Design for Test by Alfred L Crouch

Figures to Accompany

Design-for-Test for Digital IC’s and Embedded Core Systems

Alfred L. Crouch

© 1999 Prentice Hall, All Rights Reserved

Contents

ii

Chapter 1 Test and Design-for-Test Fundamentals Figure 1-1 Cost of Product Figure 1-2 Concurrent Test Engineering Figure 1-3 Why Test? Figure 1-4 Definition of Testing Figure 1-5 Measurement Criteria Figure 1-6 Fault Modeling Figure 1-7 Types of Testing Figure 1-8 Manufacturing Test Load Board Figure 1-9 Using ATE Figure 1-10 Pin Timing Figure 1-11 Test Program Components Chapter 2 Automatic Test Pattern Generation Fundamentals Figure 2-1 The Overall Pattern Generation Process Figure 2-2 Why ATPG? Figure 2-3 The ATPG Process Figure 2-4 Combinational Stuck-At Fault Figure 2-5 The Delay Fault Figure 2-6 The Current Fault Figure 2-7 Stuck-At Fault Effective Circuit Figure 2-8 Fault Masking Figure 2-9 Fault Equivalence Example Figure 2-10 Stuck-At Fault ATPG Figure 2-11 Transition Delay Fault ATPG Figure 2-12 Path Delay Fault ATPG Figure 2-13 Current Fault ATPG Figure 2-14 Two-Time-Frame ATPG Figure 2-15 Fault Simulation example Figure 2-16 Vector Compression and Compaction Figure 2-17 Some Example Design Rules for ATPG Support Figure 2-18 ATPG Measurables Chapter 3 Scan Architectures and Techniques Figure 3-1 Introduction to Scan-based Testing Figure 3-2 An Example Non-Scan Circuit

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Contents

Figure 3-3 Figure 3-4 Figure 3-5 Figure 3-6 Figure 3-7 Figure 3-8 Figure 3-9 Figure 3-10 Figure 3-11 Figure 3-12 Figure 3-13 Figure 3-14 Figure 3-15 Figure 3-16 Figure 3-17 Figure 3-18 Figure 3-19 Figure 3-20 Figure 3-21 Figure 3-22 Figure 3-23 Figure 3-24 Figure 3-25 Figure 3-26 Figure 3-27 Figure 3-28

iii

Scan Effective Circuit Flip-Flop versus Scan Flip-Flop Example Set-Scan Flip-Flops An Example Scan Circuit with a Scan Chain Scan Element Operations Example Scan Test Sequencing Example Scan Testing Timing Safe Scan Shifting Safe Scan Vectors Partial Scan Multiple Scan Chains The Borrowed Scan Interface Clocking and Scan Scan-Based Design Rules DC Scan Insertion Stuck-At Scan Diagnostics At-Speed Scan Goals At-Speed Scan Testing At-Speed Scan Architecture At-Speed Scan Interface Multiple Scan and Timing Domains Clock Skew and Scan Insertion Scan Insertion for At-Speed Scan Critical Paths for At-Speed Testing Logic BIST Scan Test Fundamentals Summary

Chapter 4 Memory Test Architectures and Techniques Figure 4-1 Introduction to Memory Testing Figure 4-2 Memory Types Figure 4-3 Simple Memory Organization Figure 4-4 Memory Design Concerns Figure 4-5 Memory Integration Concerns Figure 4-6 Embedded Memory Test Methods Figure 4-7 Simple Memory Model Figure 4-8 Bit-Cell and Array Stuck-At Faults

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Contents

Figure 4-9 Figure 4-10 Figure 4-11 Figure 4-12 Figure 4-13 Figure 4-14 Figure 4-15 Figure 4-16 Figure 4-17 Figure 4-18 Figure 4-19 Figure 4-20 Figure 4-21 Figure 4-22 Figure 4-23 Figure 4-24 Figure 4-25 Figure 4-26 Figure 4-27 Figure 4-28

iv

Array Bridging Faults Decode Faults Data Retention Faults Memory Bit Mapping Algorithmic Test Generation Scan Boundaries Memory Modeling Black Box Boundaries Memory Transparency The Fake Word Technique Memory Test Needs Memory BIST Requirements An Example Memory BIST MBIST Integration Issues MBIST Default Values Banked Operation LFSR-Based Memory BIST Shift-Based Memory BIST ROM BIST Memory Test Summary

Chapter 5 Embedded Core Test Fundamentals Figure 5-1 Introduction to Embedded Core Test and Test Integration Figure 5-2 What is a CORE? Figure 5-3 Chip Designed with Core Figure 5-4 Reuse Core Deliverables Figure 5-5 Core DFT Issues Figure 5-6 Core Development DFT Considerations Figure 5-7 DFT Core Interface Considerations Figure 5-8 DFT Core Interface Concerns Figure 5-9 DFT Core Interface Considerations Figure 5-10 Registered Isolation Test Wrapper Figure 5-11 Slice Isolation Test Wrapper Figure 5-12 Slice Isolation Test Wrapper Cell Figure 5-13 Core DFT Connections through the Test Wrapper Figure 5-14 Core DFT Connections with Test Mode Gating

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Contents

Figure 5-15 Figure 5-16 Figure 5-17 Figure 5-18 Figure 5-19 Figure 5-20 Figure 5-21 Figure 5-22 Figure 5-23 Figure 5-24 Figure 5-25 Figure 5-26 Figure 5-27

v

Other Core Interface Signal Concerns DFT Core Interface Frequency Considerations A Reuse Embedded Core’s DFT Features Core Test Economics Chip with Core Test Architecture Isolated Scan-Based Core-Testing Scan Testing the Non-Core Logic Scan Testing the Non-Core Logic Memory Testing the Device DFT Integration Architecture Test Program Components Selecting or Receiving a Core Embedded Core DFT Summary

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 1 Test and Design-for-Test Fundamentals

1

Chapter 1 Test and Design-for-Test Fundamentals

Total Cost Testing Cost Packaging Cost Silicon Cost Initial Product

Increasing Time Final Product

The goal over time is to reduce the cost of manufacturing the product by reducing the per-part recurring costs: - reduction of silicon cost by increasing volume and yield, and by die size reduction (process shrinks or more efficient layout) - reduction of packaging cost by increasing volume, shifting to lower cost packages if possible (e.g., from ceramic to plastic), or reduction in package pin count - reduction in cost of test by: - reducing the vector data size - reducing the tester sequencing complexity - reducing the cost of the tester - reducing test time - simplifying the test program Figure 1-1 Cost of Product

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 1 Test and Design-for-Test Fundamentals

2

Behavioral Specification and Model Functional Architecture Development

Test Architecture Development Test Control Test Interface BIST HDL JTAG HDL

Hardware Description Language Register Transfer Level Timing Constraints

Gate-Level Library Mapping Scan Insertion

Gate-Level Synthesis

Insert Scan Cells Scan Signals Scan Ports Test Timing

Gate-Level Netlist Static Timing Assessment

Physical Process Mapping Scan Optimization

Algorithmic Scan Signal ReOrdering

FloorPlanning and Place&Route Macrocell FloorPlanning Timing Driven Cell Placement Timing Driven Routing Clock Tree Synthesis

Figure 1-2 Concurrent Test Engineering

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 1 Test and Design-for-Test Fundamentals

3

WHY TEST? Reasons Measurement of Defects & Quality Level

Incoming Inspection Contractual

Perceived Product Quality by Customer

Reliability Requirement Contractual

Pro & Con Perceptions of DFT Eases Generation of Vectors

Adds Complexity to Design Methodology

Eases Diagnosis & Debugging

Impacts Design Power & Package Pins

Provides a Deterministic Quality Metric

Impacts Design Speed or Performance

Reduces the Cost of Test

Adds to Silicon Area Figure 1-3 Why Test?

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 1 Test and Design-for-Test Fundamentals

4

DEFINITION of TESTING Device or Circuit under test

DEVICE IN A KNOWN STATE

A KNOWN STIMULUS

A KNOWN EXPECTED RESPONSE

EXAMPLE IN_A

a

IN_B

b

IN_C

D Q

0

CLK

1 S

D Q

a

OUT_1

IN_D

OUT_2

b Broadside Parallel Vector

1 1 ^ 1

CLK

with an unknown state

1 ^ X ^

1 X 1 X 1

? ?

