ATN 910&910I&910B&950B V200R003C00 Hardware Description 01(CLI)

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Short Description

ATN 910&910I&910B&950B...

Description

ATN 910&910I&910B&950B Multi-Service Access Equipment V200R003C00

Hardware Description Issue

01

Date

2013-10-31

HUAWEI TECHNOLOGIES CO., LTD.

Copyright © Huawei Technologies Co., Ltd. 2013. All rights reserved. No part of this document may be reproduced or transmitted in any form or by any means without prior written consent of Huawei Technologies Co., Ltd.

Trademarks and Permissions and other Huawei trademarks are trademarks of Huawei Technologies Co., Ltd. All other trademarks and trade names mentioned in this document are the property of their respective holders.

Notice The purchased products, services and features are stipulated by the contract made between Huawei and the customer. All or part of the products, services and features described in this document may not be within the purchase scope or the usage scope. Unless otherwise specified in the contract, all statements, information, and recommendations in this document are provided "AS IS" without warranties, guarantees or representations of any kind, either express or implied. The information in this document is subject to change without notice. Every effort has been made in the preparation of this document to ensure accuracy of the contents, but all statements, information, and recommendations in this document do not constitute a warranty of any kind, express or implied.

Huawei Technologies Co., Ltd. Address:

Huawei Industrial Base Bantian, Longgang Shenzhen 518129 People's Republic of China

Website:

http://www.huawei.com

Email:

[email protected]

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About This Document

About This Document Related Version The following table lists the product version related to this document. Product Name

Version

l ATN 910

V200R003C00

l ATN 910I l ATN 910B l ATN 950B

Intended Audience This document describes the equipment structure, chassis structure, and board classification. This document also describes each board of these classes in details. This document helps you get the detailed information about the equipment hardware. This document is intended for: l

Network planning engineers

l

Hardware installation engineers

l

System maintenance engineers

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About This Document

Description Indicates a potentially hazardous situation which, if not avoided, may result in minor or moderate injury. Indicates a potentially hazardous situation which, if not avoided, could result in equipment damage, data loss, performance deterioration, or unanticipated results. NOTICE is used to address practices not related to personal injury. Calls attention to important information, best practices and tips. NOTE is used to address information not related to personal injury, equipment damage, and environment deterioration.

Command Conventions Convention

Description

Boldface

The keywords of a command line are in boldface.

Italic

Command arguments are in italics.

[]

Items (keywords or arguments) in brackets [ ] are optional.

{ x | y | ... }

Optional items are grouped in braces and separated by vertical bars. One item is selected.

[ x | y | ... ]

Optional items are grouped in brackets and separated by vertical bars. One item is selected or no item is selected.

{ x | y | ... }*

Optional items are grouped in braces and separated by vertical bars. A minimum of one item or a maximum of all items can be selected.

[ x | y | ... ]*

Optional items are grouped in brackets and separated by vertical bars. Several items or no item can be selected.

GUI Conventions

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Description

Boldface

Buttons, menus, parameters, tabs, window, and dialog titles are in boldface. For example, click OK. Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd.

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ATN 910&910I&910B&950B Multi-Service Access Equipment Hardware Description

About This Document

Convention

Description

>

Multi-level menus are in boldface and separated by the ">" signs. For example, choose File > Create > Folder.

Change History Updates between document issues are cumulative. Therefore, the latest document issue contains all updates made in previous issues.

Changes in Issue 01 (2013-10-31) This document is the first release of the V200R003C00 version.

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Contents

Contents About This Document.....................................................................................................................ii 1 ATN 910 Chassis............................................................................................................................1 1.1 Appearance.....................................................................................................................................................................2 1.2 Slot Distribution.............................................................................................................................................................2 1.3 Installation Information..................................................................................................................................................3 1.4 Heat Dissipation.............................................................................................................................................................7 1.5 Safety Labels..................................................................................................................................................................8

2 ATN 910I Chassis........................................................................................................................10 2.1 Appearance...................................................................................................................................................................11 2.2 Functions and Features.................................................................................................................................................12 2.3 Working Principle and Signal Flow.............................................................................................................................14 2.4 Panel.............................................................................................................................................................................16 2.5 Installation Information................................................................................................................................................22 2.6 Heat Dissipation...........................................................................................................................................................23 2.7 Safety Labels................................................................................................................................................................23

3 ATN 910B Chassis.......................................................................................................................26 3.1 Appearance...................................................................................................................................................................27 3.2 Functions and Features.................................................................................................................................................27 3.3 Working Principle and Signal Flow.............................................................................................................................29 3.4 Panel.............................................................................................................................................................................30 3.5 Installation Information................................................................................................................................................36 3.6 Heat Dissipation...........................................................................................................................................................37 3.7 Safety Labels................................................................................................................................................................37

4 ATN 950B Chassis.......................................................................................................................39 4.1 Appearance...................................................................................................................................................................40 4.2 Slot Distribution...........................................................................................................................................................40 4.3 Installation Information................................................................................................................................................42 4.4 Heat Dissipation...........................................................................................................................................................46 4.5 Safety Labels................................................................................................................................................................47

5 ATN 910 Boards...........................................................................................................................49 Issue 01 (2013-10-31)

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5.1 Board Overview............................................................................................................................................................51 5.2 Board Type and Application.........................................................................................................................................53 5.2.1 Board Type................................................................................................................................................................53 5.2.2 Ethernet Service Interface Board...............................................................................................................................56 5.2.3 E1 Service Interface Board........................................................................................................................................56 5.2.4 xDSL Service Interface Board...................................................................................................................................59 5.3 ANC2CXPI/ANC2CXPL - System Control, Cross-connect, and Multi-protocol Process Unit..................................60 5.3.1 Front Panel.................................................................................................................................................................60 5.3.2 Functions and Features..............................................................................................................................................65 5.3.3 Working Principle and Signal Flow..........................................................................................................................67 5.3.4 CF Card and DIP Switch...........................................................................................................................................69 5.3.5 Technical Specifications ...........................................................................................................................................70 5.4 AND1EG4T - 4 Channels FE/GE Adaptive Electronic Interface Board.....................................................................73 5.4.1 Front Panel.................................................................................................................................................................73 5.4.2 Functions and Features..............................................................................................................................................75 5.4.3 Working Principle and Signal Flow..........................................................................................................................76 5.4.4 Technical Specifications............................................................................................................................................77 5.5 AND1EF8T - 8 Channels Fast Ethernet Electric Interface Board................................................................................78 5.5.1 Front Panel.................................................................................................................................................................78 5.5.2 Functions and Features..............................................................................................................................................79 5.5.3 Working Principle and Signal Flow..........................................................................................................................80 5.5.4 Technical Specifications............................................................................................................................................81 5.6 AND1EG2 - 2 Channels GE Optical Interface Board..................................................................................................82 5.6.1 Front Panel.................................................................................................................................................................82 5.6.2 Functions and Features..............................................................................................................................................83 5.6.3 Working Principle and Signal Flow..........................................................................................................................84 5.6.4 Technical Specifications............................................................................................................................................85 5.7 AND1EG4F - 4 Channels FE/GE Adaptive Optical Interface Board..........................................................................86 5.7.1 Front Panel.................................................................................................................................................................86 5.7.2 Functions and Features..............................................................................................................................................87 5.7.3 Working Principle and Signal Flow..........................................................................................................................88 5.7.4 Technical Specifications............................................................................................................................................90 5.8 AND1EF8F - 8 Channels Fast Ethernet Optical Interface Board.................................................................................92 5.8.1 Front Panel.................................................................................................................................................................92 5.8.2 Functions and Features..............................................................................................................................................93 5.8.3 Working Principle and Signal Flow..........................................................................................................................94 5.8.4 Technical Specifications............................................................................................................................................95 5.9 AND1ML1/AND1ML1A - 16 Channels E1 Electrical Interface Board......................................................................96 5.9.1 Front Panel.................................................................................................................................................................96 5.9.2 Functions and Features..............................................................................................................................................98 5.9.3 Working Principle and Signal Flow........................................................................................................................100 Issue 01 (2013-10-31)

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5.9.4 Specifications...........................................................................................................................................................102 5.10 AND2ML1A/AND2ML1B - 16 Channels E1 Interface Board................................................................................102 5.10.1 Front Panel.............................................................................................................................................................103 5.10.2 Functions and Features..........................................................................................................................................105 5.10.3 Working Principle and Signal Flow......................................................................................................................106 5.10.4 Technical Specifications........................................................................................................................................108 5.11 AND1MD1A/AND1MD1B - 32 Channels E1 Interface Board...............................................................................109 5.11.1 Front Panel.............................................................................................................................................................109 5.11.2 Functions and Features..........................................................................................................................................112 5.11.3 Working Principle and Signal Flow......................................................................................................................113 5.11.4 Technical Specifications........................................................................................................................................115 5.12 AND1MO1C - 8 Channels T1 Interface Board .......................................................................................................116 5.12.1 Front Panel.............................................................................................................................................................116 5.12.2 Functions and Features..........................................................................................................................................117 5.12.3 Working Principle and Signal Flow......................................................................................................................118 5.12.4 Technical Specifications........................................................................................................................................120 5.13 AND1AVD8A - 8 Channels ADSL2+ Service Interface Board..............................................................................121 5.13.1 Front Panel.............................................................................................................................................................121 5.13.2 Functions and Features..........................................................................................................................................122 5.13.3 Working Principle and Signal Flow......................................................................................................................123 5.13.4 Technical Specifications .......................................................................................................................................125 5.14 AND1AVD8B - 8 Channels VDSL2 Service Interface Board.................................................................................125 5.14.1 Front Panel.............................................................................................................................................................125 5.14.2 Functions and Features..........................................................................................................................................127 5.14.3 Working Principle and Signal Flow......................................................................................................................127 5.14.4 Technical Specifications .......................................................................................................................................129 5.15 AND1SHD4 - 4 Channels G.SHDSL Service Interface Board ...............................................................................130 5.15.1 Front Panel.............................................................................................................................................................130 5.15.2 Functions and Features..........................................................................................................................................131 5.15.3 Working Principle and Signal Flow......................................................................................................................132 5.15.4 Technical Specifications .......................................................................................................................................133 5.16 AND1SHD4I - 4 Channels G.SHDSL Interface Board for IMA Mode ..................................................................133 5.16.1 Front Panel.............................................................................................................................................................133 5.16.2 Functions and Features..........................................................................................................................................135 5.16.3 Working Principle and Signal Flow......................................................................................................................135 5.16.4 Technical Specifications .......................................................................................................................................138 5.17 TNC1PIU - Power Interface Board..........................................................................................................................138 5.17.1 Front Panel.............................................................................................................................................................138 5.17.2 Functions and Features..........................................................................................................................................139 5.17.3 Working Principle and Signal Flow......................................................................................................................140 5.17.4 Technical Specifications........................................................................................................................................141 Issue 01 (2013-10-31)

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5.18 ANC1FAN - Fan Board............................................................................................................................................141 5.18.1 Front Panel.............................................................................................................................................................141 5.18.2 Functions and Features..........................................................................................................................................142 5.18.3 Working Principle and Signal Flow......................................................................................................................142 5.18.4 Technical Specifications........................................................................................................................................143 5.19 Filler Panel................................................................................................................................................................144 5.19.1 Appearance and Valid Slots..................................................................................................................................144 5.19.2 Functions and Features..........................................................................................................................................144

6 ATN 910I Boards........................................................................................................................146 7 ATN 910B Boards.......................................................................................................................147 8 ATN 950B Boards.......................................................................................................................148 8.1 Board Overview..........................................................................................................................................................150 8.2 Board Type and Application.......................................................................................................................................152 8.2.1 Board Type..............................................................................................................................................................152 8.2.2 Ethernet Service Interface Board.............................................................................................................................154 8.2.3 E1 Service Interface Board......................................................................................................................................155 8.2.4 STM-1 Service Interface Board...............................................................................................................................157 8.3 AND1CXPA/AND1CXPB - System Control, Cross-connect, and Multi-protocol Process Unit..............................158 8.3.1 Front Panel...............................................................................................................................................................159 8.3.2 Functions and Features............................................................................................................................................162 8.3.3 Working Principle and Signal Flow........................................................................................................................163 8.3.4 CF Card and DIP Switch.........................................................................................................................................165 8.3.5 Technical Specifications..........................................................................................................................................166 8.4 AND2CXPA/AND2CXPB/AND2CXPE - System Control, Cross-connect, and Multi-protocol Process Unit........167 8.4.1 Front Panel...............................................................................................................................................................167 8.4.2 Functions and Features............................................................................................................................................171 8.4.3 Working Principle and Signal Flow........................................................................................................................172 8.4.4 DIP Switch...............................................................................................................................................................174 8.4.5 Technical Specifications..........................................................................................................................................174 8.5 AND1EM4T - 4 Channels GE/FE Electrical Interface Board ...................................................................................175 8.5.1 Front Panel...............................................................................................................................................................175 8.5.2 Functions and Features............................................................................................................................................176 8.5.3 Working Principle and Signal Flow........................................................................................................................177 8.5.4 Technical Specifications..........................................................................................................................................179 8.6 AND1EM8T - 8 Channels GE/FE Electric Interface Board .....................................................................................179 8.6.1 Front Panel...............................................................................................................................................................179 8.6.2 Functions and Features............................................................................................................................................181 8.6.3 Working Principle and Signal Flow........................................................................................................................181 8.6.4 Technical Specifications..........................................................................................................................................183 8.7 AND1EM4F - 4 Channels GE/FE Optical Interface Board ......................................................................................184 Issue 01 (2013-10-31)

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8.7.1 Front Panel...............................................................................................................................................................184 8.7.2 Functions and Features............................................................................................................................................185 8.7.3 Working Principle and Signal Flow........................................................................................................................186 8.7.4 Technical Specifications..........................................................................................................................................188 8.8 AND1EM4C: 4 Channels GE/FE Combo Board.......................................................................................................189 8.8.1 Front Panel...............................................................................................................................................................190 8.8.2 Functions and Features............................................................................................................................................191 8.8.3 Working Principle and Signal Flow........................................................................................................................192 8.8.4 Technical Specifications and Standards Compliance..............................................................................................194 8.9 AND1EM8F - 8 Channels GE/FE Optical Interface Board ......................................................................................196 8.9.1 Front Panel...............................................................................................................................................................196 8.9.2 Functions and Features............................................................................................................................................197 8.9.3 Working Principle and Signal Flow........................................................................................................................198 8.9.4 Technical Specifications..........................................................................................................................................200 8.10 AND1EX1 - 1 Channel 10 GE Optical Interface Board...........................................................................................202 8.10.1 Front Panel.............................................................................................................................................................202 8.10.2 Functions and Features..........................................................................................................................................203 8.10.3 Working Principle and Signal Flow......................................................................................................................203 8.10.4 Technical Specifications........................................................................................................................................205 8.11 AND2CQ1B - 4 Channels Channelized OC-3c/STM-1c POS Optical Interface Board..........................................206 8.11.1 Front Panel.............................................................................................................................................................207 8.11.2 Functions and Features..........................................................................................................................................208 8.11.3 Working Principle and Signal Flow......................................................................................................................209 8.11.4 Technical Specifications........................................................................................................................................212 8.12 AND2PQ1: 4 Channels OC-3/STM-1 POS Optical Interface Board.......................................................................212 8.12.1 Front Panel.............................................................................................................................................................212 8.12.2 Functions and Features..........................................................................................................................................213 8.12.3 Working Principle and Signal Flow......................................................................................................................214 8.12.4 Technical Specifications and Standards Compliance............................................................................................215 8.13 AND1ML1/AND1ML1A - 16 Channels E1 Electrical Interface Board..................................................................216 8.13.1 Front Panel.............................................................................................................................................................216 8.13.2 Functions and Features..........................................................................................................................................219 8.13.3 Working Principle and Signal Flow......................................................................................................................220 8.13.4 Specifications.........................................................................................................................................................222 8.14 AND3ML1A/AND3ML1B - 16 Channels E1 Interface Board................................................................................223 8.14.1 Front Panel.............................................................................................................................................................223 8.14.2 Functions and Features..........................................................................................................................................225 8.14.3 Working Principle and Signal Flow......................................................................................................................227 8.14.4 Technical Specifications........................................................................................................................................229 8.15 AND2MD1A/AND2MD1B - 32 Channels E1 Interface Board...............................................................................230 8.15.1 Front Panel.............................................................................................................................................................230 Issue 01 (2013-10-31)

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8.15.2 Functions and Features..........................................................................................................................................232 8.15.3 Working Principle and Signal Flow......................................................................................................................234 8.15.4 Technical Specifications........................................................................................................................................236 8.16 TND1PIU - Power Interface Board..........................................................................................................................236 8.16.1 Front Panel.............................................................................................................................................................237 8.16.2 Functions and Features..........................................................................................................................................238 8.16.3 Working Principle and Signal Flow......................................................................................................................238 8.16.4 Specifications.........................................................................................................................................................239 8.17 AND1FAN - Fan Board...........................................................................................................................................240 8.17.1 Front Panel.............................................................................................................................................................240 8.17.2 Functions and Features..........................................................................................................................................241 8.17.3 Working Principle and Signal Flow......................................................................................................................241 8.17.4 Specifications.........................................................................................................................................................243 8.18 Filler Panel................................................................................................................................................................243 8.18.1 Appearance and Valid Slots..................................................................................................................................243 8.18.2 Functions and Features..........................................................................................................................................244

9 Swappable Optical/Electrical Modules.................................................................................245 9.1 Overview....................................................................................................................................................................246 9.2 FE Optical Module.....................................................................................................................................................248 9.3 GE Optical Module.....................................................................................................................................................250 9.4 10GE Optical Module.................................................................................................................................................255 9.5 Electrical Module.......................................................................................................................................................257

10 Cables.........................................................................................................................................259 10.1 Power Supply Cables and Ground Cables................................................................................................................260 10.1.1 -48 V Power Supply Cable....................................................................................................................................260 10.1.2 Power Cable...........................................................................................................................................................261 10.1.3 PGND Cables........................................................................................................................................................262 10.2 Management Cables.................................................................................................................................................263 10.3 Alarm Input/Output Cables......................................................................................................................................264 10.4 Clock Cables.............................................................................................................................................................265 10.4.1 External Clock Cables...........................................................................................................................................265 10.4.2 Clock Bridging Cable............................................................................................................................................267 10.5 Service Cables..........................................................................................................................................................269 10.5.1 Ethernet Cables......................................................................................................................................................269 10.5.2 75-Ohm 8 x E1 Cables...........................................................................................................................................273 10.5.3 120-Ohm 8 x E1 Cables.........................................................................................................................................274 10.5.4 75-Ohm 16 x E1 Cables.........................................................................................................................................277 10.5.5 120-Ohm 16 x E1 Cables.......................................................................................................................................280 10.5.6 xDSL Cables..........................................................................................................................................................283 10.6 Optical Fibers...........................................................................................................................................................285 Issue 01 (2013-10-31)

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11 Equipment Support.................................................................................................................287 11.1 Cabinet Support........................................................................................................................................................288 11.1.1 APM30H Outdoor Cabinet....................................................................................................................................288 11.1.2 IMB Network Cabinet...........................................................................................................................................289 11.1.3 19-inch Open Rack................................................................................................................................................291 11.1.4 N63E Cabinet........................................................................................................................................................292 11.2 Power Distribution Equipment.................................................................................................................................293 11.2.1 Power Distribution.................................................................................................................................................293 11.2.2 EPS30-4815AF Power System..............................................................................................................................294 11.2.3 27S48D Power System..........................................................................................................................................299 11.2.4 HW-100-48AC14D-1 Power System....................................................................................................................301 11.2.5 Lead-Acid Battery.................................................................................................................................................302 11.3 Heater........................................................................................................................................................................303

12 Quick Reference.......................................................................................................................305 12.1 Indicators..................................................................................................................................................................306 12.2 Dimensions and Weight............................................................................................................................................314 12.3 Power Consumption.................................................................................................................................................317 12.4 Interface Specifications............................................................................................................................................320 12.4.1 Specifications of STM-1 Optical Interfaces..........................................................................................................320 12.4.2 Specifications of FE Optical Interfaces.................................................................................................................322 12.4.3 Specifications of GE Optical Interfaces................................................................................................................324 12.4.4 Specifications of 10GE Optical Interfaces............................................................................................................329 12.4.5 Specifications of GE and FE Electrical Interfaces................................................................................................331 12.4.6 Specifications of E1 Electrical Interfaces..............................................................................................................331 12.4.7 Specifications of T1 Electrical Interfaces..............................................................................................................332 12.4.8 Specifications of the ADSL2+ Interface...............................................................................................................332 12.4.9 Specifications of the VDSL2 Interface..................................................................................................................332 12.4.10 Specifications of the G.SHDSL Interface............................................................................................................333

A Acronyms and Abbreviations................................................................................................334

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1 ATN 910 Chassis

1

ATN 910 Chassis

About This Chapter The ATN 910 uses the chassis of 1 U high (1 U = 44.45 mm) and supports multiple installation modes, which facilitates flexible deployment. The ATN 910 can be flexibly deployed with high reliability and scalability. It has the following features: l

One power board provides two –48 V or –60 V DC power inputs, ensuring redundancy backup of input power.

l

The fan board provides three fans, ensuring proper heat dissipation even when a fan is faulty.

l

Two slots can be flexibly configured with service boards.

1.1 Appearance The ATN 910 provides 6 slots and all boards are swappable. The ATN 910 provides six slots and all boards are swappable. A chassis has a mounting ear at each side and can be installed in different cabinets and racks. 1.2 Slot Distribution This section describes slot distribution on the ATN 910. 1.3 Installation Information ATN 910 provides multiple installation positions for mounting ears and supports various mounting ears, so ATN 910 can be installed in multiple types of cabinets. 1.4 Heat Dissipation ATN 910 dissipates heat by drawing in air from the left and expelling out the air from the right. 1.5 Safety Labels The equipment has various safety labels. This section describes the suggestions and locations of these safety labels.

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1 ATN 910 Chassis

1.1 Appearance The ATN 910 provides 6 slots and all boards are swappable. The ATN 910 provides six slots and all boards are swappable. A chassis has a mounting ear at each side and can be installed in different cabinets and racks. Figure 1-1 shows the appearance of the ATN 910 that has boards fully configured. Figure 1-1 Appearance of the ATN 910 that has boards fully configured

Figure 1-2 shows the appearance of the ATN 910 that does not have boards fully configured. Figure 1-2 Appearance of the ATN 910 that does not have boards fully configured

1.2 Slot Distribution This section describes slot distribution on the ATN 910. Figure 1-3 shows the slot distribution on the ATN 910. Figure 1-3 Slot distribution on the ATN 910 SLOT SLOT 6 5

SLOT 3 (2 x GE)

SLOT 4 (2 x GE)

SLOT 1 and SLOT 2

Table 1-1 describes priorities of slots where boards supported by the ATN 910 can be inserted. Issue 01 (2013-10-31)

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Table 1-1 Priorities of available slots Name

Valid Slot

Priorities of Slots (in Descending Order)

ANC2CXPI/ANC2CXPL

slot 1 and slot 2

-

AND1EF8T/AND1EF8F

slot 3 or slot 4

slot 3 - slot 4

slot 3 or slot 4

slot 4 - slot 3

AND1MO1C

slot 3 or slot 4

slot 3 - slot 4

AND1AVD8A/ AND1AVD8B

slot 3 or slot 4

slot 3 - slot 4

TNC1PIU

slot 5

-

ANC1FAN

slot 6

-

AND1EG2 AND1EG4F AND2ML1A/AND2ML1B AND1MD1A/AND1MD1B

AND1SHD4/AND1SHD4I

Note: The ANC2CXPI or ANC2CXPL each house two slots. Slot 1 and slot 2 house one ANC2CXPI or ANC2CXPL.

1.3 Installation Information ATN 910 provides multiple installation positions for mounting ears and supports various mounting ears, so ATN 910 can be installed in multiple types of cabinets. As shown in Table 1-2, ATN 910 supports various mounting ears and can be installed in multiple types of cabinets. Table 1-2 Requirements on the cabinet and mounting ears Mounting Ear

Applicable Cabinet Standard

Applicable Huawei Cabinet

Remarks

IEC60297

N66E

The mounting ears are delivered with the device.

N68E N610E 19-inch open rack IMB network cabinet APM30H outdoor cabinet Issue 01 (2013-10-31)

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Mounting Ear

1 ATN 910 Chassis

Applicable Cabinet Standard

Applicable Huawei Cabinet

Remarks

ETSI300-119

N63E

The mounting ears are rack-mounting ears that are installed on the mounting ears delivered with the device.

N66T

IEC60297 (23inch)

-

The mounting ears are for a 23-inch cabinet and are used to substitute for the mounting ears delivered with the device when the device needs to be installed in a 23inch cabinet.

ATN 910 provides three installation positions for mounting ears. Users can determine an installation position for mounting ears based on the depth of the cabinet. Figure 1-4 shows the installation positions of mounting ears. Position 1 shows a pair of mounting ears delivered with ATN 910. Figure 1-4 Installation positions of mounting ears

Already installed mounting ears

Position 3 for installing the mounting ears

Position 1 for installing the mounting ears Position 2 for installing the mounting ears

Determine an installation position for mounting ears based on the cabinet depth. The following figures show the installation dimensions when mounting ears are installed in different positions.

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Figure 1-5 Determine an installation position for mounting ears (IEC) Unit: mm 220 31.8

465.1 224

208

132.5

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Figure 1-6 Determine an installation position for mounting ears (ETSI) Unit: mm 220 25

515 241.5

225.5

150

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Figure 1-7 Determine an installation position for mounting ears (23-inch) Unit: mm 220 31.8

566.7

217.5

201.5

126

NOTE

When installing the ATN 910 in the cabinet, reserve 80 mm space at the front of the panel for cabling.

1.4 Heat Dissipation ATN 910 dissipates heat by drawing in air from the left and expelling out the air from the right. Figure 1-8 shows the system air duct.

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Figure 1-8 ATN 910 Air duct

l

Heat dissipation holes of air intake and exhaust vents on ATN 910 must be kept clean and unblocked.

l

A distance of at least 50 mm must be reserved at the air intake/exhaust vent on ATN 910 to ensure good ventilation.

l

Filler panels must be installed on unused slots. In addition, on ATN 910, heat must be dissipated by drawing in air from the left and expelling out the air from the right.

l

The ambient temperature of ATN 910 must be within the range of -20°C to +60°C. When ATN 910 is installed in a cabinet, temperature inside the cabinet must be within the temperature range and the air duct of the cabinet must be consistent with that of ATN 910.

1.5 Safety Labels The equipment has various safety labels. This section describes the suggestions and locations of these safety labels.

Label Position Figure 1-9 shows positions of labels on the chassis. Figure 1-9 Label position ATN 910 电源额定值 POWER RATING:

N14036

-48--60V;4A

1类激光产品 Class 1 Laser Product

合格证/QUALIFICATION CARD この装置は、クラスA情報技術装置です。この 装置を家庭環境で 使用すゐと電波妨害を 引き起こすことがぁります。この場合には使用 者が適切な対策を講ずゐよぅ 要求されゐことがぁります。 VCCI-A

HUAWEI 华为技术有限公司

中国制作

HUAW EI TEC HNOLOGIES CO.,L TD.

M ADE IN C HIN A

华为技术有限公司

中国制造

HUAWE I TE CHNO LG I E S CO. , LTD.

MADE IN CHINA

!

Label Description There are labels on the chassis and boards. See Table 1-3. Issue 01 (2013-10-31)

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ATN 910&910I&910B&950B Multi-Service Access Equipment Hardware Description

1 ATN 910 Chassis

Table 1-3 Label description Figure

Type

Description

Backplane bar code label

The bar code of the backplane will be retrieved by ATN 910 as the equipment serial number (ESN).

ESD protection label

The label suggests the electrostaticsensitive equipment.

Chassis grounding label

The label indicates the position of the grounding terminal. When the equipment is installed in a 19-inch cabinet, it is recommended that you use the grounding terminal specified in this label.

Chassis grounding label

The label indicates the position of the general grounding terminal. When the equipment is installed in a cabinet rather than a 19-inch cabinet, it is recommended that you use the grounding terminal specified in this label.

Fan warning label

The label suggests that do not touch the fan leaves when the fan is rotating.

Operation warning label

The label indicates the precautions that should be taken for operations on the PIU board. For details, see Label.

Qualification label

The equipment is qualified.

Product nameplate label (General)

The label suggests the product name and certification.

Product nameplate label (North America)

The label suggests the product name and certification.

! 合格证/QUALIFICATION CARD

HUAWEI 华为技术有限公司

中国制造

HUAWEI TECHNOLOGIES CO.,LTD.

MADE IN CHINA

ATN 910 电源额定值 POWER RATING:

N14036

-48--60V;4A

1类激光产品 Class 1 Laser Product

この装置は、クラスA情報技術装置です。この装置を家庭環境で使用すゐ と電波妨害を引き起こすことがぁります。この場合には使用者が適切な対策 を講ずゐよぅ要求されゐことがぁります。 VCCI-A

中国制造 MADE IN CHINA

华为技术有限公司

HUAWEI TECHNOLGIES CO.,LTD.

ATN 910 电源额定值 POWER RATING:

-48--60V;4A

This device complies with Part 15 of the FCC Rules.Operation is subject to the following two conditions:(1)this device may not cause harmful interference,and(2)this device must accept any interference received,including interference that may cause undesired operation. この装置は、クラスA情報技術装置です。この装置を家庭環境で使用 すゐと電波妨害を引き起こすことがぁります。この場合には使用者が適 切な対策を講ずゐよぅ要求されゐことがぁります。 V C C I ------ A

1类激光产品 Class 1 Laser Product

Complles With 21 CFR Chapter I,Subchapter J UL US I.T.E. N14036 C 65JJ E210619 LISTED 华为技术有限公司

HUAWEI TECHNOLGIES CO.,LTD.

中国制造 MADE IN CHINA

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ATN 910&910I&910B&950B Multi-Service Access Equipment Hardware Description

2 ATN 910I Chassis

2

ATN 910I Chassis

About This Chapter The ATN 910I uses the chassis of 1 U high (1 U = 44.45 mm) and supports multiple installation modes, which facilitates flexible deployment. 2.1 Appearance The ATN 910I integrates boards and modules, which are not swappable. A chassis has a mounting ear at each side and can be installed in different cabinets and racks. 2.2 Functions and Features The ATN 910I can receive and process FE, GE, and E1 service signals, implement service scheduling, support system control, and provide system clock processing and auxiliary interface functions. 2.3 Working Principle and Signal Flow The ATN 910I consists of the ANF1CXPx, power module, and fan module. 2.4 Panel There are indicators, buttons, and interfaces on the ATN 910I panel. 2.5 Installation Information ATN 910I provides multiple installation positions for mounting ears and supports various mounting ears, so ATN 910I can be installed in multiple types of cabinets. 2.6 Heat Dissipation ATN 910I dissipates heat by drawing in air from the left and expelling out the air from the right. 2.7 Safety Labels The equipment has various safety labels. This section describes the suggestions and locations of these safety labels.

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2.1 Appearance The ATN 910I integrates boards and modules, which are not swappable. A chassis has a mounting ear at each side and can be installed in different cabinets and racks. Table 2-1 describes multiple models of the ATN 910I. Table 2-1 Description of the ATN 910I models Model/ Silkscreen

Builtin Contro l Board

Power Suppl y

Interface

Temperature

1588 ACR

POE

ATN 910I AC

ANF1C XPI

AC

4GE(Oa)+4GE/FE(O)+4GE/ FE(Eb)

-20ºC to +60ºC (fan cooling)

Not supported

Not supported

ATN 910I-C AC

ANF1C XPB

AC

4GE(O)+4GE/FE(O)+4GE/ FE(E)+16E1

-20ºC to +60ºC (fan cooling)

Supported

Not supported

ATN 910IPOE

ANF2C XPA

AC

4GE(O)+4GE/FE(O)+4GE/ FE(E)

-20ºC to +65ºC (fan cooling)

Not supported

Supported

ATN 910I DC

ANF1C XPI

DC

4GE(O)+4GE/FE(O)+4GE/ FE(E)

-20ºC to +60ºC (fan cooling)

Not supported

Not supported

ANF1C XPA

DC

4GE(O)+4GE/FE(O)+4GE/ FE(E)+16E1

-20ºC to +60ºC (fan cooling)

Not supported

Not supported

ANF1C XPB

DC

4GE(O)+4GE/FE(O)+4GE/ FE(E)+16E1

-40ºC to +65ºC (fan cooling)

Supported

Not supported

ATN 910I-TC DC NOTE

l (O) indicates an SPF cage. l (E) indicates an RJ-45 electrical interface. l (COMBO) indicates a COMBO interface.

