Busbar Design

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 Busbar Design Basics David Chapman Copper Development Association [email protected]

Copper Development Association

Materials for Busbar Systems 

High electrical conductivity • only silver is better than copper



Good thermal conductor • heat reaches surface quickly



Strong (at working temperature) • to withstand short circuit stresses • low creep



Easy to joint • resistant to corrosion Copper Development Association

Busbar System Current Ratings

Busbar ratings are determined only by the maximum desired working temperature

At working temperature: heat generated = heat lost

Copper Development Association

Busbar System Current Ratings Busbar ratings depend on: • Working and ambient temperatures temperatu res • Heat lost from the busbar – by convection – by radiation • Heat generated in the busbar

Copper Development Association

Busbar System Current Ratings Power dissipated by convection is given by: 1.25

 P cv

7.66 θ  =

v

0.25

Pcv2

Pcv1

v

where θ is the temperature rise above ambient v is the vertical height of the surface

Copper Development Association

Busbar System Current Ratings Convection (for 80 C temperature rise) Power dissipation per metre length v Vertical height 160    )    W    (    h    t   g   n   e 120    l   e   r    t   e   m   r   e   p 80   n   o    i    t   a   p    i   s   s    i    d 40   r   e   w   o    P 0 0

50

100

150

200

Vertical height (mm)

Copper Development Association

Busbar System Current Ratings Power dissipated by radiation is given by: Pr 

 P r 

=

5.7ε 

4 4 T 2 − T 1

× 10

−8

Pr 

where Pr is the power dissipated per square metre T2 is the working temperature, K T1 is the ambient temperature, K ε is the emissivity Copper Development Association

Busbar System Current Ratings

The emissivity, ε, describes how effectively the surface radiates heat For a perfectly polished surface, the value is close to zero - a very poor radiator For a matt black surface, the value is close to 1 - a very good radiator

Copper Development Association

Busbar System Current Ratings Bright copper has an emissivity of about 0.1 During use, the emissivity of the copper surface increases - and the current rating increases - as the copper darkens to reach an emissivity value of about 0.7 Tin plated copper has an emissivity of about 0.3 to 0.5 But painting bars reduces the current rating!

Copper Development Association

Busbar System Current Ratings Pr 

Pr 

Pr 

Pr 

Pr 

Pr 

No radiation heat loss from internal surfaces

Copper Development Association

Busbar System Current Ratings Radiation (for 30 C ambient) Radiation power dissipation v Working temperature 100

   ) 80   m   q   s   r   e   p 60    W    (   n   o    i    t   a   p    i   s 40   s    i    d   r   e   w   o    P 20

0 273

323

3 73

Absolute Working Temperature (K)

Copper Development Association

Busbar System Current Ratings for 100 mm vertical height, 30 C ambient Total power dissipation dissipation v Working temperature

1000

  q   s   r   e   p    W    (   n   o    i    t   a   p    i   s   s    i    d   r   e   w   o    P

900

Convection

800

Radiation

700

Total

600 500 400 300 200 100 0 40

60

80

100

120

140

Working temperature (C)

Copper Development Association

Busbar System Current Ratings The power generated by current in the busbar is: 2

 P  =  I   R

 P  =  I 

2

ρ l  a

where ρ is the resistivity of the material a is the cross sectional area l 

is the length Copper Development Association

Busbar System Current Ratings

At some temperature, the heat generated in the busbar is equal to the total heat lost by convection and radiation.

 P i

=

[ P c ] + [ P r  ]

Copper Development Association

Minimum size calculation Calculation method: 1

Select working and ambient temperatures

2

Assume initial current density of 8 amps/mm2

3

Find appropriate size in standard range

4

Calculate heat generated due to current

5

Calculate heat loss at working temperature

6

If 4>5, increase size and return to 4 When 4=101.5 % IACS

Easy Formability • due to to small small grain grain siz size e and and advanc advanced ed produ productio ction n technology • easy easy to bend bend withou withoutt surface surface deform deformatio ation n

Good Flatness • simple reliable jointing

Good Straightness • easy installation, lower joint stress Copper Development Association

David Chapman Copper Development Association [email protected]

Copper Development Association

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