Figure 1-4 Definition of Testing

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 1 Test and Design-for-Test Fundamentals

Vdd S

5

physical defects opens shorts metal bridges process errors

source-to-drain short

G D is always at a logic 1

D S G

transistor faults S2 D G2 D S2 G G2 SB S 2 SB D2 SB

D Vss

+

gate faults a@ 0 a@ 1 b@ 0 b@ 1 c@ 0 c@ 1

A

C observed truth table A B C failures 0 0 1 0 0 1 1 0 1 1 0 1 1 0 1 0

B

Transistor and Gate Representation of Defects, Faults, and Failures Figure 1-5 Measurement Criteria

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 1 Test and Design-for-Test Fundamentals

defects open/short bridge mask process

6

transistor faults s2 d g2 d s2 g g 2 sb s 2 sb d 2 sb

stuck faults a@ 0 a@ 1 b@ 0 b@ 1 c@ 0 c@ 1 6 gate faults transition delay faults a 1- 0 a 0- 1 b1- 0 b0- 1 c 1- 0 c 0- 1

+ g

a

s d

c

Truth Table with fail modes nand ab a b c ab c 0 1 1 0 00 1 1 1 1 0 01 1 1 0 1 0 10 1 1 1 0 0 11 0 1 0 0 0

b

A

B

6 transitions

a e

r

f

t

s

S

b c

C

1 BIT ADDER with CARRY

Figure 1-6 Fault Modeling

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

path delay faults A2SR A2SF A2CR A2CF B2SR B2SF B2CR B2CF path R=Slow-to-Rise F=Slow-to-Fall

Alfred L. Crouch

Chapter 1 Test and Design-for-Test Fundamentals

7

Functional

3 a

5

b

4

4

/

/

A D D E R

4

/

4

/

s

8

c

0

3+5=8

Structural A

a e f

B

r s

S

t

b c

C

1 BIT ADDER with CARRY

faultlist a@ 0 a@ b@ 0 b@ e@ 0 e@ f@ 0 f@ r@ 0 r@ t@ 0 t@ s@ 0 s@ c@ 0 c@

1 1 1 1 1 1 1 1

16 faults

Figure 1-7 Types of Testing

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 1 Test and Design-for-Test Fundamentals

8

Chip under Test

The chip will be accessed by the tester at its pins only A custom (load) board will be made for this purpose Each pin has a limited number of bits available (e.g., 2 MB) The test program (set of vectors and tester control) will be applied at tester speed (may be less than actual chip speed) The primary goal of manufacturing test is structural verification

Figure 1-8 Manufacturing Test Load Board

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 1 Test and Design-for-Test Fundamentals

2 Meg Memory Depth

9

Clock Gen 1 Clock Gen 2 Clock Gen 3

C

hi

pS o

ck et

192 Channels

Loadboard

Power Supply 1 Power Supply 2 Power Supply 3

Figure 1-9 Using ATE

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 1 Test and Design-for-Test Fundamentals

10

Chip Point of View

1 2

DV 4

3

1. Input Setup Time:

time the signal must arrive and be stable before the clock edge to ensure capture

2. Input Hold Time:

time the signal must remain stable after the clock edge to ensure that capture is stable

3. Output Valid Time:

time the signal takes to be valid (or tristated) and stable on the output after the clock edge

4. Output Hold Time:

time that the signal remains available after output valid so that it can be used

Tester Point of View CLK

NRZ

1

0

0

RZ

1

0

0

SBC

1

0

0

Figure 1-10 Pin Timing

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 1 Test and Design-for-Test Fundamentals

11

DC Pin Parametrics Test Logic Verification DC Logic Stuck-At DC Logic Retention AC Logic Delay AC Frequency Assessment AC Pin Specification Memory Testing Memory Retention Idd and Iddq Specialty Vectors Analog Functions Test Escapes

The Venn circles are examples of DC fault coverages of some of the vector classifications in the test program Some of the fault coverages overlap Vector reduction can be accomplished by removing overlap or by combining vector sets

Scan Path Delay

Scan Transition Delay

Scan Stuck-At

Scan Sequential

Parametric

Functional Test Escapes

Figure 1-11 Test Program Components

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 2 Automatic Test Pattern Generation Fundamentals

1

Chapter 2 Automatic Test Pattern Generation Fundamentals

Library Support

Netlist Conditioning

Observe Point Assessment

Vector Generation/Simulation

Vector Compression

Vector Writing

Figure 2-1 The Overall Pattern Generation Process

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 2 Automatic Test Pattern Generation Fundamentals

2

WHY ATPG?

Reasons Greater Measurement Ability

Reduction in Cycle Time

Perceived Competitive Methodology

More Efficient Vectors

Pro & Con Perceptions of ATPG Good

Bad

Eases Generation of Vectors

Adds Complexity to Design Methodology

Eases Diagnosis & Debugging

Requires Design-for-Test Analysis

Provides a Deterministic Quality Metric

Requires Library Support

Reduces the Cost of Test

Requires Tool Support Figure 2-2 Why ATPG?

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 2 Automatic Test Pattern Generation Fundamentals

3

Fault Selection

Fault Observe Point Assessment

Fault Excitation

Vector Generation

Fault Simulation

Fault Dropping

Figure 2-3 The ATPG Process

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 2 Automatic Test Pattern Generation Fundamentals

4

a X

b e

stuck-at-0 force to a 1

detected good = faulty

c

d 1

1

0

1

0

0

0

0

0

0

GOOD CIRCUIT

1

1

0

0

1

0

0

0

0

0

1 D I F F E R E N T

0

FAULTY CIRCUIT Figure 2-4 Combinational Stuck-At Fault

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 2 Automatic Test Pattern Generation Fundamentals

5

Delay from Strong Driver Insufficient Transistor Doping

A

Delay Model Element

B Resistive Bridge

Z

C Delay from Extra Load

D

Slow Gate Output Slow Gate Input

E F

Capacitive or Resistive Wire Delay from Opens and Metal Defects The Delay Fault Model is an added delay to net, nodes, wires, gates and other circuit elements Effect of Delay Fault Delay of Transition Occurrence Changing of Edge-Rate Edge-Rate Layover “Ideal” Signal 1 0

0

Added Rise Delay

Added Fall Delay

Figure 2-5 The Delay Fault

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 2 Automatic Test Pattern Generation Fundamentals

6

Leakage from Bridge Leakage from Metastability

A

Leakage Fault Model

B Resistive Bridge

Z

C Leakage from Bridge

D

Internal Gate Leakage

E F

Capacitive or Resistive Delay Extends Current Flow Time

The Current Fault Model is an added Leakage to net, nodes, wires, gates and other circuit elements

Effect of a Current Fault is to add extra current flow or to extend flow time

I(t)

t Figure 2-6 The Current Fault

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 2 Automatic Test Pattern Generation Fundamentals

7

a b

nand ab z 00 1 01 1 10 1 11 0

X stuck-at-0 force to a 1

e

c d

1

evaluate fault against the gate’s truth table R E M A P

nor ab z 00 1 01 0 10 0 11 0

c e d

evaluate change against the gate’s truth table R E M A P

0

e

Detectable

evaluate final result against the circuit’s whole truth table

Figure 2-7 Stuck-At Fault Effective Circuit

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 2 Automatic Test Pattern Generation Fundamentals

a

8

stuck-at-0 force to a 1

X

b e not detected good = faulty

c 1

1

0

1

0

X

0

1

0

X

GOOD CIRCUIT

1

0

0

1

1

X

1

1

S A M E

0

X

FAULTY CIRCUIT Figure 2-8 Fault Masking

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 2 Automatic Test Pattern Generation Fundamentals

A

faultlist a@ 0 a@ b@ 0 b@ e@ 0 e@ f@ 0 f@ r@ 0 r@ t@ 0 t@ s@ 0 s@ c@ 0 c@

a e f b a’

B

r r t t

s

c

e

S

C

GOOD - 1 BIT ADDER with CARRY

a b a a

z z z

b Fault Equivalence Table

AND

a@0 = b@0 = z@0

INV

a@1 = z@0 : a@0 = z@1

OR

a@1 = b@1 = z@1

9

1 1 1 1 1 1 1 1

16 faults

1. Any fault that requires a logic 1 on the output of an AND-gate will also place 1’s on inputs 2. Similar analysis exists for all other gate-level elements 3. If one fault is detected, all equivalent faults are detected 4. Fault selection only needs to target one of the equivalent faults

Figure 2-9 Fault Equivalence Example

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 2 Automatic Test Pattern Generation Fundamentals

A 1

a

1

eX f B

1

r 1 0

0

0

1

s

1

S

t

b c

C

1 BIT ADDER with CARRY Set Up the Detect and Propagation Path

10

faultlist a@ 0 a@ b@ 0 b@ e@ 0 e@ f@ 0 f@ r@ 0 r@ t@ 0 t@ s@ 0 s@ c@ 0 c@

1 1 1 1 1 1 1 1

16 faults

1. Set up the path to pass the opposite of e S @ 0, which is e = 1 2. Exercise by setting e equal to1

A

a e f

B 0

1

r s

S

3. Detect by observing S for wrong value during fault simulation

t

b c

C

1 BIT ADDER with CARRY Exercise the Fault Figure 2-10 Stuck-At Fault ATPG

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 2 Automatic Test Pattern Generation Fundamentals

A 1

a 1 eX f 0

B

1

0

r t

1 1 0

s

1

faultlist a@ 0 a@ b@ 0 b@ e@ 0 e@ f@ 0 f@ r@ 0 r@ t@ 0 t@ s@ 0 s@ c@ 0 c@

S

b c

C

1 BIT ADDER with CARRY

a e 0

0

f B 1

r t

s

0

0

1. Set up the path to pass the opposite of e S=0 S @ 0, which is e = 1

S@Time 1

2. Pre-fail by setting e equal to 0

b c

C

1 BIT ADDER with CARRY Pre-Fail the Fault by Passing a 0

A

f B 0

1

r 1

t

3. Exercise by setting e equal to 1 some time period later 4. Detect by observing S for wrong value during timing simulation

a e 1

1 1 1 1 1 1 1 1

16 faults

Set Up the Detect Path to Pass a 1

A

11

s

1

S@Time 2

b c

S=1 The Transition Delay Faultlist is identical to the Stuck-At Faultlist but the goal is to detect a Logic Transition within C a given time period