The following figures show the appearance of the ATN 910I of different models. Figure 2-1 Appearance of the ATN 910I AC with interfaces 4GE(O)+4GE/FE(O)+4GE/FE(E)

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Figure 2-2 Appearance of the ATN 910I-C AC with interfaces 4GE(O)+4GE/FE(O)+4GE/FE (E)+16E1

Figure 2-3 Appearance of the ATN 910I-POE AC with interfaces 4GE(O)+4GE/FE(O)+4GE/ FE(E)

Figure 2-4 Appearance of the ATN 910I DC with interfaces 4GE(O)+4GE/FE(O)+4GE/FE(E)

Figure 2-5 Appearance of the ATN 910I DC with interfaces 4GE(O)+4GE/FE(O)+4GE/FE(E) +16E1

Figure 2-6 Appearance of the ATN 910I-TC DC with interfaces 4GE(O)+4GE/FE(O)+4GE/FE (E)+16E1

2.2 Functions and Features The ATN 910I can receive and process FE, GE, and E1 service signals, implement service scheduling, support system control, and provide system clock processing and auxiliary interface functions. Table 2-2 describes functions and features of the ATN 910I. Issue 01 (2013-10-31)

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Table 2-2 Functions and features of the ATN 910I Function and Feature

Description

Auxiliary interface function

Provides one NM serial port or NM network port to communicate with the NMS so that the NMS can manage and query the equipment. Provides two interfaces for inputting and outputting the external clock/time to obtain the external clock/time information. Provides one alarm input/output interface. The interface provides three inputs of alarm digital parameters.

Ethernet interface function

FE SFP interfaces support FE optical modules and FE electrical modules. GE SFP interfaces support GE optical modules and GE electrical modules. FE/GE SFP interfaces support FE optical modules, FE electrical modules, GE optical modules, and GE electrical modules. FE electrical interfaces support signals at 10 Mbit/s and 100 Mbit/s. FE/GE electrical interfaces support signals at 10 Mbit/s, 100 Mbit/s, and 1000 Mbit/s. Electrical interfaces support the PoE function and a maximum output power of 30 W (only on the ATN 910I-P AC). Supports inloops and outloops. GE interfaces support flow control. Supports Layer 2 and Layer 3 working modes. Supports physical-layer clock synchronization (synchronous Ethernet). Supports IEEE 1588v2 and IEEE 1588 ACR.

E1 interface function

Supports a 75-ohm or 120-ohm impedance value (based on the actual E1 cable) Supports the E1 and CE1 modes. Supports inloops and outloops. Supports the PRBS function in framed or unframed mode of an E1 interface in the receive/transmit direction. Supports the ATM, TDM, and PPP protocols. Supports physical-layer clock synchronization.

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ATN 910&910I&910B&950B Multi-Service Access Equipment Hardware Description

Function and Feature

2 ATN 910I Chassis

Description

NOTE l If the SFP interface houses an electrical module, the interface does not support synchronous Ethernet or IEEE 1588v2. l When using an electrical interface at 10 Mbit/s, the interface does not support synchronous Ethernet clock or IEEE 1588v2. l Only some models of the ATN 910I support the 1588 ACR clock. For details, see 2.1 Appearance.

2.3 Working Principle and Signal Flow The ATN 910I consists of the ANF1CXPx, power module, and fan module. Figure 2-7 describes the functional block diagram of the ATN 910I. Figure 2-7 Functional block diagram of the ATN 910I Power supply

Clock input/output interface Time input/output interface NM network interface/serial interface Alarm input/output interface

Auxiliary interface module

Time/clock signals

Power module

Clock module

To other function modules Communication control module

To other function modules

4 x GE optical signals 4 x FE/GE optical signals 4 x FE/GE electrical signals

Service scheduling and processing module

Fan module

16 x E1 signals 4 x FE electrical signals

FE pinch board

Transmit Direction After buffering and scheduling the service packets, the service scheduling and processing module performs coding/decoding and serial/parallel conversion. Then the interfaces on the panel send Ethernet electrical/optical signals and E1 signals out.

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Receive Direction The service access interfaces on the panel receive Ethernet electrical/optical signals and E1 signals. Then the service scheduling and processing module performs serial/parallel conversion and coding/decoding, and buffers and schedules service packets.

Auxiliary Interface Module The auxiliary interface module provides the following interfaces: l

External time input/output interface

l

External clock input/output interface

l

NM serial interface/NM interface used to communicate with the NMS and to manage and query network elements

l

Alarm input/output interface

Communication Control Module The communication control module provides the following functions: l

Configures and monitors the entire system.

l

Provides an NM interface or NM serial interface for communication.

Service Scheduling and Processing Module The service scheduling and processing module provides the following functions: l

Processes service signals received on the interface cards.

l

Schedules services with the switching capacity of 12 Gbit/s in full duplex mode.

Clock Module The clock module provides the following functions: l

Provides a working clock for each module on the board.

l

Supports synchronous Ethernet and the SSM protocol.

l

Supports IEEE 1588v2.

l

Supports the 1588 ACR clock. NOTE

Only some models of the ATN 910I support the 1588 ACR clock. For details, see 2.1 Appearance.

Power Module The power module supplies power for other modules. NOTE

The ATN 910I supports AC and DC power supplies. For details about power supplies supported by each product model, see 2.1 Appearance.

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ATN 910&910I&910B&950B Multi-Service Access Equipment Hardware Description

2 ATN 910I Chassis

Fan Module The fan module implements heat dissipation for the system.

2.4 Panel There are indicators, buttons, and interfaces on the ATN 910I panel.

Appearance of the Panel Figure 2-8 shows the appearance of the ATN 910I panel. Figure 2-8 Appearance of the ATN 910I panel (ATN 910I DC is used as an example) PWR

STAT

ETH/OAM

ALM

RST

GE0-GE3

CLK

FE/GE0-FE/GE3

TOD

ALMI/ALMO

FE/GE4-FE/GE7

E1(0-15)

Indicator The ATN 910I provides the following indicators: System indicator l

PWRA/PWRB indicator, green, which indicates the power status

l

STAT indicator, red, green, or orange, which indicates the working status

l

ALM, red or orange, which indicates the alarm status.

Interface indicator l

LINK/ACT, green or orange, which indicates the connection status/data transceiving status on the SFP interface.

l

LINK indicator, green, which indicates the connection status of a service port

l

ACT indicator, orange, which indicates the receive/transmit status of a service port

Button There is only one RST button on the ATN 910I for resetting the device. The RST button can also be used to clear the passwords and configuration files on the ATN 910I. Once you press the RST button, the device begins to reset. Then you press and hold down the RST button for about 10s until the PWR, STA, and ALM indicators blink green. The device begins to automatically clear the passwords and configuration files. If you hold down the RST button 15s or more than 15s, the device only resets and does not clear the passwords and configuration files. Issue 01 (2013-10-31)

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Interface Table 2-3 describes the interfaces on the ATN 910I and their functions. Table 2-3 Interfaces on the ATN 910I Interface Name

Interface Type

Function

Description about the Corresponding Cable

ETH/OAM

RJ-45

10M/100M interface that can function as an NM interface or console interface

For details, see 10.2 Management Cables.

CLK

RJ-45

Clock input/output interface

For details, see 10.4 Clock Cables.

TOD

RJ-45

Time input/output interface

For details, see 10.4 Clock Cables.

ALMI/O

RJ-45

Alarm input/output interface

-

GE0 to GE3

SFP

GE service signal input/output interface

For details, see 10.6 Optical Fibers or 10.5.1 Ethernet Cables.

FE/GE0 to FE/GE3

SFP

FE/GE service signal input/ output interface

For details, see 10.6 Optical Fibers or 10.5.1 Ethernet Cables.

FE/GE4 to FE/GE7

RJ-45

FE/GE service signal input/ output interface

For details, see 10.5.1 Ethernet Cables.

E1 (0 to 15)

Anea 96

E1 service signal input/output interface

For details, see 10.5.4 75Ohm 16 x E1 Cables and 10.5.5 120-Ohm 16 x E1 Cables.

NOTE The SFP interface can connect to cables only after an optical module or an electrical module is installed.

As shown in Table 2-5, the three groups of interfaces on the ATN 910I are controlled by the license (LANFGEPAYG01 and LANFCOMBO01). l

LANFGEPAYG01 is used for interfaces in group 1. Interfaces in group 1 can be normally used only after this license is used.

l

LANFCOMBO01 is used for interfaces in groups 2 and 3. Interfaces in groups 2 and 3 can be divided into 4 pairs: FE/GE0, FE/GE1, FE/GE2, and FE/GE3. Each pair includes one SFP interface and one RJ-45 interface. – When this license is not used, either the SFP or RJ-45 interface in each pair of interfaces can be used. Among the 8 interfaces in groups 2 and 3, a maximum of 4 interfaces can be used. – When this license is used, all of the 8 interfaces in groups 2 and 3 can be normally used.

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ATN 910&910I&910B&950B Multi-Service Access Equipment Hardware Description

2 ATN 910I Chassis

Figure 2-9 Three groups of interfaces on the ATN 910I FE/GE0 FE/GE1 FE/GE2 FE/GE3

Group 1

Group 2

Group 3

Pin Assignments Table 2-4 Pins for the ETH/OAM interface Front View

87654321

Pin

Function

1

Transmit positive pole of the NM interface

2

Transmit negative pole of the NM interface

3

Receive positive pole of the NM interface

4

Ground end of the console interface

5

Receive end of the console interface

6

Receive negative pole of the NM interface

7

Unspecified

8

Receive end of the console interface

Table 2-5 Pins for the CLK interface Front View

87654321

Issue 01 (2013-10-31)

Pin

Working Mode

1

Receive negative pole of the CLK interface

2

Receive positive pole of the CLK interface

3

Unspecified

4

Transmit negative pole of the CLK interface

5

Transmit positive pole of the CLK interface

6

Unspecified

7

Unspecified

8

Unspecified

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Table 2-6 Pins for the TOD interface Front View

Pin

87654321

Working Mode External Time Input

External Time Output

(1 PPS+Time Information)

(1 PPS+Time Information)

1

Unspecified

Unspecified

2

Unspecified

Unspecified

3

Input negative pole of 1 PPS signals

Output negative pole of 1 PPS signals

(RS422 level)

(RS422 level)

4

Ground end

Ground end

5

Ground end

Ground end

6

Input positive pole of 1 PPS signals

Output positive pole of 1 PPS signals

(RS422 level)

(RS422 level)

Input negative pole of time information

Output negative pole of time information

(RS422 level)

(RS422 level)

Input positive pole of time information

Output positive pole of time information

(RS422 level)

(RS422 level)

7

8

NOTE The TOD interface can work only in one mode.

Table 2-7 Pins for the ALMI/ALMO interface Front View

87654321

Issue 01 (2013-10-31)

Pin

Function

1

Boolean input

2

Ground end

3

Boolean input

4

Boolean input

5

Ground end

6

Ground end

7

Boolean output positive pole

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ATN 910&910I&910B&950B Multi-Service Access Equipment Hardware Description

Front View

2 ATN 910I Chassis

Pin

Function

8

Boolean output negative pole

Table 2-8 Pins for the GE electrical interface Front View

87654321

Pin

Usage

1

Positive of twisted pair cable 1

2

Negative of twisted pair cable 1

3

Positive of twisted pair cable 2

4

Positive of twisted pair cable 3

5

Negative of twisted pair cable 3

6

Negative of twisted pair cable 2

7

Positive of twisted pair cable 4

8

Negative of twisted pair cable 4

Table 2-9 Pins for the FE interface Front View

87654321

Issue 01 (2013-10-31)

Pin

Function

1

Positive pole of twisted pair cable 1

2

Negative pole of twisted pair cable 1

3

Positive pole of twisted pair cable 2

4

Unspecified

5

Unspecified

6

Negative pole of twisted pair cable 2

7

Unspecified

8

Unspecified

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ATN 910&910I&910B&950B Multi-Service Access Equipment Hardware Description

2 ATN 910I Chassis

Table 2-10 Pins of the Anea 96 interface Front View

Connector Pin

Usage

Connector Pin

Usage

1

Rx0

25

Tx0

2 3

26 Rx1

4 5

Rx2

Rx3

Rx4

Rx5

Rx6

Rx7

Rx8

Rx9

R x 10

R x 11

R x 12

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39

Tx7

41

Tx8

43

Tx9

45

T x 10

47

T x 11

73

T x 12

74 R x 13

52 53

Tx6

48

50 51

37

46

24 49

Tx5

44

22 23

35

42

20 21

Tx4

40

18 19

33

38

16 17

Tx3

36

14 15

31

34

12 13

Tx2

32

10 11

29 30

8 9

Tx1

28

6 7

27

75

T x 13

76 R x 14

77

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T x 14 21

ATN 910&910I&910B&950B Multi-Service Access Equipment Hardware Description

Front View

Connector Pin

2 ATN 910I Chassis

Usage

Connector Pin

54

Usage

78

55

R x 15

79

56

T x 15

80

2.5 Installation Information ATN 910I provides multiple installation positions for mounting ears and supports various mounting ears, so ATN 910I can be installed in multiple types of cabinets. As shown in Table 2-11, ATN 910I supports various mounting ears and can be installed in multiple types of cabinets. Table 2-11 Requirements on the cabinet and mounting ears Mounting Ear

Applicable Cabinet Standard

Applicable Huawei Cabinet

Remarks

IEC60297

N66E

The mounting ears are delivered with the device.

N68E N610E 19-inch open rack IMB network cabinet APM30H outdoor cabinet ETSI300-119

N63E N66T

IEC60297 (23inch)

Issue 01 (2013-10-31)

-

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The mounting ears are rack-mounting ears that are installed on the mounting ears delivered with the device. The mounting ears are for a 23-inch cabinet and are used to substitute for the mounting ears delivered with the device when the device needs to be installed in a 23inch cabinet. 22

ATN 910&910I&910B&950B Multi-Service Access Equipment Hardware Description

2 ATN 910I Chassis

2.6 Heat Dissipation ATN 910I dissipates heat by drawing in air from the left and expelling out the air from the right. Figure 2-10 shows the ATN 910I air duct. Figure 2-10 ATN 910I air duct

l

Heat dissipation holes of air intake and exhaust vents on ATN 910I must be kept clean and unblocked.

l

A clearance of at least 50 mm must be reserved at the air intake/exhaust vent on ATN 910I to ensure good ventilation.

l

The ambient temperature of the ATN 910I-TC DC must be within the range of -40°C to 65°C, and that of ATN 910I in other models must be within the range of -20°C to +60° C.ATN 910I When ATN 910I is installed in a cabinet, temperature inside the cabinet must be within the permitted temperature range and the air duct of the cabinet must be consistent with that of ATN 910I.

l

When ATN 910I is installed in a cabinet, temperature inside the cabinet must be within the temperature range and the air duct of the cabinet must be consistent with that of ATN 910I. For details about temperature range by each product model, see 2.1 Appearance.

2.7 Safety Labels The equipment has various safety labels. This section describes the suggestions and locations of these safety labels.

Label Position Figure 2-11 shows positions of labels on the chassis.

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ATN 910&910I&910B&950B Multi-Service Access Equipment Hardware Description

2 ATN 910I Chassis

Figure 2-11 Label position O ptiX P TN 910-F 电源额定值 POWER RATING: ~100-240V;50/60Hz;0.8A MAX

N1 4036

合格证/QUALIFICATION CARD 1类激光产品 Class 1 Laser Product

HUAWEI 华为技术有限公司

中国制作

HUAW EI TEC HNOLOGIES CO.,L TD.

M ADE IN C HIN A

华为技 术有 限公 司

HUAW EI TECHNO LGIES CO .,LT D.

中 国制 造 MADE IN CHINA

Label Description There are labels on the chassis. See Table 2-12. Table 2-12 Label description Figure

合格证/QUALIFICATION CARD

Type

Description

Backplane bar code label

The bar code of the backplane will be retrieved by ATN device as the equipment serial number (ESN).

Chassis grounding label

The label indicates the position of the general grounding terminal. When the equipment is installed in a cabinet rather than a 19-inch cabinet, it is recommended that you use the grounding terminal specified in this label.

Chassis grounding label

The label indicates the position of the grounding terminal. When the equipment is installed in a 19-inch cabinet, it is recommended that you use the grounding terminal specified in this label.

Operation warning label

The label indicates the precautions that should be taken for operations.

Qualification label

The equipment is qualified.

HUAWEI 华为技术有限公司

中国制造

HUAWEI TECHNOLOGIES CO.,LTD.

MADE IN CHINA

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ATN 910&910I&910B&950B Multi-Service Access Equipment Hardware Description

Figure

Issue 01 (2013-10-31)

2 ATN 910I Chassis

Type

Description

Product nameplate label

The label suggests the product name and certification.

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ATN 910&910I&910B&950B Multi-Service Access Equipment Hardware Description

3 ATN 910B Chassis

3

ATN 910B Chassis

About This Chapter The ATN 910B uses the chassis of 1 U high (1 U = 44.45 mm) and supports multiple installation modes, which facilitates flexible deployment. 3.1 Appearance The ATN 910B integrates boards and modules, which are not swappable. A chassis has a mounting ear at each side and can be installed in different cabinets and racks. 3.2 Functions and Features The ATN 910B can receive and process FE, GE, 10GE, and E1 service signals, implement service scheduling, support system control, and provide system clock processing and auxiliary interface functions. 3.3 Working Principle and Signal Flow The ATN 910B consists of the CXPx, power module, and fan module. 3.4 Panel There are indicators, buttons, and interfaces on the ATN 910B panel. 3.5 Installation Information ATN 910B provides multiple installation positions for mounting ears and supports various mounting ears, so ATN 910B can be installed in multiple types of cabinets. 3.6 Heat Dissipation ATN 910B dissipates heat by drawing in air from the left and expelling out the air from the right. 3.7 Safety Labels The equipment has various safety labels. This section describes the suggestions and locations of these safety labels.

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ATN 910&910I&910B&950B Multi-Service Access Equipment Hardware Description

3 ATN 910B Chassis

3.1 Appearance The ATN 910B integrates boards and modules, which are not swappable. A chassis has a mounting ear at each side and can be installed in different cabinets and racks. Table 3-1 describes multiple models of the ATN 910B. Table 3-1 Description of the ATN 910B models Silkscreen

Built-in Control Board

Interface

CrossConnect Capacity

1588 ACR

ATN 910B-A DC

ANG1CXPA

2x10GE(O)+8xGE/FE(O)+8xFE/GE(E) +16E1

36 Gbit/s

Supported

ATN 910B-B DC

ANG1CXPB

2x10GE(O)+16xGE/FE(O)+8xFE/GE(E)

44 Gbit/s

Not supported

NOTE l (O) indicates an XFP interface for 10GE services or an SFP interface for GE/FE services. l (E) indicates an RJ-45 electrical interface.

Figure 3-1 and Figure 3-2 show the appearance of the ATN 910B of different models. Figure 3-1 Appearance of the ATN 910B-A with interfaces 2x10GE(O)+8xGE/FE(O)+8xFE/ GE(E)+16E1

Figure 3-2 Appearance of the ATN 910B-B with interfaces 2x10GE(O)+16xGE/FE(O)+8xFE/ GE(E)

3.2 Functions and Features The ATN 910B can receive and process FE, GE, 10GE, and E1 service signals, implement service scheduling, support system control, and provide system clock processing and auxiliary interface functions. Issue 01 (2013-10-31)

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Table 3-2 describes functions and features of the ATN 910B. Table 3-2 Functions and features of the ATN 910B Function and Feature

Description

Auxiliary interface function

Provides one NM serial port or NM network port to communicate with the NMS so that the NMS can manage and query the equipment. Provides two interfaces for inputting and outputting the external clock/time to obtain the external clock/time information. Provides one alarm input/output interface. The interface provides three inputs of alarm digital parameters.

Ethernet interface function

FE/GE SFP interfaces support FE optical modules, FE electrical modules, GE optical modules, and GE electrical modules. 10GE XFP interfaces support 10GE optical modules. FE/GE electrical interfaces support signals at 10 Mbit/s, 100 Mbit/s, and 1000 Mbit/s. Supports inloops and outloops. GE interfaces support flow control. Supports Layer 2 and Layer 3 working modes. Supports physical-layer clock synchronization (synchronous Ethernet). Supports IEEE 1588v2 and IEEE 1588 ACR.

E1 interface function

Supports a 75-ohm or 120-ohm impedance value (based on the actual E1 cable) Supports the E1 and CE1 modes. Supports inloops and outloops. Supports the PRBS function in framed or unframed mode of an E1 interface in the receive/transmit direction. Supports the ATM, TDM, and PPP protocols. Supports physical-layer clock synchronization.

NOTE l If the SFP interface houses an electrical module, the interface does not support synchronous Ethernet or IEEE 1588v2. l When using an electrical interface at 10 Mbit/s, the interface does not support synchronous Ethernet clock or IEEE 1588v2. l Among the two ATN 910B models, only ATN 910B-A supports 1588 ACR.

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ATN 910&910I&910B&950B Multi-Service Access Equipment Hardware Description

3 ATN 910B Chassis

3.3 Working Principle and Signal Flow The ATN 910B consists of the CXPx, power module, and fan module. Figure 3-3 uses ATN 910B-A as an example to show the working principle and signal flow of ATN 910B. Figure 3-3 Functional block diagram of the ATN 910B Power supply

Clock input/output interface Time input/output interface NM network interface/serial interface Alarm input/output interface

Auxiliary interface module

Time/clock signals

Power module

Clock module

To other function modules Communication control module

2 x 10GE optical signals 8 x FE/GE optical signals 8 x FE/GE electrical signals

16 x E1 signals

To other function modules

Service scheduling and processing module

Fan module

ANG1MO1 pinch board

Transmit Direction After buffering and scheduling the service packets, the service scheduling and processing module performs coding/decoding and serial/parallel conversion. Then the interfaces on the panel send Ethernet electrical/optical signals and E1 signals out.

Receive Direction The service access interfaces on the panel receive Ethernet electrical/optical signals and E1 signals. Then the service scheduling and processing module performs serial/parallel conversion and coding/decoding, and buffers and schedules service packets.

Auxiliary Interface Module The auxiliary interface module provides the following interfaces: Issue 01 (2013-10-31)

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l

External time input/output interface

l

External clock input/output interface

l

NM serial interface/NM interface used to communicate with the NMS and to manage and query network elements

l

Alarm input/output interface

Communication Control Module The communication control module provides the following functions: l

Configures and monitors the entire system.

l

Provides an NM interface or NM serial interface for communication.

Service Scheduling and Processing Module The service scheduling and processing module provides the following functions: l

Processes service signals received on the interface cards.

l

Schedules services in full duplex mode.

Clock Module The clock module provides the following functions: l

Provides a working clock for each module on the board.

l

Supports synchronous Ethernet and the SSM protocol.

l

Supports IEEE 1588v2.

l

Supports the 1588 ACR clock.

Power Module The power module supplies power for other modules.

Fan Module The fan module implements heat dissipation for the system.

3.4 Panel There are indicators, buttons, and interfaces on the ATN 910B panel.

Appearance of the Panel Figure 3-4 uses ATN 910B-A as an example to show the panels of ATN 910Bl.

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Figure 3-4 Appearance of the ATN 910B panel FE/GE: 1|3|5|7 FE/GE: 9|11|13|15 ETH/ OAM CLK

PWR STAT ALM

PWRA PWRB

RST OUT0 OUT1 FE/GE: 0|2|4|6 IN0 IN1 ALMI/ TOD LINK/ ALMO ACT

FE/GE: 8|10|12|14

E1(8-15)

E1(0-7)

Indicator The ATN 910B provides the following indicators: System indicator l

PWRA/PWRB indicator, green, which indicates the power status

l

STAT indicator, red, green, or orange, which indicates the working status

l

ALM, red or orange, which indicates the alarm status.

Interface indicator l

LINK/ACT, green or orange, which indicates the connection status/data transceiving status on the SFP interface and XFP interface.

l

LINK indicator, green, which indicates the connection status of a service port

l

ACT indicator, orange, which indicates the receive/transmit status of a service port

Button There is only one RST button on the ATN 910B for resetting the device. The RST button can also be used to clear the passwords and configuration files on the ATN 910B. Once you press the RST button, the device begins to reset. Then you press and hold down the RST button for about 10s until the PWR, STA, and ALM indicators blink green. The device begins to automatically clear the passwords and configuration files. If you hold down the RST button 15s or more than 15s, the device only resets and does not clear the passwords and configuration files.

Interface Table 3-3 describes the interfaces on the ATN 910B and their functions.

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Table 3-3 Interfaces on the ATN 910B Interface Name

Interface Type

Function

Description about the Corresponding Cable

ETH/OAM

RJ-45

10M/100M interface that can function as an NM interface or console interface

For details, see 10.2 Management Cables.

CLK

RJ-45

Clock input/output interface

For details, see 10.4 Clock Cables.

TOD

RJ-45

Time input/output interface

For details, see 10.4 Clock Cables.

ALMI/ ALMO

RJ-45

Alarm input/output interface

-

OUT0 IN0 — OUT1 IN1

XFP

10GE service signal input/ output interface

For details, see 10.6 Optical Fibers.

FE/GE0 — FE/GE7 (ATN 910B-A)

SFP

FE/GE service signal input/ output interface

For details, see 10.6 Optical Fibers or 10.5.1 Ethernet Cables.

FE/GE0 — FE/GE15 (ATN 910B-B)

SFP

FE/GE service signal input/ output interface

For details, see 10.6 Optical Fibers or 10.5.1 Ethernet Cables.

FE/GE8 — FE/GE15 (ATN 910B-A)

RJ-45

FE/GE service signal input/ output interface

For details, see 10.5.1 Ethernet Cables.

FE/GE16 — FE/ GE23 (ATN 910B-B)

RJ-45

FE/GE service signal input/ output interface

For details, see 10.5.1 Ethernet Cables.

E1 (0–15) (ATN 910B-A)

DB44

E1 service signal input/output interface

For details, see 10.5.2 75Ohm 8 x E1 Cables and 10.5.3 120-Ohm 8 x E1 Cables.

NOTE The SFP interface can connect to cables only after an optical module or an electrical module is installed. The XFP interface can connect to cables only after an optical module is installed. 10GE interfaces on the ATN 910B are under license control (LANG2XGE01). If the license is not loaded, 10GE interfaces are unavailable. GE interfaces are also under license control (LANGGEPAYG01 and LANG4GEPAYG01). If the license is not loaded, only a maximum of eight interfaces can be used.

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Pin Assignments Table 3-4 Pins for the ETH/OAM interface Front View

87654321

Pin

Function

1

Transmit positive pole of the NM interface

2

Transmit negative pole of the NM interface

3

Receive positive pole of the NM interface

4

Ground end of the console interface

5

Receive end of the console interface

6

Receive negative pole of the NM interface

7

Unspecified

8

Receive end of the console interface

Table 3-5 Pins for the CLK interface Front View

Pin

Working Mode

1

Receive negative pole of the CLK interface

2

Receive positive pole of the CLK interface

3

Unspecified

4

Transmit negative pole of the CLK interface

5

Transmit positive pole of the CLK interface

6

Unspecified

7

Unspecified

8

Unspecified

87654321

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Table 3-6 Pins for the TOD interface Front View

Pin

87654321

Working Mode External Time Input

External Time Output

(1 PPS+Time Information)

(1 PPS+Time Information)

1

Unspecified

Unspecified

2

Unspecified

Unspecified

3

Input negative pole of 1 PPS signals

Output negative pole of 1 PPS signals

(RS422 level)

(RS422 level)

4

Ground end

Ground end

5

Ground end

Ground end

6

Input positive pole of 1 PPS signals

Output positive pole of 1 PPS signals

(RS422 level)

(RS422 level)

Input negative pole of time information

Output negative pole of time information

(RS422 level)

(RS422 level)

Input positive pole of time information

Output positive pole of time information

(RS422 level)

(RS422 level)

7

8

NOTE The TOD interface can work only in one mode.

Table 3-7 Pins for the ALMI/ALMO interface Front View

87654321

Issue 01 (2013-10-31)

Pin

Function

1

Boolean input

2

Ground end

3

Boolean input

4

Boolean input

5

Ground end

6

Ground end

7

Boolean output positive pole

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Front View

Pin

Function

8

Boolean output negative pole

Table 3-8 Pins for the GE electrical interface Front View

87654321

Pin

Usage

1

Positive of twisted pair cable 1

2

Negative of twisted pair cable 1

3

Positive of twisted pair cable 2

4

Positive of twisted pair cable 3

5

Negative of twisted pair cable 3

6

Negative of twisted pair cable 2

7

Positive of twisted pair cable 4

8

Negative of twisted pair cable 4

Table 3-9 Pins of the DB44 interface Front View 1

44

Pin

Usage

Pin

Usage

38

R0

15

T0

23 37

30 R1

22 36

R2

R3

R4

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12

T3

11

T4

26 R5

18 32

T2

27

19 33

13 28

20 34

T1

29

21 35

14

10

T5

25 R6

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9

T6

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ATN 910&910I&910B&950B Multi-Service Access Equipment Hardware Description

Front View

Pin

3 ATN 910B Chassis

Usage

17 31

Pin

Usage

24 R7

8

16

T7

7

3.5 Installation Information ATN 910B provides multiple installation positions for mounting ears and supports various mounting ears, so ATN 910B can be installed in multiple types of cabinets. As shown in Table 3-10, ATN 910B supports various mounting ears and can be installed in multiple types of cabinets. Table 3-10 Requirements on the cabinet and mounting ears Mounting Ear

Applicable Cabinet Standard

Applicable Huawei Cabinet

Remarks

IEC60297

N66E

The mounting ears are delivered with the device.

N68E N610E 19-inch open rack IMB network cabinet APM30H outdoor cabinet ETSI300-119

N63E N66T

IEC60297 (23inch)

Issue 01 (2013-10-31)

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The mounting ears are rack-mounting ears that are installed on the mounting ears delivered with the device. The mounting ears are for a 23-inch cabinet and are used to substitute for the mounting ears delivered with the device when the device needs to be installed in a 23inch cabinet. 36

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3 ATN 910B Chassis

3.6 Heat Dissipation ATN 910B dissipates heat by drawing in air from the left and expelling out the air from the right. Figure 3-5 shows the system air duct. Figure 3-5 ATN 910B air duct

≥50 mm

≥50 mm

l

Heat dissipation holes of air intake and exhaust vents on ATN 910B must be kept clean and unblocked.

l

A clearance of at least 50 mm must be reserved at the air intake/exhaust vent on ATN 910B to ensure good ventilation.

l

The ambient temperature of ATN 910B must be within the range of -40 °C to +65 °C. When ATN 910B is installed in a cabinet, temperature inside the cabinet must be within the permitted temperature range and the air duct of the cabinet must be consistent with that of ATN 910B.

3.7 Safety Labels The equipment has various safety labels. This section describes the suggestions and locations of these safety labels.

Label Position Figure 3-6 shows positions of labels on the chassis. Figure 3-6 Label position O ptiX P TN 910-F 电源额定值 POWER RATING: ~100-240V;50/60Hz;0.8A MAX

N1 4036

合格证/QUALIFICATION CARD 1类激光产品 Class 1 Laser Product

HUAWEI

Issue 01 (2013-10-31)

华为技术有限公司

中国制作

HUAW EI TEC HNOLOGIES CO.,L TD.

