Design of Thermal Systems_stoecker 3rd Edition

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TO. TIm. THIR.D,,.E DITI01\I ,

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The field of thermal ,system design and analysis continues to develop. The number of workers is gro\\"ing, technical papers appear in greater numbers, and new textbooks are _being written. . . The major objective of this third ,edition is tQ organize so.me of the new approaches that are now ,avaHabJe and to provide more flexibibty to - instructors who use Design of Thermal Systems as a texL The changes to the twelve chapters of the second edition are modest and mainly constitute the inclusion of some additional end-of-chapter problems. Chapters 13 tPJ"Dugh \ 19, ho\v~yer, are all new_ One possible use of th~ text is to cover the first twelve chapters in an advanced-level undergraduate course and the remaining seven chapters as a graduate COjJfse. In some engineering schools students already have some J.01d of optimiiatlOn course prior to ' taking the' thermal design course. For those classes certai)1 chapters of the fIrst hvelve (usually the ones on search methods, dynamic prograrrul:ring, and linear proirarruning) can be omi.tted and material can be supplemented from the, new seven chapters. Several of the new chapters are exten~ions of the introductions offered in the lust twelve chapters, especially mathematical moqeling, steady~state system simulation', and search methods. Chapter 14 addresses $.Orne of the challenges that arise when simulating Jarge, thennal systems. New material appears in Chapter 15 on dynamic be'h~yior, in Chapter 18 which introduces calculus of variations as a companion to dynamic programming, and in Chapter 19 on probabilistic approaches to design, which is exploratory. '., The author thanks colleagues both at the University of nlinois at Urbana-Champaign and at other engineering schools for continued input and suggestions during [he past several years on how to keep the ,book fresh. ~qraw2Hjl1 would rus,9. like to thank the foHowing ' reviewers for their useful comments: John R. Biddle, California State Polytechnic.

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PREFACE TO TI-IE THIRD EDmON

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University, Po'mona; Theodore F. ' Smith,.:1be University 0 '- 0 a; Edward Q~ Stoffel" CalifonUa State Polyt~chnic .Uriivers~ty; San Luis Obispo; John A. Tichy, ,Rensselaer Polytechnic Institute;, Daniel T. Va1~I! . e, ~larkson ,College; ?lld 'William' J. 'Wepfet" qe'