1 BIT ADDER with CARRY Exercise the Fault to Pass a 1

Figure 2-11 Transition Delay Fault

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 2 Automatic Test Pattern Generation Fundamentals

A

1->1

a

X

X

r

eX f

B

1->1

x->x b

X 0->0

0

x

0

s

X

t

16.0 pt

c

e

0->1

r 0->1

f

s 0->1

16 faults

S@Time1 -> S@Time2

t

b

B

1 1 1 1 1 1 1 1

2. Exercise by first setting B equal to 1 and then to 0. This is known as a vector-pair

a 1->0

C

faultlist a@ 0 a@ b@ 0 b@ e@ 0 e@ f@ 0 f@ r@ 0 r@ t@ 0 t@ s@ 0 s@ c@ 0 c@

1. Set up the path to pass a transition on B-to-S through e, r, and s by setting the off-path values to be stable for 2 time periods

1 BIT ADDER with CARRY Set Up the Off-Path

A

S

12

1->0

c

1. Detect by observing S for wrong value during fault simulation with respect to a time C standard

1 BIT ADDER with CARRY Exercise the Fault (Path) Figure 2-12 Path Delay Fault

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 2 Automatic Test Pattern Generation Fundamentals

faultlist a@ 0 a@ b@ 0 b@ e@ 0 e@ f@ 0 f@ r@ 0 r@ t@ 0 t@ s@ 0 s@ c@ 0 c@

13

1 1 1 1 1 1 1 1

16 faults

A

a e f

B 0

1. Exercise by first setting e equal to1 1

r s t

S 2. Detect by measuring current and accept vector by quietness

b c

C

1 BIT ADDER with CARRY Exercise the Fault

Figure 2-13 Current Fault

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 2 Automatic Test Pattern Generation Fundamentals

14

Transition bit

End of Path bit

1->0

1 second-order cone of logic

0 0

establishes transition and off-path values

1

establishes the legal next-state

Defined Critical Path

1->1

Solve This Combinational Cone of Logic As Second Step after Middle Register Values Are Established by First Cone

D Expect Value

0->0

first-order combinational cone of logic

1->1

contains path and off-path logic

establish first state

preset next-state

Q

Gate Elements

legal next-next-state

legal next-state

Solve This Combinational Cone of Logic As the First Step to Combinational Multiple Time Frame Analysis

Slack Time Propagation Delay Time Register Setup Time

1

2

3

1. Launch 1st Value:

establish path fail value at clock edge

2. Launch Transition:

provide pass value at next clock edge

3. Capture Transition:

observe transition value at this clock edge

Figure 2-14 Two-Time-Frame ATPG

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 2 Automatic Test Pattern Generation Fundamentals

A

B

15

faultlist a@ 0 a@ b@ 0 b@ e@ 0 e@ f@ 0 f@ r@ 0 r@ t@ 0 t@ s@ 0 s@ c@ 0 c@

a e

r

f

t

s

S

b c

C

GOOD - 1 BIT ADDER with CARRY

A

B

16 faults

a e

r

f

t

s

b

S

GND

C

“t” S@0 - 1 BIT ADDER with CARRY

B

a e

r

f

t

s

b +

1. Create multiple copies of the netlist for each fault. 2. Apply same vectors to each copy.

c

A

1 1 1 1 1 1 1 1

S

VDD

c

“t” S@1 - 1 BIT ADDER with CARRY

C

3. Compare each copy to good simulation (expected response). 4. Fault is detected if bad circuit and good circuit differ at a detect point. 5. Measurement is faults detected divided by total number of faults (8/16 = 50%).

Figure 2-15 Fault Simulation example

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 2 Automatic Test Pattern Generation Fundamentals

16

Simulation Post Processing Compression Pattern Set

Fault Re-Simulation with Redundant Vector Dropping

01101110001010 01101110101110 00101110111010 11111110001010 01100000001011 01001011001010 01010101010101 11101100101010 11001110001010 01111000001010 00000000001010

This Usually Drops Early Vectors That Are Fully Covered by Later Vectors and Eliminates Less Efficient Vectors

Dynamic ATPG Compression

X X 1 0 1 0 X X X X

X one targeted fault

During ATPG a Vector Is Not Submitted to Fault Simulation until Multiple Faults have been Targeted — “X”s Mapped This can Greatly Increase Vector Generation Time But Usually Results in the Most Efficient Vectors

Figure 2-16 Vector Compression and Compaction

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 2 Automatic Test Pattern Generation Fundamentals

17

Transistor Structure Equivalent Gate Structure

ATPG May Only Operate on Gate-level Elements

Combinational Feedback Results in Latches, Oscillators, or Endless Loops

Propagation Timing Distance Must Be Less Than One Test Clock Cycle

SET D Q

General Combinational Logic

CLK

CLR D Q CLK

Figure 2-17 Some Example Design Rules for ATPG

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 2 Automatic Test Pattern Generation Fundamentals

Sizing

Design Description

Complexity

ATPG Library

Faultlist Management Support Files

18

ATPG TOOL

Runscripts

Runtime

algorithms rule checks Vectors Vector Features Compression

Detected Faults

Vector Translation Figure 2-18 ATPG Measurables

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 3 Scan Architectures and Techniques

1

Chapter 3 Scan Architectures and Techniques

- >1,000,000 gates - >5,000,000 faults - >10,000 flip-flops - > 1,000 sequential depth - < 500 chip pins * > 2,000 gates/pin * > 2M = 21000 A deep sequential circuit Chip under Test without Scan

- >1,000,000 gates - >5,000,000 faults - > no effective flip-flops - > no sequential depth - < 500 + 10,000 chip pins * > 95.23 gates/pin * > 2M = 20 = 1 A combinational circuit Chip under Test with Full-Scan

Figure 3-1 Introduction to Scan-based Testing

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 3 Scan Architectures and Techniques

2

Combinational & Sequential Logic input1 input2 input3 input4

output1 Q

D

QN clk

D

Q

D

Q

input5

D

input6

1

Q

2

output2

34

Sequential Depth of 4 Combinational Width of 6 26+4 = 1024 Vectors Figure 3-2 An Example Non-Scan Circuit

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 3 Scan Architectures and Techniques

3

Combinational-Only Logic

input1 input2 input3 input4

output1 D

Q QN D

Q

D

Q

input5

input6

D

Q

output2

TPI1 TPI2 TPI3 TPI4 TPI5

A no-clock, combinational-only circuit with: 6 inputs plus 5 pseudo-inputs and

TPO1 TPO2 TPO3 TPO4

2 outputs plus 4 pseudo-outputs

Figure 3-3 Scan Effective Circuit

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 3 Scan Architectures and Techniques

D

D

Q

4

Q

QN CLK

clk

Regular D Flip-Flop

SDO

D D

Q

SDI SE

Q SDO

clk

QN

CLK Scannable D Flip-Flop

Figure 3-4 Flip-Flop versus Scan Flip-Flop

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Alfred L. Crouch

Chapter 3 Scan Architectures and Techniques

5

SET D

SDO D

Q

Q

SDI QN SE clk

CLK Set-Scan D Flip-Flop with Set at Higher Priority

D SET

D

Q

SDI SE

SDO Q QN

clk

CLK Set-Scan D Flip-Flop with Scan-Shift at Higher Priority Figure 3-5 Example Set-Scan Flip-Flops

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 3 Scan Architectures and Techniques

6

Combinational and Sequential Logic input1 input2

output1

input3 input4 SE

SE

scanin

SDI

clk

Q

D

QN D

SDO

Q

SE

input5

SDI

D

input6

D

Q

SE

SE

SDI

SDI

0

scanout

Q

output2

SDO

SDO

1

SDO

1

1

4-Bit Scan Vector

Figure 3-6 An Example Scan Circuit with a Scan Chain

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 3 Scan Architectures and Techniques

D

a D

SDI

7

Q

Q

b

QN SE

clk

SDO

CLK Scannable D Flip-Flop

The scan cell provides observability and controllability of the signal path by conducting the four transfer functions of a scan element. Operate: D to Q through port a of the input multiplexer: allows normal transparent operation of the element. Scan Sample: D to SDO through port a of the input multiplexer: gives observability of logic that fans into the scan element. Scan Load/Shift: SDI to SDO through the b port of the multiplexer: used to serially load/shift data into the scan chain while simultaneously unloading the last sample. Scan Data Apply: SDI to Q through the b port of the multiplexer: allows the scan element to control the value of the output, thereby controlling the logic driven by Q.