M ADE IN C HIN A

华为技 术有 限公 司

HUAW EI TECHNO LGIES CO .,LT D.

中 国制 造 MADE IN CHINA

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ATN 910&910I&910B&950B Multi-Service Access Equipment Hardware Description

3 ATN 910B Chassis

Label Description There are labels on the chassis. See Table 3-11. Table 3-11 Label description Figure

合格证/QUALIFICATION CARD

Type

Description

Backplane bar code label

The bar code of the backplane will be retrieved by ATN device as the equipment serial number (ESN).

Chassis grounding label

The label indicates the position of the general grounding terminal. When the equipment is installed in a cabinet rather than a 19-inch cabinet, it is recommended that you use the grounding terminal specified in this label.

Chassis grounding label

The label indicates the position of the grounding terminal. When the equipment is installed in a 19-inch cabinet, it is recommended that you use the grounding terminal specified in this label.

Operation warning label

The label indicates the precautions that should be taken for operations.

Qualification label

The equipment is qualified.

Product nameplate label

The label suggests the product name and certification.

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ATN 910&910I&910B&950B Multi-Service Access Equipment Hardware Description

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4

ATN 950B Chassis

About This Chapter The ATN 950B uses the chassis of 2 U high (1 U = 44.45 mm) and supports multiple installation modes, which facilitates flexible deployment. The ATN 950B can be flexibly deployed with high reliability and scalability. It has the following features: l

Two power boards are supported for redundancy protection.

l

Two control boards are supported for redundancy protection.

l

The fan board provides six fans, ensuring proper heat dissipation even when a fan is faulty.

l

Six slots can be flexibly configured with service boards.

4.1 Appearance The ATN 950B provides 11 slots and all boards are swappable. A chassis has a mounting ear at each side and can be installed in different cabinets and racks. 4.2 Slot Distribution This section describes slot distribution on the ATN 950B. 4.3 Installation Information ATN 950B provides multiple installation positions for mounting ears and supports various mounting ears, so ATN 950B can be installed in multiple types of cabinets. 4.4 Heat Dissipation ATN 950B dissipates heat by drawing in air from the left and expelling out the air from the right. 4.5 Safety Labels The equipment has various safety labels. This section describes the suggestions and locations of these safety labels.

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4.1 Appearance The ATN 950B provides 11 slots and all boards are swappable. A chassis has a mounting ear at each side and can be installed in different cabinets and racks. Figure 4-1 shows the appearance of the ATN 950B that has boards fully configured. Figure 4-1 Appearance of the ATN 950B that has boards fully configured

Figure 4-2 shows the appearance of the ATN 950B that does not have boards fully configured. Figure 4-2 Appearance of the ATN 950B that does not have boards fully configured

4.2 Slot Distribution This section describes slot distribution on the ATN 950B. Figure 4-3 shows the slot distribution of the ATN 950B equipped with the AND1CXPA or AND1CXPB board.

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ATN 910&910I&910B&950B Multi-Service Access Equipment Hardware Description

4 ATN 950B Chassis

Figure 4-3 Slot distribution of the ATN 950B equipped with AND1CXPA or AND1CXPB SLOT 10

SLOT 11

SLOT 9

SLOT 7

SLOT 8

SLOT 5 (10GE/GE)

SLOT 6 (10GE/GE)

SLOT 3 (10GE/4 x GE)

SLOT 4 (10GE/4 x GE)

SLOT 1 (8 x GE)

SLOT 2 (8 x GE)

NOTE

When ATN 950B is equipped with the AND1CXPA board, each of slots 3 and 4 has a bandwidth of 4 x GE and does not support 10GE interface boards.

Figure 4-4 shows the slot distribution of the ATN 950B equipped with the AND2CXPA, AND2CXPB, or AND2CXPE board. Figure 4-4 Slot distribution of the ATN 950B equipped with AND2CXPA/AND2CXPB/ AND2CXPE SLOT 10

SLOT 11

SLOT 9

SLOT 7

SLOT 8

SLOT 5 (10GE/4 x GE)

SLOT 6 (10GE/4 x GE)

SLOT 3 (10GE/4 x GE)

SLOT 4 (10GE/4 x GE)

SLOT 1 (10GE/8 x GE)

SLOT 2 (10GE/8 x GE)

Table 4-1 describes priorities of slots where boards supported by the ATN 950B can be inserted. Table 4-1 Priorities of available slots Name

Valid Slot

Priorities of Slots (in Descending Order)

AND1CXPA/ AND1CXPB

Slot 7, slot 8

slot 7 - slot 8

AND1EM8T/ AND1EM8F

slot 1 or slot 2

slot 1 - slot 2

AND1EM4T/ AND1EM4F/ AND1EM4C

slot 1-4 (working with the AND1CXPA/ AND1CXPB)

slot 3- slot 4 - slot 1 - slot 2

AND2CXPA/ AND2CXPB/ AND2CXPE

slot 1-6 (working with the AND2CXPA/ AND2CXPB/ AND2CXPE) Issue 01 (2013-10-31)

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Name

Valid Slot

Priorities of Slots (in Descending Order)

AND2CQ1B

slot 1 to slot 6

slot 3- slot 4 - slot 1 - slot 2 - slot 5 - slot 6

slot 5-6 (working with the AND1CXPA)

slot 5 - slot 6 - slot 3 - slot 4

AND2PQ1 AND1EX1

slot 3-6 (working with the AND1CXPB) slot 1-6 (working with the AND2CXPA/ AND2CXPB/ AND2CXPE) AND1ML1/ AND1ML1A

slot 1 to slot 6

slot 4 - slot 6 - slot 3 - slot 5 - slot 2 - slot 1

TND1PIU

Slot 9, slot 10

-

AND1FAN

slot 11

-

AND3ML1A/ AND3ML1B AND2MD1A/ AND2MD1B

4.3 Installation Information ATN 950B provides multiple installation positions for mounting ears and supports various mounting ears, so ATN 950B can be installed in multiple types of cabinets. As shown in Table 4-2, ATN 950B supports various mounting ears and can be installed in multiple types of cabinets. Table 4-2 Requirements on the cabinet and mounting ears Mounting Ear

Applicable Cabinet Standard

Applicable Huawei Cabinet

Remarks

IEC60297

N66E

The mounting ears are delivered with the device.

N68E N610E 19-inch open rack IMB network cabinet APM30H outdoor cabinet Issue 01 (2013-10-31)

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ATN 910&910I&910B&950B Multi-Service Access Equipment Hardware Description

Mounting Ear

4 ATN 950B Chassis

Applicable Cabinet Standard

Applicable Huawei Cabinet

Remarks

ETSI300-119

N63E

The mounting ears are rack-mounting ears that are installed on the mounting ears delivered with the device.

N66T

IEC60297 (23inch)

-

The mounting ears are for a 23-inch cabinet and are used to substitute for the mounting ears delivered with the device when the device needs to be installed in a 23inch cabinet.

ATN 950B provides three installation positions for mounting ears. Users can determine an installation position for mounting ears based on the depth of the cabinet. Figure 4-5 shows the installation positions of mounting ears. Position 1 shows a pair of mounting ears delivered with ATN 950B. Figure 4-5 Installation positions of mounting ears

Already installed mounting ears

Position 3 for installing the mounting ears

Position 1 for installing the mounting ears Position 2 for installing the mounting ears

Determine an installation position for mounting ears based on the cabinet depth. The following figures show the installation dimensions when mounting ears are installed in different positions. Issue 01 (2013-10-31)

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Figure 4-6 Determine an installation position for mounting ears (IEC)

Unit: mm 220

76.2

465.1 224

208

132.5

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Figure 4-7 Determine an installation position for mounting ears (ETSI)

Unit: mm

220

50

515 241.5

225.5

150

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Figure 4-8 Determine an installation position for mounting ears (23-inch)

Unit: mm

220 76.2

566.7

218

202

126.5

NOTE

When installing the ATN 950B in the cabinet, reserve 80 mm space at the front of the panel for cabling.

4.4 Heat Dissipation ATN 950B dissipates heat by drawing in air from the left and expelling out the air from the right. Issue 01 (2013-10-31)

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Figure 4-9 shows the system air duct. Figure 4-9 ATN 950B Air duct

l

Heat dissipation holes of air intake and exhaust vents on ATN 950B must be kept clean and unblocked.

l

A distance of at least 50 mm must be reserved at the air intake/exhaust vent on ATN 950B to ensure good ventilation.

l

Filler panels must be installed on unused slots. In addition, on ATN 950B, heat must be dissipated by drawing in air from the left and expelling out the air from the right.

l

The ambient temperature of ATN 950B must be within the range of -20°C to +60°C. When ATN 950B is installed in a cabinet, temperature inside the cabinet must be within the temperature range and the air duct of the cabinet must be consistent with that of ATN 950B.

4.5 Safety Labels The equipment has various safety labels. This section describes the suggestions and locations of these safety labels.

Label Position Figure 4-10 shows positions of labels on the chassis. Figure 4-10 Label position ATN 950 电源额定值 POWER RATING:

N14036

-48--60V;8A

1类激光产品 Class 1 Laser Product

合格证/QUALIFICATION CARD この装置は、クラスA情報技術装置です。この装置を家庭環境で 使用すゐと電波妨害を引き起こすことがぁります。この場合には使用 者が適切な対策を講ずゐよぅ要求されゐことがぁります。 VCCI -A

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Label Description There are labels on the chassis and boards. See Table 4-3. Table 4-3 Label description Figure

Type

Description

Backplane bar code label

The bar code of the backplane will be retrieved by ATN 950B as the equipment serial number (ESN).

ESD protection label

The label suggests the electrostaticsensitive equipment.

Chassis grounding label

The label indicates the position of the grounding terminal. When the equipment is installed in a 19-inch cabinet, it is recommended that you use the grounding terminal specified in this label.

Chassis grounding label

The label indicates the position of the general grounding terminal. When the equipment is installed in a cabinet rather than a 19-inch cabinet, it is recommended that you use the grounding terminal specified in this label.

Fan warning label

The label suggests that do not touch the fan leaves when the fan is rotating.

Operation warning label

The label indicates the precautions that should be taken for operations on the PIU board. For details, see Label.

Qualification label

The equipment is qualified.

Product nameplate label

The label suggests the product name and certification.

! 合格证/QUALIFICATION CARD

HUAWEI 华为技术有限公司

中国制造

HUAWEI TECHNOLOGIES CO.,LTD.

MADE IN CHINA

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5

ATN 910 Boards

About This Chapter Boards on ATN 910 are used together to provide various functions. 5.1 Board Overview A board mainly consists of the printed circuit board (PCB) and the front panel. 5.2 Board Type and Application This section describes the applications and differences between different types of PIC boards. 5.3 ANC2CXPI/ANC2CXPL - System Control, Cross-connect, and Multi-protocol Process Unit The ANC2CXPI/ANC2CXPL (CXPI/CXPL for short) is a control, cross-connect, and protocol processing board. The function version of the ANC2CXPI/ANC2CXPL is ANC1. The ANC2CXPI/ANC2CXPL is housed in slots 1 and 2. 5.4 AND1EG4T - 4 Channels FE/GE Adaptive Electronic Interface Board The AND1EG4T board (EG4T for short) is a 4 channels FE/GE adaptive electrical interface board whose functional version is AND1. The AND1EG4T board can be housed in any of slots 3 and 4 in the chassis. 5.5 AND1EF8T - 8 Channels Fast Ethernet Electric Interface Board The AND1EF8T (EF8T for short) is an 8 channels Fast Ethernet electric interface board. The function version of the EF8T is AND1. The EF8T is housed in slot 3 or slot 4. 5.6 AND1EG2 - 2 Channels GE Optical Interface Board The AND1EG2 (EG2 for short) is a two channels GE optical interface board. The function version of the EG2 is AND1. The AND1EG2 is housed in slot 3 or slot 4. 5.7 AND1EG4F - 4 Channels FE/GE Adaptive Optical Interface Board The AND1EG4F (EG4F for short) is a four channels FE/GE adaptive optical interface board . The function version of the EG4F is AND1. The AND1EG4F is housed in slot 3 or slot 4. 5.8 AND1EF8F - 8 Channels Fast Ethernet Optical Interface Board The AND1EF8F (EF8F for short) is an 8 channels Fast Ethernet optical interface board. The function version of the EF8F is AND1. The AND1EF8F is housed in slot 3 or slot 4. 5.9 AND1ML1/AND1ML1A - 16 Channels E1 Electrical Interface Board The functional version of the AND1ML1/AND1ML1A is AND1.. Issue 01 (2013-10-31)

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5.10 AND2ML1A/AND2ML1B - 16 Channels E1 Interface Board The AND2ML1A/AND2ML1B (ML1A/ML1B for short) is a 16 channels E1 interface board. The function version of the ML1A/ML1B is AND2. The AND2ML1A/AND2ML1B is housed in slot 3 or slot 4. 5.11 AND1MD1A/AND1MD1B - 32 Channels E1 Interface Board The AND1MD1A/AND1MD1B (MD1A/MD1B for short) is a 32 channels E1 interface board. The function version of the MD1A/MD1B is AND1. The AND1MD1A/AND1MD1B is housed in slot 3 or slot 4. 5.12 AND1MO1C - 8 Channels T1 Interface Board The AND1MO1C (MO1C for short) is an 8-channel electrical interface board, whose functional version is AND1. The AND1MO1C can be housed in slot3, slot4. 5.13 AND1AVD8A - 8 Channels ADSL2+ Service Interface Board The AND1AVD8A (AVD8A for short) is an 8-channel ADSL2+ service interface board, whose functional version is AND1. The AND1AVD8A can be housed in slot3, slot4. 5.14 AND1AVD8B - 8 Channels VDSL2 Service Interface Board The AND1AVD8B (AVD8B for short) is an 8-channel VDSL2 service interface board, whose functional version is AND1. The AND1AVD8B can be housed in slot 3 or 4. 5.15 AND1SHD4 - 4 Channels G.SHDSL Service Interface Board The AND1SHD4 (SHD4 for short) is a 4-channel G.SHDSL service interface board, whose functional version is AND1. The AND1SHD4 can be housed in slot3, slot4. 5.16 AND1SHD4I - 4 Channels G.SHDSL Interface Board for IMA Mode The AND1SHD4I (SHD4I for short) is a 4-channel G.SHDSL service interface board, whose functional version is AND1. The AND1SHD4I can be housed in slot3, slot4. 5.17 TNC1PIU - Power Interface Board The TNC1PIU (PIU for short) is a power interface board. The function version of the PIU is TNC1. The PIU is housed in slot 5. 5.18 ANC1FAN - Fan Board The ANC1FAN (FAN for short) is an FAN board. The function version of the FAN is ANC1. The FAN is housed in slot 6. 5.19 Filler Panel A filler panel is used to cover any vacant slot in a chassis.

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5.1 Board Overview A board mainly consists of the printed circuit board (PCB) and the front panel.

Board Structure Figure 5-1 shows the structure of a board (using the AND1EG4F board as an example). Figure 5-1 Board structure

A board mainly consists of the following parts: l

PCB The PCB houses various functional chips of the board and is the most important part of the board. Through the front panel, the PCB provides indicators, buttons, and ports. NOTE

Different boards provide different indicators, buttons, and ports; not all boards support a daughter board. For details, see the description of each board.

l

Front panel, including the captive screws, ejector levers, indicators, buttons, and interfaces. – Captive screws: secure the board in the subrack. – Ejector levers: used for inserting or removing the board. Bar codes are also attached on the ejector levers. NOTE

The ejector lever on the left side of the front panel of a board is attached with a label marking the bar code of the board. The bar code of a control board will be retrieved by ATN 910 as the equipment serial number (ESN). The ESN is used for applying for a license. ATN 910 automatically reads the bar code of the backplane or control board as the device ESN. Generally, the bar code of the backplane takes precedence over that of the control board.

Board Naming NOTE

The preceding only describes how to roughly identify a board. For details on board specifications, see board descriptions.

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A board name mainly consists of the board functional version and short name. A short name can roughly identify a board. The short name of a control board, power board, and fan board is CXPx, PIU, and FAN respectively. The following mainly describes how to quickly identify a physical interface board through the short name of a board. As shown in Figure 5-2, the short name of a board consists of an abbreviated board name and an extended name. An abbreviated board name includes the board type, interface quantity, and interface rate. When boards have the same abbreviated board name, they can be differentiated using extended names. An extended name does not have special meanings and can be omitted. Figure 5-2 Board short name (using ML1A as an example)

ML1A Extended name Interface rate Interface quantity Board type

The following describes each part of an abbreviated board name: l

Board type M indicates an E-carrier or T-carrier interface board. The interface quantity is represented using O, L or D, indicating 8, 16 or 32 respectively. The interface rate is represented using 1, indicating E1 or T1.

l

Board type AVD indicates an ADSL2+, VDSL2, or ADSL2+/VDSL2 interface board. The interface quality is represented using an Arabic numeral, but the interface rate is not represented.

l

Board type SHD indicates a G.SHDSL interface board. The interface quality is represented using an Arabic numeral, but the interface rate is not represented.

l

Board type E indicates an Ethernet interface board. The interface quality is represented using an Arabic numeral. The interface rate is represented using F or G, indicating FE or GE respectively. Extended name F or T is used to indicate an optical interface or electrical interface respectively. NOTE

For the name of an Ethernet interface board, the interface rate and quantity rate are in an order opposite to those for the names of other boards. For example, in EG4F (a name of an Ethernet interface board), interface rate G comes before interface quantity 4.

Board Relationship A control board mainly implements system control and service grooming, and receives and processes various services by working with physical interface boards. A power board provides power inputs for the system. A fan board blows air to dissipate heat generated during system operation. Figure 5-3 shows the board relationship.

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Figure 5-3 Board relationship

User side

Control and management module

Network side

Clock module FE

FE

GE

GE

FE GE E1 E1 T1

EF8F/EF8T

EF8F/EF8T

EG2/EG4F

EG2/EG4F

ML1/ML1A/ML1B MD1A/MD1B

Service processing and switching module

ML1/ML1A/ML1B MD1A/MD1B MO1C

MO1C

AVD8A AVD8B SHD4/SHD4I

FE GE E1 E1 T1 ADSL2+ VDSL2 G.SHDSL

Control board CXPI/CXPL

Power interface board PIU

Fan board FAN

5.2 Board Type and Application This section describes the applications and differences between different types of PIC boards.

5.2.1 Board Type Boards are the key hardware components of the equipment. Boards on the ATN 910 are classified into the following types: control board (CXP), physical interface card (PIC), power interface board (PIU), and fan board (FAN).

Control Board (CXP) The control board controls the system, grooms services, processes the clock, and provides auxiliary interfaces. NOTE

The control board of the ATN 910 also provides the Ethernet service interface. For details about applications of the service interface boards, see the Ethernet service interface board.

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Table 5-1 Control boards supported by the ATN 910 Board Name

Board Description

Supported Version

ANC2CXPI

System control, switching and timing board, with 4 x FE service electrical interfaces, with 4 x FE service optical interfaces, and 2 x GE service optical interfaces

V200R002C00

ANC2CXPL

System control, switching and timing board, with 4 x FE/GE service electrical interfaces, with 4 x FE/ GE service optical interfaces, and 2 x GE service optical interfaces

V200R002C00

Physical Interface Card (PIC) The physical interface boards process the services with the control board. The physical interface boards are classified into the following types based on the service access mode: Ethernet service interface boards, E1/T1 service interface boards, and xDSL service interface boards. Table 5-2 Ethernet service interface boards supported by the ATN 910 Board Name

Board Description

Supported Version

AND1EF8T

8 x FE service interface board (electric interface)

V200R001C00

AND1EF8F

8 x FE service interface board (optical interface)

V200R001C00

AND1EG2

2 x GE service optical interface board

V200R001C00

AND1EG4F

4 x FE/GE adaptive optical interface board

V200R001C00

AND1EG4T

4 x FE/GE adaptive electric interface board

V200R001C01

Table 5-3 E1/T1 service interface boards supported by the ATN 910

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Board Name

Board Description

Supported Version

AND1ML1

16 x E1 service interface board (75 ohm)

V200R001C01

AND1ML1A

16 x E1 service interface board (120 ohm)

V200R001C01

AND2ML1A

16 x E1 service interface board (75 ohm)

V200R001C00

AND2ML1B

16 x E1 service interface board (120 ohm)

V200R001C00

AND1MD1A

32 x E1 service interface board (75 ohm)

V200R001C00

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Board Name

Board Description

Supported Version

AND1MD1B

32 x E1 service interface board (120 ohm)

V200R001C00

AND1MO1C

8 x T1 service interface board (100 ohm)

V200R001C01

Table 5-4 xDSL service interface boards supported by the ATN 910 Board Name

Board Description

Supported Version

AND1AVD8A

8 x ADSL2+ interface board

V200R001C01

AND1AVD8B

8 x VDSL2 interface board

V200R003C00

AND1SHD4

4 x G.SHDSL interface board

V200R001C01

(supporting the ATM mode and EFM mode) AND1SHD4I

4 x G.SHDSL interface board

V200R001C01

(supporting the IMA mode)

Power Board Power boards lead in power for supplying power to the device. For details about power distribution, see Power Distribution. Table 5-5 Power boards supported by the ATN 910 Board Name

Board Description

Supported Version

TNC1PIU

Power interface board

V200R001C00

Fan Board (FAN) The fan board exhausts hot air for heat dissipation. For details about air duct, see Heat Dissipation. Table 5-6 Fan board supported by the ATN 910

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Board Name

Board Description

Supported Version

ANC1FAN

Fan board

V200R001C00

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5.2.2 Ethernet Service Interface Board The ATN 910 supports multiple types of Ethernet interface boards to address requirements for various interface quantities, interface rates, and interface types (optical/electrical). Ethernet service interface boards are widely used in various network environments. They can accept base station services on the user side, and transmit services upstream on the network side. The Ethernet service interface board supports Layer 2 services, Layer 3 services, and hybrid transmission of Layer 2 and Layer 3 services. (When the main interface is in Layer 2 mode, configure the sub-interface to transmit Layer 2/Layer 3 services.) Table 5-7 shows the Ethernet service interface boards supported by the ATN 910 and the differences between the boards. Table 5-7 Ethernet service interface boards Board

Interface Description

AND1EG4T

4 x FE/GE electrical interface

AND1EF4T

4 x FE electrical interface

AND1EG2

2 x GE SFP interface

AND1EG4F

4 x FE/GE SFP interface

AND1EF8F

8 x FE SFP interface

ANC2CXPI

4 x FE electrical interface 4 x FE SFP interface 2 x GE SFP interface

ANC2CXPL

4 x FE/GE electrical interface 4 x FE/GE SFP interface 2 x GE SFP interface

NOTE l Electrical interfaces: l FE electrical interfaces support signals at 10 Mbit/s and 100 Mbit/s. l FE/GE electrical interfaces support signals at 10 Mbit/s and 100 Mbit/s and 1000 Mbit/s. l SFP interfaces: l FE SFP interfaces support FE optical modules and FE electrical modules. l GE SFP interfaces support GE optical modules and GE electrical modules. l FE/GE SFP interfaces support GE optical modules and GE electrical modules, FE optical modules and FE electrical modules.

5.2.3 E1 Service Interface Board The E1 service interface board supports ATM, PPP, and TDM link-layer protocols. Issue 01 (2013-10-31)

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ATM Figure 5-4 shows the application of the E1 service interface board using the ATM protocol. Figure 5-4 Application of the E1 service interface board using the ATM protocol

An ATN device uses the E1 service interface board on the user side to support ATM over E1. When the ATM service access rate is between E1 and E3, multiple E1 links are bound into an IMA group to increase service bandwidth. On the network side, the E1 service interface board implements ATM service emulation and transparently transmits the ATM services over the packet switched network (PSN), such as MPLS or Ethernet. For detailed information, see the chapter "ATM IMA application" in the Feature Description.

PPP Figure 5-5 and Figure 5-6 show the applications of the E1/T1 service interface board using the PPP protocol. Figure 5-5 Application of the E1/T1 service interface board using the PPP protocol (user side)

Figure 5-6 Application of the E1 service interface board using the PPP protocol (network side)

The ATN device uses the E1/T1 service interface board to support IP/MPLS services carried over ML-PPPs on both user side and network side. For example, in the Offload scenario, services (such as voice service) that require high reliability can be carried over an SDH network through E1 private lines using ML-PPP. Issue 01 (2013-10-31)

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NOTE

An independent PPP link cannot carry service. PPP links must be added to an ML-PPP group to carry services.

TDM Figure 5-7 shows the application of the E1/T1 service interface board using the TDM protocol. Figure 5-7 Application of the E1 service interface board using the TDM protocol

The ATN device uses the E1 service interface board to access the TDM service, encapsulate the service signals into packets, and transparently transmit the packets through PWs over the PSN network. This achieves CES service emulation. For detailed information, see the chapter "CES application" in the Feature Description.

Comparison Between E1 Service Interface Boards Table 5-8 shows the E1/T1 service interface boards supported by the ATN device and the differences between the boards. Table 5-8 E1/T1 service interface boards Function

AND1ML1

AND2ML1A

AND1MD1A

AND1ML1A

AND2ML1B

AND1MD1B

Interface type

E1

E1

E1

T1

Number of interfaces

16

16

32

8

Interface impedance

AND1ML1: 75 ohm

AND2ML1A: 75 ohm

AND1MD1A: 75 ohm

100 ohm

AND1ML1A: 120 ohm

AND2ML1B: 120 ohm

AND1MD1B: 120 ohm

Interface clock mode

Master clock mode

Master/slave clock mode

Master/slave clock mode

Master/slave clock mode

Link-layer protocols

ATM, PPP, TDM

ATM, PPP, TDM

ATM, PPP, TDM

PPP, TDM

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Function

Minimum number of timeslots in CE1 mode

5 ATN 910 Boards

AND1ML1

AND2ML1A

AND1MD1A

AND1ML1A

AND2ML1B

AND1MD1B

2

1

1

AND1MO1C

-

5.2.4 xDSL Service Interface Board The xDSL service interface board has similar functions to the xDSL modem, which enables higher reliability and easy management. The xDSL service interface board on an ATN device can be configured on the network side to transmit services upstream through xDSL signals. When no optical fiber is available, an ATN device can use the xDSL interface board to transmit base station services upstream through the existing copper lines. Figure 5-8 shows the position of the xDSL service interface board on a network. Figure 5-8 Network application of xDSL services

ATN boards support the following xDSL technologies: l

ADSL2+: has a long delay and asymmetric upstream and downstream bandwidth. The downstream bandwidth is higher than the upstream bandwidth. Therefore, the ADSL2+ is suitable to carry data services, especially HSDPA services.

l

VDSL2 is compatible with ADSL2+. VDSL2 has symmetrical upstream and downstream bandwidths, and 100 Mbit/s transmission in a short distance within 300 m. It is suitable to carry voice services, data services, and video services.

l

G.SHDSL: has a stable delay and symmetric upstream and downstream bandwidth. Compared with the ADSL2+, the G.SHDSL is suitable to carry high-priority services, such as voice services.

The combination of ADSL2+ line and G.SHDSL line meets requirements on data and voice services access. In addition, the Offload is also an important scenario in the mobile communication network. In other words, the received base station services are classified and transmitted by ATN devices. Traditional voice services (2G, 3G R99 CS) are transmitted using the E1 private line to ensure high QoS, low delay, and high reliability. High-bandwidth packet services, such as HSDPA services with low requirements on delay, are backhauled using the xDSL technology. For detailed information, see the chapter "xDSL application" in the Feature Description. Issue 01 (2013-10-31)

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Table 5-9 shows the xDSL service interface boards supported by ATN devices and the differences between the boards. Table 5-9 xDSL service interface boards Item

AND1AVD8A

AND1AVD8A

AND1SHD4

AND1SHD4I

xDSL technology

ADSL2+

VDSL2

G.SHDSL

G.SHDSL

Number of interfaces

8

8

4

4

Number of binding groups

4

4

1

1

Working mode

ATM mode

PTM mode

ATM mode

IMA mode

EFM mode Maximum upstream rate

1.024 Mbit/s

50 Mbit/s

5.7 Mbit/s

2.3 Mbit/s

Maximum downstream rate

24 Mbit/s

100 Mbit/s

5.7 Mbit/s

2.3 Mbit/s

NTR clock

Not supported

Not supported

Supported

Supported

NOTE The AND1SHD4 in ATM mode supports SHDSL.bis. Both the AND1SHD4 and AND1SHD4I support one binding group. The difference is as follows: l When the AND1SHD4 is in ATM mode, interface binding needs to be manually configured. When the AND1SHD4 is in EFM mode, the ATN device automatically adapts to the interface binding configuration on the DSLAM. l The IMA binding group of the AND1SHD4I has a fixed number of member links, that is, 4. No manual configuration is required.

5.3 ANC2CXPI/ANC2CXPL - System Control, Crossconnect, and Multi-protocol Process Unit The ANC2CXPI/ANC2CXPL (CXPI/CXPL for short) is a control, cross-connect, and protocol processing board. The function version of the ANC2CXPI/ANC2CXPL is ANC1. The ANC2CXPI/ANC2CXPL is housed in slots 1 and 2.

5.3.1 Front Panel On the front panel of the ANC2CXPI/ANC2CXPL, there are indicators, buttons, and interfaces.

Appearance of the Front Panel Figure 5-9 and Figure 5-10 show the appearances of the front panels of the ANC2CXPI/ ANC2CXPL. Issue 01 (2013-10-31)

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Figure 5-9 Appearance of the front panel of the ANC2CXPI

Figure 5-10 Appearance of the front panel of the ANC2CXPL

Indicators The following indicators are present on the front panel of the ANC1CXPI: l

STAT indicator, red, green, or orange, which indicates the working status

l

PROG indicator, red or green, which indicates the running status of the program

l

SYNC indicator, red or green, which indicates the clock synchronization status

l

SRV indicator, which is reserved for later use

l

CRIT indicator, red, which indicates critical alarms

l

MAJ indicator, orange, which indicates major alarms

l

MIN indicator, yellow, which indicates minor alarms

l

GE L/A0 to GE L/A1, FE L/A0 to FE L/A3 indicators, orange or green, which indicate the connection status of the port NOTE

l Five pairs of Link and ACT indicators located above ETH/OAM interfaces and four FE service interfaces on the ANC2CXPI, which indicate the connection status of the Ethernet interface. l Five pairs of Link and ACT indicators located above ETH/OAM interfaces and four FE service interfaces on the ANC2CXPL, which indicate the connection status of the Ethernet interface.

For details on indications of indicators, see 12.1 Indicators.

Buttons The following buttons are present on the front panel of the ANC1CXPI: l

RST button, which is used for warm reset of the board. When you press the RST button and then release it, the board is reset (warm).

l

CF RCV button, which is used to restore the configuration data from the CF card. When you hold down the CF RCV button for five seconds, the equipment automatically restores the configuration data from the CF card.

l

LAMP button, which is used to test the indicators. When you press the LAMP button, except the service port indicators on the AND1EF8T, AND1EF8F, AND1AVD8A, AND1SHD4, AND1SHD4I, all the board indicators on the NE are on.

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Interfaces Table 5-10 lists the types and usage of the interfaces on the ANC2CXPI/ANC2CXPL. Table 5-10 Interfaces on the ANC2CXPI/ANC2CXPL Board

Interface Name

Interface Type

Usage

Corresponding Cable

ANC2CXPI

ETH/OAM

RJ-45

10M/100M interface for NM network port or NM serial port

For details, see 10.2 Management Cables.

RJ-45

ANC2CXPL

CLK0/ TOD0 CLK1/ TOD1

External time/clock input/output interface

For details, see 10.4 Clock Cables.

ANC2CXPI

ALMI/O

RJ-45

Alarm input/output interface

-

GE0, GE1

SFP

Input/output interface for GE optical/ electrical signals

For details, see 10.6 Optical Fibers and 10.5.1 Ethernet Cables.

ANC2CXPI

FE0 to FE3

SFP

Input/output interface for FE optical signals

For details, see 10.6 Optical Fibers.

