
/Radio
/Optical
/FS/BPN0A/BPN0 /BPN2
SFP (LC)
CPRI
3 pairs /BPL1A/BPL1
Clock
32
GPS
1
SMA
GPS TX/RX Port NMEA 0183 V3.0
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ZXSDR B8200 Product Description
Monitor External
Dry
32 pairs (8,16 or
contacts
24 pairs optional)
EXT
1
DB44 RS485/RS2 32
3.5
N/A
N/A
Environment Indices Table 3-6
B8200 Working Environment Characteristics Item
Requirement
Temperature
-20 to +55°C
Relative Humidity
5% to 95%
Protection classification
Compliant with IP20 ETSI EN 300 386
Emission and Immunity ETSI TS 125 113 ≤5 Ω; earth resistance can be less than 10 Ω in lightning-less area with less than 20 lightning storms a
Ground
year. Mechanical vibration
3.6
ETSI 300019-1-4 ClassM4.1
Electromagnetic Compatibility Indices Table 3-7
ZXSDR B8200 Electromagnetic Compatibility Characteristics Item
Anti-static protection
Requirement Capable of protecting against a contact discharge of ±6000V, Air discharge of ±8000V.
Surge anti-interference
3.7
±2000V between lines and ground.
Reliability Indices The reliability of the ZXSDR B8200 system conforms to the national military GJB/Z299B Electronic Equipment Reliability Estimation Manual and the IEC TR62390 standard.
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ZXSDR B8200 Product Description
The Reliability characteristics vary at different configurations. The reliability indices are calculated based on typical configuration supporting GUL multi-mode, listed in table 3-8.
Table 3-8
B8200 Reliability Characteristics Item
34
Value
MTBF
≥240,000 hours
MTTR
0.5 hour
Availability index
≥99.999792%
Down duration
≤1.095 min/year
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ZXSDR B8200 Product Description
4
Configurations Principles B8200 is the baseband unit of macro base station, which is composed of the following boards: CC, BP, FS, SA/SE, UES, TAM, PM, FAM, etc. Configuration principles of these boards are described in the following table:
Table 4-1
B8200 Configuration
Board
Configuration Principles Refer to table 2-2 for the key indices of CC boards. At least 1 board is configured by default.
CC
Maximally 2 boards can be configured for GU and LTE respectively or 1+1 backup. UBPG
12 GSM TRXs/board. Maximally 5 boards can be configured.
UBPG3
24 GSM TRXs/board. Maximally 5 boards can be configured.
BPK_e1
BPK_e
BPK_d
BP
BPL1A
BPL1
BPN0A
BPN0
BPN2
Refer to table 2-5 for the key indices. Maximally 5 boards can be configured. Refer to table 2-5 for the key indices. Maximally 5 boards can be configured. Refer to table 2-5 for the key indices. Maximally 4 boards can be configured. Refer to table 2-6 for the key indices. Maximally 3 boards can be configured. Refer to table 2-6 for the key indices. Maximally 3 boards can be configured. Refer to table 2-6 for the key indices. Maximally 6 boards can be configured. Refer to table 2-6 for the key indices. Maximally 6 boards can be configured. Refer to table 2-8 for the key indices. Maximally 4 boards can be configured. Refer to table 2-10 for the key indices of FS boards. At least 1
FS
board is configured by default for G/U mode. FS is optional in LTE single mode configuration. Maximally 2 boards can be configured.
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ZXSDR B8200 Product Description
SA
Refer to table 2-12 for the interfaces of the 2 types of SA boards. It is configured by default. Refer to table 2-13 for the interfaces of the 2 types of SE boards. It
SE
is configured only when the requirements of dry contacts or E1/T1 exceed SA capacity.
UES
4 electrical and 2 optical Ethernet interfaces per board. It is configured when L2 Ethernet switch is required. 1 optical interface and 3 HDMI interfaces per board. UCI is configured for connecting to the remote device when remote
UCI
transportation of GPS signal is required and the optical RGPS solution is adopted. UCI-C is configured in the GLONASS system.
TAM
PM FAM
6 DC outputs with customized voltage per board. It is configured for tower amplifier control when TMA is needed. At least 1 board is configured by default. Maximally 2 boards can be configured for 1+1 backup. It is configured by default.
Note: The above table describes the maximum hardware capacity. The actual capacity is up to the licenses configured.
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ZXSDR B8200 Product Description
5
Glossary Abbreviations
Full Characteristics rd
3GPP
3 Generation Partnership Project
BP
Baseband Processing
BBU
Base Band processing Unit
BITS
Building Integrated Timing Supply
BPL
Baseband Processing Board for LTE
BPL1
Baseband Processing Board for LTE type1
BSP
Board Support Package
CAPEX
Capital Expenditure
CC
Control & Clock module
CPRI
Common Public Radio Interface
DBS
Data Base Sub-system
DL
Downlink
DTX
Discontinuous transmission
EUTRAN
Evolved Universal Mobile Telecommunications System
FAM
Fan Module
FE
Fast Ethernet
FS
Fabric Switch board
GE
Gigabit Ethernet
GPS
Global Positioning System
GSM
Global System for Mobile communications
HSPA+
HSPA Evolution
LMT
Local Maintenance Terminal
LTE
Long Term Evolution
MDLSD
MAC Downlink Schedule
MicroTCA
Micro Telecommunications Computing Architecture
MIMO
Multi Input Multi Output
MTBF
Mean Time Between Failures
MTTR
Mean Time To Recovery
MULSD
MAC Uplink Schedule
OAM
Operating Administration and Maintenance
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