Figure 3-7 Scan Element Operations

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Alfred L. Crouch

Chapter 3 Scan Architectures and Techniques

D

From normal operation: D

Q

SDI

SE=0

Q QN

clk

SDO

CLK

Apply clocks for scan length D

Q

SDI SE=1

Q QN

SDO

clk

Scan Shift Load/Unload Mode

D

Q

SDI

Q QN

SE=1

clk

SDO

Scan Apply Mode (Last Shift)

The next rising edge of the clock will sample D

NOTE: unloading is simultaneous with loading the next test D

Q

SDI

SE=0

Normal circuit response will be applied to D

Return to Load/Shift mode to unload circuit response sample

CLK

D

When chain is loaded, the last shift clock will apply scan data While the clock is low, place SE = 0

CLK

D

While the clock is low, apply test data to SDI and Place SE = 1 At the rising edge of the clock, test data will be loaded

Functional Operation Mode

D

8

Q QN

clk

SDO

CLK Scan Sample Mode

Repeat operations until all vectors have been applied NOTE: the chip’s primary inputs must be applied during the scan apply mode (after the last shift)

Figure 3-8 Example Scan Test Sequencing

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Alfred L. Crouch

Chapter 3 Scan Architectures and Techniques

9

The Scan Sample The Last Shift In

The First Shift Out

CLK

SE

Scan Enable Assert

Scan Enable De-assert

The Output Pin Strobe SHIFT DATA

SHIFT DATA

FAULT EXERCISE

SAMPLE DATA

SHIFT DATA

SHIFT DATA

Faults Exercised Interval

Figure 3-9 Example Scan Testing Timing

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 3 Scan Architectures and Techniques

Gated Clock Nets

10

clock tree distribution

Provide an Enable Signal f_seB force the clock on

Asynchronous or Synchronous Signals with Higher Priority than Scan—or Non-Scan Elements D Q HOLD SET CLR f_seB CLK Provide a Blocking Signal

D Q HOLD SET CLR CLK

Driven Contention During Scan Shifting

D Q

Q D

CLK

CLK

D Q

Q D

CLK

t_seB Provide a Forced Mutual Exclusivity

CLK

Figure 3-10 Safe Scan Shifting

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 3 Scan Architectures and Techniques

11

The Scan Sample The Last Shift In

The First Shift Out

CLK

Faults Exercised Interval SE

t_seB

a tristate scan enable may be a separate signal that has slightly different timing than the flip-flop SE

Driven Contention during the Capture Cycle

D Q

Q D

CLK

CLK

D Q

Q D

CLK

t_seB de-asserted

CLK

Figure 3-11 Safe Scan Vectors

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 3 Scan Architectures and Techniques

12

Combinational-Only Logic

input1 input2 input3 input4

output1 D

Q QN D

Q

D

Q

input5

input6

D

Q

output2

TPI1 TPI2

TPO1

TPI3 TPI5

A clocked, sequential circuit with depth=1: 6 inputs plus 4 pseudo-inputs and 2 outputs plus 3 pseudo-outputs

TPO3 TPO4

Figure 3-12 Partial Scan

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 3 Scan Architectures and Techniques

13

An Example Using a Chip with 1000 Scan Bits and 5 Scan Vectors Red Space Is Wasted Tester Memory 1000

1000

One Long Scan Chain

1000

Vector Data

One Channel

1000

X’s on all Other Channels not actively used for parallel pin data

Each Vector is 1000 Bits Long So 5 Vectors Are 5000 Bits of Tester Memory

Many Variable Length Scan Chains

120 X 80 XXX 100 XX 110 XX 90 XXX 180 X20 XXXX 100 XX 100 XX 100 XX

120 X 80 XXX 100 XX 110 XX 90 XXX 180 X20 XXXX 100 XX 100 XX 100 XX

Vector Data Vector Data Vector Data Vector Data Vector Data Vector Data Vector Data Vector Data Vector Data Vector Data

120 X 80 XXX 100 XX 110 XX 90 XXX 180 X 20 XXXX 100 XX 100 XX 100 XX

120 X 80 XXX 100 XX 110 XX 90 XXX 180 X 20 XXXX 100 XX 100 XX 100 XX

10 Non-Balanced Channels

Each Vector Is 180 Bits Long—So 900 Bits of Tester Memory Differences from Longest Chain (180) Are Full of X’s—Wasted Memory

Many Balanced Scan Chains

100 100 100 100 100 100 100 100 100 100

100 100 100 100 100 100 100 100 100 100

Vector Data Vector Data Vector Data Vector Data Vector Data Vector Data Vector Data Vector Data Vector Data Vector Data

100 100 100 100 100 100 100 100 100 100

100 100 100 100 100 100 100 100 100 100

10 Balanced Channels

Each Vector Is 100 Bits Long—So 500 Bits of Tester Memory No Wasted Memory Space

Figure 3-13 Multiple Scan Chains

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Alfred L. Crouch

Chapter 3 Scan Architectures and Techniques

14

Borrowed DC Scan Input on Bidirectional Pin Combinational Logic

Scan Data Input

Output Data Path Blocked during Scan Shift

Output Enable with bus_se Captures through the or scan_mode Combinational Logic during the Sample Operation Combinational Logic

Any Bidir Functional Pin

D S SE

Pad

Captures Directly from the Input Pin During the Shift Operation

Q Input

Parallel Scan Input to Chip Normal Input to Logic

SE

Input Scan Interface—May Resolve to Functional during Sample Interval

Borrowed DC Scan Output on Bidirectional Pin Last Scan Shift Bit from Scan Chain

D Q Input

Normal Output from Logic

D S SE

Q

S SE

Input Data Path Is a Don’t Care during Scan Shift SE on Input Combinational Blocks Data Logic

Combinational Logic

Output

a b s

Added Scan Output Mux with bus_se or scan_mode

Scan Data Output Any Bidir Pin

Pad

Functional Output Enable with bus_se or scan_mode added

Output Scan Interface—May Resolve to Functional during Sample Interval Figure 3-14 The Borrowed Scan Interface

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 3 Scan Architectures and Techniques

15

• Scan Bypass Clocks • Scan Testing an On-Chip Clock Source

Bypass Clocks

Analog

Digital 1

Digital 2

VCO Raw VCO Clock

Counters & Dividers

On-Chip Clock Generation Logic

Figure 3-15 Clocking and Scan

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 3 Scan Architectures and Techniques

16

Driven Contention during Scan Shifting

D Q

Q D

CLK

CLK

D Q

Q D

CLK

CLK

t_seB Provide a Forced Mutual Exclusivity

Asynchronous or Synchronous Signals with Higher Priority than Scan—or Non-Scan Elements D Q HOLD SET CLR f_seB CLK Provide a Blocking Signal

D Q HOLD SET CLR CLK

Gated Clock Nets Provide a Blocking Signal f_seB

Figure 3-16 Scan-Based Design Rules

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 3 Scan Architectures and Techniques

17

Basic Netlist Scan Insertion Element Substitution Ports, Routing & Connection of SE Ports, Routing & Connection of SDI-SDO Extras Tristate “Safe Shift” Logic Asynchronous “Safe Shift” Logic Gated-Clock “Safe Shift” Logic Multiple Scan Chains Scan-Bit Re-Ordering Clock Considerations

All Non-Sampling Clock Domains Inhibit Sample Clock Pulse

Last Shift

All Scan Chains (Clocks) Shift

Only One Clock Domain Conducts a Sample Clock

Figure 3-17 DC Scan Insertion

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Alfred L. Crouch

Chapter 3 Scan Architectures and Techniques

18

1

1

1

1

1

1

1

1

0

0

0

0

0

0

0

0

1

0

1

0

1

0

1

0

1

1

0

0

1

1

0

0

0

1

0

1

0

1

0

1

0

0

1

1

0

0

1

1

0

1

0

1

0

1

0

1

Scan Fail Data Presented at Chip Interface Automatically Implicates the Cone of Logic at One Flip-Flop

1 0

Multiple Fails under the Single Fault Assumption Implicate Gates Common to Both Cones of Logic

0

0 1

1

0 Figure 3-18 Stuck-At Scan Diagnostics

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Alfred L. Crouch

Chapter 3 Scan Architectures and Techniques

19

Basic Purpose • Frequency Assessment • Pin Specifications • Delay Fault Content

Cost Drivers • No Functional Vectors • Fewer Overall Vectors • Deterministic Grade

Figure 3-19 At-Speed Scan Goals

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 3 Scan Architectures and Techniques

20

The Transition Launch The First Shift Out

The Last Shift In

The Transition Capture

CLK

Transition Generation Interval

Faults Exercised Interval

SE

T_SE

F_SE

Bus_SE

Separate Scan Enables for Tristate Drivers, Clock Forcing Functions, Logic Forcing Functions, Scan Interface Forcing Functions, and the Scan Multiplexor Control Because the Different Elements Have Different Timing Requirements

Figure 3-20 At-Speed Scan Testing

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Alfred L. Crouch

Chapter 3 Scan Architectures and Techniques

21

Borrowed Scan Input with Scan Head Register Output Data Path Blocked during Scan Shift Output Enable with bus_se Combinational Logic

Any Bidir Pin

D Q Input

Pad

Parallel Scan Input to Chip Normal Input to Logic

D S SE

Q Input

At-Speed Scan Interface—Resolves to Functional During Sample Interval

Driven Contention During Scan Shifting

D

Q

Q

CLK

CLK D

D

Q

Q

CLK

D

CLK

t_seB At-Speed Assert and De-Assert

Asynchronous or Synchronous Signals with Higher Priority than Scan or Non-Scan Sequential Elements D