ANC2CXPL

FE/GE0 to FE/GE3

SFP

Input/output interface for FE/GE optical signals

For details, see 10.6 Optical Fibers and 10.5.1 Ethernet Cables.

ANC2CXPI

FE4 to FE7

RJ-45

Input/output interface for FE electrical signals

For details, see 10.5.1 Ethernet Cables.

ANC2CXPL

FE/GE4 to FE/GE7

RJ-45

Input/output interface for FE/GE electrical signals

For details, see 10.5.1 Ethernet Cables.

ANC2CXPL ANC2CXPI

ANC2CXPL ANC2CXPI ANC2CXPL

Table 5-11 Pins of the ETH/OAM interface Front View

87654321

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Pin

Usage

1

Transmit positive of the NM network port

2

Transmit negative of the NM network port

3

Receive positive of the NM network port

4

Grounding end of the NM serial port

5

Receive end of the NM serial port

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Front View

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Pin

Usage

6

Receive negative of the NM network port

7

Unspecified

8

Transmit end of the NM serial port

Table 5-12 Pins of the CLK0/TOD0 and CLK1/TOD1 interfaces Front View

87654321

Pin

Working Mode External Clock

External Time Input

External Time Output

(1PPS + Time Information)

(1PPS + Time Information)

1

Receive negative of the CLK

Unspecified

Unspecified

2

Receive positive of the CLK

Unspecified

Unspecified

3

Unspecified

Input negative for the 1PPS signal

Output negative for the 1PPS signal

(RS422 level)

(RS422 level)

4

Transmit negative of the CLK

Grounding end

Grounding end

5

Transmit positive of the CLK

Grounding end

Grounding end

6

Unspecified

Input positive for the 1PPS signal

Output positive for the 1PPS signal

(RS422 level)

(RS422 level)

Input negative for the time information

Output negative for the time information

(RS422 level)

(RS422 level)

Input positive for the time information

Output positive for the time information

(RS422 level)

(RS422 level)

7

8

Unspecified

Unspecified

NOTE The CLK0/TOD0 and CLK1/TOD1 interfaces can be configured so that they can work in one of the preceding three working modes.

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Table 5-13 Pins of the ALMI/O interface Front View

87654321

Pin

Usage

1

Input for the digital parameter

2

Grounding end

3

Input for the digital parameter

4

Input for the digital parameter

5

Grounding end

6

Grounding end

7

Positive output for the digital parameter

8

Negative output for the digital parameter

Table 5-14 Description of the SFP interface Interface on the Front Panel

Supported Modules

Interface Type

Usage

GE0, GE1

GE optical module

LC

Input/Output interfaces for GE optical signals

GE electrical interface

RJ-45

Input/Output interfaces for GE electrical signals

FE0 to FE3

FE optical module

LC

Input/Output interfaces for FE optical signals

FE/GE0 to FE/ GE3

FE optical module

LC

Input/Output interfaces for FE optical signals

GE optical module

LC

Input/Output interfaces for GE optical signals

GE electrical interface

RJ-45

Input/Output interfaces for GE electrical signals

NOTE The GE SFP interface on the front panel can function as either an optical interface or an electrical interface. When the SFP interface functions as an optical interface, it needs to be used with an optical module; when the SFP interface functions as an electrical interface, it needs to be used with an electrical module.

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Table 5-15 Pins of the FE electrical interface (FE4 to FE7) Front View

87654321

Pin

Usage

1

Positive of twisted pair 1

2

Negative of twisted pair 1

3

Positive of twisted pair 2

4

Unspecified

5

Unspecified

6

Negative of twisted pair 2

7

Unspecified

8

Unspecified

Table 5-16 Pins of the GE electrical interface (FE/GE4 to FE/GE7) Front View

87654321

Pin

Usage

1

Positive of twisted pair 1

2

Negative of twisted pair 1

3

Positive of twisted pair 2

4

Positive of twisted pair 3

5

Negative of twisted pair 3

6

Negative of twisted pair 2

7

Positive of twisted pair 4

8

Negative of twisted pair 4

5.3.2 Functions and Features The ANC2CXPI/ANC2CXPL transmits, accesses and processes FE/GE signals, grooms services, performs the system control, processes the system clock, and provides auxiliary interfaces. Table 5-17 lists the functions and features of the ANC2CXPI/ANC2CXPL.

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Table 5-17 Functions and features of the ANC2CXPI/ANC2CXPL Function and Feature

Description

Basic function

Cross-connect capacity

ANC2CXPI: 6.8 Gbit/s ANC2CXPL: 12 Gbit/s

The ANC2CXPI provides four FE electrical interfaces, four FE SFP interfaces, and two GE SFP interfaces. The ANC2CXPL provides four FE/GE electrical interfaces, four FE/GE SFP interfaces, and two GE SFP interfaces. Supports the hot swappable function. Detects the temperature and voltage of the board. Auxiliary interface function

Provides one NM serial port or NM network port to communicate with the NMS so that the NMS can manage and query the equipment. Provides two interfaces for inputting and outputting the external clock/time to obtain the external clock/time information. Provides one alarm input/output interface. The interface provides three inputs of alarm digital parameters.

Ethernet interface function

FE SFP interfaces support FE optical modules and FE electrical modules. GE SFP interfaces support GE optical modules and GE electrical modules. FE/GE SFP interfaces support FE optical modules, FE electrical modules, GE optical modules, and GE electrical modules. FE electrical interfaces support signals at 10 Mbit/s and 100 Mbit/s. FE/GE electrical interfaces support signals at 10 Mbit/s, 100 Mbit/s, and 1000 Mbit/s. Supports inloops and outloops. GE interfaces support the traffic control function. Supports Layer 2 and Layer 3 working modes. Supports physical-layer clock synchronization (synchronous Ethernet). Supports IEEE 1588v2 and IEEE 1588 ACR.

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Description

NOTE l If the SFP interface houses an electrical module, the interface does not support synchronous Ethernet or IEEE 1588v2. l When using an electrical interface at 10 Mbit/s, the interface does not support synchronous Ethernet clock or IEEE 1588v2.

5.3.3 Working Principle and Signal Flow The ANC2CXPI/ANC2CXPL consists of the auxiliary interface module, control and communication module, service grooming and processing module, clock module, and power supply module. Figure 5-11 shows the block diagram for the working principle (using an ANC2CXPL as an example). Figure 5-11 Block diagram for the working principle of the ANC1CXPL Backplane

Two external time/clock input/output interfaces NMS network port or NMS serial port

Alarm input/output interface

Auxiliary interface module

Alarm

Two external time/clock signals Each module on the board

Clock signal

Clock signal

Clock module

Interface boards

NMS signal

signal

Control and communication module

Management bus

Interface boards

Management bus 2 x GE signals 4 x FE/GE optical signals 4 x FE/GE electrical signals

Service grooming and processing module

Service bus

3.3V Each module on the board

Working power supply

Power supply module

12V -48V/-60V -48V/-60V

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Interface boards

Interface boards FAN System power supply System power supply

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Auxiliary Interface Module This module performs the following functions: l

Provides two interfaces for inputting and outputting the external clock/time.

l

Provides one NM serial port or NM network port for communicating with the NMS, managing the equipment, and querying the equipment.

l

Reserves one alarm input/output interface.

Control and Communication Module This module performs the following functions: l

Configures and monitors the ANC2CXPI/ANC2CXPL and the entire system.

l

Enables the communication through the NM serial port or NM network port.

Service Grooming and Processing Module This module performs the following functions: l

Accesses and processes 2 x GE optical/electrical signals.

l

Accesses and processes 4 x FE electrical signals.

l

Accesses and processes 4 x FE optical signals.

l

Processes the service signals accessed by the interface boards.

l

Grooms services with 6.8 Gbit/s switching capacity in the full-duplex mode.

l

Accesses and processes 4 x FE (ANC2CXPI) optical signals and 4 x FE/GE (ANC2CXPL) optical signals.

l

Accesses and processes 4 x FE (ANC2CXPI) electrical signals and 4 x FE/GE (ANC2CXPL) electrical signals.

l

Processes the service signals accessed by the interface boards.

l

Grooms services with 6.8 Gbit/s (ANC2CXPI) and 12 Gbit/s (ANC2CXPL) switching capacity in the full-duplex mode.

Clock Module This module performs the following functions: l

Provides the system clock signals and processes the clock signals from the service boards and the external clock/time interfaces.

l

Provides the working clock for each module on the CXPI.

l

Supports the synchronous Ethernet and the SSM protocol.

l

Supports the IEEE 1588V2 protocol.

l

Supports the 1588 ACR clock.

Power Supply Module This module performs the following functions: Issue 01 (2013-10-31)

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l

Accesses two -48 V or -60 V DC power supplies.

l

Supplies working power for each module on the CXPI.

l

Supplies 12 V power for the FAN board.

l

Supplies 3.3 V power for the interface board.

5.3.4 CF Card and DIP Switch A board has a set of DIP switches and a hot-swappable CF card.

CF Card and DIP Switch Locations Figure 5-12 shows the locations of the CF card and DIP switches on ANC2CXPI/ANC2CXPL. Figure 5-12 Locations of the CF card and DIP switches on ANC2CXPI/ANC2CXPL. CF Card

DIP Switch

ON DIP

1 2 3 4

CF Card The size of the CF card on ANC2CXPI/ANC2CXPL is 512 MB. The CF card is used to backup data and load packages.

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DIP Switch

NOTICE l This operation should be executed with caution. Use it under the guidance of technical personnel. l After the configuration file is deleted, reset the DIP switches to 0, 0, 0, and 0. In this way, you do not need to delete the configuration file at each startup. l The numeral indicates 1, and the letter indicates 0. l The device password is deleted when the configuration file is deleted. You can use the DIP switches to delete the configuration file loaded on the device. Set DIP switches on ANC2CXPI/ANC2CXPL to 1, 1, 0, and 1. During startup, the device deletes the loaded configuration file based on the DIF switch status.After the password is deleted, you are required to enter a new password when a PC is connected to the device through the console interface. NOTE

If no PC is connected to the device through the console interface, you can check whether the password is deleted based on the indicator status. The password is deleted at the stage when the BIOS is guiding the upper-layer software during the device startup. At this stage, the green PROG indicator is on for 300 ms and off for 300 ms. To reset the DIP switches to 0, 0, 0, and 0, you are advised to remove the board after the STAT and PROG indicators become green.

5.3.5 Technical Specifications The technical specifications of the ANC2CXPI/ANC2CXPL cover the interface specifications, board dimensions, weight, and power consumption.

Interface Specifications l

For the specifications of the FE electrical interface, see Table 5-18.

l

For the specifications of the FE/GE electrical interface, see Table 5-19.

l

For the specification of the swappable FE optical/electrical modules supported at an FE (SFP) interface, see Table 5-20 and Table 5-22.

l

For the specifications of the swappable GE optical/electrical modules supported at a GE (SFP) interface, see Table 5-21 and Table 5-23.

l

For the specifications of the swappable FE/GE optical/electrical modules supported at an FE/GE (SFP) interface, see Table 5-20, Table 5-21, Table 5-22, and Table 5-23. NOTE

The specifications of an SFP interface on a board depend on the optical/electrical module on the board. For the specifications of the optical/module modules on a board, see 9 Swappable Optical/Electrical Modules.

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Table 5-18 Specifications of the FE electrical interface Item

Specification Requirement

Interface rate

10 Mbit/s, 100 Mbit/s.

RJ-45 electrical interface specification

Complies with IEEE 802.3 and enterprise regulations.

Table 5-19 Specifications of the FE/GE electrical interface Item

Specification Requirement

Interface rate

10 Mbit/s, 100 Mbit/s, 1000 Mbit/s.

RJ-45 electrical interface specification

Complies with IEEE 802.3 and enterprise regulations.

Table 5-20 Information about FE optical modules Code

Optical Module Information

Remarks

S4015755

eSFP, 1310 nm, STM-1, LC, Single-mode, 15 km

S4015715

eSFP, 1310 nm, STM-1, LC, Single-mode, 40 km

Two-fiber bidirectional

34060282

eSFP, 1550 nm, STM-1, LC, Single-mode, 80 km

34060363

eSFP, Tx 1310 nm/Rx 1550 nm, LC, Single-mode, 10 km

34060364

eSFP, Tx 1550 nm/Rx 1310 nm, LC, Single-mode, 10 km

Commercial Single-fiber bidirectional Commercial

Table 5-21 Information about GE optical modules

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Code

Optical Module Information

Remarks

34060286

eSFP, 850 nm, LC, Multi-mode, 0.5 km

34060473

eSFP, 1310 nm, LC, Single-mode, 10 km

Two-fiber bidirectional

S4016954

eSFP, 1310 nm, LC, Single-mode, 40 km

34060360

eSFP, 1550 nm, LC, Single-mode, 80 km

34060483

eSFP, 1471nm, LC, Single-mode, 80 km

34060481

eSFP, 1491nm, LC, Single-mode, 80 km

34060479

eSFP, 1511nm, LC, Single-mode, 80 km

34060482

eSFP, 1521nm, LC, Single-mode, 80 km Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd.

Commercial

Two-fiber bidirectional CWDM Commercial

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Code

Optical Module Information

34060478

eSFP, 1551nm, LC, Single-mode, 80 km

34060476

eSFP, 1571nm, LC, Single-mode, 80 km

34060477

eSFP, 1591nm, LC, Single-mode, 80 km

34060480

eSFP, 1611nm, LC, Single-mode, 80 km

34060475

eSFP, Tx 1490 nm/Rx 1310 nm, LC, Single-mode, 10 km

34060470

eSFP, Tx 1310 nm/Rx 1490 nm, LC, Single-mode, 10 km

34060539

eSFP, Tx 1310 nm/Rx 1490 nm, LC, Single-mode, 40 km

34060540

eSFP, Tx 1490 nm/Rx 1310 nm, LC, Single-mode, 40 km

34060595

eSFP, Tx 1570 nm/Rx 1490 nm, LC, Single-mode, 80 km

34060596

eSFP, Tx 1490 nm/Rx 1570 nm, LC, Single-mode, 80 km

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Remarks

Single-fiber bidirectional Commercial

Table 5-22 Information about FE Electrical Module Code

Electrical Module Information

34100101

100BASE-T, RJ45, SFP Electrical Module, 100 m

Table 5-23 Information about GE Electrical Module Code

Electrical Module Information

34100080

1000BASE-T, RJ45, SFP Electrical Module, 100 m

34100052

1000BASE-T, RJ45, SFP Electrical Module, Auto Negotiate, 100 m

Other Specifications Board dimensions (mm): 20.3 (H) x 226.0 (D) x 388.4 (W)(0.80 in.×8.90 in.×15.29 in.) Board weight: 1.08 kg(2.38 lb) Power consumption (W, room temperature): 28.0 (ANC2CXPI), 29.5 (ANC2CXPL)

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5.4 AND1EG4T - 4 Channels FE/GE Adaptive Electronic Interface Board The AND1EG4T board (EG4T for short) is a 4 channels FE/GE adaptive electrical interface board whose functional version is AND1. The AND1EG4T board can be housed in any of slots 3 and 4 in the chassis.

5.4.1 Front Panel On the front panel of the AND1EG4T board, there are one indicator and four interfaces.

Appearance of the Front Panel Figure 5-13 shows the front panel of the AND1EG4T board. Figure 5-13 Appearance of the front panel

Indicator The following indicators are present on the front panel of the AND1EG4T board: l

STAT indicator, red, green, or orange, which indicates the working status

l

LINK indicator, green, which indicates the connection status of the port

l

ACT indicator, yellow, which indicates the data transceiving status of the port NOTE

There are four LINK indicators and eight ACT indicators. One LINK indicator and one ACT indicator are present above each FE/GE service interface.

For details on the meaning of the indicators, see 12.1 Indicators.

Interfaces On the AND1EG4T board, four interfaces are present. Table 5-24 lists the types and usage of the interfaces.

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Table 5-24 Types and usage of interfaces on the AND1EF4T Interface on the Front Panel

Interfac e Type

Usage

Pin

Corresponding Cable

FE/GE0FE/GE3

RJ-45

Input/output interfaces for FE/GE electrical signals

For details, see Table 5-25 and Table 5-26.

For details, see10.5.1 Ethernet Cables.

Table 5-25 Pins for the FE electrical interface Front View

87654321

Pin

Usage

1

Positive of twisted pair cable 1

2

Negative of twisted pair cable 1

3

Positive of twisted pair cable 2

4

Unspecified

5

Unspecified

6

Negative of twisted pair cable 2

7

Unspecified

8

Unspecified

Table 5-26 Pins for the GE electrical interface Front View

Pin

Usage

1

Positive of twisted pair cable 1

2

Negative of twisted pair cable 1

3

Positive of twisted pair cable 2

4

Positive of twisted pair cable 3

5

Negative of twisted pair cable 3

6

Negative of twisted pair cable 2

87654321

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Front View

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Pin

Usage

7

Positive of twisted pair cable 4

8

Negative of twisted pair cable 4

5.4.2 Functions and Features The AND1EG4T provides four FE/GE service interfaces (two groups) and works with the control board to transmit, receive, and process four FE/GE electrical services. Table 5-27 lists the functions and features of the AND1EG4T board. Table 5-27 Functions and features of the AND1EG4T board Function and Feature

Description

Basic function

Provides four FE/GE electrical interfaces. Supports the hot swappable function. Detects the temperature and voltage of the board.

Interface function

Supports signals at 10 Mbit/s, 100 Mbit/s and 1000 Mbit/s. Supports inloops and outloops. Supports the traffic control function. Supports the master/slave port mode. Supports Layer 2 and Layer 3 working modes.

Clock

Supports physical-layer clock synchronization (synchronous Ethernet). Supports IEEE 1588v2 and IEEE 1588 ACR.

NOTE When using an electrical interface at 10 Mbit/s, the interface does not support synchronous Ethernet clock or IEEE 1588v2. On the front panel of the AND1EG4T, the first two FE/GE interfaces are considered as one group and the other two FE/GE interfaces on the back are considered as another group. The service access ability of the AND1EG4T is 2 Gbit/s and that of each interface group is 1 Gbit/s. The two interfaces of each group share the group bandwidth.

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5.4.3 Working Principle and Signal Flow The AND1EG4T board consists of the service access module, service processing module, management module, clock module, and power module. Figure 5-14 shows the functional block diagram of the AND1EG4T board. Figure 5-14 Functional block diagram of the AND1EG4T board Backplane 4 x FE/GE signals

Service access module

Service signals

Service processing module

Management bus

Management bus

Management module

Service signals

CXP

Clock signals

Clock module

Clock signals

CXP

Management bus

CXP

Each module on the board

3.3 V 3.0 V 2.5 V 1.2 V

Power supply module

-48 V/-60 V

System power supply

-48 V/-60 V

System power supply

In the Transmit Direction When receiving service packets from the control board, the EG4T board sends them to the service processing module through backplane interfaces. The service processing module identifies the destination ports for the service packets, buffers and schedules them accordingly. Then the service packets are sent to the service access module, where coding/decoding, parallel/serial conversion, and E/O conversion are performed. Finally, the service packets are sent through FE/ GE ports on the front panel.

In the Receive Direction The AND1EG4T board receives service packets from FE/GE ports on the front panel and sends them to the service access module, where coding/decoding, serial/parallel conversion, and O/E conversion are performed. Then the service packets are sent to the service processing module. When receiving the service packets, the service processing module buffers and schedules them based on the service access capability of the AND1EG4T board and access bandwidth configurations at each port. Finally, the service packets are sent out through backplane interfaces.

Service Access Module This module performs the following functions: l

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l

5 ATN 910 Boards

In the transmit direction, it receives the service packets from the service processing module, performs coding/decoding, parallel/serial conversion, and E/O conversion, and then sends the service packets through FE/GE ports on the front panel.

Service Processing Module This module performs the following functions: l

In the receive direction, it receives and buffers service packets from the interface conversion module. Then, it schedules the service packets based on the service access capability of the EG4T board and access bandwidth configurations at each port. Finally, it sends the service packets through backplane interfaces.

l

In the transmit direction, it receives service packets from the control board, identifies the destination ports for the packets, buffers and schedules them based on the service access capability of the board and bandwidth configurations at each port. Finally, it sends the service packets to the service access module.

l

It extracts synchronous Ethernet clock signals.

l

It extracts and inserts IEEE 1588v2 packets.

Management Module This module works with the control board to manage and control each module on the board.

Clock Module This module performs the following functions: l

Provides the working clock for each module on the EG4T board.

l

Supports synchronous Ethernet and the SSM protocol.

l

Supports the IEEE 1588v2 protocol.

l

Supports the 1588 ACR clock.

Power Supply Module This module provides the following DC voltages for the modules on the board: l

3.3 V

l

3.0 V

l

2.5 V

l

1.2 V

5.4.4 Technical Specifications Technical specifications of the AND1EG4T board include interface specifications and physical specifications.

Interface Specifications Table 5-28 lists the specifications of the electrical interfaces on the AND1EG4T board. Issue 01 (2013-10-31)

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Table 5-28 Specifications of the FE/GE electrical interface Item

Specification Requirement

Interface rate

10 Mbit/s, 100 Mbit/s, 1000 Mbit/s.

RJ-45 electrical interface specification

Complies with IEEE 802.3 and enterprise regulations.

Physical Specifications Board dimensions (mm): 20.32 (height) x 225.75 (depth) x 193.8 (width)(0.80 in.×8.89 in.×7.63 in.) Weight (kg): 0.50(1.10 lb) Power consumption at room temperature (W): 10.0

5.5 AND1EF8T - 8 Channels Fast Ethernet Electric Interface Board The AND1EF8T (EF8T for short) is an 8 channels Fast Ethernet electric interface board. The function version of the EF8T is AND1. The EF8T is housed in slot 3 or slot 4.

5.5.1 Front Panel On the front panel of the AND1EF8T, there are indicators and interfaces.

Appearance of the Front Panel Figure 5-15 shows the appearance of the front panel of the AND1EF8T. Figure 5-15 Font panel of the AND1EF8T

Indicator The following indicators are present on the front panel of the AND1EF8T: l

STAT indicator, red, green, or orange, which indicates the working status

l

LINK indicator, green, which indicates the connection status of the port

l

ACT indicator, yellow, which indicates the data transceiving status of the port

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NOTE

There are eight LINK indicators and eight ACT indicators. One LINK indicator and one ACT indicator are present above each FE service interface.

For details on meanings of indicators, see 12.1 Indicators.

Interface Table 5-29 lists the types and usage of the interfaces on the AND1EF8T. Table 5-29 Types and usage of interfaces on the AND1EF8T Interface on the Front Panel

Interface Type

Usage

Pin

Correspondin g Cable

FE0 - FE7

RJ45

Input/output interfaces for FE electrical signals

For details, see Table 5-30.

For details, see 10.5.1 Ethernet Cables.

NOTE The FE0 to FE7 interfaces support auto-adaptation to a straight-through cable or a crossover cable.

Table 5-30 Pins of the RJ45 connector of the AND1EF8T Front View

87654321

Pin

Usage

1

Positive of twisted pair 1

2

Negative of twisted pair 1

3

Positive of twisted pair 2

4

Unspecified

5

Unspecified

6

Negative of twisted pair 2

7

Unspecified

8

Unspecified

5.5.2 Functions and Features The AND1EF8T mainly transmits/accesses 8 x FE electrical signals, and processes the services with the control board. Table 5-31 lists the functions and features of the AND1EF8T. Issue 01 (2013-10-31)

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Table 5-31 Functions and features of the AND1EF8T Function and Feature

Description

Basic function

Provides eight FE electrical interfaces. Supports the hot swappable function. Detects the temperature and voltage of the board.

Interface function

Supports signals at 10 Mbit/s and 100 Mbit/s. Supports inloops and outloops. Supports Layer 2 and Layer 3 working modes.

Clock

Supports physical-layer clock synchronization (synchronous Ethernet). Supports IEEE 1588v2 and IEEE 1588 ACR.

NOTE When using an electrical interface at 10 Mbit/s, the interface does not support synchronous Ethernet clock or IEEE 1588v2/IEEE 1588 ACR.

5.5.3 Working Principle and Signal Flow The AND1EF8T mainly consists of the access and convergence module, control driver module, clock module, and power supply module. Figure 5-16 shows the block diagram for the functions of the AND1EF8T. Figure 5-16 Block diagram for the functions of the AND1EF8T Backplane 8 x FE electrical signals

Access and convergence module

Service bus

Management bus

Control driver module

Service bus

CXP CXP

Clock signals Clock signals

Each module on the board

3.3 V 1.2 V

Each module on the board

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Clock module

Power supply module

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Clock signals

-48 V/-60 V -48 V/-60 V

CXP

System power supply System power supply

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Access and Convergence Module This module performs the following functions: l

Transmits and receives 8 x FE electrical signals.

l

Buffers FE signals to avoid packet loss.

l

Provides flow control frames to control the number of packets.

l

Processes the IEEE 1588V2 packets.

Control Driver Module This module performs the following functions: l

Detects the system status through the management bus. – Detects any fault of the system control board. – Detects whether board is loosened from the slot. – Detects the voltage and temperature.

l

Realizes the hot swappable function of the board.

Clock Module This module performs the following functions: l

Provides the working clock for each module on the board.

l

Supports the synchronous Ethernet and the SSM protocol.

l

Supports the IEEE 1588V2 protocol.

l

Supports the 1588 ACR clock.

Power Supply Module This module performs the following functions: l

Accesses two -48 V DC or -60 V DC power supplies.

l

Supplies 3.3 V and 1.2 V power for the EF8T.

5.5.4 Technical Specifications The technical specifications of the AND1EF8T include the interface specifications and physical specifications.

Interface Specifications Table 5-32 lists the specifications of the electrical interfaces of the AND1EF8T. Table 5-32 Specifications of the FE electrical interface

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Item

Specification Requirement

Interface rate

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Item

Specification Requirement

RJ-45 electrical interface specification

Complies with IEEE 802.3 and enterprise regulations.

Physical Specifications Board dimensions (mm): 20.32 (H) x 225.75 (D) x 193.80 (W)(0.80 in.×8.89 in.×7.63 in.) Weight (kg): 0.53(1.17 lb) Power consumption (W, room temperature): 9.0

5.6 AND1EG2 - 2 Channels GE Optical Interface Board The AND1EG2 (EG2 for short) is a two channels GE optical interface board. The function version of the EG2 is AND1. The AND1EG2 is housed in slot 3 or slot 4.

5.6.1 Front Panel On the front panel of the AND1EG2, there are indicators and interfaces.

Appearance of the Front Panel Figure 5-17 shows the appearance of the front panel of the AND1EG2. Figure 5-17 Front panel of the AND1EG2

Indicators The following indicators are present on the front panel of the AND1EG2. l

STAT indicator, red, green, or orange, which indicates the working status

l

LINK0 to LINK1 indicators, green, which indicate the connection status of the port

l

ACT0 to ACT1 indicators, yellow, which indicate the data transceiving status of the port

For details on meanings of indicators, see 12.1 Indicators.

Interfaces Two SFP interfaces are present on the AND1EG2. Table 5-33 list the types and usage of the interfaces on the AND1EG2. Issue 01 (2013-10-31)

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Table 5-33 Types and usage of optical interfaces on the AND1EG2 Interface on the Front Panel

Interf ace Type

Usage

Correspond ing Fiber

Optical module

LC

When a two-fiber bidirectional optical module is used, this interface is used as an input interface for the GE optical signal.

For details, see 10.6 Optical Fibers.

IN0, IN1

When a single-fiber bidirectional optical module is used, this interface is not used. OUT0, OUT1

LC

When a two-fiber bidirectional optical module is used, this interface is used as an output interface for the GE optical signal. When a single-fiber bidirectional optical module is used, this interface is used as an input/output interface for the GE optical signal.

5.6.2 Functions and Features The AND1EG2 mainly transmits/receives 2 x GE signals, and processes the services with the control board. Table 5-34 lists the functions and features of the AND1EG2. Table 5-34 Functions and Features of the AND1EG2 Function and Feature

Description

Basic function

Provides two GE interfaces (SFP). Supports the hot swappable function. Detects the temperature and voltage of the board.

Interface function

Supports only GE optical modules. Supports inloops and outloops. Supports the traffic control function. Supports Layer 2 and Layer 3 working modes.

Clock

Supports physical-layer clock synchronization (synchronous Ethernet). Supports IEEE 1588v2 and IEEE 1588 ACR.

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5.6.3 Working Principle and Signal Flow The AND1EG2 mainly consists of the interface conversion module, control driving module, clock module, and power supply module. Figure 5-18 shows the block diagram for the functions of the AND1EG2. Figure 5-18 Block diagram for the functions of the AND1EG2 Backplane

2 x GE signals

Interface conversion module

Service bus

Management bus

Control driver module

CXP

Service bus

CXP

Clock signals

Clock signals

Clock module

Each module on the board

3.3 V 1.2 V

Each module on the board

Power supply module

Clock signals

CXP

-48 V/-60 V

System power supply

-48 V/-60 V

System power supply

Interface Conversion Module This module performs the following functions: l

Transmits and receives 2 x GE services.

l

Supports SFP interfaces. Select a proper module for single-mode or multi-mode transmission over a specified distance.

Control Driving Module This module performs the following functions: l

Detects the system status through the management bus. – Detects any fault of the system control board. – Detects whether board is loosened from the slot. – Detects the voltage and temperature.

l

Realizes the hot swappable function of the board.

Clock module This module performs the following functions: Issue 01 (2013-10-31)

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l

Provides the working clock for each module on the AND1EG2.

l

Supports the synchronous Ethernet and the SSM protocol.

l

Supports the IEEE 1588V2 protocol.

l

Supports the 1588 ACR clock.

5 ATN 910 Boards

Power Supply Module This module performs the following functions: l

Accesses two -48 V DC or -60 V DC power supplies.

l

Supplies 3.3 V or 1.2 V power for each module on the AND1EG2.

5.6.4 Technical Specifications The technical specifications of the AND1EG2 include the interface specifications and physical specifications.

Interface Specifications For information about the swappable optical modules supported by SFP interfaces on the AND1EG2 board, see Table 5-35. The interface specifications depend on the optical modules on the board. For details on the optical modules, see 9 Swappable Optical/Electrical Modules. Table 5-35 Information about GE optical modules

Issue 01 (2013-10-31)

Code

Optical Module Information

Remarks

34060286

eSFP, 850 nm, LC, Multi-mode, 0.5 km

34060473

eSFP, 1310 nm, LC, Single-mode, 10 km

Two-fiber bidirectional

S4016954

eSFP, 1310 nm, LC, Single-mode, 40 km

34060360

eSFP, 1550 nm, LC, Single-mode, 80 km

34060483

eSFP, 1471nm, LC, Single-mode, 80 km

34060481

eSFP, 1491nm, LC, Single-mode, 80 km

34060479

eSFP, 1511nm, LC, Single-mode, 80 km

34060482

eSFP, 1521nm, LC, Single-mode, 80 km

34060478

eSFP, 1551nm, LC, Single-mode, 80 km

34060476

eSFP, 1571nm, LC, Single-mode, 80 km

34060477

eSFP, 1591nm, LC, Single-mode, 80 km

34060480

eSFP, 1611nm, LC, Single-mode, 80 km

34060475

eSFP, Tx 1490 nm/Rx 1310 nm, LC, Single-mode, 10 km

34060470

eSFP, Tx 1310 nm/Rx 1490 nm, LC, Single-mode, 10 km Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd.

Commercial

Two-fiber bidirectional CWDM Commercial

Single-fiber bidirectional

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Code

Optical Module Information

Remarks

34060539

eSFP, Tx 1310 nm/Rx 1490 nm, LC, Single-mode, 40 km

Commercial

34060540

eSFP, Tx 1490 nm/Rx 1310 nm, LC, Single-mode, 40 km

34060595

eSFP, Tx 1570 nm/Rx 1490 nm, LC, Single-mode, 80 km

34060596

eSFP, Tx 1490 nm/Rx 1570 nm, LC, Single-mode, 80 km

Physical Specifications Board dimensions (mm): 20.32 (H) x 225.75 (D) x 193.80 (W) (0.80 in. x 8.89 in. x 7.63 in.) Weight (kg): 0.52(1.15 lb) Power consumption (W, room temperature): 5.9

5.7 AND1EG4F - 4 Channels FE/GE Adaptive Optical Interface Board The AND1EG4F (EG4F for short) is a four channels FE/GE adaptive optical interface board . The function version of the EG4F is AND1. The AND1EG4F is housed in slot 3 or slot 4.

5.7.1 Front Panel On the front panel of the AND1EG4F, there are indicators and interfaces.

Appearance of the Front Panel Figure 5-19 shows the appearance of the front panel of the AND1EG4F. Figure 5-19 Appearance of the front panel of the AND1EG4F

Indicators The following indicators are present on the front panel of the AND1EG4F: l

STAT indicator, red, green, or orange, which indicates the working status

l

L/A0 to L/A3 indicators, green or orange, which indicate the port connection status and data transmit/receive status

For details on indications of the indicators, see 12.1 Indicators. Issue 01 (2013-10-31)

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Interfaces There are four SFP interfaces on the AND1EG4F. Table 5-36 lists the types and usage of the interfaces. Table 5-36 Types and usage of interfaces on the AND1EG4F Interface on the Front Panel

Interface Type

Usage

Correspo nding Cable

Optical module

LC

When a two-fiber bidirectional optical module is used, this interface is used as an input interface for the FE/GE optical signal.

For details, see 10.6 Optical Fibers.

IN0 to IN3

When a single-fiber bidirectional optical module is used, this interface is not used. OUT0 to OUT3

LC

When a two-fiber bidirectional optical module is used, this interface is used as an output interface for the FE/GE optical signal. When a single-fiber bidirectional optical module is used, this interface is used as an input/output interface for the FE/GE optical signal.

Electrical module

OUT0 IN0, OUT3 IN3

RJ-45

Input/Output interfaces for GE electrical signals

For details, see 10.5.1 Ethernet Cables.

NOTE The GE SFP interface on the front panel can function as either an optical interface or an electrical interface. When the SFP interface functions as an optical interface, it needs to be used with an optical module; when the SFP interface functions as an electrical interface, it needs to be used with an electrical module.

5.7.2 Functions and Features The AND1EG4F provides four FE/GE service interfaces (two groups). The AND1EG4F is used with the control board to transmit, receive, and process four channels of FE/GE optical services. Table 5-37 lists the functions and features of the AND1EG4F.

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Table 5-37 Functions and features of the AND1EG4F Function and Feature

Description

Basic function

Provides four FE/GE interfaces (SFP). Supports the hot swappable function. Detects the temperature and voltage of the board.

Interface function

Supports FE optical modules, FE electrical modules, GE optical modules, GE electrical modules. Supports inloops and outloops. Supports the traffic control function. Supports Layer 2 and Layer 3 working modes.

Clock

Supports physical-layer clock synchronization (synchronous Ethernet). Supports IEEE 1588v2 and IEEE 1588 ACR.

NOTE On the front panel of the AND1EG4F, the first two FE/GE interfaces are considered as one group and the other two FE/GE interfaces on the back are considered as another group. The service access ability of the AND1EG4F is 2 Gbit/s and that of each interface group is 1 Gbit/s. The two interfaces of each group share the group bandwidth. If the SFP interface houses an electrical module, the interface does not support synchronous Ethernet or IEEE 1588v2/IEEE 1588 ACR.

5.7.3 Working Principle and Signal Flow The AND1EG4F consists of the service access module, service processing module, management module, clock module, and power supply module. Figure 5-20 shows the block diagram for the working principle of the AND1EG4F. Figure 5-20 Block diagram for the working principle of the AND1EG4F Backplane 4 x FE/GE signals

Service access module

Service signals

Service processing module

Management bus

Management bus

Management module

Service signals

CXP

Clock signals

Clock module

Clock signals

CXP

Management bus

CXP

Each module on the board

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3.3 V 3.0 V 2.5 V 1.2 V

Power supply module

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-48 V/-60 V

System power supply

-48 V/-60 V

System power supply

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Transmit Direction The service packets from the control board are sent to the service processing module through the backplane-side interface of the AND1EG4F. The service processing module identifies the destination interfaces for the packets, and buffers and schedules the packets. Then, the service processing module sends the processed packets to the service access module, where coding/ decoding, serial/parallel conversion, and E/O conversion are performed. Finally, the service access module outputs the packets through the FE/GE interfaces on the front panel.

Receive Direction The FE/GE interfaces on the front panel receive FE/GE service signals. Then, the service access module performs O/E conversion, serial/parallel conversion, and coding/decoding on the services, and then sends the services to the service processing module. The service processing module buffers the service packets, schedules the packets based on the service access capability of the EG4F and the access bandwidth setting at each interface, and finally outputs the packets through the backplane-side interface.

Service Access Module This module performs the following functions: l

In the receive direction, this module receives the FE/GE services from the interfaces on the front panel, performs O/E conversion, serial/parallel conversion, and coding/decoding, and then sends the services to the service processing module.

l

In the transmit direction, this module receives the service packets from the service processing module, performs coding/decoding, serial/parallel conversion, and E/O conversion on the packets, and then outputs the packets through the FE/GE interfaces on the front panel.

Service Processing Module This module performs the following functions: l

In the receive direction, this module receives and buffers the service packets from the interface conversion module. Then, this module schedules packets from different interfaces based on the access capability of the EG4F and the access bandwidth settings at these interfaces. Finally, this module outputs the packets through the backplane-side interface.

l

In the transmit direction, this module receives service packets from the control board, identifies the destination interfaces of the packets, and buffers and schedules the packets based on the access capability of the EG4F and the access bandwidth setting at each interface. Finally, this module outputs the packets to the service access module.

l

This module extracts the synchronous Ethernet clock.

l

This module extracts and inserts IEEE 1588 V2 packets.

Management Module This module is used with the control board to manage and control each module on the EG4F. Issue 01 (2013-10-31)

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Clock Module This module performs the following functions: l

Provides the working clock for each module on the EG4F.

l

Supports the synchronous Ethernet and SSM protocols.

l

Supports the IEEE 1588 V2 protocol.

l

Supports the 1588 ACR clock.

Power Supply Module This module provides the DC power of the following specifications to each module on the EG4F. l

3.3 V

l

3.0 V

l

2.5 V

l

1.2 V

5.7.4 Technical Specifications The technical specifications of the AND1EG4F include the interface specifications and physical specifications.

Interface Specifications For information about the swappable FE/GE optical/electrical modules supported by SFP interfaces on the AND1EG4F board, see Table 5-38, Table 5-39, Table 5-40, Table 5-40, and Table 5-41. The interface specifications depend on the optical/electrical modules on the board. For details on the optical/electrical modules, see 9 Swappable Optical/Electrical Modules. Table 5-38 Information about FE optical modules Code

Optical Module Information

Remarks

S4015755

eSFP, 1310 nm, STM-1, LC, Single-mode, 15 km

S4015715

eSFP, 1310 nm, STM-1, LC, Single-mode, 40 km

Two-fiber bidirectional

34060282

eSFP, 1550 nm, STM-1, LC, Single-mode, 80 km

34060363

eSFP, Tx 1310 nm/Rx 1550 nm, LC, Single-mode, 10 km

34060364

eSFP, Tx 1550 nm/Rx 1310 nm, LC, Single-mode, 10 km

Commercial Single-fiber bidirectional Commercial

Table 5-39 Information about GE optical modules

Issue 01 (2013-10-31)

Code

Optical Module Information

Remarks

34060286

eSFP, 850 nm, LC, Multi-mode, 0.5 km

Two-fiber bidirectional

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Code

Optical Module Information

Remarks

34060473

eSFP, 1310 nm, LC, Single-mode, 10 km

Commercial

S4016954

eSFP, 1310 nm, LC, Single-mode, 40 km

34060360

eSFP, 1550 nm, LC, Single-mode, 80 km

34060483

eSFP, 1471nm, LC, Single-mode, 80 km

34060481

eSFP, 1491nm, LC, Single-mode, 80 km

34060479

eSFP, 1511nm, LC, Single-mode, 80 km

34060482

eSFP, 1521nm, LC, Single-mode, 80 km

34060478

eSFP, 1551nm, LC, Single-mode, 80 km

34060476

eSFP, 1571nm, LC, Single-mode, 80 km

34060477

eSFP, 1591nm, LC, Single-mode, 80 km

34060480

eSFP, 1611nm, LC, Single-mode, 80 km

34060475

eSFP, Tx 1490 nm/Rx 1310 nm, LC, Single-mode, 10 km

34060470

eSFP, Tx 1310 nm/Rx 1490 nm, LC, Single-mode, 10 km

34060539

eSFP, Tx 1310 nm/Rx 1490 nm, LC, Single-mode, 40 km

34060540

eSFP, Tx 1490 nm/Rx 1310 nm, LC, Single-mode, 40 km

34060595

eSFP, Tx 1570 nm/Rx 1490 nm, LC, Single-mode, 80 km

34060596

eSFP, Tx 1490 nm/Rx 1570 nm, LC, Single-mode, 80 km

Two-fiber bidirectional CWDM Commercial

Single-fiber bidirectional Commercial

Table 5-40 Information about FE Electrical Module Code

Electrical Module Information

34100101

100BASE-T, RJ45, SFP Electrical Module, 100 m

Table 5-41 Information about GE Electrical Module Code

Electrical Module Information

34100080

1000BASE-T, RJ45, SFP Electrical Module, 100 m

34100052

1000BASE-T, RJ45, SFP Electrical Module, Auto Negotiate, 100 m

Physical Specifications Board dimensions (mm): 20.32 (H) x 225.75 (D) x 193.80 (W) (0.80 in. x 8.89 in. x 7.63 in.) Issue 01 (2013-10-31)

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Weight (kg): 0.50 (1.10 lb) Power consumption (W, room temperature): 13.2

5.8 AND1EF8F - 8 Channels Fast Ethernet Optical Interface Board The AND1EF8F (EF8F for short) is an 8 channels Fast Ethernet optical interface board. The function version of the EF8F is AND1. The AND1EF8F is housed in slot 3 or slot 4.

5.8.1 Front Panel On the front panel of the AND1EF8F, there are indicators and interfaces.

Appearance of the Front Panel Figure 5-21 shows the appearance of the front panel of the AND1EF8F. Figure 5-21 Font panel of the AND1EF8F

Indicators The following indicators are present on the front panel of the AND1EF8F: l

STAT indicator, red, green, or orange, which indicates the working status

l

LINK0 to LINK7 indicators, green, which indicate the connection status of the port

For details on meanings of indicators, see 12.1 Indicators.

Interfaces Eight SFP interfaces are present on the AND1EF8F. Table 5-42 lists the types and usage of the interfaces.

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Table 5-42 Interfaces of the AND1EF8F Interface on the Front Panel

Interface Type

Usage

Corresponding Fiber

IN0 - IN7

LC

When a two-fiber bidirectional optical module is used, this interface is used as an input interface for the FE optical signal.

For details, see 10.6 Optical Fibers.

OUT0 OUT7

LC

When a two-fiber bidirectional optical module is used, this interface is used as an output interface for the FE optical signal.

NOTE The SFP interface should be used with an optical module. l When a two-fiber bidirectional optical module is used, two LC interfaces are provided on the left and right sides of the optical module. Each interface uses one fiber, which is used to transmit or receive service signals. l When a single-fiber bidirectional optical module is used, only one LC interface is provided on the left side of the optical module. This optical interface uses only one fiber, which is used to transmit and receive service signals at the same time.

5.8.2 Functions and Features The AND1EF8F mainly transmits/receives 8 x FE optical signals, and processes the services with the control board. Table 5-43 lists the functions and features of the AND1EF8F. Table 5-43 Functions and features of the AND1EF8F Function and Feature

Description

Basic function

Supports eight FE interfaces (SFP). Supports the hot swappable function. Detects the temperature and voltage of the board.

Interface function

Supports FE optical modulesand FE electrical modules. Supports inloops and outloops. Supports the traffic control function. Supports Layer 2 and Layer 3 working modes.

Clock

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Function and Feature

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Description Supports IEEE 1588v2 and IEEE 1588 ACR.

NOTE If the SFP interface houses an electrical module, the interface does not support synchronous Ethernet or IEEE 1588v2.

5.8.3 Working Principle and Signal Flow The AND1EF8F mainly consists of the access and convergence module, control driver module, clock module, and power supply module. Figure 5-22 shows the block diagram for the functions of the AND1EF8F. Figure 5-22 Block diagram for the functions of the AND1EF8F Backplane

8 x FE optical signals

Access and convergence module

Service bus

Management bus

Control driver module

Service bus

CXP CXP

Clock signals

Clock signals

Each module on the board Each module on the board

Clock module

3.3 V 1.2 V

Clock signals

Power supply module

CXP

-48 V/-60 V

System power supply

-48 V/-60 V

System power supply

Access and Convergence Module This module performs the following functions: l

Transmits/receives 8 x FE optical signals.

l

Buffers FE signals to avoid packet loss.

l

Provides flow control frames to control the number of packets.

l

Processes the IEEE 1588V2 packets.

Control Driver Module This module performs the following functions: l Issue 01 (2013-10-31)

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– Checks whether any fault occurs on the system control board. – Detects whether board is loosened from the slot. – Detects the voltage and temperature. l

Realizes the hot swappable function of the board.

Clock Module This module performs the following functions: l

Provides the working clock for each module on the EF8F.

l

Supports the synchronous Ethernet and the SSM protocol.

l

Supports the IEEE 1588V2 protocol.

l

Supports the 1588 ACR clock.

Power Supply Module This module performs the following functions: l

Accesses two - 48 V DC or - 60 V DC power supplies.

l

Supplies 3.3 V and 1.2 V power for the EF8F.

5.8.4 Technical Specifications The technical specifications of the AND1EF8F include the interface specifications and physical specifications.

Interface Specifications For information about the swappable FE/GE optical/electrical modules supported by SFP interfaces on the AND1EF8F board, see Table 5-44 and Table 5-45. The interface specifications depend on the optical/electrical modules on the board. For details on the optical/electrical modules, see 9 Swappable Optical/Electrical Modules. Table 5-44 Information about FE optical modules

Issue 01 (2013-10-31)

Code

Optical Module Information

Remarks

S4015755

eSFP, 1310 nm, STM-1, LC, Single-mode, 15 km

S4015715

eSFP, 1310 nm, STM-1, LC, Single-mode, 40 km

Two-fiber bidirectional

34060282

eSFP, 1550 nm, STM-1, LC, Single-mode, 80 km

34060363

eSFP, Tx 1310 nm/Rx 1550 nm, LC, Single-mode, 10 km

34060364

eSFP, Tx 1550 nm/Rx 1310 nm, LC, Single-mode, 10 km

Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd.

Commercial Single-fiber bidirectional Commercial

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Table 5-45 Information about FE Electrical Module Code

Electrical Module Information

34100101

100BASE-T, RJ45, SFP Electrical Module, 100 m

Physical Specifications Board dimensions (mm): 20.32 (H) x 225.75 (D) x 193.80 (W) (0.80 in. x 8.89 in. x 7.63 in.) Weight (kg): 0.55(1.21 lb) Power consumption (W, room temperature): 12.9

5.9 AND1ML1/AND1ML1A - 16 Channels E1 Electrical Interface Board The functional version of the AND1ML1/AND1ML1A is AND1.. NOTE

The AND1ML1 and AND1ML1A have the same functions and features except for the matched impedance (AND1ML1: 75 ohms E1; AND1ML1A: 120 ohms E1).

5.9.1 Front Panel On the front panel of the AND1ML1/AND1ML1A, there are indicators and interfaces.

Appearance of the Front Panel Figure 5-23 shows the appearance of the front panel of the AND1ML1. Figure 5-23 Front panel of the AND1ML1

Figure 5-24 shows the appearance of the front panel of the AND1ML1A. Figure 5-24 Front panel of the AND1ML1A

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Indicators The following indicators are present on the front panel of the AND1ML1/AND1ML1A: l

STAT indicator, red, green, or orange, which indicates the working status

For details on meanings of indicators, see 12.1 Indicators.

Interfaces There is one Anea 96 interface on the front panel of the AND1ML1/AND1ML1A. Table 5-46 lists the type and usage of the interface. For cables corresponding to the interfaces, see 10.5.4 75-Ohm 16 x E1 Cables and 10.5.5 120-Ohm 16 x E1 Cables. Table 5-46 Type and usage of the interface on the front panel of the ML1 Interface on the Front Panel

Interface Type

Usage AND1ML1

AND1ML1A

1 - 16

Anea 96

75-ohm interface, which is used to transmit or receive the first to sixteenth channels of E1 services.

120-ohm interface, which is used to transmit or receive the first to sixteenth channels of E1 services.

Table 5-47 lists the pins of the Anea 96 interface. Table 5-47 Pins of the Anea 96 interface Front View

Connector Pin

Usage

Connector Pin

Usage

1

Rx0

25

Tx0

2 3

26 Rx1

4 5

Rx2

Rx3

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Tx2

31

Tx3

32 Rx4

10 11

29 30

8 9

Tx1

28

6 7

27

33

Tx4

34 Rx5

35

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Tx5 97

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Front View

Connector Pin

5 ATN 910 Boards

Usage

12 13

Rx6

Rx7

Rx8

Rx9

R x 10

R x 11

R x 12

R x 13

56

Tx9

45

T x 10

47

T x 11

73

T x 12

75

T x 13

76 R x 14

54 55

43

74

52 53

Tx8

48

50 51

41

46

24 49

Tx7

44

22 23

39

42

20 21

Tx6

40

18 19

37 38

16 17

Usage

36

14 15

Connector Pin

77

T x 14

78 R x 15

79

T x 15

80

5.9.2 Functions and Features The AND1ML1 is a 75-ohm E1 board and the AND1ML1A is a 120-ohm E1 board. The AND1ML1/ML1A can access a maximum of 16 x E1 signals, supports flexible configuration of different services on each port, and is hot swappable. Table 5-48 lists functions and features of the AND1ML1/AND1ML1A.

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Table 5-48 Functions and features of the AND1ML1/AND1ML1A Function and Feature

Remarks

Basic function

Provides 16 E1 interfaces. Supports the hot swappable function. Detects the temperature and voltage of the board.

Interface function

Impedance supported by the interface

AND1ML1: 75 ohm AND1ML1A: 120 ohm

Supports the E1 and CE1 modes. Supports the master clock mode (unconfigurable). Supports the HDB3 line coding (unconfigurable). Supports inloops and outloops. Supports the PRBS function in framed or unframed mode of an E1 interface in the receive/transmit direction. ATM

Number of supported ATM E1 services

16

Number of supported IMA groups

16

Maximum number of E1 links in each IMA group

16

Encapsulates ATM VPC/VCC service to the PWE3 in the Nto-1 (N≤32) or 1-to-1 format. Supports the ATM bundle function.

TDM

Number of supported PVCs/ PVPs

256

Number of supported local ATM CCCs

32

Number of supported remote ATM PWE3s

64

Supports CES services in CESoPSN and SAToP modes. Supports the timeslot compression function. For services in CESoPSN mode, a minimum of 2 timeslots can be bundled during serial port configuration. Supports the fractional E1. Different timeslots of an E1 can be bound to different CES PWs.

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Remarks

PPP

Clock

Number of supported local TDM CCCs

8

Number of supported remote TDM PWE3s

16

Number of supported PPP links

16

Number of supported MLPPP groups

8

Maximum number of links supported by each ML-PPP group

16

Supports physical-layer clock synchronization.

5.9.3 Working Principle and Signal Flow The AND1ML1/AND1ML1A mainly consists of the control module, line-side processing module, system-side processing module, backplane interface module, clock module, and power supply module. Figure 5-25shows the block diagram for the working principle of the AND1ML1/AND1ML1A. Figure 5-25 Block diagram for the working principle of the AND1ML1/AND1ML1A Backplane 1.2 V To each module

16 x E1 signals

Line-side processing module

Service bus

-48 V/-60 V

1.26 V

System-side

Service bus

processing module

Backplane interface module

Management bus Management bus

To each module

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Clock signals

-48 V/-60 V

Power supply module

2.5 V 3.3 V

Control module

Clock module

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Service bus Service bus

Serial management bus

Active CXP Standby CXP

CXP

Clock signals CXP

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In Transmit Direction The AND1ML1/AND1ML1A first distributes the signals in Ethernet packets from the backplane to different protocol processing chips according to the service types. The system-side processing module decapsulates the concatenated services and buffers the services in queues. Then, this module schedules the egress queues according to the service types, processes and converts the services, and finally sends the services to the line-side processing module. The line-side processing module performs coding, dejitter, pulse shaping, and line driving for the services, and finally sends the services to E1 interfaces.

In Receive Direction The line processing module performs impedance match, signal equalization, signal level conversion, clock data recovery, dejitter, and decoding for the accessed E1 signals. Then, the signals are sent into the system-side processing module, which frames the signals, encapsulates the IMA, CES, and ML-PPP services in PWE3, and schedules PWs. Finally, this module sends the signals in Ethernet packets to the backplane interface module.

Line-Side Processing Module In the receive channel, this module performs impedance match, signal equalization, electrical level conversion, clock data recovery, dejitter, and decoding to signals. In the transmit channel, this module performs encoding, dejitter, pulse shaping, and line driving to signals.

System-Side Processing Module This module frames 16 x E1 signals, runs the CES, IMA, and ML-PPP protocols, and performs PWE3 encapsulation.

Backplane Interface Module The service bus receives or transmits service signals.

Control Module This module controls the reading and writing on the chip, resets the chip, and detects faults in the chip. When used with the control board, this module controls the board.

Clock Module This module provides various clock signals for the board to operate normally, detects clocks, and selects the line recovery clock.

Power Supply Module This module converts the -48 V DC/-60 V DC voltage to DC voltages required by each module on the board. Issue 01 (2013-10-31)

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5.9.4 Specifications The technical specifications of the AND1ML1/AND1ML1A include the interface specifications, dimensions, weight, and power consumption. Table 5-49 lists the specifications of the interfaces on the AND1ML1/AND1ML1A. Table 5-49 Specifications of the interfaces on the AND1ML1/AND1ML1A Item

Specification Requirement

Nominal bit rate (kbit/s)

2048

Interface impedance

75 ohms (AND1ML1) 120 ohms (AND1ML1A)

Interface code

HDB3

Pulse waveform at the output interface

Complies with ITU-T G.703

Attenuation tolerance of the input interface at the point with a frequency of 1024 kHz (dB)

0 to 6

Anti-interference capability of the input interface

Complies with ITU-T G.703

Input jitter tolerance

Complies with ITU-T G.823

Output jitter

Complies with ITU-T G.823

Board dimensions (mm): 20.32 (H) x 225.75 (D) x 193.80 (W)(0.80 in.×8.89 in.×7.63 in.) Weight (kg): 0.56(1.23 lb) Power consumption (W, room temperature): 13.1

5.10 AND2ML1A/AND2ML1B - 16 Channels E1 Interface Board The AND2ML1A/AND2ML1B (ML1A/ML1B for short) is a 16 channels E1 interface board. The function version of the ML1A/ML1B is AND2. The AND2ML1A/AND2ML1B is housed in slot 3 or slot 4. NOTE

The mapping impedance of an interface on the AND2ML1A is 75 ohm, and the mapping impedance of an interface on the AND2ML1B is 120 ohm. Except the difference of mapping impedance, the functions and features of the AND2ML1A and AND2ML1B are the same.

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5.10.1 Front Panel On the front panel of the AND2ML1A/AND2ML1B, there are indicators and interfaces.

Appearances of the Front Panel Figure 5-26 and Figure 5-27 show the appearances of the front panel of the AND2ML1A/ AND2ML1B. Figure 5-26 Front panels of the AND2ML1A

Figure 5-27 Front panels of the AND2ML1B

Indicators The following indicators are present on the front panel of the AND2ML1A/AND2ML1B: l

STAT indicator, red, green, or orange, which indicates the working status

For details on meanings of indicators, see 12.1 Indicators.

Interfaces There is one Anea 96 interface on the front panel of the AND2ML1A/AND2ML1B. Table 5-50 lists the type and usage of the interfaces. 10.5.4 75-Ohm 16 x E1 Cables and 10.5.5 120Ohm 16 x E1 Cables list the cables corresponding to the interfaces. Table 5-50 Type and usage of the interfaces on the front panel of the AND2ML1A/AND2ML1B

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Interface Type

Usage AND2ML1A

AND2ML1B

0 - 15

Anea 96

75-ohm interface, which is used to transmit or receive the zero to fifteenth channels of E1 services.

120-ohm interface, which is used to transmit or receive the zero to fifteenth channels of E1 services.

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Table 5-51 lists the pins of the Anea 96 interface. Table 5-51 Pins of the Anea 96 interface Front View

Connector Pin

Usage

Connector Pin

Usage

1

Rx0

25

Tx0

2 3

26 Rx1

4 5

Rx2

Rx3

Rx4

Rx5

Rx6

Rx7

Rx8

Rx9

R x 10

R x 11

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Tx6

39

Tx7

41

Tx8

43

Tx9

45

T x 10

47

T x 11

48 R x 12

50 51

37

46

24 49

Tx5

44

22 23

35

42

20 21

Tx4

40

18 19

33

38

16 17

Tx3

36

14 15

31

34

12 13

Tx2

32

10 11

29 30

8 9

Tx1

28

6 7

27

73

T x 12

74 R x 13

75

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Connector Pin

Usage

52 53

Usage

76 R x 14

54 55

Connector Pin

77

T x 14

78 R x 15

56

79

T x 15

80

5.10.2 Functions and Features AND2ML1A is a 75-ohm E1 board and the AND2ML1B is a 120-ohm E1 board. The AND2ML1A/AND2ML1B must be used with the system control board to access and process 16 channels of E1 services. Services at interfaces on the AND2ML1A/AND2ML1B can be flexibly configured, and protocols such as ATM E1, IMA, CES, and ML-PPP are supported. Table 5-52 lists the functions and features of the AND2ML1A/AND2ML1B. Table 5-52 Functions and features of the AND2ML1A/AND2ML1B Function and Feature

Remarks

Basic function

Provides 16 E1 interfaces. Supports the hot swappable function. Detects the temperature and voltage of the board.

Interface function

Impedance supported by the interface

AND2ML1A: 75 ohms AND2ML1B: 120 ohms

Supports the E1 and CE1 modes. Supports the master/slave clock mode. Supports the HDB3 line coding (unconfigurable). Supports inloops and outloops. Supports the PRBS function in framed or unframed mode of an E1 interface in the receive/transmit direction. ATM

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Number of supported ATM E1 services

16

Number of supported IMA groups

16

Maximum number of E1 links in each IMA group

16

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Remarks Encapsulates ATM VPC/VCC service to the PWE3 in the Nto-1 (N≤32) or 1-to-1 format. Supports the ATM bundle function.

TDM

Number of supported PVCs/ PVPs

256

Number of supported local ATM CCCs

32

Number of supported remote ATM PWE3s

64

Supports CES services in CESoPSN and SAToP modes. Supports the timeslot compression function. For services in CESoPSN mode, a minimum of 1 timeslots can be bundled during serial port configuration. Supports the fractional E1. Different timeslots of an E1 can be bound to different CES PWs.

PPP

Clock

Number of supported local TDM CCCs

8

Number of supported remote TDM PWE3s

16

Number of supported PPP links

16

Number of supported MLPPP groups

8

Maximum number of links supported by each ML-PPP group

16

Supports physical-layer clock synchronization.

5.10.3 Working Principle and Signal Flow The AND2ML1A/AND2ML1B mainly consists of the service access module, service processing module, management module, clock module, and power supply module. Figure 5-28 shows the functional block diagram of the AND2ML1A/AND2ML1B.

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Figure 5-28 Functional block diagram of the AND2ML1A/AND2ML1B Backplane 16 x E1

Service access module

Service signal Management bus

Line clocks

3.3V . . .

Service signal CXP

Management bus

Management module

Clock module

Service processing module

. . .

1V

Power supply module

-48V/-60V

System power supply

-48V/-60V

System power supply

System clocks Line clocks

CXP

CXP CXP

Transmit Direction The service signals from the control board are sent to the service processing module. The service processing module performs PWE3 decapsulation and PW scheduling for the service signals, processes the service signals based on the IMA/ATM, CES, and ML-PPP protocols, performs the E1 framing function, and sends the service signals to the service access module. The service access module performs encoding and line drive for the signals and outputs the signals through the backplane-side interfaces.

Receive Direction The board accesses service signals through the backplane-side interfaces, and then the signals are sent to the service access module. The service access module performs interference isolation, lightning-proof, impedance matching, level conversion, signal balancing, decoding, and then sends the processed signals to the service processing module. The service processing module performs E1 framing, processes service signals based on the IMA/ATM, CES, and ML-PPP protocols, implements PWE3 encapsulation and PW scheduling, and sends the signals to the control board through the backplane-side interfaces.

Service Access Module This module performs the following functions: l

In the receive direction, this module isolates common mode interference, protects circuits against transient failures, matches the impedance in the receive direction with the internal impedance, and performs level conversion, balancing, and decoding for the service signals. Finally, this module sends the processed signals to the service processing module.

l

In the transmit direction, this module receives the service signals from the service processing module, encodes the signals, drives the line, and outputs the service signals through the backplane-side interfaces.

l

This module recovers the line clock.

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Service Processing Module This module performs the following functions: l

In the receive direction, this module receives the signals from the service access module and performs E1 framing. This module also identifies protocol types of the service signals, processes the service signals based on the IMA/ATM, CES, and ML-PPP protocols (for example, addition and deletion of IMA group members, VP/VC switching and concatenation of ATM cells, vacant slot compression of CES services, and setup of MLPPP groups). Then, this module performs PWE3 encapsulation and PW scheduling, Finally, this module converts the processed signals to high-rate signals, and then sends the signals to the control board through the backplane-side interfaces.

l

In the transmit direction, this module receives the high-rate signals from the control board through the backplane-side interfaces and recovers low-rate service signals. Then, this module performs PWE3 decapsulation, identifies different protocols and processes the service signals, and completes E1 framing. Finally, this module sends the processed signals to the service access module.

Management Module This module manages and controls each module on the board.

Clock Module This module performs the following functions: l

When used with the control board, processes the recovered line clock.

l

Provides the working clock for each module on the board.

Power Supply Module This module converts the input DC voltage into various DC voltages required by each module on the board.

5.10.4 Technical Specifications The technical specifications of the AND2ML1A/AND2ML1B include the interface specifications and physical specifications.

Interface Specifications Table 5-53 lists the specifications of the interfaces on the AND2ML1A/AND2ML1B. Table 5-53 Specifications of the interfaces on the AND2ML1A/AND2ML1B Item

Specification Requirement

Nominal bit rate (kbit/s)

2048

Interface impedance

75 ohms (ML1A) 120 ohms (ML1B)

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Item

Specification Requirement

Interface code

HDB3

Pulse waveform at the output interface

Complies with ITU-T G.703

Attenuation tolerance of the input interface at the point with a frequency of 1024 kHz (dB)

0 to 6

Anti-interference capability of the input interface

Complies with ITU-T G.703

Input jitter tolerance

Complies with ITU-T G.823

Output jitter

Complies with ITU-T G.823

Physical Specifications Board dimensions (mm): 20.32 (H) x 225.75 (D) x 193.80 (W)(0.80 in.×8.89 in.×7.63 in.) Weight (kg): 0.44(0.97 lb) Power consumption (W, room temperature): 9.5

5.11 AND1MD1A/AND1MD1B - 32 Channels E1 Interface Board The AND1MD1A/AND1MD1B (MD1A/MD1B for short) is a 32 channels E1 interface board. The function version of the MD1A/MD1B is AND1. The AND1MD1A/AND1MD1B is housed in slot 3 or slot 4. NOTE

The mapping impedance of an interface on the AND1MD1A is 75 ohms, and the mapping impedance of an interface on the AND1MD1B is 120 ohms. Except the difference of mapping impedance, the functions and features of the AND1MD1A and AND1MD1B are the same.