Q

D

HOLD SET CLR CLK

Q

HOLD SET CLR

f_seB

CLK

At-Speed Assert and De-Assert Figure 3-21 At-Speed Scan Architecture

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 3 Scan Architectures and Techniques

22

Borrowed AC Scan Input on Bidirectional Pin Combinational Logic

Output Data Path Blocked during Scan Shift Output Enable with at-speed bus_se

Scan Data Input

Captures through the Combinational Logic during the Sample Operation Combinational Logic

Any Bidir Functional Pin

S SE

Pad

Parallel Scan Input to Chip Normal Input to Logic

D Q Input

Captures Directly from the Input Pin During the Shift Operation

D Q Input Head

Input Scan Interface—Resolves to Functional during Sample Interval

Borrowed AC Scan Output on Bidirectional Pin Last Scan Shift Bit from Scan Chain

D Q Input

Normal Output from Logic

D S SE

Q Output

S SE

Input Data Path Is a Don’t Care during Scan Shift SE on Input Combinational Blocks Data Logic

Combinational Logic

a

D Q b Output s Tail

Added Scan Output Mux with bus_se

Scan Data Output Any Bidir Pin

Pad

Functional Output Enable with bus_se Added

Output Scan Interface—Resolves to Functional During Sample Interval Figure 3-22 At-Speed Scan Interface

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Alfred L. Crouch

Chapter 3 Scan Architectures and Techniques

23

Fast to Slow Transfers

Slow to Fast Transfers

Fast Logic

Slow Logic Fast to Slow Transfers

Fast Scannable System Registers

Slow Scannable System Registers

Clock A Scan Enable A

Clock B Scan Enable B

The Clock Domains and Logic Timing should be crafted so that the very next rising edge after the launch or last shift is the legal capture edge Last Scan Shift Edge

Legal ATPG Transfer

Illegal ATPG Transfer

Applied Fast Clock

Applied Slow Clock

Only Fast-to-Slow Legal ATPG Transfer

Figure 3-23 Multiple Scan and Timing Domains

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 3 Scan Architectures and Techniques

24

Combinational Logic

Combinational Logic

Combinational Logic scanned flip-flop D

Q

D

SDI

Q

D

SDI

Q

SDI 165 ps

CLK

120 ps

SE

150 ps

First Clock Domain — All Elements on Same Clock Tree 300ps+

Cross Domain Clock Skew

Combinational Logic

Combinational Logic

Combinational Logic scanned flip-flop

D

Q

D

SDI

Q

D

SDI

Q

SDI 165 ps

CLK SE

120 ps 150 ps

Second Clock Domain—All Elements on Same Clock Tree Cross Domain Clock Skew must be managed to less than the fastest flip-flop update time in the launching clock domain If it is not, then the receiving flip-flop may receive new-new scan data before the capture clock arrives To prevent this outcome, constrain the ATPG tool to only sample one clock domain at a time during the sample interval

Figure 3-24 Clock Skew and Scan Insertion

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 3 Scan Architectures and Techniques

25

Specification Development Scan Mode Bus_SE Tristate_SE Logic Force_SE Architecture Development

Simulation Verification

Model

Behavior Synthesis

Scan Shift SE Clock Force_SE Scan Data Connection Insertion

Timing Analysis

Place and Route

Scan Chain Bit Re-Ordering

Specification Determination

Gates Mask

Mask and Fab

Silicon Test

Silicon Design Flow Chart Scan Mode: Fixed “Safe” Logic

Scan Enable (SE): Scan Shift

Force_SE:

Force_SE: Clock Force States

Logic Forced States

Tristate_SE: Internal Tristates

Bus_SE: Scan Interface Control

Figure 3-25 Scan Insertion for At-Speed Scan

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 3 Scan Architectures and Techniques

D Q R1 D Q R2 In1

0>1

A U35 B 0 X

In2 0

In3

0

In4 0

A U36 B A U39 B

26

Static Timing Analysis Provides Path Description of Identified Critical Path from the Q-Output of R1 to the Device Output Pin—Out1

0>1

1

A U37 B

1>0

A U38 B

1>0

Out1

1 Isolated Combinational Logic All Fan-in to Endpoint Is Accounted at this Endpoint Fanout to other Endpoints is Evaluated atThose Endpoints

Period = 20ns : Output Strobe @ 15ns Path Element Incremental Cumulative Description Delay Delay

Clk R1.Q U35.A U35.Z U37.A U37.Z U38.A U38.Z Out1

2.2ns 0.0ns 2.1ns 0.1ns 3.2ns 0.2ns 2.2ns 0.1ns Dly=10.1

Skew Amb. 0.0ns 2.1ns 2.2ns 5.4ns 5.6ns 7.8ns 7.9ns Slk=4.9ns

Timing Analysis Report Figure 3-26 Critical Paths for At-Speed Testing

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 3 Scan Architectures and Techniques

27

Polynomial: X3 + X +1 = X3 + X1 + X0 = 23 + 21 + 20 = 11

LFSR - PRPG: pseudo-random pattern generation

X3 Seed

DQ 1

X2

DQ 1

X1

DQ 1

CLK

X0

111 011 001 100 010 101 110 111

Chip with Full-Scan and X-Management

DQ

DQ

DQ

CLK LFSR - MISR: multiple input signature register

Figure 3-27 Logic BIST

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 3 Scan Architectures and Techniques

28

Scan Testing Methodology Advantages Direct Observability of Internal Nodes Direct Controllability of Internal Nodes Enables Combinational ATPG More Efficient Vectors Higher Potential Fault Coverage Deterministic Quality Metric Efficient Diagnostic Capability AC and DC Compliance Concerns Safe Shifting Safe Sampling Power Consumption Clock Skew Design Rule Impact on Budgets Figure 3-28 Scan Test Fundamentals Summary

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 4 Memory Test Architectures and Techniques

1

Chapter 4 Memory Test Architectures and Techniques

Chip-Level

Embedded Memory

Logic

Memory Access

PLL

TAP JTAG Boundary Scan

Figure 4-1 Introduction to Memory Testing

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 4 Memory Test Architectures and Techniques

2

Row/Word-Address

Select

Select

Column/Bit-Data

Column/Bit-Data

Storage

6 Transistor SRAM Cell Row/Word-Address

Storage

Select Column/Bit-Data

1 Transistor DRAM Cell Row/Word-Address

Storage

Select

Column/Bit-Data 2 Transistor EEPROM Cell Figure 4-2 Memory Types

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 4 Memory Test Architectures and Techniques

3

Data Bus: To Multiple Memory Arrays

Address Bus: To Multiple Memory Arrays

Bus Enable Data In

Data Out Memory: Data Width by Address Depth 32 x 512

Address In

Read/WriteBar

Memory Array Address Decode to Row Drivers Data Decode to Column Drivers

Output Enable

Control Circuitry to Read, Write, and Data Output Enable

Control Signals: Individual Signals to This Memory Array

Figure 4-3 Simple Memory Organization

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 4 Memory Test Architectures and Techniques

4

Chip FloorPlan

Memory 1 M e m o r y 3

Memory 2 - Aspect Ratio - Access Time - Power Dissipation

Memory 4

Figure 4-4 Memory Design Concerns

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 4 Memory Test Architectures and Techniques

5

Chip FloorPlan

Memory 1 M e m o r y

Memory 2 - Routing

3

- Placement & Distribution - Overall Power Dissipation

Processor Local Logic Memory 4

Figure 4-5 Memory Integration Concerns

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 4 Memory Test Architectures and Techniques

6

32 Embedded Microprocessor Core

Data 24

Embedded Memory Array

Address 3

Control Functional Memory Test Data Address Control

32 Embedded Memory Array

24 3

Direct Access Memory Test

Invoke

BIST Controller Done

Reset

Embedded Memory Array

Hold

Fail

BIST Memory Test

Figure 4-6 Embedded Memory Test Methods

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 4 Memory Test Architectures and Techniques

7

column # —>

0

1

2

3

row # —> 0

1

0

0

1

row # —> 1

1

0

1

1

0

1

data bit cell

row # —> 2

0

1

Figure 4-7 Simple Memory Model

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 4 Memory Test Architectures and Techniques

8

Data in Bit Cells May Be Stuck-At Logic 1 or Logic 0 word stuck-at data value 1110

address A031—>

address A032—>

address A033—>

single bit stuck-at 1

1

0

1

1

1

1

1

0

1

0

1

0

single bit stuck-at 0

Figure 4-8 Bit-Cell and Array Stuck-At Faults

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 4 Memory Test Architectures and Techniques

9

Data in Bit Cells May Be Bridged to Other Bit Cells

horizontal (row) bit bridging

0

1

1

0

1

0

1

0

1

1

1

0

0

0

1

1

1

1

0

0

0

0

1

1

1

1

0

0

vertical (column) bit bridging

word bridging unidirectional one-way short

random bit bridging

word bridging bidirectional two-way short

Figure 4-9 Array Bridging Faults

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 4 Memory Test Architectures and Techniques