5.11.1 Front Panel On the front panel of the AND1MD1A/AND1MD1B, there are indicators and interfaces.

Appearances of the Front Panel Figure 5-29 shows the appearances of the front panel of the AND1MD1A/AND1MD1B.

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Figure 5-29 Front panels of the AND1MD1A/AND1MD1B

Indicators The following indicators are present on the front panel of the AND1MD1A/AND1MD1B: l

STAT indicator, red, green, or orange, which indicates the working status

For details on meanings of indicators, see 12.1 Indicators.

Interfaces There are two Anea 96 interfaces on the front panel of the AND1MD1A/AND1MD1B. Table 5-54 lists the type and usage of the interfaces. 10.5.4 75-Ohm 16 x E1 Cables and 10.5.5 120Ohm 16 x E1 Cables list the cables corresponding to the interfaces. Table 5-54 Type and usage of the interfaces on the front panel of the AND1MD1A/AND1MD1B Interfac e on the Front Panel

Interfac e Type

Usage AND1MD1A

AND1MD1B

0 to 15

Anea 96

75-ohm interface, which is used to transmit or receive the zero to fifteenth channels of E1 services.

120-ohm interface, which is used to transmit or receive the zero to fifteenth channels of E1 services.

16 to 31

Anea 96

75-ohm interface, which is used to transmit or receive the sixteenth to thirty-first channels of E1 services.

120-ohm interface, which is used to transmit or receive the sixteenth to thirty-first channels of E1 services.

Table 5-55 lists the pins of the Anea 96 interface.

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Table 5-55 Pins of the Anea 96 interface Front View

Connector Pin

Usage

Connector Pin

Usage

1

Rx0

25

Tx0

2 3

26 Rx1

4 5

Rx2

Rx3

Rx4

Rx5

Rx6

Rx7

Rx8

Rx9

R x 10

R x 11

R x 12

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39

Tx7

41

Tx8

43

Tx9

45

T x 10

47

T x 11

73

T x 12

74 R x 13

52 53

Tx6

48

50 51

37

46

24 49

Tx5

44

22 23

35

42

20 21

Tx4

40

18 19

33

38

16 17

Tx3

36

14 15

31

34

12 13

Tx2

32

10 11

29 30

8 9

Tx1

28

6 7

27

75

T x 13

76 R x 14

77

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Connector Pin

Usage

54 55

Connector Pin

Usage

78 R x 15

56

79

T x 15

80

5.11.2 Functions and Features The AND1MD1A is a 75-ohm E1 board and the AND1MD1B is a 120-ohm E1 board. The AND1MD1A/AND1MD1B must be used with the system control board to access and process 32 channels of E1 services. Services at interfaces on the AND1MD1A/AND1MD1B can be flexibly configured, and protocols such as ATM E1, IMA, CES, and ML-PPP are supported. Table 5-56 lists the functions and features of the AND1MD1A/AND1MD1B. Table 5-56 Functions and features of the AND1MD1A/AND1MD1B Function and Feature

Remarks

Basic function

Provides 32 E1 interfaces. Supports the hot swappable function. Detects the temperature and voltage of the board.

Interface function

Impedance supported by the interface

AND1MD1A: 75 ohms AND1MD1B: 120 ohms

Supports the E1 and CE1 modes. Supports the master/slave clock mode. Supports the HDB3 line coding (unconfigurable). Supports inloops and outloops. Supports the PRBS function in framed or unframed mode of an E1 interface in the receive/transmit direction. ATM

Number of supported ATM E1 services

32

Number of supported IMA groups

32

Maximum number of E1 links in each IMA group

16a

Encapsulates ATM VPC/VCC service to the PWE3 in the Nto-1 (N≤32) or 1-to-1 format.

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Remarks Supports the ATM bundle function.

TDM

Number of supported PVCs/ PVPs

512

Number of supported local ATM CCCs

64

Number of supported remote ATM PWE3s

128

Supports CES services in CESoPSN and SAToP modes. Supports the timeslot compression function. For services in CESoPSN mode, a minimum of 1 timeslots can be bundled during serial port configuration. Supports fractional E1. Different timeslots of an E1 can be bound to different CES PWs.

PPP

Clock

Number of supported local TDM CCCs

16

Number of supported remote TDM PWE3s

32

Number of supported PPP links

32

Number of supported MLPPP groups

16

Maximum number of links supported by each ML-PPP group

16b

Supports physical-layer clock synchronization.

NOTE a: In the case of the AND1MD1A/AND1MD1B, the links corresponding to the former 16 and latter 16 E1 ports cannot be bundled to an IMA group. b: In the case of the AND1MD1A/AND1MD1B, the links corresponding to the former 16 and latter 16 E1 ports cannot be bundled to an ML-PPP group.

5.11.3 Working Principle and Signal Flow The AND1MD1A/AND1MD1B mainly consists of the service access module, service processing module, management module, clock module, and power supply module. Figure 5-30 shows the functional block diagram of the AND1MD1A/AND1MD1B.

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Figure 5-30 Functional block diagram of the AND1MD1A/AND1MD1B Backplane 32 x E1

Service access module

Service signal Management bus

Line clocks

3.3V . . .

Service signal CXP

Management bus

Management module

Clock module

Service processing module

. . .

1V

Power supply module

-48V/-60V

System power supply

-48V/-60V

System power supply

System clocks Line clocks

CXP

CXP CXP

Transmit Direction The service signals from the control board are sent to the service processing module. The service processing module performs PWE3 decapsulation and PW scheduling for the service signals, processes the service signals based on the IMA/ATM, CES, and ML-PPP protocols, performs the E1 framing function, and sends the service signals to the service access module. The service access module performs encoding and line drive for the signals and outputs the signals through the backplane-side interfaces.

Receive Direction The board accesses service signals through the backplane-side interfaces, and then the signals are sent to the service access module. The service access module performs interference isolation, lightning-proof, impedance matching, level conversion, signal balancing, decoding, and then sends the processed signals to the service processing module. The service processing module performs E1 framing, processes service signals based on the IMA/ATM, CES, and ML-PPP protocols, implements PWE3 encapsulation and PW scheduling, and sends the signals to the control board through the backplane-side interfaces.

Service Access Module This module performs the following functions: l

In the receive direction, this module isolates common mode interference, protects circuits against transient failures, matches the impedance in the receive direction with the internal impedance, and performs level conversion, balancing, and decoding for the service signals. Finally, this module sends the processed signals to the service processing module.

l

In the transmit direction, this module receives the service signals from the service processing module, encodes the signals, drives the line, and outputs the service signals through the backplane-side interfaces.

l

This module recovers the line clock.

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Service Processing Module This module performs the following functions: l

In the receive direction, this module receives the signals from the service access module and performs E1 framing. This module also identifies protocol types of the service signals, processes the service signals based on the IMA/ATM, CES, and ML-PPP protocols (for example, addition and deletion of IMA group members, VP/VC switching and concatenation of ATM cells, vacant slot compression of CES services, and setup of MLPPP groups). Then, this module performs PWE3 encapsulation and PW scheduling, Finally, this module converts the processed signals to high-rate signals, and then sends the signals to the control board through the backplane-side interfaces.

l

In the transmit direction, this module receives the high-rate signals from the control board through the backplane-side interfaces and recovers low-rate service signals. Then, this module performs PWE3 decapsulation, identifies different protocols and processes the service signals, and completes E1 framing. Finally, this module sends the processed signals to the service access module.

Management Module This module manages and controls each module on the board.

Clock Module This module performs the following functions: l

When used with the control board, processes the recovered line clock.

l

Provides the working clock for each module on the board.

Power Supply Module This module converts the input DC voltage into various DC voltages required by each module on the board.

5.11.4 Technical Specifications The technical specifications of the AND1MD1A/AND1MD1B include the interface specifications and physical specifications.

Interface Specifications Table 5-57 lists the specifications of the interfaces on the AND1MD1A/AND1MD1B. Table 5-57 Specifications of the interfaces on the AND1MD1A/AND1MD1B Item

Specification Requirement

Nominal bit rate (kbit/s)

2048

Interface impedance

75 ohms (MD1A) 120 ohms (MD1B)

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Item

Specification Requirement

Interface code

HDB3

Pulse waveform at the output interface

Complies with ITU-T G.703

Attenuation tolerance of the input interface at the point with a frequency of 1024 kHz (dB)

0 to 6

Anti-interference capability of the input interface

Complies with ITU-T G.703

Input jitter tolerance

Complies with ITU-T G.823

Output jitter

Complies with ITU-T G.823

Physical Specifications Board dimensions (mm): 20.32 (H) x 225.75 (D) x 193.80 (W)(0.80 in.×8.89 in.×7.63 in.) Weight (kg): 0.49(1.08 lb) Power consumption (W, room temperature): 12.1

5.12 AND1MO1C - 8 Channels T1 Interface Board The AND1MO1C (MO1C for short) is an 8-channel electrical interface board, whose functional version is AND1. The AND1MO1C can be housed in slot3, slot4.

5.12.1 Front Panel On the front panel of the AND1MO1C board, there are indicators and interfaces.

Appearance of the Front Panel Figure 5-31 shows the appearance of the front panel of the AND1MO1C board. Figure 5-31 Appearance of the front panel

Indicator The following indicators are present on the front panel of the AND1MO1C board: Issue 01 (2013-10-31)

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l

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STAT indicator, red, green, or orange, which indicates the working status

For details on the meaning of indicators, see 12.1 Indicators.

Port Name Table 5-58 lists the number of interfaces, types, and usage of the interfaces on the AND1MO1C board. Table 5-58 Interfaces on the AND1MO1C board Interfac e on the Front Panel

Interfac e Type

Usage

Pin

Required Cable

T1 0-T1 7

RJ-45

Input/output interfaces for T1 electrical signals

For details, see Table 5-59.

-

Table 5-59 Pins of the RJ-45 connector of the AND1MO1C board Front View

87654321

Pin No.

Usage

1

Transmit positive TTip

2

Transmit negative TRing

3

Unspecified

4

Receive positive RTip

5

Receive negative RRing

6

Unspecified

7

Grounding terminal

8

Grounding terminal

5.12.2 Functions and Features The AND1MO1C board receives 8 x T1 signals and works with the system control board to process the received signals. The AND1MO1C board supports various service types, including CES and ML-PPP. Table 5-60 lists the functions and features of the AND1MO1C board.

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Table 5-60 Functions and features of the AND1MO1C board Function and Feature

Description

Basic function

Provides eight T1 interfaces. Supports the hot swappable function. Detects the temperature and voltage of the board.

Interface function

Supports the 100 ohm impedance. Supports the T1 and CT1 modes. Supports the master/slave clock mode. Supports the AMI and B8ZS line coding. Supports inloops and outloops. Supports PRBS tests in framed or unframed mode for T1 interfaces in both the transmit and receive directions.

Supports the TDM and PPP protocols. TDM

PPP

Clock

Supports CES services in CESoPSN and SAToP modes. Number of supported local TDM CCCs

4

Number of supported remote TDM PWE3s

8

Number of supported PPP links

8

Number of supported ML-PPP groups

8

Maximum number of links supported by each ML-PPP group

8

Supports physical-layer clock synchronization.

5.12.3 Working Principle and Signal Flow The AND1MO1C board consists of the service access module, service processing module, management module, clock module, and power module. Figure 5-32 shows the functional block diagram of the AND1MO1C board.

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Figure 5-32 Functional block diagram of the AND1MO1C board Backplane 8 x T1

Service access module

Service signal Management bus

Line clocks

3.3V 3.3V 2.5V 1.8V 1.2V 1V

Service signal CXP

Management bus

Management module

Clock module

Service processing module

. . .

Power supply module

Line clocks

CXP

-48V/-60V

System power supply

-48V/-60V

System power supply

System clocks

CXP CXP

In the Transmit Direction Service signals from the control board are sent to the service processing module. When receiving the service signals, the service processing module decapsulates and schedules PWs, processes CES and ML-PPP protocols, frames T1 signals, and then sends the framed T1 signals to the service access module. The service access module encodes the T1 signals, drives the line, and outputs the service signals through the interfaces on the front panel.

In the Receive Direction T1 signals are received through interfaces on the front panel and are sent to the service access module. When receiving the signals, the service access module isolates the signals from interference, provides surge protection, matches resistance, converts signal levels, restores clock data, balances signals, and decodes signals. Finally, the service access module sends the signals to the service processing module. The service processing module frames T1 signals, processes the signals according to CES and ML-PPP protocols, performs PWE3 encapsulation, schedules PWs, and sends the signals to the control board through backplane interfaces.

Service Access Module This module performs the following functions: l

In the receive direction, this module isolates signals from common-mode interference, protects circuit against transient states, matches resistance, converts signal levels, balances and decodes the signals. Finally, this module sends the signals to the service processing module.

l

In the transmit direction, this module receives service signals from the service processing module, encodes the signals, drives the line, and outputs signals through interfaces on the front panel.

l

This module also recovers the line clock.

Service Processing Module This module performs the following functions: Issue 01 (2013-10-31)

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l

In the receive direction, this module receives signals from the service access module and frames E1 signals. Then it identifies the protocol type of the signals and processes the signals accordingly. For example, if the protocol type is ML-PPP, this module creates an ML-PPP group. After that, it performs PWE3 encapsulation and schedules PWs. Finally, this module converts the signals into high-rate signals and sends them to the control board through backplane interfaces.

l

In the transmit direction, this module receives high-rate service signals from the control board through backplane interfaces and recovers low-rate service signals. Then it performs PWE3 decapsulation, identifies the protocol type, and processes the signals accordingly. Finally, this module frames T1 signals and sends the signals to the service access module.

Management Module This module manages and controls other modules on the board.

Clock Module This module performs the following functions: l

Works with the control board to process the recovered line clock signals.

l

Provides working clock signals for each module on the board.

Power Supply Module This module converts the input DC voltage into various DC voltages required by each module on the board.

5.12.4 Technical Specifications Technical specifications of the AND1MO1C board include interface specifications and physical specifications.

Interface Specifications Table 5-61 lists the specifications of interfaces on the AND1MO1C board. Table 5-61 Specifications of interfaces on the AND1MO1C board

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Item

Specification

Nominal bit rate

1544 kbit/s

Interface impedance

100 ohm

Code

B8ZS

Pulse shape at output port

Compliant with ITU-T G.703

Anti-interference capability of input port

Compliant with ITU-T G.703

Input jitter tolerance

Compliant with ITU-T G.824

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Item

Specification

Output jitter

Compliant with ITU-T G.824

Physical Specifications Board dimensions (mm): 20.32 (height) x 225.75 (depth) x 193.8 (width) Weight (kg): 0.59(1.30 lb) Power consumption at room temperature (W): 10.6

5.13 AND1AVD8A - 8 Channels ADSL2+ Service Interface Board The AND1AVD8A (AVD8A for short) is an 8-channel ADSL2+ service interface board, whose functional version is AND1. The AND1AVD8A can be housed in slot3, slot4.

5.13.1 Front Panel On the front panel of the AND1AVD8A, there are indicators and interfaces.

Front Panel Figure 5-33 shows the appearance of the front panel of the AND1AVD8A. Figure 5-33 Front panel of the AND1AVD8A

Indicators The following indicators are present on the front panel of the AND1AVD8A. l

STAT indicator, red, green, or orange, which indicates the working status NOTE

There are eight LINK indicators, which are present above each service interface.

For details on indications of indicators, see 12.1 Indicators.

Interfaces There are eight ADSL2+ interfaces on the front panel of the AND1AVD8A. Table 5-62 lists types and usage of these interfaces. Issue 01 (2013-10-31)

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Table 5-62 Interfaces on the AND1AVD8A Interface on the Front Panel

Interface Type

Usage

Cable

DSL0-DSL7

RJ-45

Accesses ADSL2+ service signals.

For details, see 10.5.6 xDSL Cables.

Table 5-63 lists the pins of DSL1-DSL8 interfaces. Table 5-63 Pins of DSL0-DSL7 interfaces Front View

87654321

Pin

Description

1

Unspecified

2

Unspecified

3

Unspecified

4

TIP

5

RING

6

Unspecified

7

Unspecified

8

Unspecified

5.13.2 Functions and Features The AND1AVD8A is an 8-channel ADSL2+ service interface board. The AND1AVD8A on the network side must work with the control board to access and process ADSL2+ services. In addition, the AND1AVD8A supports the ADSL2+ bundling function. Table 5-64 lists functions and features of the AND1AVD8A. Table 5-64 Functions and features of the AND1AVD8A Function and Feature

Description

Basic function

Provides eight ADSL2+ interfaces. Used on the NNI side. Supports the hot swappable function. Detects the temperature and voltage of the board.

Interface function Issue 01 (2013-10-31)

Provides 4 binding groups.

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Description Supports the ETHoA-LLC and ETHoA-VCMUX modes. Supports two xDSL protocol modes: Annex A and Annex M. (The xDSL protocol mode is unconfigurable. The protocol mode configured on the DSLAM applies.)

NOTE The following groups of ADSL2+ ports are present on the board: l Group 1: port 0 and port 1 l Group 2: port 2 and port 3 l Group 3: port 4 and port 5 l Group 4: port 6 and port 7 The AND1AVD8A board provides insufficient upstream bandwidth and forwards packets with a long delay, which may affect voice services carried on it. Therefore, it is not recommended to use the AND1AVD8A board to carry base station voice services.

5.13.3 Working Principle and Signal Flow The AND1AVD8A mainly consists of the service access module, service processing module, management module, clock module, and power supply module. Figure 5-34 shows the block diagram for the working principle of the AND1AVD8A. Figure 5-34 Block diagram for the working principle of the AND1AVD8A Backplane 8 x ADSL2+ signals

Service Access Module

Service signals

Service processing module

Management bus

Management bus

NTR clock signal To each module on the AVD8A

To each module on the AVD8A

12V . . . 1.2V

CXP

Management bus

Management module

Working clock signals

Service signals

CXP

Clock signals Clock C module

CXP

-48V/-60V Power supply module

-48V/-60V

PIU PIU

Transmit Direction The control board sends signals to the service processing module through the backplane-side interfaces. When receiving the service signals, the service processing module encapsulates the service packets in ETHOA mode, and then sends the packets to the service access module, where Issue 01 (2013-10-31)

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encoding and D/A conversion are performed. Finally, the signals are output through the backplane-side interfaces.

Receive Direction The service access module accesses ADSL2+ service signals through the backplane-side interfaces. The service access module performs A/D conversion and decoding on the signals, and then sends the signals to the service processing module. The service processing module decapsulates the service packets in ETHOA mode, and then sends the processed packets to the control board.

Service Access Module This module performs the following functions: l

In the receive direction, this module accesses ADSL2+ service signals through the backplane-side interfaces, performs amplification, filtering, A/D conversion, balancing, decoding, and verification on the signals, and then sends the signals to the service processing module.

l

In the transmit direction, this module receives the service signals from the service processing module, performs framing, encoding, D/A conversion, filtering, amplification, and line driving on the signals, and outputs the signals through the backplane-side interfaces.

l

When the DSLTRUNK attribute of the interfaces on the board is Bundled Group, this module implements the ADSL link bundling function.

l

This module extracts the NTR clock from the ADSL2+ service signals, and then sends the clock to the clock module.

Service Processing Module This module performs the following functions: l

In the receive direction, this module receives signals from the service access module, extracts ATM cells, and rearranges service packets. Then, this module works with the control board to decapsulate the service packets in ETHOA mode. Finally, this module outputs the high-rate service packets through the backplane-side interfaces.

l

In the transmit direction, this module receives the service packets accessed through the backplane-side interfaces, performs AAL5 SAR on the service packets, and encapsulates the service packets into ATM cells. In this manner, this module encapsulates the service packets in ETHOA mode when working with the control board. Finally, this module outputs the service packets to the service access module.

l

This module controls the committed access rate (CAR).

Management Module When used with the system control board, this module manages and controls each module on the AND1AVD8A.

Clock Module This module performs the following functions: Issue 01 (2013-10-31)

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l

Receives the NTR clock from the service access module, and processes the clock when used with the control board.

l

Provides the working clock to each module on the AND1AVD8A.

Power Supply Module This module performs the following functions: l

Accesses two -48 V or -60 V DC power supplies.

l

Provides the working power for each module on the AVD8A.

5.13.4 Technical Specifications The technical specifications of the AND1AVD8A include performance specifications, dimensions, weight, and power consumption. Table 5-65 lists the performance specifications of the AND1AVD8A. Table 5-65 Specifications of the ADSL2+ interfaces Interface

Max. Uplink Rate

Max. Downlink Rate

Max. Transmission Distance

ADSL2+

2.5 Mbit/s

24 Mbit/s

6.5 km

Board dimensions (mm): 20.32 (H) x 225.75 (D) x 193.8 (W)(0.80 in.×8.89 in.×7.63 in.) Weight (kg): 0.50(1.10 lb) Power consumption at room temperature (W):19.6 W

5.14 AND1AVD8B - 8 Channels VDSL2 Service Interface Board The AND1AVD8B (AVD8B for short) is an 8-channel VDSL2 service interface board, whose functional version is AND1. The AND1AVD8B can be housed in slot 3 or 4.

5.14.1 Front Panel On the front panel of the AND1AVD8B, there are indicators and interfaces.

Front Panel Figure 5-35 shows the appearance of the front panel of the AND1AVD8B. Figure 5-35 Front panel of the AND1AVD8B

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Indicators The following indicators are present on the front panel of the AND1AVD8B. l

STAT indicator, red, green, or orange, which indicates the working status NOTE

There are eight LINK indicators, which are present above each service interface.

For details on indications of indicators, see 12.1 Indicators.

Interfaces There are eight ADSL2+/VDSL2 interfaces on the front panel of the AND1AVD8B. Table 5-66 lists types and usage of these interfaces. Table 5-66 Interfaces on the AND1AVD8B Interface on the Front Panel

Interface Type

Usage

Cable

DSL0-DSL7

RJ-45

Accesses VDSL2 service signals.

For details, see 10.5.6 xDSL Cables.

Table 5-67 lists the pins of DSL1-DSL8 interfaces. Table 5-67 Pins of DSL0-DSL7 interfaces Front View

87654321

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Pin

Description

1

Unspecified

2

Unspecified

3

Unspecified

4

TIP

5

RING

6

Unspecified

7

Unspecified

8

Unspecified

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5.14.2 Functions and Features The AND1AVD8B is an 8-channel VDSL2 service interface board. The AND1AVD8B on the network side must work with the control board to access and process VDSL2 services. In addition, the AND1AVD8B supports the VDSL2 bundling function. Table 5-68 lists functions and features of the AND1AVD8B. Table 5-68 Functions and features of the AND1AVD8B Function and Feature

Description

Basic function

Provides eight VDSL2 interfaces. Used on the NNI side. Supports the hot swappable function. Detects the temperature and voltage of the board.

Interface function

Provides 4 binding groups. Supports Vectoring. Supports Annex B protocol mode.

NOTE The following groups of VDSL2 ports are present on the board: l Group 1: port 0 and port 1 l Group 2: port 2 and port 3 l Group 3: port 4 and port 5 l Group 4: port 6 and port 7

5.14.3 Working Principle and Signal Flow The AND1AVD8B mainly consists of the service access module, service processing module, management module, clock module, and power supply module. Figure 5-36 shows the block diagram for the working principle of the AND1AVD8B.

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Figure 5-36 Block diagram for the working principle of the AND1AVD8B Backplane 8 x VDSL2 signals

Service Access Module

Service signals

Service processing module

Management bus

Service signals CXP

Management bus

Management module

Management bus

CXP

Clock signals To each module on the AVD8B

To each module on the AVD8B

Working clock signals

12V . . . 1.2V

Clock C module

CXP

-48V/-60V Power supply module

-48V/-60V

PIU PIU

Transmit Direction The control board sends signals to the service processing module through the backplane-side interfaces. When receiving the service signals, the service processing module encapsulates the service packets, and then sends the packets to the service access module, where encoding and D/A conversion are performed. Finally, the signals are output through the backplane-side interfaces.

Receive Direction The service access module accesses VDSL2 service signals through the backplane-side interfaces. The service access module performs A/D conversion and decoding on the signals, and then sends the signals to the service processing module. The service processing module decapsulates the service packets, and then sends the processed packets to the control board.

Service Access Module This module performs the following functions: l

In the receive direction, this module accesses VDSL2 service signals through the backplane-side interfaces, performs amplification, filtering, A/D conversion, balancing, decoding, and verification on the signals, and then sends the signals to the service processing module.

l

In the transmit direction, this module receives the service signals from the service processing module, performs framing, encoding, D/A conversion, filtering, amplification, and line driving on the signals, and outputs the signals through the backplane-side interfaces.

Service Processing Module This module performs the following functions: Issue 01 (2013-10-31)

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l

In the receive direction, this module receives signals from the service access module, extracts PTM cells, and rearranges service packets. Then, this module works with the control board to decapsulate the service packets. Finally, this module outputs the high-rate service packets through the backplane-side interfaces.

l

In the transmit direction, this module receives the service packets accessed through the backplane-side interfaces, and encapsulates the service packets into PTM cells. In this manner, this module encapsulates the service packets when working with the control board. Finally, this module outputs the service packets to the service access module.

Management Module When used with the system control board, this module manages and controls each module on the AND1AVD8B.

Clock Module This module performs the following functions: l

Receives the NTR clock from the service access module, and processes the clock when used with the control board.

l

Provides the working clock to each module on the AND1AVD8B.

Power Supply Module This module performs the following functions: l

Accesses two -48 V or -60 V DC power supplies.

l

Provides the working power for each module on the AVD8B.

5.14.4 Technical Specifications The technical specifications of the AND1AVD8B include performance specifications, dimensions, weight, and power consumption. Table 5-69 lists the performance specifications of the AND1AVD8B. Table 5-69 Specifications of the VDSL2 interfaces Interface

Max. Uplink Rate

Max. Downlink Rate

Max. Transmission Distance

VDSL2

50 Mbit/s

100 Mbit/s

3.5 km

Board dimensions (mm): 20.32 (H) x 225.75 (D) x 193.8 (W)(0.80 in.×8.89 in.×7.63 in.) Weight (kg): 0.50(1.10 lb) Power consumption at room temperature (W):19.6 W Issue 01 (2013-10-31)

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5.15 AND1SHD4 - 4 Channels G.SHDSL Service Interface Board The AND1SHD4 (SHD4 for short) is a 4-channel G.SHDSL service interface board, whose functional version is AND1. The AND1SHD4 can be housed in slot3, slot4.

5.15.1 Front Panel On the front panel of the AND1SHD4, there are indicators, and interfaces.

Appearance of the Front Panel Figure 5-37 shows the appearance of the front panel of the AND1SHD4. Figure 5-37 Appearance of the front panel of the AND1SHD4

Indicators l

STAT indicator, red, green, or orange, which indicates the working status

l

LINK0/LINK1/LINK2/LINK3 indicators, green, which indicate the port connection status.

For details on indications of indicators, see 12.1 Indicators.

Interfaces Table 5-70 lists the types of the interfaces on the AND1SHD4 and their respective usage. Table 5-70 Types and usage of the interfaces on the AND1SHD4 Interface Interface on the Type Front Panel

Usage

Corresponding Cable

SHDSL0 SHDSL3

Accesses the first 4 x G.SHDSL services.

For details, see 10.5.6 xDSL Cables.

RJ-11

Table 5-71 lists the pins of theSHDSL0 - SHDSL3 interfaces.

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Table 5-71 Pins of the SHDSL0 - SHDSL3 interfaces on the AND1SHD4 Front View

6543 21

Pin No.

Usage

1

Unspecified

2

Unspecified

3

TIP

4

RING

5

Unspecified

6

Unspecified

5.15.2 Functions and Features Used with the control board, the AND1SHD4 can process the G.991.2 single-pair high-speed digital subscriber line (G.SHDSL) service. Table 5-72 lists the functions and features of the AND1SHD4. Table 5-72 Functions and features of the AND1SHD4 Function and Feature

Description

Basic function

Provides four G.SHDSL interfaces. Used on the NNI side. Supports the hot swappable function. Detects the temperature and voltage of the board.

Interface function

Supports one binding group. Supports the ATM mode and the EFM mode. Supports the extended attributes compliant with the ITU-T G. 992.1.bis in ATM mode. Supports the NTR clock.

NOTE The AND1SHD4 supports one binding group. l When the AND1SHD4 is in ATM mode, interface binding needs to be manually configured. l When the AND1SHD4 is in EFM mode, the ATN device automatically adapts to the interface binding configuration on the DSLAM.

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5.15.3 Working Principle and Signal Flow The AND1SHD4 mainly consists of the service access module, interface converting module, clock module, and power supply module. Figure 5-38 shows the block diagram for the working principle of the AND1SHD4. Figure 5-38 Block diagram for the working principle of the AND1SHD4 Backplane Each module of the board

Signal voltage and performs protection module

4 x G.SHDSL signals

Clock signals Clock module

Service bus Service encapsulation and bundling Management bus module

Logic control unit

Clock signals

Parallel/serial converting module

Service bus

Serial management bus Status signal

CXP

CXP

CXP CXP

Interface converting and control module

Service access module

To each module

1.2 V 1.5 V 3.3 V

Power supply module

-48V/-60V

System power supply

-48V/-60V

System power supply

In the Transmit Direction The control board sends the service signals to the parallel/serial converting module and then to the logic control unit, which processes the service signals. Finally, the service encapsulation and bundling module decapsulates the service signals and outputs the G.SHDSL service.

In the Receive Direction The service board accesses the G.SHDSL signals and the service access module transforms the signal voltage and performs protection for the signals. Then, the service encapsulation and bundling module encapsulates and bundles the signals, adjusts the signal rate, frames the signals, and then sends the signals to the logic control module, which processes the service signals. Finally, the parallel/serial converting module converts and sends the service signals to the control board.

Service Access Module l

The service access module transforms the signal voltage and performs protection for the access signals. Then, the service encapsulation and bundling module bundles four channels of G.SHDSL signals, strips the ATM AAL5 adaptation layer, and finally outputs the service signals.

l

The interface converting and control module sends the service to the service encapsulation and bundling module, which then performs ATM AAL5 adaptation and encapsulation, and finally outputs the G.SHDSL service.

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Interface Converting and Control Module This module performs parallel/serial conversion for transporting the service between the system control board and the local board. The system control board controls and manages the board through the serial management bus. In addition, the logic control unit detects alarms and reports them to the control board through the serial management bus.

Clock Module The clock module provides working clock for each module on the AND1SHD4.

Power Supply Module This module provides DC voltages required by each module on the board.

5.15.4 Technical Specifications The technical specifications of the AND1SHD4 cover the performance specifications, board dimensions, weight, and power consumption. Table 5-73 lists the performance specifications of the AND1SHD4. Table 5-73 Specifications of the interfaces on the AND1SHD4 Interface

Max. Upstream Rate

Max. Downstream Rate

Max. Four-Line Bundling Rate

Max. Transmission Distance

G.SHDSL

5.7 Mbit/s

5.7 Mbit/s

23 Mbit/s

5.25 km

Board dimensions (mm): 20.32 (H) x 225.75 (D) x 193.80 (W)(0.80 in.×8.89 in.×7.63 in.) Weight (kg): 0.60(1.32 lb) Power consumption (W, room temperature): 7.4

5.16 AND1SHD4I - 4 Channels G.SHDSL Interface Board for IMA Mode The AND1SHD4I (SHD4I for short) is a 4-channel G.SHDSL service interface board, whose functional version is AND1. The AND1SHD4I can be housed in slot3, slot4.

5.16.1 Front Panel On the front panel of the AND1SHD4I, there are indicators and interfaces. Issue 01 (2013-10-31)

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Appearance of the Front Panel Figure 5-39 shows the appearance of the front panel of the AND1SHD4I. Figure 5-39 Appearance of the front panel of the AND1SHD4I

Indicator The following indicators are present on the front panel of the AND1SHD4I: l

STAT indicator, red, green, or orange, which indicates the working status

l

LINK0, LINK1, LINK2 and LINK3 indicators, green, which indicate the port connection status.