10

Column Decode X

C O

Select Lines

L

X

X

R O 0

1

1

1

1

0

1

1

X

W

1

1

1

1

X

X

1

1

1

1

0

1

1

1

0

0

1

1

Row Decode stuck-at faults result

R

in always choosing

o

wrong address

w

Row Decode

D

bridging faults result

e

in always selecting

c

multiple addresses

o d e

Column Decode bridging faults result in always selecting multiple data bits

Column Decode

Select Line

stuck-at faults result

faults result in

in always choosing

similar array

wrong data bit

fault effects Figure 4-10 Decode Faults

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 4 Memory Test Architectures and Techniques

11

Data around target cell is written with complement data

Complementary Data around Target Cell

Address 21 = A

1

0

1

0

Address 22 = 5

0

1

0

1

Address 23 = A

1

0

1

0

0

1

0

1

Address 24 = 5

alternating 5’s and A’s make for a natural checkerboard pattern Figure 4-11 Data Retention Faults

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 4 Memory Test Architectures and Techniques

Blue: Pass Red: Fail

12

Column Data Fault

Physical Memory Organization Row Address Fault

Logical Memory Organization Stuck-At Bit Faults

Physical Memory Organization Bridged Cell Faults

Physical Memory Organization Figure 4-12 Memory Bit Mapping

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 4 Memory Test Architectures and Techniques

13

Address 00 —>

0

1

0

1

0

1

0

1

Address 01 —>

0

1

0

1

0

1

0

1

Address 02 —>

0

1

0

1

0

1

0

1

Address 03 —> Addr(00) to Addr(Max) Read(5)-Write(A)-Read(A) Address 04 —> Increment Address Address 05 —>

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

Address 06 —> Addr(00) to Addr(Max) Read(A)-Write(5)-Read(5) Address 07 —> Increment Address Address 08 —>

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

Address 09 —> Addr(Max) to Addr(00) Read(5)-Write(A)-Read(A) Address 10 —> Decrement Address Address 11 —>

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

Address 12 —> Addr(Max) to Addr(00) Read(A)-Write(5)-Read(5) Address 13 —> Decrement Address Address 14 —>

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

Address 15 —>

0

1

0

1

0

1

0

1

Address 16 —>

0

1

0

1

0

1

0

1

Address 17 —>

0

1

0

1

0

1

0

1

Address 18 —>

1

0

1

0

1

0

1

0

Address 19 —>

1

0

1

0

1

0

1

0

Address 20 —>

1

0

1

0

1

0

1

0

Address 21 —>

1

0

1

0

1

0

1

0

Address 22 —>

1

0

1

0

1

0

1

0

Address 23 —>

1

1

1

0

1

0

1

0

Addr(00) to Addr(Max) Write(5)-Initialize Increment Address

Addr(Max) to Addr(00) Read(5) Decrement Address Read (A)-------> Write (5) Read (5) Increment Address March C+ Algorithm

Memory Array with 24 Addresses with Algorithm at Read (A) Stage

Figure 4-13 Algorithmic Test Generation

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Alfred L. Crouch

Chapter 4 Memory Test Architectures and Techniques

14

Boundary at some level of scanned registration or “pipelining” away from the memory array

Data

Data Memory

Detection of incoming signals

Control of outgoing signals

Array

Address

Control

scan-memory boundary Minimum Requirement Detection up to Memory Input and Control of Memory Output

Concern: the Logic between the Scan Test Area and the Memory Test Area Is not Adequately Covered

Non-Scanned Registration inside the Boundary but Before the Memory Test Area Results in a Non-Overlap Zone Figure 4-14 Scan Boundaries

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 4 Memory Test Architectures and Techniques

15

The Memory Array is modeled for the ATPG Engine so the ATPG Tool can use the memory to observe the inputs and control the outputs

Data In

Din

Dout

Data Out

Memory Array Address

Ain

ATPG Model

Control

Read/Write

Scan Architecture

Figure 4-15 Memory Modeling

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 4 Memory Test Architectures and Techniques

16

Boundary at some level is blocked off as if the memory was cut out of the circuit Scan Mode

Control of outgoing signals

Data In

Gated Data Out

Detection of incoming signals

Memory Array can be

Address

Multiplexed Data Out

removed from

All Registers are in the scan chain architecture

netlist for ATPG purposes Control

scan black-box boundary Observe-only registers used for detection of memory input signals

Gate or Multiplexor is used to Block—fix to a known value—the Memory Output Signals

Figure 4-16 Black Box Boundaries

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 4 Memory Test Architectures and Techniques

17

Boundary at some level is blocked off as if the memory was cut out of the circuit

Input is passed to output as the form of output control

Data In

Bypass Data Out

Detection of incoming signals

Memory array can be

Address

removed from netlist for ATPG purposes

Control

scan black-box boundary Observe-only registers used for detection of memory input signals

Multiplexor is used to pass the input directly to the output

Figure 4-17 Memory Transparency

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 4 Memory Test Architectures and Techniques

18

Detection of incoming data signals done here Boundary at some level is blocked off as if the memory was cut out of the circuit Input is passed to output with registration Data In

Bypass Data Out Memory

In ideal sense, timing should also be matched

array can be Address

removed from netlist for ATPG purposes

Control

scan black-box boundary Observe-only registers not needed on data since register emulates memory

Register and multiplexor is used to emulate memory timing and output

Figure 4-18 The Fake Word Technique

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 4 Memory Test Architectures and Techniques

19

Data Bus: Possibly to Multiple Memory Arrays

Address Bus: Possibly to Multiple Memory Arrays

Data In

Data Out Memory: data width by address depth 32 x 512

Address

Read/WriteB

Memory Array Address Decode to Row Drivers Data Decode to Column Drivers

Output Enable

Control Circuitry to Read, Write, and Data Output Enable

Control Signals: Individual Signals to This Memory Array Test Must Access the Data, Address, and Control Signals in order to Test This Memory

Figure 4-19 Memory Test Needs

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 4 Memory Test Architectures and Techniques

20

Chip Level

Invoke Retention Debug

Algorithm Controller Address Generator Data Generator

Done Fail Debug_data

Memory Array(s) Comparator

INPUTS Invoke: Start BIST Retention: Pause BIST and Memory Clocking Debug: Enable BIST Bitmap Output OUTPUTS Fail: A Memory Has Failed a BIST Test Done: Operation of BIST Is Complete Debug_data: Debug Data Output OPERATIONS Address: Ability to Apply Address Sequences Data: Ability to Apply Different Data Sequences Algorithm: Ability to Apply Algorithmic Control Sequences Comparator: Ability to Verify Memory Data Figure 4-20 Memory BIST Requirements

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 4 Memory Test Architectures and Techniques

Retention Release Bitmap

Algorithm Controller Address Generator Data Generator

Comparator

Invoke

21

Din

Memory DI Array Do

Ain

A

Write_en

WRB

Read_en

CEB

done Fail Hold_out Bitmap_out Dout

Clk INPUTS Invoke: invoke the BIST (apply muxes and release reset) Retention: enable retention algorithm and pause Release: discontinue and release pause Bitmap: enable bitmap output on fail occurrence OUTPUTS Fail: sticky fail flag—dynamic under bitmap Done: operation of BIST is complete Bitmap_out: fail data under bitmap Hold_out: indication of pause Figure 4-21 An Example Memory BIST

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 4 Memory Test Architectures and Techniques

22

Chip Level bitmap_out1 Memory Array with BIST

Invoke

done1 fail1 bitmap_out2 Memory Array with BIST

Reset Bitmap

done2 fail2 bitmap_out3 Memory Array with BIST

Hold_1 Hold_2 Hold_3 Hold_4

done3 fail3 bitmap_out4 Memory Array with BIST so s1

done4 fail4 fail 1-4 done 1-4 Invoke: a global signal to invoke all BIST units

Reset: a global signal to hold all BIST units in reset done fail diag_out Bitmap: a global signal to put all BIST units in debug mode Hold_#: individual hold signals to place memories in retention or to select which memory is displayed during debug done: all memory BISTs have completed fail: any memory BIST has detected a fault or a failure diag_out: the memory BIST not in hold mode will present debug data Figure 4-22 MBIST Integration Issues

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 4 Memory Test Architectures and Techniques

23

bitmap_out1

Memory Array with BIST

Invoke

done1

Reset

fail1

bitmap_out2

Memory Array with BIST

Bitmap

done2

fail2

Hold_1 Memory Array with BIST

bitmap_out3

Hold_2 done3

fail3

Hold_3 Hold_4

Memory Array with BIST done4

bitmap_out4

so s1

fail4

fail 1-4 done 1-4

Invoke: must be a logic 0 when BIST is not enabled Reset: should be a logic 0 when BIST is not enabled

done

fail diag_out

Bitmap: should be a logic 0 when BIST is not enabled Hold_#: should be a logic 0 when BIST is not enabled done: should not be connected to package output pin when BIST is not enabled fail: should not be connected to package output pin when BIST is not enabled diag_out: should not be connected to package output pin when BIST is not enabled

Figure 4-23 MBIST Default Values

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 4 Memory Test Architectures and Techniques

n Invoke n Reset n Bitmap

Hold_1 Hold_2 Hold_n

M e m o r y

invoke 1-m

done A 1-n r r a y s

M e m m o r y

with fail 1-n I M n B debug d I e S hold_l1 p T e s hold_l2 n d hold_1m e n t Bank 1 scan_out 1-n

24

done A 1-m r r a y s

with

fail 1-m

m I M n B d I e S p T e s n d e n t Bank 2

n

n

m diag_out 1-m

so s1 Invoke: global signal invokes bank 1 BIST Reset: global signal holds bank 1 BIST in reset diag_out Bitmap: global signal that enables BIST debug

fail

done

Hold_#: paired hold signals to place memories in retention or to select which memory is displayed during debug done: bank n memory BISTs have completed fail: any memory BIST has detected a fault or a failure diag_out: the memory BIST not in hold will present debug data Figure 4-24 Banked Operation

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 4 Memory Test Architectures and Techniques

25

LFSR - PRPG

DQ

DQ

DQ

CLK MBIST Address

Functional 5 A 0 F

Memory Array

MBIST Data In

Data Functional Data In

Algorithm Sequencer

MBIST Control

Functional Functional & MBIST Data Out

DQ

DQ

Data Out

DQ

CLK LFSR - MISR Figure 4-25 LFSR-Based Memory BIST

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 4 Memory Test Architectures and Techniques

26

The Address sequence can be shifted both forward and backward to provide all addresses The Data sequence can be shifted across the data lines, and can also provide data for a comparator 0 0 1 0 1 1 0 0 1 1 1 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 1 0

Address

Memory Array 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0

Data

0 1 0 0 1 0

Read/Write

The Control sequence can be shifted across the read-write or output enable or other control signals

Figure 4-26 Shift-Based Memory BIST

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 4 Memory Test Architectures and Techniques

27

MBIST Address

Functional

Read-Only Memory Array MBIST Functional

Read Control

Functional Data Out

Data Out

MBIST

DQ

DQ

DQ

CLK LFSR - MISR Figure 4-27 ROM BIST

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 4 Memory Test Architectures and Techniques

28

Memory Testing Fundamentals Summary Memory Testing Is Defect-Based Memory Testing Is Algorithmic Different Types of Memories—Different Algorithms A Memory Fault Model Is Wrong Data on Read Memory Testing Relies on Multiple-Clue Analysis A Memory Test Architecture May CoExist with Scan A Memory Can Block Scan Test Goals Modern Embedded Memory Test Is BIST-Based BIST Is the Moving of the Tester into the Chip BIST-Based Testing Allows Parallelism Parallel Testing Impacts Retention Testing Parallel Testing Impacts Power Requirements Parallel Testing Requires Chip-Level Integration Figure 4-28 Memory Test Summary

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 5 Embedded Core Test Fundamentals

1

Chapter 5 Embedded Core Test Fundamentals

Chip-Level TCU Core 4

Core 5

Core 1

Core 2

General Logic

Core 3 Memory Access Embedded Memory

PLL

Embedded Memory

TAP JTAG Boundary Scan

Figure 5-1 Introduction to Embedded Core Test and Test Integration

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 5 Embedded Core Test Fundamentals

2

WHAT IS A CORE?

SOFT

HDL Model with No Test

HDL Model with Modeled Test

RTL Model with No Test

RTL Model with Modeled Test

Gate-Level Netlist with No Test

Gate-Level Netlist with Synthesized Test

Gate-Level Netlist with Inserted Test

Gate-Level Netlist with Mixed Test

FIRM

HARD Layout GDSII with No Test

Layout with Test from Synthesis

Layout with Test from Gate-Level

Layout with Test Optimization

Figure 5-2 What is a CORE?

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 5 Embedded Core Test Fundamentals

3

TMode[3:0]

4 Chip-Level CTCU

3 Core

UDL

2

1

Embedded Memories

Embedded Memories Wrapper

5

PLL

TAP

6

JTAG Boundary Scan

- A Core-Based Device May Include 1. Core(s) with Test Wrapper + Embedded Memory Arrays 2. Chip-Level User Defined Logic + Embedded Memory Arrays 3. Chip-Level Test Selection and Control Logic 4. Dedicated Chip-Level Test Pins 5. Chip-Level Clock Generation and Clock Control Logic 6. IEEE 1149.1 Controller and Boundary Scan Logic Figure 5-3 Chip Designed with Core

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 5 Embedded Core Test Fundamentals

4

A Reuse Embeddable Core

Business Deliverables 1. The Core 2. The Specification or Data Sheet 3. The Various Models 4. The Integration Guide 5. The Reuse Vectors Figure 5-4 Reuse Core Deliverables

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 5 Embedded Core Test Fundamentals

5

CORE-BASED DESIGN DFT ISSUES Chip-Level Device A KNOWN STIMULUS

ACCESS TO THE EMBEDDED CORE

A KNOWN EXPECTED RESPONSE

Other Chip-Level Logic • If the Core is HARD — DFT must exist before delivery — how is access provided at the chip level? • If the Core is HARD — and delivered with pre-generated vectors — how are vectors merged in the whole test program? • If the Core is HARD — and part of the overall chip test environment — how is the core test scheduled? • If the Core is HARD — and part of the overall chip test environment — what defaults are applied when not active? • If the Core is HARD — what is the most economical and effective test mix — Scan? LBIST? MBIST? Functional? • If the Core is SOFT — is the overall chip test environment developed as a Core and UDL or as a unified design? • If the Core operates at a different frequency from the pin I/O or other chip logic — how does this affect DFT and Test? Figure 5-5 Core DFT Issues

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 5 Embedded Core Test Fundamentals

6

A Reuse Embeddable Core

• DFT Drivers During Core Development Target Market/business — Turnkey versus Customer Design Target Cost-Performance Profile — Low to High Potential Packages — Plastic versus Ceramic Potential Pin Counts • Core Test Architectures and Interfaces Direct Access — Mux Out Core Terminals Add-On Test Wrapper — Virtual Test Socket Interface Share-Wrapper — Scanned Registered Core I/O At-Speed Scan Or Logic Built-in Self-test (LBIST) • Design For Reuse Considerations Dedicated Core Test Ports — Access Via IC Pins Reference Clocks — Test and Functional Test Wrapper — Signal Reduction/No JTAG/No Bidi’s Virtual Test Socket — Vector Reuse Figure 5-6 Core Development DFT Considerations

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 5 Embedded Core Test Fundamentals

7

A Chip Package with 44 Functional Signals

A ReUse Embeddable Core with 60 Functional Signals

• Core DFT Interface Considerations Note — none of this is known a priori Access to core test ports via IC pins (integration) I/O port count less restrictive than IC pin count Impact of routing core signals to the chip edge - Dedicated test signals to place in test mode - Number of test signals needed to test core - Frequency requirements of test signals Figure 5-7 DFT Core Interface Considerations

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 5 Embedded Core Test Fundamentals

UDL Logic

At the time of Core Development, the UDL logic is not available and i’s configuration is not known

8

Embedded Core

DQ

DQ For example: - registered inputs or outputs - combinational logic - bidirectional signals or tristate busses

QD

QD How are vectors generated for a Hard Core before integration? How are vectors delivered that can assess the signal timing or frequency? UDL Domain

How is test access planned to be provided — through the UDL or directly from the package pins?

CORE Domain

Figure 5-8 DFT Core Interface Concerns

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 5 Embedded Core Test Fundamentals

9

A Chip Package with 44 Functional Signals Test Wrapper with 10 Test Signals

A Reuse Embeddable Core with 60 Functional Signals

• Core DFT Interface Considerations Wrapper for interface signal reduction Wrapper for frequency assessment Wrapper as frequency boundary Wrapper as a virtual test socket (for ATPG) Note: bidirectional functional signals can’t cross the boundary if wrapper or scan

Figure 5-9 DFT Core Interface Considerations

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 5 Embedded Core Test Fundamentals

UDL Logic

“Land between the Lakes” The Isolation Test Wrapper D Q

DQ

DQ

10

Embedded Hard Core

DQ

D Q

QD

QD

QD

D Q UDL Scan Domain

CORE Scan Domain Core-Wrapper Scan Domain where the wrapper is the registered core functional I/F that is scan-inserted separately Note: Wrapper and core are on same clock and path delay is used to generate vectors

Figure 5-10 Registered Isolation Test Wrapper

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 5 Embedded Core Test Fundamentals

UDL Logic

11

“Land between the Lakes” The Isolation Test Wrapper

DQ

Embedded Hard Core

DQ DQ

D Q

QD

QD Q D

QD

UDL Scan Domain

CORE Scan Domain Wrapper Scan Domain where the wrapper is an added “slice” between the core functional I/F and the UDL functional I/F Wrapper and core are on different clocks and path delay is used to generate vectors

Figure 5-11 Slice Isolation Test Wrapper

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 5 Embedded Core Test Fundamentals

UDL Logic

12

“Land between the Lakes” The Isolation Test Wrapper Core_Test

TR_SDO

DQ

DQ DQ

D Q

QD

QD

UDL Scan Domain

Embedded Hard Core

TR_SE TR_SDI

TR_CLK

Wrapper Scan Domain

TR_Mode

CORE Scan Domain

System Clock the wrapper is an added “slice” between the core functional I/F and the UDL functional I/F Wrapper and core are on different clocks and path delay is used to generate vectors