For details on indications of indicators, see 12.1 Indicators.

Interface Table 5-74 lists the types of the interfaces on the AND1SHD4I and their respective usage. Table 5-74 Types and usage of the interfaces on the AND1SHD4I Interface on the Front Panel

Interface Type

Usage

Corresponding Cable

SHDSL0SHDSL3

RJ-11

Input and output G.SHDSL signals.

For details, see 10.5.6 xDSL Cables.

Table 5-75 lists the pins of the SHDSL1-SHDSL4 interfaces. Table 5-75 Pins of the SHDSL0 - SHDSL3 interfaces on the AND1SHD4I Front View

6 5 4 3 2 1

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Pin No.

Usage

1

Unspecified

2

Unspecified

3

TIP

4

RING

5

Unspecified

6

Unspecified

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5.16.2 Functions and Features The AND1SHD4I can access four channels of G.SHDSL signals encapsulated in the IMA format when it is used with the control board. Table 5-76 lists the functions and features of the AND1SHD4I. Table 5-76 Functions and features of the AND1SHD4I Function and Feature

Description

Basic Function

Provides four G.SHDSL interfaces. Used on the NNI side. Supports the hot swappable function. Detects the temperature and voltage of the board.

Interface function

Supports one binding group. Supports the IMA mode. Supports the NTR clock.

NOTE The IMA binding group of the AND1SHD4I has a fixed number of member links, that is, 4. No manual configuration is required. The AND1SHD4I supports one IMA binding group, but two VE interfaces can be created for the active and standby service trails to protect services.

5.16.3 Working Principle and Signal Flow The AND1SHD4I mainly consists of the service access module, interface converting and control module, IMA processing module, clock module, and power supply module. Figure 5-40 shows the block diagram for the working principle of the AND1SHD4I.

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Figure 5-40 Block diagram for the working principle of the AND1SHD4I Management and control bus

IMA processing module

4 x G.SHDSL signals

Service access module

Backplane Service signals

IMA service signals ATM cells

IMA service signals

Interface converting and control module

Serial management bus

Status signal bus

Management and control bus

CXP

CXP

CXP

4 x NTR clock signals

To each module on the SHD4I

Working clock signals

To each module on the SHD4I

3.3 V 1.8 V 1.5 V 1.2 V

Clock module

Power supply module

Clock signals

CXP

-48 V/-60 V

System power supply

-48 V/-60 V

System power supply

In the Receive Direction The RJ-11 interfaces access the G.SHDSL signals to the service access module. Then, the service access module works with the IMA processing module to multiplexes the service signals, and sends the ATM cells to the interface converting and control module. The interface converting and control module decapsulates the ATM frames, converts the parallel signals to serial signals, converges the serial signals to one channel service signal, and finally sends the service signal to the backplane.

In the Transmit Direction The interface converting and control module receives the service signal from the backplane, converts the serial signal to parallel signal, encapsulates the signals in the ATM frame format, and then sends the ATM frames to the service access module. The service access module processes the ATM cells and work with the IMA processing module to inversely multiplex the ATM signals as IMA signals. Finally, the service access module sends the packets to the G.SHDSL interfaces.

Service Access Module This module accesses the service packets in different modes according to the encapsulation mode of the G.SHDSL interfaces. In addition, this module has the thunder protection function. l

In the receive direction, this module converts the serial packets to parallel packets, and sends the parallel packets to the interface converting and control module.

l

In the transmit direction, this module receives the IMA service signals from the interface converting and control module, converts the serial IMA service signals to parallel IMA service signals, and finally sends the parallel IMA service signals to the G.SHDSL interfaces.

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In addition, this module extracts the NTR clock signals from the G.SHDSL service signals received and sends the clock signals to the clock module.

Interface Converting and Control Module This module converges the G.SHDSL service signals to one channel service signal and works with the control board to manage and control the SHD4I. l

In the receive direction, this module receives the IMA service signals from the service access module, converts the IMA service signals, and sends the service signals to the IMA processing module, which multiplexes the service signals. Then, this module receives the ATM cells from the IMA processing module, decapsulates the ATM frames, converts the parallel signals to serial signals, converges the signals to one channel service signal, and finally sends the service signal to the backplane.

l

In the transmit direction, this module receives the service signal from the backplane, converts the serial signal to parallel signal, encapsulates the service signal into ATM frames, and sends the ATM cells to the IMA processing module, which inversely multiplexes the ATM signals. Then, this module receives IMA signals from the IMA processing module and finally sends the IMA signals to the service access module.

l

In addition, this module works with the control board to manage and control each module on the AND1SHD4I.

IMA Processing Module This module performs the following functions: l

In the receive direction, this module receives the IMA service signals from the interface converting and control module, multiplexes the service signals as ATM signals, and finally sends the ATM signals to the interface converting and control module, which converges the signals.

l

In the transmit direction, this module receives the service signals from the backplane after the interface converting and control module processes the service signals. Then, this module inversely multiplexes the ATM signals and sends the IMA service signals to the interface converting and control module.

Clock Module This module performs the following functions: l

Selects a clock source from the four channels of NTR clock signals and uploads the clock signals to the control board.

l

Provides working clock signals for each module on the SHD4I board.

Power Supply Module This module provides the following DC voltages for the modules on the AND1SHD4I board: l

3.3 V

l

1.8 V

l

1.5 V

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5 ATN 910 Boards

1.2 V

5.16.4 Technical Specifications The technical specifications of the AND1SHD4I cover the interface specifications, board dimensions, weight, and power consumption. Table 5-77 lists the specifications of the interfaces of the AND1SHD4I. Table 5-77 Specifications of the interfaces on the AND1SHD4I Interface

Max. Upstream Rate (Mbit/s)

Max. Downstream Rate (Mbit/s)

Max. Rate of Four Bundled Interfaces (Mbit/s)

Max. Transmission Distance (km)

G.SHDSL

2.3

2.3

9.2

5.25

Board dimensions (mm): 20.32 (H) x 225.75 (D) x 193.82 (W)(0.80 in.×8.89 in.×7.63 in.) Board weight (kg): 0.60(1.32 lb) Power consumption (W, room temperature): 7.5

5.17 TNC1PIU - Power Interface Board The TNC1PIU (PIU for short) is a power interface board. The function version of the PIU is TNC1. The PIU is housed in slot 5.

5.17.1 Front Panel On the front panel of the PIU, there are indicators, power supply interfaces, and a label.

Appearance of the Front Panel Figure 5-41 shows the appearance of the front panel of the PIU. Figure 5-41 Appearance of the front panel of the PIU

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Indicators The following indicator is present on the front panel of the PIU. PWRA/PWRB, green, which indicates the power supply status. When PWRA/PWRB is on and green, it indicates that power is accessed. For details on indications of indicators, see 12.1 Indicators.

Interfaces The PIU accesses two power supplies. Table 5-78 lists the types of the interfaces on the PIU and their respective usage. For cable corresponding to the interfaces, see 10.1 Power Supply Cables and Ground Cables. Table 5-78 Types and usage of the interfaces on the PIU Interface on the Front Panel

Usage

NEG1(-)

-48 V power input interface

RTN1(+)

BGND power input interface

NEG2(-)

-48 V power input interface

RTN2(+)

BGND power input interface

Label Operation warning label: indicates the following precautions , which should be taken for removal or insertion of the PIU board.

NOTICE Multiple power supplies are accessed for the equipment. When powering off the equipment, make sure that these power supplies are disabled. Do not remove or insert the board with power on.

5.17.2 Functions and Features The PIU, a power interface board, supports the functions and features such as power access, power protection, surge protection detection, and information reporting. Table 5-79 lists functions and features of the PIU.

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Table 5-79 Functions and features of the PIU Function and Feature

Description

Power access

PIU accesses two -48 V DC or -60 V DC power supplies for the equipment.

Power protection

The PIU protects the power supply against overcurrent and short circuit. In this way, the overcurrent is prevented from shocking board and components on it.

Surge protection

The PIU protects the equipment against lightning and reports an alarm if the protection fails.

Power backup

The two DC power supplies back up each other.

5.17.3 Working Principle and Signal Flow The PIU mainly consists of the surge protection and failure detection module, communication unit module, and board in-position module. Figure 5-42 shows the block diagram for the working principle of the PIU. Figure 5-42 Block diagram for the working principle of the PIU -48 V/-60 V

Surge protection and failure detection module

-48 V/-60 V

Surge protection and failure detection module

Surge protection failure alarm signals Communication

Board in-position module

Backplane Each board

Surge protection failure alarm signals

Each board

Inter-board communication bus

CXP

Board in-position signals

CXP

Surge Protection and Failure Detection Module This module protects the equipment against lightning and detects the failure of the anti-lightning circuit. If the surge protection fails, the PIU reports the alarm signals to the control board.

Communication Unit Module This module has the function of reporting the board manufacturing information, PCB version information, and alarm signals about the surge protection failure.

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Board In-Position Module This module reports the board in-position signals to the control board.

5.17.4 Technical Specifications The technical specifications of the PIU cover the board dimensions, weight, power consumption, and input voltage. Table 5-80 lists the technical specifications of the PIU. Table 5-80 Technical specifications of the PIU Item

Technical Specification

Board dimensions (mm)

41.4 (H) x 224.8 (D) x 21.0 (W)

Weight (kg)

0.12

Power consumption (W, room temperature)

0.5

Input voltage (V)

-38.4 to -72.0

5.18 ANC1FAN - Fan Board The ANC1FAN (FAN for short) is an FAN board. The function version of the FAN is ANC1. The FAN is housed in slot 6.

5.18.1 Front Panel On the front panel of the FAN, there are indicators, ESD wrist strap jack, handle, and labels.

Appearance of the Front Panel Figure 5-43 shows the appearance of the front panel of the FAN. Figure 5-43 Appearance of the front panel

Indicators The following indicators are present on the front panel of the FAN: Issue 01 (2013-10-31)

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ANC1FAN indicator, red or green, which indicates status of fans. For details on indications of indicators, see 12.1 Indicators.

ESD Strap Jack The ESD wrist strap should be connected to this jack for proper grounding of the human body.

Handle The handle is used for pushing the FAN into or pulling the FAN out of the chassis during board replacement.

Label The following labels are present on the front panel of the FAN: l

ESD protection label, which indicates that the equipment is static-sensitive.

l

Fan warning label, which says that do not touch the fan leaves before the fan stops rotating.

5.18.2 Functions and Features The FAN is used to adjust the fan rotating speed, detect and report status of fans. The functions and features of the FAN are as follows: l

Accesses one 12 V power supply for driving three fans.

l

Provides start-delay for the power supply of the fans and protects fans against overcurrent.

l

Intelligently adjusts the rotating speed of fans to ensure proper heat dissipation of the system.

l

Reports information about the fan rotating speed, environment temperature, alarms, version number, and board in-position information.

l

Provides alarm indicators.

5.18.3 Working Principle and Signal Flow The FAN mainly consists of the start-delay module, communication unit module, intelligent fan speed adjustment module, and board in-position module. Figure 5-44 shows the block diagram for the working principle of the FAN.

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Figure 5-44 Block diagram for the working principle of the ANC1FAN Fans x 3 12 V

Backplane

12 V 12 V

CXP

12 V power shut signals Communication unit module

Fan-speed reporting module PWM signals

12V

Start-delay module

Inter-board communication bus CXP

Fan-speed signals CXP

PWM driver module Intelligent fan speed adjustment module Board in-position module

CXP

Fan in-position signals CXP

Start-delay Module This module has the function of provides start-delay to the power supply for fans and protects fans against overcurrent.

Communication Unit Module This module reports the board manufacturing information, PCB version, and environment temperature information. In addition, this module provides 12 V power shut signals to the startdelay module.

Intelligent Fan Speed Adjustment Module This module reports information about the fan rotating speed to the control board and adjusts the fan rotating speed according to the pulse-width modulation (PWM) signals received from the control board.

Board In-Position Module This module reports the board in-position signals to the control board.

5.18.4 Technical Specifications The technical specifications of the FAN cover the board dimensions, weight, power consumption, and input voltage. Issue 01 (2013-10-31)

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Table 5-81 lists the technical specifications of the FAN. Table 5-81 Technical specifications of the FAN Item

Technical Specification

Board dimensions (mm)

42.0 (H) x 217.6 (D) x 28.5 (W)

Weight (kg)

0.20

Power consumption (W)

l Low rate: 2.3 l Medium rate: 6.1 l High rate: 17

Working voltage (V)

12 V DC power

5.19 Filler Panel A filler panel is used to cover any vacant slot in a chassis.

5.19.1 Appearance and Valid Slots There is no indicator or interface on a filler panel.

Appearance Figure 5-45 shows the appearance of a filler panel. Figure 5-45 Appearance of a filler panel

Valid Slots A filler panel can be housed in any of slots 3-4 of a chassis.

5.19.2 Functions and Features A filler panel can be used to perform electromagnetic shielding, keep out foreign substances, and ensure proper ventilation. Main functions of a filler panel are as follows: l

Performs electromagnetic shielding and ensures that the chassis meets the requirement of electromagnetic radiation.

l

Prevents foreign substances from getting into the chassis.

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l

Prevents internal voltage from being exposed.

l

Ensures proper ventilation of cooling current inside the chassis.

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6

ATN 910I Boards

ATN 910I has integrated with boards that are not swappable.

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7

ATN 910B Boards

ATN 910B has integrated with boards that are not swappable.

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8

ATN 950B Boards

About This Chapter Boards on ATN 950B are used together to provide various functions. 8.1 Board Overview A board mainly consists of the printed circuit board (PCB) and the front panel. 8.2 Board Type and Application This section describes the applications and differences between different types of PIC boards. 8.3 AND1CXPA/AND1CXPB - System Control, Cross-connect, and Multi-protocol Process Unit The AND1CXPA/AND1CXPB (CXPA/CXPB for short) is a control, cross-connect, and protocol processing board. The function version of the CXPA/CXPB is AND1. The CXPA/ CXPB is housed in slot 7 or slot 8. 8.4 AND2CXPA/AND2CXPB/AND2CXPE - System Control, Cross-connect, and Multiprotocol Process Unit The AND2CXPA/AND2CXPB/AND2CXPE (CXPA/CXPB/CXPE for short) is a control, cross-connect, and protocol processing board. The function version of the CXPA/CXPB/CXPE is AND1. The CXPA/CXPB/CXPE is housed in slot 7 or slot 8. 8.5 AND1EM4T - 4 Channels GE/FE Electrical Interface Board The AND1EM4T (EM4T for short) is a four channels FE/GE adaptive electrical interface board. The function version of the EM4T is AND1. The AND1EM4T is housed in any of slots 1 to 4 (when working with the AND1CXPA/AND1CXPB) and in any of slots 1 to 6 (when working with the AND2CXPA/AND2CXPB/AND2CXPE). 8.6 AND1EM8T - 8 Channels GE/FE Electric Interface Board The AND1EM8T (EM8T for short) is an eight channels FE/GE adaptive electrical interface board. The function version of the EM8T is AND1. The AND1EM8T is housed in any of slots 1 to 2. 8.7 AND1EM4F - 4 Channels GE/FE Optical Interface Board The AND1EM4F (EM4F for short) is a four channels FE/GE optical interface board. The function version of the EM4F is AND1. The AND1EM4F is housed in any of slots 1 to 4 (when

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working with the AND1CXPA/AND1CXPB) and in any of slots 1 to 6 (when working with the AND2CXPA/AND2CXPB/AND2CXPE). 8.8 AND1EM4C: 4 Channels GE/FE Combo Board The AND1EM4C (EM4C for short) board is a 4 x FE/GE Combo board and its functional version is AND1. The AND1EM4C is housed in any of slots 1 to 4 (when working with the AND1CXPA/ AND1CXPB) and in any of slots 1 to 6 (when working with the AND2CXPA/AND2CXPB/ AND2CXPE). 8.9 AND1EM8F - 8 Channels GE/FE Optical Interface Board The AND1EM8F (EM8F for short) is an eight channels FE/GE optical interface board. The function version of the EM8F is AND1. The AND1EM8F is housed in any of slots 1 to 2. 8.10 AND1EX1 - 1 Channel 10 GE Optical Interface Board The AND1EX1 (EX1 for short) is a one channel 10 GE optical interface board. The function version of the EX1 is AND1. The AND1EX1 is housed in any of slots 5 to 6 (when working with the AND1CXPA), in any of slots 3 to 6 (when working with the AND1CXPB), and in any of slots 1 to 6 (when working with the AND2CXPA/AND2CXPB/AND2CXPE). 8.11 AND2CQ1B - 4 Channels Channelized OC-3c/STM-1c POS Optical Interface Board This section describes the AND2CQ1B, a 4 channels channelized OC-3c/STM-1c POS optical interface board, in terms of the overview, functions, features, working principle, front panel, and technical specifications. 8.12 AND2PQ1: 4 Channels OC-3/STM-1 POS Optical Interface Board The AND2PQ1 (PQ1 for short) board is a 4 x OC-3/STM-1 POS optical interface board and its functional version is AND2. It is configured in any of slots 1 to 6 in a chassis. 8.13 AND1ML1/AND1ML1A - 16 Channels E1 Electrical Interface Board The functional version of the AND1ML1/AND1ML1A is AND1.. 8.14 AND3ML1A/AND3ML1B - 16 Channels E1 Interface Board The AND3ML1A/AND3ML1B (ML1A/ML1B for short) is a 16 channels E1 interface board. The function version of the ML1A/ML1B is AND3. The AND3ML1A/AND3ML1B is housed in slots 1 to 6. 8.15 AND2MD1A/AND2MD1B - 32 Channels E1 Interface Board The AND2MD1A/AND2MD1B (MD1A/MD1B for short) is a 32 channels E1 interface board. The function version of the MD1A/MD1B is AND2. The AND2MD1A/AND2MD1B is housed in slots 1 to 6. 8.16 TND1PIU - Power Interface Board The TND1PIU (PIU for short) is a power interface board. The function version of the PIU is TND1. The PIU is housed in slot 9 or slot 10. 8.17 AND1FAN - Fan Board The AND1FAN (FAN for short) is an FAN board. The function version of the FAN is AND1. The FAN is housed in slot 11. 8.18 Filler Panel A filler panel is used to cover any vacant slot in a chassis.

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8.1 Board Overview A board mainly consists of the printed circuit board (PCB) and the front panel.

Board Structure Figure 8-1 shows the structure of a board (using the AND1EM4F board as an example). Figure 8-1 Board structure

A board mainly consists of the following parts: l

PCB The PCB houses various functional chips of the board and is the most important part of the board. Through the front panel, the PCB provides indicators, buttons, and ports. NOTE

Different boards provide different indicators, buttons, and ports; not all boards support a daughter board. For details, see the description of each board.

l

Front panel, including the captive screws, ejector levers, indicators, buttons, and interfaces. – Captive screws: secure the board in the subrack. – Ejector levers: used for inserting or removing the board. Bar codes are also attached on the ejector levers. NOTE

The ejector lever on the left side of the front panel of a board is attached with a label marking the bar code of the board (for a control board, the bar code label is above the ejector level on the front panel). The bar code of a control board will be retrieved by ATN 950B as the equipment serial number (ESN). The ESN is used for applying for a license. ATN 950B automatically reads the bar code of the backplane or control board as the device ESN. Generally, the bar code of the backplane takes precedence over that of the control board.

Board Naming NOTE

The preceding only describes how to roughly identify a board. For details on board specifications, see board descriptions.

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A board name mainly consists of the board functional version and short name. A short name can roughly identify a board. The short name of a control board, power board, and fan board is CXPx, PIU, and FAN respectively. The following mainly describes how to quickly identify a physical interface board through the short name of a board. As shown in Figure 8-2, the short name of a board consists of an abbreviated board name and an extended name. An abbreviated board name includes the board type, interface quantity, and interface rate. When boards have the same abbreviated board name, they can be differentiated using extended names. An extended name does not have special meanings and can be omitted. Figure 8-2 Board short name (using ML1A as an example)

ML1A Extended name Interface rate Interface quantity Board type

The following describes each part of an abbreviated board name: l

Board type M indicates an E-carrier interface board. The interface quantity is represented using L or D, indicating 16 or 32 respectively. The interface rate is represented using 1, indicating E1.

l

Board type C indicates a CPOS interface board. The interface quantity is represented using Q, indicating 4. The interface rate is represented using 1, indicating STM-1.

l

Board type P indicates a POS interface board. The interface quantity is represented using Q, indicating 4. The interface rate is represented using 1, indicating STM-1.

l

Board type E indicates an Ethernet interface board. The interface quality is represented using an Arabic numeral. The interface rate is represented using M or X, indicating FE/GE or 10GE respectively. Extended name F or T is used to indicate an optical interface or electrical interface respectively. NOTE

For the name of an Ethernet interface board, the interface rate and quantity rate are in an order opposite to those for the names of other boards. For example, in EM4F (a name of an Ethernet interface board), interface rate M comes before interface quantity 4.

Board Relationship A control board mainly implements system control and service grooming, and receives and processes various services by working with physical interface boards. A power board provides power inputs for the system. A fan board blows air to dissipate heat generated during system operation. Figure 8-3 shows the board relationship.

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Figure 8-3 Board relationship

User side

Control and management module

Network side

Clock module FE/GE FE/GE 10GE E1 E1 CPOS STM-1 POS STM-1

EM4F/EM4T

EM4F/EM4T

FE/GE

EM8F/EM8T

EM8F/EM8T

FE/GE

EX1

EX1 Service processing and switching module

10GE

ML1/ML1A/ML1B

E1

MD1A/MD1B

E1

CQ1B

CQ1B

CPOS STM-1

PQ1

PQ1

POS STM-1

ML1/ML1A/ML1B MD1A/MD1B

Control board CXPA/CXPB/CXPE

Power interface board PIU

Fan board FAN

ATN 950B is equipped with active and standby control boards, which form a hot backup. A dual feeding and selective receiving mechanism is used for service interaction between physical interface boards and the two control boards.

8.2 Board Type and Application This section describes the applications and differences between different types of PIC boards.

8.2.1 Board Type Boards are the key hardware components of the equipment. Boards on the ATN 950B are classified into the following types: control board (CXP), physical interface card (PIC), power interface board (PIU), and fan board (FAN).

Control Board (CXP) The control board controls the system, grooms services, processes the clock, and provides auxiliary interfaces.

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Table 8-1 Control boards supported by the ATN 950B Board Name

Board Description

Supported Version

AND1CXPA

System control, switching and timing board

V200R001C02

AND2CXPA

System control, switching and timing board

V200R003C00

AND1CXPB

System control, switching and timing board

V200R001C02

AND2CXPB

System control, switching and timing board

V200R003C00

AND2CXPE

System control, switching and timing board

V200R003C00

Physical Interface Card (PIC) The physical interface boards process the services with the control board. The physical interface boards are classified into the following types based on the service access mode: Ethernet service interface boards, E1 service interface boards, STM-1 service interface boards. Table 8-2 Ethernet service interface boards supported by the ATN 950B Board Name

Board Description

Supported Version

AND1EM4T

4 Channels GE/FE Electric Interface Board

V200R001C02

AND1EM8T

8 Channels GE/FE Electric Interface Board

V200R001C02

AND1EM4F

4 Channels GE/FE Optical Interface Board

V200R001C02

AND1EM8F

8 Channels GE/FE Optical Interface Board

V200R001C02

AND2EM4C

4 Channels GE/FE Combo Board

V200R003C10

AND1EX1

1 Channel 10GE Optical Interface Board

V200R001C02

Table 8-3 E1 service interface boards Supported by the ATN 950B and Valid Slots

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Board Name

Board Description

Supported Version

AND1ML1

16 Channels E1 Electrical Interface Board (75 ohm)

V200R001C02

AND1ML1A

16 Channels E1 Electrical Interface Board (120 ohm)

V200R001C02

AND3ML1A

16 Channels E1 Electrical Interface Board (75 ohm)

V200R001C02

AND3ML1B

16 Channels E1 Electrical Interface Board (120 ohm)

V200R001C02

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Board Name

Board Description

Supported Version

AND2MD1A

32 Channels E1 Electrical Interface Board (75 ohm)

V200R001C02

AND2MD1B

32 Channels E1 Electrical Interface Board (120 ohm)

V200R001C02

Table 8-4 STM-1 service interface boards supported by the ATN 950B Board Name

Board Description

Supported Version

AND2CQ1B

4 Channels Channelized OC-3c/STM-1c POS Optical Interface Board

V200R002C00

AND2PQ1

4 Channels OC-3/STM-1 POS Optical Interface Board

V200R002C01

Power Board Power boards lead in power for supplying power to the device. For details about power distribution, see Power Distribution. Table 8-5 Power boards supported by the ATN 950B Board Name

Board Description

Supported Version

TND1PIU

Power interface board

V200R001C02

Fan Board (FAN) The fan board exhausts hot air for heat dissipation. For details about air duct, see Heat Dissipation. Table 8-6 Fan boards supported by the ATN 950B Board Name

Board Description

Supported Version

AND1FAN

Fan board

V200R001C02

8.2.2 Ethernet Service Interface Board The ATN 950B supports multiple types of Ethernet interface boards to address requirements for various interface quantities, interface rates, and interface types (optical/electrical). Ethernet service interface boards are widely used in various network environments. They can accept base station services on the user side, and transmit services upstream on the network side. Issue 01 (2013-10-31)

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The Ethernet service interface board supports Layer 2 services, Layer 3 services, and hybrid transmission of Layer 2 and Layer 3 services. (When the main interface is in Layer 2 mode, configure the sub-interface to transmit Layer 2/Layer 3 services.) Table 8-7 shows the Ethernet service interface boards supported by the ATN 950B and the differences between the boards. Table 8-7 Ethernet service interface boards Board

Interface Description

AND1EM4T

4 x FE/GE electrical interface

AND1EM8T

8 x FE/GE electrical interface

AND1EM4F

4 x FE/GE SFP interface

AND1EM8F

8 x FE/GE SFP interface

AND1EX1

1 x 10 GE XFP interface

NOTE Ethernet service interface boards have similar service functions, but differ in the interface quantity and interface type. l FE/GE electrical interfaces support signals at 10 Mbit/s, 100 Mbit/s and 1000 Mbit/s. l FE/GE SFP interfaces support GE optical modules, GE electrical modules, FE optical modules, and FE electrical modules. l 10GE XFP interfaces support 10GE optical modules.

8.2.3 E1 Service Interface Board The E1 service interface board supports ATM, PPP, and TDM link-layer protocols.

ATM Figure 8-4 shows the application of the E1 service interface board using the ATM protocol. Figure 8-4 Application of the E1 service interface board using the ATM protocol

An ATN device uses the E1 service interface board on the user side to support ATM over E1. When the ATM service access rate is between E1 and E3, multiple E1 links are bound into an IMA group to increase service bandwidth. On the network side, the E1 service interface board implements ATM service emulation and transparently transmits the ATM services over the Issue 01 (2013-10-31)

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packet switched network (PSN), such as MPLS or Ethernet. For detailed information, see the chapter "ATM IMA application" in the Feature Description.

PPP Figure 8-5 shows the application of the E1 service interface board using the PPP protocol. Figure 8-5 Application of the E1 service interface board using the PPP protocol (user side)

The ATN device uses the E1 service interface board to support IP services carried over MLPPPs on user side. NOTE

An independent PPP link cannot carry service. PPP links must be added to an ML-PPP group to carry services. An ML-PPP does not support MPLS services.

TDM Figure 8-6 shows the application of the E1 service interface board using the TDM protocol. Figure 8-6 Application of the E1 service interface board using the TDM protocol

The ATN device uses the E1 service interface board to access the TDM service, encapsulate the service signals into packets, and transparently transmit the packets through PWs over the PSN network. This achieves CES service emulation. For detailed information, see the chapter "CES application" in the Feature Description.

Comparison Between E1 Service Interface Boards Table 8-8 shows the E1 service interface boards supported by the ATN 950B and the differences between the boards. Issue 01 (2013-10-31)

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Table 8-8 E1 service interface boards Function

AND1ML1

AND2ML1A

AND1MD1A

AND1ML1A

AND2ML1B

AND1MD1B

Interface type

E1

E1

E1

Number of interfaces

16

16

32

Interface impedance

AND1ML1: 75 ohm

AND2ML1A: 75 ohm

AND1MD1A: 75 ohm

AND1ML1A: 120 ohm

AND2ML1B: 120 ohm

AND1MD1B: 120 ohm

Interface clock mode

Master clock mode

Master/slave clock mode

Master/slave clock mode

Link-layer protocols

ATM, PPP, TDM

ATM, PPP, TDM

ATM, PPP, TDM

Minimum number of timeslots in CE1 mode

2

1

1

8.2.4 STM-1 Service Interface Board ATN devices support STM-1 POS interfaces and CPOS interfaces. A POS interface directly maps data packets of variable length into SONET payload and uses the SONET physical-layer transmission standard. A CPOS interface is a channelized POS interface. Figure 8-7 and Figure 8-8 show the applications of STM-1 service interface boards on a network. Figure 8-7 Application of the STM-1 service interface board (user side)

Node B MSTP

POS/CPOS STM-1 Board

CXP

ATN

PIC

CX600

RNC

Node B

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Figure 8-8 Application of the STM-1 service interface board (network side)

PIC

Node B

CXP

ATN

STM-1 Board

POS/CPOS

CX600

CX600

RNC

The AND2CQ1B on the ATN 950B is used as the STM-1 service interface board, which provides four CPOS interfaces. Each CPOS interface supports 63 E1 channels. The supported services are almost the same as those of the E1 service interface board. On ATN 950B, AND2PQ1 and AND2CQ1B are the interface boards that support STM-1 services. The AND2PQ1 board provides 4 POS interfaces. It uses the SONET as the physicallayer protocol and PPP to control links at the data link layer. The AND2PQ1 board runs IP services at the network layer. The AND2CQ1B board provides 4 CPOS interfaces. The CPOS physical ports are no longer used as service ports, but the channelized 63 E1 channels are used as synchronization serial ports that support the same services as an E1 service interface board. l

The AND2PQ1 board can be used on the user or network side. It carries IP services over POS interfaces.

l

The AND2CQ1B board can be used on the user or network side. It supports ML-PPP and carries IP services over E1 channels on CPOS interfaces.

l

The AND2CQ1B board on the user side can access and converge ATM and TDM services over E1 channels on CPOS interfaces. It implements service emulation and transparent transmission over a packet switched network, achieving ATM PWE3 and TDM PWE3 (CES) services. NOTE

Services supported by the E1 channel on the CPOS interface are basically the same as those provided by the E1 service interface board. The differences are listed as follows: l The E1 channel of the AND2CQ1B supports IP and MPLS services carried over ML-PPPs; the E1 service interface board only supports IP services. l The E1 channel of the AND2CQ1B does not support fractional E1; the E1 service interface board supports fractional E1 when the TDM protocol is used.

8.3 AND1CXPA/AND1CXPB - System Control, Crossconnect, and Multi-protocol Process Unit The AND1CXPA/AND1CXPB (CXPA/CXPB for short) is a control, cross-connect, and protocol processing board. The function version of the CXPA/CXPB is AND1. The CXPA/ CXPB is housed in slot 7 or slot 8. Table 8-9 provides comparison between AND1CXPA and AND1CXPB.

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Table 8-9 Board comparison Board Type

Cross-Connect Capacity

1588 ACR

AND1CXPA

44 Gbit/s

Supported

AND1CXPB

56 Gbit/s

Supported

8.3.1 Front Panel On the front panel of the AND1CXPA/AND1CXPB, there are indicators, buttons, switch for the ejector lever, and interfaces.