Figure 5-12 Slice Isolation Test Wrapper Cell

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 5 Embedded Core Test Fundamentals

Internal BIST In

Direct Test Signals go to Package Pins

Internal BIST Out

Internal Scan In

Internal Scan Out

QD

QD

13

D Q

Q D

D Q

Q D

QD

Wrapper Scan In D Q UDL Scan Domain UDL Logic

CORE Scan Domain Core-Wrapper Scan Domain

Embedded Hard Core

“Land between the Lakes” The Isolation Test Wrapper

All Core Test Interface Signals pass through the Test Wrapper without being acted upon All Core I/O are part of the Wrapper Scan Chain So Total Core Test I/F is: Internal Scan Internal MBIST Wrapper Scan Figure 5-13 Core DFT Connections through the Test Wrapper

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 5 Embedded Core Test Fundamentals

14

Internal BIST In

Direct Test Signals Go to Package Pins

Internal Scan In

Test Mode Control

QD

QD

D Q

D Q

Core Test Controller

QD

Wrapper Scan In D Q UDL Scan Domain UDL Logic

CORE Scan Domain Core-Wrapper Scan Domain

Embedded Hard Core

“Land between the Lakes” The Isolation Test Wrapper

All Core Test Interface Signals pass through the Test Wrapper and may be acted upon by a Test Mode All Core I/O are part of the Wrapper Scan Chain So Total Core Test I/F is: Gated Internal Scan Gated Internal MBIST Gated Wrapper Scan Figure 5-14 Core DFT Connections with Test Mode Gating

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 5 Embedded Core Test Fundamentals

15

Can’t Use the Wrapper Cell

Wrapper Cell

UDL

Test Wrapper

PLL Bypass Test Clock Mul/Div Clocks

A Reuse Embeddable Hard Core with Pre-Existing Clock Trees

Core

Clock Out Signal(s)

• DFT Considerations Can’t Support Bidirectional Core Ports Input and Reference Clocks Figure 5-15 Other Core Interface Signal Concerns

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 5 Embedded Core Test Fundamentals

16

A Chip Package with a 25 MHz Interface Test Wrapper with 10 Test Signals

A Reuse Embeddable Core with Fmax = 100MHz Logic

• Core DFT Frequency Considerations Wrapper for frequency boundary Test signals designed for low frequency Package interface designed for high frequency Wrapper as a multi-frequency ATPG test socket Note: functional high/low frequency signals can cross the wrapper—the test I/F is the concern

Figure 5-16 DFT Core Interface Frequency Considerations

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 5 Embedded Core Test Fundamentals

The Core’s Test Port Internal Scan Data In Internal Scan Enable Wrapper Scan Data In Wrapper Scan Enable Wrapper Test Enable MemBIST Invoke MemBIST Retention MemBIST Bitmap Internal Scan Data Out Wrapper Scan Data Out MemBIST Fail MemBIST Done MemBIST Bitmap Out

17

A Test Wrapper

A Reuse Embeddable Core with Existing DFT and Test Features

• Core DFT Goals and Features Embedded Memory Test by MBIST - Few Signals — High Coverage — Less Test Time - Bitmap Characterization Support Structure by Stuck-At Scan - High Coverage — Fewer Vectors — Ease of Application Frequency by At-Speed Scan (Path & Transition Delay) - Deterministic — Fewer Vectors — Ease of Application Reuse of Core Patterns Independent of Integration Test Insulation from Customer Logic Embedded Core I/O Timing Specifications with Wrapper Minimize Test Logic Area Impact Minimize Test Logic Performance Penalty DFT Scannability Logic Full-Scan Single-Edge Triggered MUX DFF Tristate Busses - Contention/Float Prevention Negedge Inputs and Outputs Iddq—No Active Logic and Clock Stop Support Figure 5-17 A Reuse Embedded Core’s DFT Features

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 5 Embedded Core Test Fundamentals

18

A Test Wrapper

The Core’s Test Port Internal Scan Data In Internal Scan Enable Wrapper Scan Data In Wrapper Scan Enable Wrapper Test Enable MemBIST Invoke MemBIST Retention MemBIST Bitmap Internal Scan Data Out Wrapper Scan Data Out MemBIST Fail MemBIST Done MemBIST Bitmap Out

A Reuse Embeddable Core with Existing DFT and Test Features

• Core Economic Considerations Test Integration (Time-to-Market) Core Area and Routing Impact (Silicon/Package Cost) Core Power and Frequency Impact (Package/Pin Cost) Core Test Program Time/Size/Complexity (Tester Cost)

Time and/or Tester Memory

Retention Testing Chip Logic Testing Total

Chip Test Program Budget(s)

Memory Testing Embedded Core Testing Chip Parametrics

Figure 5-18 Core Test Economics

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 5 Embedded Core Test Fundamentals

19

TMode[3:0]

Chip-Level CTCU

Core

UDL

Embedded Memories

Embedded Memories Wrapper

PLL

TAP

JTAG Boundary Scan

- A Core-Base Device May Include Core(s) with Test Wrapper and Embedded Memory Arrays Chip-Level Non-Core Logic with Embedded Memory Arrays Chip-Level Test Selection and Control Logic Dedicated Chip-Level Test Pins Chip-Level Clock Generation and Control Logic IEEE 1149.1 Controller and Boundary Scan Logic Figure 5-19 Chip with Core Test Architecture

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 5 Embedded Core Test Fundamentals

20

Pre-Existing Vectors

Chip-Level CTCU

Test Selection

Wrapper and Core Scan Package Pin Connections

Core

UDL

PLL Clock Bypass

TAP JTAG Boundary Scan

Figure 5-20 Isolated Scan-Based Core-Testing

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 5 Embedded Core Test Fundamentals

21

Development Generated Vectors

Chip-Level CTCU

Wrapper and UDL Scan Package Pin Connections

Test Selection

UDL

Clock Bypass

PLL

TAP JTAG Boundary Scan

Figure 5-21 Scan Testing the Non-Core Logic

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 5 Embedded Core Test Fundamentals

22

Development Generated Vectors

Chip-Level CTCU

Wrapper and UDL Scan Package Pin Connections

Test Selection

UDL

Clock Bypass

PLL

TAP JTAG Boundary Scan

I/O specification testing—bus_SE Tristate busses - contention/float prevention Iddq—HighZ pin Pin requirements—(open drains) Figure 5-22 Scan Testing the Non-Core Logic

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 5 Embedded Core Test Fundamentals

23

Development Generated Vectors

Chip-Level CTCU Test Selection

Core

UDL

Embedded Memories

Embedded Memories Wrapper

PLL Clock Bypass

TAP JTAG Boundary Scan

Figure 5-23 Memory Testing the Device

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 5 Embedded Core Test Fundamentals

24

Chip-Level CTCU Core 4

Core 5

Core 1

Core 2

General Logic

Core 3 Memory Access Embedded Memory

PLL

Embedded Memory

TAP JTAG Boundary Scan

• Chip-level DFT integration considerations each core/vector set must have: 1. Power Rating during Test 2. Frequency/Data Rate of Test Vectors 3. Fault Coverage of the Test Vectors 4. Required Test Architecture to Reuse Vectors 5. ATPG Test Wrapper or Encrypted Sim Model 6. The Vector Set’s Format 7. The Vector Set Sizing Figure 5-24 DFT Integration Architecture

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 5 Embedded Core Test Fundamentals

25

Chip Parametrics Chip Iddq (Merged) Core 1 Test Components Core 2 Test Components Core 3 Test Components Chip-Level Memory Chip-Level Analog Core 1 Components Core 1 Iddq Core 1 Scan Core 1 Memory Test Core 1 Analog

Test Time in (s)

1

2

3 4 # of Cores

Figure 5-25 Test Program Components

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 5 Embedded Core Test Fundamentals

26

• Receiving Core DFT Specification • Driven by Fab and Integration Requirements • Core DFT Specification Items - Test Mix - Style of Test - Maximum Number of Integration Signals - Minimum-Maximum Test Frequency - Maximum Vector Sizing - Minimum Fault Coverage - Clock Source

Figure 5-26 Selecting or Receiving a Core

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch

Chapter 5 Embedded Core Test Fundamentals

27

• Core Test Driven by Cost-of-Test and TTM • Two Concerns: Reuse and Integration • Reuse: Interface, Clocks, Test Features - number of dedicated test signal - size of test integration interface - ability to test interface timing - no functional bidirectional ports - specifications and vectors based on clock-in - specifications and vectors based on clock-out - ability to stop clock for retention or Iddq - number of clock domains - at-speed full scan - at-speed memory BIST - use of a scan test wrapper - self-defaulting safety logic • Integration: Core Connections, Chip Test Modes - simple core integration - reuse of pre-existing vectors - application of test signal defaults - shared resources (pins and control logic) - shared testing (parallel scheduling) - chip level test controller Figure 5-27 Embedded Core DFT Summary

Design-for-Test for Digital IC’s and Embedded Core Systems © 1999 Prentice Hall, All Rights Reserved

Alfred L. Crouch