Appearance of the Front Panel Figure 8-9 and Figure 8-10 show the appearance of the front panel of the AND1CXPA/ AND1CXPB. Figure 8-9 Front panel of the AND1CXPA

Figure 8-10 Front panel of the AND1CXPB

Indicator The following indicators are present on the front panel of the AND1CXPA/AND1CXPB: l

STAT indicator, red, green, or orange, which indicates the working status

l

PROG indicator, red or green, which indicates the running status of the program

l

SYNC indicator, red or green, which indicates the clock synchronization status

l

ACTX indicator, green, which indicates the cross-connection or clock active/standby status

l

ACTC indicator, green, which indicates the active/standby system control board

For details on meanings of indicators, see 12.1 Indicators.

Button The following buttons are present on the front panel of the AND1CXPA/AND1CXPB: Issue 01 (2013-10-31)

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l

CF RCV button, which is reserved for later use.

l

RRST button, which is used for reset on the board. When you press the RST button and then release it, the board is reset.

l

LAMP button, which is used to test the indicators. When you press the LAMP button, all the board indicators on the NE are on.

Switch for the Ejector Lever On the front panel, there are two switches for the two ejector levers on the front panel. To remove a board, you need to push the two switches to the middle and then rotate the ejector levers.

Interface Table 8-10 lists the types and usage of the interfaces on the AND1CXPA/AND1CXPB. Table 8-10 Types and usage of the interfaces on the AND1CXPA/AND1CXPB Interface on the Front Panel

Interface Type

Usage

Pin

Correspondi ng Cable

ETH/ OAM

RJ45

10M/100M auto-sensing Ethernet NM interface or Console interface

Refer to Table 8-11.

Refer to 10.2 Management Cables.

CLK

RJ45

Clock input/output interface

Refer to Table 8-12.

Refer to 10.4 Clock Cables.

TOD

RJ45

Time input/output interface

Refer to Table 8-13.

Refer to 10.4 Clock Cables.

ALMI/O

RJ45

Alarm input/output interface

Refer to Table 8-14.

-

Table 8-11 Pins of the ETH/OAM interface Front View

87654321

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Pin

Usage

1

Transmit positive of the NM interface

2

Transmit negative of the NM interface

3

Receive positive of the NM interface

4

Grounding end of the Console interface

5

Receive end of the Console interface

6

Receive negative of the NM interface

7

Unspecified

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Pin

Usage

8

Transmit end of the Console interface

Table 8-12 Pins of the CLK interface Front View

87654321

Pin

Usage

1

Negative receive end of external clock

2

Positive receive end of external clock

3

Unspecified

4

Negative transmit end of external clock

5

Positive transmit end of external clock

6

Unspecified

7

Unspecified

8

Unspecified

Table 8-13 Pins of the TOD interface Front View

Pin

87654321

External Time Input

External Time Output

(1PPS + Time Information)

(1PPS + Time Information)

1

Unspecified

Unspecified

2

Unspecified

Unspecified

3

Negative input for the 1pps signal

Negative output for the 1pps signal

(RS422 level)

(RS422 level)

4

Grounding end

Grounding end

5

Grounding end

Grounding end

6

Positive input for the 1pps signal

Positive output for the 1pps signal

(RS422 level)

(RS422 level)

Negative input for time information

Negative output for time information

(RS422 level)

(RS422 level)

7

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Working Mode

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Pin

8

8 ATN 950B Boards

Working Mode External Time Input

External Time Output

(1PPS + Time Information)

(1PPS + Time Information)

Positive input for time information

Positive output for time information

(RS422 level)

(RS422 level)

NOTE The TOD interfaces can be configured so that they can work in one of the preceding two working modes.

Table 8-14 Pins of the ALMI/O interface Front View

87654321

Pin

Usage

1

Input for the digital parameter

2

Grounding end

3

Input for the digital parameter

4

Input for the digital parameter

5

Grounding end

6

Grounding end

7

Positive output for the digital parameter

8

Negative output for the digital parameter

8.3.2 Functions and Features The AND1CXPA/AND1CXPB controls the system, grooms services, processes the clock, and provides auxiliary interfaces. Table 8-15 lists the functions and features of the AND1CXPA/AND1CXPB. Table 8-15 Functions and Features of the AND1CXPA/AND1CXPB Function and Feature

Description

Basic funtion

Cross-connect capacity

AND1CXPA: 44 Gbit/s AND1CXPB: 56 Gbit/s

Supports switching, control, and clock management. Issue 01 (2013-10-31)

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Function and Feature

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Description Supports the board-level 1+1 backup function.

Auxiliary interface function

Provides one 10 Mbit/s or 100 Mbit/s auto-sensing Ethernet NM interface or Console interface for communication with the NMS. Provides one time input/output interface and provides the synchronization time source for the equipment. Provides one clock input/output interface and provides the synchronization clock source for the equipment. Provides one alarm input/output interface. The interface provides three inputs of alarm digital parameters.

Tact switches

Provides two tact switches. When you rotate the ejector levers to remove the board, the two tact switches are triggered to start the active/standby protection switching.

NOTE When you rotate only one ejector lever, the protection switching is not triggered. The protection switching is triggered only when you rotate the two ejector levers.

8.3.3 Working Principle and Signal Flow The AND1CXPA/AND1CXPB mainly consists of the service processing and grooming module, system control module, clock processing module, auxiliary interface module, and power supply module. Figure 8-11 shows the block diagram for the working principle of the AND1CXPA/ AND1CXPB.

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Figure 8-11 Block diagram for the functions of the AND1CXPA/AND1CXPB Back plane NM pass-through NM network interface/serial interface Time input/output interface Clock input/output interface

NM communication Auxiliary interface module

NM serial interface

Alarm input/output interface

System control module

Active/standby board communication bus

CPU control unit

The other CXP

The other CXP

Management bus Clock signals

Time signals

Clock processing module

Logic control unit

Time signals

Serial management bus

Clock signals

PICs

Management bus Service signals Under-voltage/overvoltage detection bus

Service processing and grooming module

Power supply module

Service communication bus

PICs The other CXP

-48V/-60V

System power supply

-48V/-60V

System power supply

12V 3.3V

FAN Interface cards

Service Processing and Grooming Module This module performs the following functions: l

Grooms services with switching capacity.

l

Supports automatic switching and manual switching of the active and standby boards.

System Control Module This module mainly consists of the CPU control unit and logic control unit, which perform the following functions: l

The CPU control unit works with the logic control unit to detects alarms and hardware faults, control boards, process overhead, and manage the equipment.

l

The logic control unit provides interfaces through which the CPU control unit connects to other chips on the board. The logic control unit specifies the working states of chips, initializes chips, and operates the register. In addition, the logic control unit achieves log control on active/standby switching, monitors the working state of the board, and detects the states of other boards.

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Clock Processing Module This module performs the following functions: l

Provides working clock signals for the key chips on the AND1CXPA/AND1CXPB.

l

Supports the physical-layer clock synchronization, and provides system clock signals for each boards.

l

Processes the IEEE 1588V2 protocol to achieve clock/time synchronization.

l

Supports the 1588 ACR clock.

l

Supports the NTP clock.

Auxiliary Interface Module This module performs the following functions: l

Provides one NM Ethernet interface or console interface.

l

Provides one time input/output interface and one time input/output interface.

l

Provides one alarm input/output interface.

Power Supply Module This module performs the following functions: l

Accesses two -48 V DC/-60 V DC power supplies.

l

Detects and reports overvoltage and undervoltage of two input power supplies.

l

Supplies 12 V power for the FAN board.

l

Supplies 3.3 V working power for the local board and the PIC boards in a centralized manner.

8.3.4 CF Card and DIP Switch A board has a set of DIP switches and a hot-swappable CF card.

CF Card and DIP Switch Locations Figure 8-12 shows the locations of the CF card and DIP switches on AND1CXPA/AND1CXPB.

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Figure 8-12 Locations of the CF card and DIP switches on AND1CXPA/AND1CXPB.

ON DIP

1 2 3 4

CF Card

DIP Switch

CF Card The size of the CF card on AND1CXPA/AND1CXPB is 512 MB. The CF card is used to backup data and load packages.

DIP Switch You can use the DIP switches to delete the configuration file loaded on the device. Set DIP switches on AND1CXPA/AND1CXPB to 1, 1, 0, and 1. During startup, the device deletes the loaded configuration file based on the DIF switch status.

NOTICE l This operation should be executed with caution. Use it under the guidance of technical personnel. l After the configuration file is deleted, reset the DIF switches to 0, 0, 0, and 0. In this way, you do not need to delete the configuration file at each startup. l The numeral indicates 1, and the letter indicates 0. l The device password is deleted when the configuration file is deleted.

8.3.5 Technical Specifications The technical specifications of the AND1CXPA/AND1CXPB include board dimensions, weight, and power consumption. Issue 01 (2013-10-31)

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Board dimensions (mm): 22.86 (H) x 225.75 (D) x 193.80 (W) Weight (kg): 0.68 Power consumption (W, room temperature): 27.3

8.4 AND2CXPA/AND2CXPB/AND2CXPE - System Control, Cross-connect, and Multi-protocol Process Unit The AND2CXPA/AND2CXPB/AND2CXPE (CXPA/CXPB/CXPE for short) is a control, cross-connect, and protocol processing board. The function version of the CXPA/CXPB/CXPE is AND1. The CXPA/CXPB/CXPE is housed in slot 7 or slot 8. Table 8-16 provides comparison between AND2CXPA, AND2CXPB, and AND2CXPE. Table 8-16 Board Comparison Board Type

Cross-Connect Capacity

1588 ACR

AND2CXPA

44 Gbit/s

Not supported

AND2CXPB

56 Gbit/s

Not supported

AND2CXPE

56 Gbit/s

Supported

8.4.1 Front Panel On the front panel of the AND2CXPA/AND2CXPB/AND2CXPE, there are indicators, buttons, switch for the ejector lever, and interfaces.

Appearance of the Front Panel Figure 8-13, Figure 8-14 and Figure 8-15 show the appearance of the front panel of the AND2CXPA/AND2CXPB/AND2CXPE. Figure 8-13 Front panel of the AND2CXPA

Figure 8-14 Front panel of the AND2CXPB

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Figure 8-15 Front panel of the AND2CXPE

Indicator The following indicators are present on the front panel of the AND2CXPA/AND2CXPB/ AND2CXPE: l

STAT indicator, red, green, or orange, which indicates the working status

l

PROG indicator, red or green, which indicates the running status of the program

l

SYNC indicator, red or green, which indicates the clock synchronization status

l

ACTX indicator, green, which indicates the cross-connection or clock active/standby status

l

ACTC indicator, green, which indicates the active/standby system control board

For details on meanings of indicators, see 12.1 Indicators.

Button The following buttons are present on the front panel of the AND2CXPA/AND2CXPB/ AND2CXPE: l

CF RCV button, which is reserved for later use.

l

RRST button, which is used for reset on the board. When you press the RST button and then release it, the board is reset.

l

LAMP button, which is used to test the indicators. When you press the LAMP button, all the board indicators on the NE are on.

Switch for the Ejector Lever On the front panel, there are two switches for the two ejector levers on the front panel. To remove a board, you need to push the two switches to the middle and then rotate the ejector levers.

Interface Table 8-17 lists the types and usage of the interfaces on the AND2CXPA/AND2CXPB/ AND2CXPE.

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Table 8-17 Types and usage of the interfaces on the AND2CXPA/AND2CXPB/AND2CXPE Interface on the Front Panel

Interface Type

Usage

Pin

Correspondi ng Cable

ETH/ OAM

RJ45

10M/100M auto-sensing Ethernet NM interface or Console interface

Refer to Table 8-18.

Refer to 10.2 Management Cables.

CLK

RJ45

Clock input/output interface

Refer to Table 8-19.

Refer to 10.4 Clock Cables.

TOD

RJ45

Time input/output interface

Refer to Table 8-20.

Refer to 10.4 Clock Cables.

ALMI/O

RJ45

Alarm input/output interface

Refer to Table 8-21.

-

Table 8-18 Pins of the ETH/OAM interface Front View

87654321

Pin

Usage

1

Transmit positive of the NM interface

2

Transmit negative of the NM interface

3

Receive positive of the NM interface

4

Grounding end of the Console interface

5

Receive end of the Console interface

6

Receive negative of the NM interface

7

Unspecified

8

Transmit end of the Console interface

Table 8-19 Pins of the CLK interface Front View

87654321

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Pin

Usage

1

Negative receive end of external clock

2

Positive receive end of external clock

3

Unspecified

4

Negative transmit end of external clock

5

Positive transmit end of external clock

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Pin

Usage

6

Unspecified

7

Unspecified

8

Unspecified

Table 8-20 Pins of the TOD interface Front View

Pin

87654321

Working Mode External Time Input

External Time Output

(1PPS + Time Information)

(1PPS + Time Information)

1

Unspecified

Unspecified

2

Unspecified

Unspecified

3

Negative input for the 1pps signal

Negative output for the 1pps signal

(RS422 level)

(RS422 level)

4

Grounding end

Grounding end

5

Grounding end

Grounding end

6

Positive input for the 1pps signal

Positive output for the 1pps signal

(RS422 level)

(RS422 level)

Negative input for time information

Negative output for time information

(RS422 level)

(RS422 level)

Positive input for time information

Positive output for time information

(RS422 level)

(RS422 level)

7

8

NOTE The TOD interfaces can be configured so that they can work in one of the preceding two working modes.

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Table 8-21 Pins of the ALMI/O interface Front View

87654321

Pin

Usage

1

Input for the digital parameter

2

Grounding end

3

Input for the digital parameter

4

Input for the digital parameter

5

Grounding end

6

Grounding end

7

Positive output for the digital parameter

8

Negative output for the digital parameter

8.4.2 Functions and Features The AND2CXPA/AND2CXPB/AND2CXPE controls the system, grooms services, processes the clock, and provides auxiliary interfaces. Table 8-22 lists the functions and features of the AND2CXPA/AND2CXPB/AND2CXPE. Table 8-22 Functions and Features of the AND2CXPA/AND2CXPB/AND2CXPE Function and Feature

Description

Basic function

Cross-connect capacity

AND1CXPA: 44 Gbit/s AND1CXPB: 56 Gbit/s AND1CXPE: 56 Gbit/s

Supports switching, control, and clock management. Supports the board-level 1+1 backup function. Auxiliary interface function

Provides one 10 Mbit/s or 100 Mbit/s auto-sensing Ethernet NM interface or Console interface for communication with the NMS. Provides one time input/output interface and provides the synchronization time source for the equipment. Provides one clock input/output interface and provides the synchronization clock source for the equipment. Provides one alarm input/output interface. The interface provides three inputs of alarm digital parameters.

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Function and Feature

Description

Tact switches

Provides two tact switches. When you rotate the ejector levers to remove the board, the two tact switches are triggered to start the active/standby protection switching.

NOTE When you rotate only one ejector lever, the protection switching is not triggered. The protection switching is triggered only when you rotate the two ejector levers.

8.4.3 Working Principle and Signal Flow The AND2CXPA/AND2CXPB/AND2CXPE mainly consists of the service processing and grooming module, system control module, clock processing module, auxiliary interface module, and power supply module. Figure 8-16 shows the block diagram for the working principle of the AND2CXPA/ AND2CXPB/AND2CXPE. Figure 8-16 Block diagram for the functions of the AND2CXPA/AND2CXPB/AND2CXPE Back plane NM pass-through NM network interface/serial interface Time input/output interface Clock input/output interface

NM communication Auxiliary interface module

NM serial interface

Alarm input/output interface

System control module

Active/standby board communication bus

CPU control unit

The other CXP

The other CXP

Management bus Clock signals

Time signals

Clock processing module

Time signals

Logic control unit

Serial management bus

Clock signals

PICs

Management bus Service signals Under-voltage/overvoltage detection bus

Service processing and grooming module

Power supply module

Service communication bus

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The other CXP

-48V/-60V

System power supply

-48V/-60V

System power supply

12V 3.3V

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FAN Interface cards

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Service Processing and Grooming Module This module performs the following functions: l

Grooms services with switching capacity.

l

Supports automatic switching and manual switching of the active and standby boards.

System Control Module This module mainly consists of the CPU control unit and logic control unit, which perform the following functions: l

The CPU control unit works with the logic control unit to detects alarms and hardware faults, control boards, process overhead, and manage the equipment.

l

The logic control unit provides interfaces through which the CPU control unit connects to other chips on the board. The logic control unit specifies the working states of chips, initializes chips, and operates the register. In addition, the logic control unit achieves log control on active/standby switching, monitors the working state of the board, and detects the states of other boards.

Clock Processing Module This module performs the following functions: l

Provides working clock signals for the key chips on the AND2CXPA/AND2CXPB/ AND2CXPE.

l

Supports the physical-layer clock synchronization, and provides system clock signals for each boards.

l

Processes the IEEE 1588V2 protocol to achieve clock/time synchronization.

l

Supports the 1588 ACR clock (supported by AND2CXPE).

l

Supports the NTP clock.

Auxiliary Interface Module This module performs the following functions: l

Provides one NM Ethernet interface or console interface.

l

Provides one time input/output interface and one time input/output interface.

l

Provides one alarm input/output interface.

Power Supply Module This module performs the following functions: l

Accesses two -48 V DC/-60 V DC power supplies.

l

Detects and reports overvoltage and undervoltage of two input power supplies.

l

Supplies 12 V power for the FAN board.

l

Supplies 3.3 V working power for the local board and the PIC boards in a centralized manner.

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8.4.4 DIP Switch A board has a set of DIP switches. Figure 8-17 shows the locations of the DIP switches on AND2CXPA/AND2CXPB/ AND2CXPE.

1 2 3 4

ON DIP

Figure 8-17 Locations of the DIP switches on AND2CXPA/AND2CXPB/AND2CXPE.

拨码开关

You can use the DIP switches to delete the configuration file loaded on the device. Set DIP switches on AND2CXPA/AND2CXPB/AND2CXPE to 1, 1, 0, and 1. During startup, the device deletes the loaded configuration file based on the DIF switch status.

NOTICE l This operation should be executed with caution. Use it under the guidance of technical personnel. l After the configuration file is deleted, reset the DIF switches to 0, 0, 0, and 0. In this way, you do not need to delete the configuration file at each startup. l The numeral indicates 1, and the letter indicates 0. l The device password is deleted when the configuration file is deleted.

8.4.5 Technical Specifications The technical specifications of the AND2CXPA/AND2CXPB/AND2CXPE include board dimensions, weight, and power consumption. Issue 01 (2013-10-31)

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Board dimensions (mm): 22.86 (H) x 225.75 (D) x 193.80 (W) Weight (kg): 0.68 Power consumption (W, room temperature): 23.6 (AND2CXPA), 28.5 (AND2CXPB/ AND2CXPE)

8.5 AND1EM4T - 4 Channels GE/FE Electrical Interface Board The AND1EM4T (EM4T for short) is a four channels FE/GE adaptive electrical interface board. The function version of the EM4T is AND1. The AND1EM4T is housed in any of slots 1 to 4 (when working with the AND1CXPA/AND1CXPB) and in any of slots 1 to 6 (when working with the AND2CXPA/AND2CXPB/AND2CXPE).

8.5.1 Front Panel On the front panel of the AND1EM4T, there are indicators and interfaces.

Appearance of the Front Panel Figure 8-18 shows the appearance of the front panel of the AND1EM4T. Figure 8-18 Front panel of the AND1EM4T

Indicator The following indicators are present on the front panel of the AND1EM4T: l

STAT indicator, red, green, or orange, which indicates the working status

l

LINK indicator, green, which indicates the connection status of the port

l

ACT indicator, yellow, which indicates the data transceiving status of the port NOTE

Above each service interface, there is a service port connection status indicator (LINK) and a service port transmit/receive status indicator (ACT).

For details on meanings of indicators, see 12.1 Indicators.

Interface Table 8-23 lists the types and usage of the interfaces on the AND1EM4T. Issue 01 (2013-10-31)

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Table 8-23 Types and usage of the interfaces on the AND1EM4T Interfac e on the Front Panel

Interfac e Type

Usage

Pin

Corresponding Cable

FE/GE0 to FE/ GE3

RJ45

FE/GE auto-sensing electrical interface

Refer to Table 8-24.

Refer to 10.5.1 Ethernet Cables.

Table 8-24 Pins of the FE/GE electrical interfaces Front View

87654321

Pin

Usage

1

Positive of twisted pair 1

2

Negative of twisted pair 1

3

Positive of twisted pair 2

4

Positive of twisted pair 3

5

Negative of twisted pair 3

6

Negative of twisted pair 2

7

Positive of twisted pair 4

8

Negative of twisted pair 4

8.5.2 Functions and Features The AND1EM4T mainly accesses 4 x FE/GE electrical signals, and processes the services with the control board. Table 8-25 lists the functions and features of the AND1EM4T. Table 8-25 Functions and features of the AND1EM4T Function and Feature

Description

Basic function

Provides four FE/GE electrical interfaces. Supports the hot swappable function. Detects the temperature and voltage of the board.

Interface function

Supports signals at 100 Mbit/s and 1000 Mbit/s. Supports inloops and outloops.

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Description Supports the traffic control function. Supports Layer 2 and Layer 3 working modes.

Clock

Supports physical-layer clock synchronization (synchronous Ethernet). Supports IEEE 1588v2 and IEEE 1588 ACR.

NOTE When using an electrical interface at 10 Mbit/s, the interface does not support synchronous Ethernet clock or IEEE 1588v2.

8.5.3 Working Principle and Signal Flow The AND1EM4T mainly consists of the service access module, service processing module, management module, clock module, and power supply module Figure 8-19 shows the block diagram for the functions of the AND1EM4T. Figure 8-19 Block diagram for the functions of the AND1EM4T 4 x FE/GE electrical signals

Back plane Service access module

Management bus

Service signals

Service processing module

Management bus

Management module

Service signals

CXP

Clock signals

Clock module

Clock signals

Management bus

Each module on the board

3.3V 3.0V 2.5V 1.2V

CXP CXP

Power supply module

-48V/-60V

System power supply

-48V/-60V

System power supply

Transmit Direction The service packets from AND1CXPA/AND1CXPB are sent to the service processing module through the backplane-side interface of the AND1EM4T. The service processing module identifies the destination interfaces for the packets, and buffers and schedules the packets. Then, the service processing module sends the processed packets to the service access module, where coding/decoding and serial/parallel conversion are performed. Finally, the service access module outputs the packets through the GE/FE interfaces on the front panel.

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Receive Direction The GE/FE interfaces on the front panel receive GE/FE service signals. Then, the service access module performs serial/parallel conversion and coding/decoding on the services, and then sends the services to the service processing module. The service processing module buffers the service packets, schedules the packets, and finally outputs the packets through the backplane-side interface.

Service Access Module This module performs the following functions: l

In the receive direction, this module receives the GE/FE services from the interfaces on the front panel, performs serial/parallel conversion and coding/decoding, and then sends the services to the service processing module.

l

In the transmit direction, this module receives the service packets from the service processing module, performs coding/decoding, and serial/parallel conversion on the packets, and then outputs the packets through the GE/FE interfaces on the front panel.

l

This module extracts the synchronous Ethernet clock.

Service Processing Module This module performs the following functions: l

In the receive direction, this module receives and buffers the service packets from the interface conversion module. Then, this module schedules packets from different interfaces. Finally, this module outputs the packets through the backplane-side interface.

l

In the transmit direction, this module receives service packets from the AND1CXPA/ AND1CXPB, identifies the destination interfaces of the packets, and buffers and schedules the packets based on the access capability of the EM4T and the access bandwidth setting at each interface. Finally, this module outputs the packets to the service access module.

l

This module extracts and inserts IEEE 1588 V2 packets.

Management Module This module is used with the CXP to manage and control each module on the EM4T.

Clock Module This module performs the following functions: l

Provides the working clock for each module on the EM4T.

l

Supports the synchronous Ethernet and SSM protocols.

l

Supports the IEEE 1588 V2 protocol.

l

Supports the 1588 ACR clock.

Power Supply Module This module provides the DC power of the following specifications to each module on the EM4T. l Issue 01 (2013-10-31)

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l

3.0 V

l

2.5 V

l

1.2 V

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8.5.4 Technical Specifications Technical specifications of the AND1EM4T board include interface specifications and physical specifications.

Interface Specifications Table 8-26 lists the specifications of the electrical interfaces on the AND1EM4T board. Table 8-26 Specifications of the FE/GE electrical interface Item

Specification Requirement

Interface rate

10 Mbit/s, 100 Mbit/s, 1000 Mbit/s.

RJ-45 electrical interface specification

Complies with IEEE 802.3 and enterprise regulations.

Physical Specifications Board dimensions (mm): 22.86 (H) x 225.75 (D) x 193.80 (W) Weight (kg): 0.44 Power consumption (W, room temperature): 10.4

8.6 AND1EM8T - 8 Channels GE/FE Electric Interface Board The AND1EM8T (EM8T for short) is an eight channels FE/GE adaptive electrical interface board. The function version of the EM8T is AND1. The AND1EM8T is housed in any of slots 1 to 2.

8.6.1 Front Panel On the front panel of the AND1EM8T, there are indicators and interfaces.

Appearance of the Front Panel Figure 8-20 shows the appearance of the front panel of the AND1EM8T. Figure 8-20 Front panel of the AND1EM8T

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Indicator The following indicators are present on the front panel of the AND1EM8T: l

STAT indicator, red, green, or orange, which indicates the working status

l

LINK indicator, green, which indicates the connection status of the port

l

ACT indicator, yellow, which indicates the data transceiving status of the port NOTE

Above each service interface, there is a service port connection status indicator (LINK) and a service port transmit/receive status indicator (ACT).

For details on meanings of indicators, see 12.1 Indicators.

Interface Table 8-27 lists the types and usage of the interfaces on the AND1EM8T. Table 8-27 Types and usage of the interfaces on the AND1EM8T Interfac e on the Front Panel

Interfac e Type

Usage

Pin

Corresponding Cable

FE/GE0 to FE/ GE7

RJ45

FE/GE auto-sensing electrical interface

Refer to Table 8-28.

Refer to 10.5.1 Ethernet Cables.

Table 8-28 Pins of the FE/GE electrical interfaces Front View

87654321

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Pin

Usage

1

Positive of twisted pair 1

2

Negative of twisted pair 1

3

Positive of twisted pair 2

4

Positive of twisted pair 3

5

Negative of twisted pair 3

6

Negative of twisted pair 2

7

Positive of twisted pair 4

8

Negative of twisted pair 4

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8.6.2 Functions and Features The AND1EM8T mainly accesses 8 x FE/GE electrical signals, and processes the services with the AND1CXPA/AND1CXPB. Table 8-29 lists the functions and features of the AND1EM8T. Table 8-29 Functions and features of the AND1EM8T Function and Feature

Description

Basic function

Provides eight FE/GE electrical interfaces. Supports the hot swappable function. Detects the temperature and voltage of the board.

Interface function

Supports signals at 100 Mbit/s and 1000 Mbit/s. Supports inloops and outloops. Supports the traffic control function. Supports Layer 2 and Layer 3 working modes.

Clock

Supports physical-layer clock synchronization (synchronous Ethernet). Supports IEEE 1588v2 and IEEE 1588 ACR.

NOTE When using an electrical interface at 10 Mbit/s, the interface does not support synchronous Ethernet clock or IEEE 1588v2.

8.6.3 Working Principle and Signal Flow The AND1EM8T mainly consists of the service access module, service processing module, management module, clock module, and power supply module. Figure 8-21 shows the block diagram for the functions of the AND1EM8T.

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Figure 8-21 Block diagram for the functions of the AND1EM8T 8 x FE/GE electrical signals

Back plane Service access module

Management bus

Service signals

Service processing module

Management bus

Management module

Service signals

CXP

Clock signals

Clock module

Clock signals

Management bus

Each module on the board

3.3V 3.0V 2.5V 1.8V 1.2V

CXP CXP

Power supply module

-48V/-60V

System power supply

-48V/-60V

System power supply

Transmit Direction The service packets from AND1CXPA/AND1CXPB are sent to the service processing module through the backplane-side interface of the AND1EM8T. The service processing module identifies the destination interfaces for the packets, and buffers and schedules the packets. Then, the service processing module sends the processed packets to the service access module, where coding/decoding and serial/parallel conversion are performed. Finally, the service access module outputs the packets through the GE/FE interfaces on the front panel.

Receive Direction The GE/FE interfaces on the front panel receive GE/FE service signals. Then, the service access module performs serial/parallel conversion and coding/decoding on the services, and then sends the services to the service processing module. The service processing module buffers the service packets, schedules the packets, and finally outputs the packets through the backplane-side interface.

Service Access Module This module performs the following functions: l

In the receive direction, this module receives the GE/FE services from the interfaces on the front panel, performs serial/parallel conversion and coding/decoding, and then sends the services to the service processing module.

l

In the transmit direction, this module receives the service packets from the service processing module, performs coding/decoding, and serial/parallel conversion on the packets, and then outputs the packets through the GE/FE interfaces on the front panel.

l

This module extracts the synchronous Ethernet clock.

Service Processing Module This module performs the following functions: Issue 01 (2013-10-31)

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l

In the receive direction, this module receives and buffers the service packets from the interface conversion module. Then, this module schedules packets from different interfaces. Finally, this module outputs the packets through the backplane-side interface.

l

In the transmit direction, this module receives service packets from the AND1CXPA/ AND1CXPB, identifies the destination interfaces of the packets, and buffers and schedules the packets based on the access capability of the EM8T and the access bandwidth setting at each interface. Finally, this module outputs the packets to the service access module.

l

This module extracts and inserts IEEE 1588 V2 packets.

Management Module This module is used with the CXP to manage and control each module on the EM8T.

Clock Module This module performs the following functions: l

Provides the working clock for each module on the EM8T.

l

Supports the synchronous Ethernet and SSM protocols.

l

Supports the IEEE 1588 V2 protocol.

l

Supports the 1588 ACR clock.

Power Supply Module This module provides the DC power of the following specifications to each module on the EM8T. l

3.3 V

l

3.0 V

l

2.5 V

l

1.8 V

l

1.2 V

8.6.4 Technical Specifications Technical specifications of the AND1EM8T board include interface specifications and physical specifications.

Interface Specifications Table 8-30 lists the specifications of the electrical interfaces on the AND1EM8T board. Table 8-30 Specifications of the FE/GE electrical interface

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Item

Specification Requirement

Interface rate

10 Mbit/s, 100 Mbit/s, 1000 Mbit/s.

RJ-45 electrical interface specification

Complies with IEEE 802.3 and enterprise regulations.

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Physical Specifications Board dimensions (mm): 22.86 (H) x 225.75 (D) x 193.80 (W) Weight (kg): 0.46 Power consumption (W, room temperature): 21.1

8.7 AND1EM4F - 4 Channels GE/FE Optical Interface Board The AND1EM4F (EM4F for short) is a four channels FE/GE optical interface board. The function version of the EM4F is AND1. The AND1EM4F is housed in any of slots 1 to 4 (when working with the AND1CXPA/AND1CXPB) and in any of slots 1 to 6 (when working with the AND2CXPA/AND2CXPB/AND2CXPE).

8.7.1 Front Panel On the front panel of the AND1EM4F, there are indicators and interfaces.

Appearance of the Front Panel Figure 8-22shows the appearance of the front panel of the AND1EM4F. Figure 8-22 Front panel of the AND1EM4F

Indicator The following indicators are present on the front panel of the AND1EM4F: l

STAT indicator, red, green, or orange, which indicates the working status

l

L/A0 to L/A3 indicators, green or orange, which indicate the port connection status and data transmit/receive status

For details on meanings of indicators, see 12.1 Indicators.

Interface Four SFP interfaces are present on the EM4F. Table 8-31 lists the types and usage of the interfaces on the EM4F.

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Table 8-31 Types and usage of the interfaces on the AND1EM4F Interface on the Front Panel

Interface Type

Usage

Correspo nding Fiber

Optical module

LC

When a two-fiber bidirectional optical module is used, this interface is used as an input interface for the GE optical signal.

Refer to 10.6 Optical Fibers.

IN0 to IN3

When a single-fiber bidirectional optical module is used, this interface is not used. OUT0 to OUT3

LC

When a two-fiber bidirectional optical module is used, this interface is used as an output interface for the GE/FE optical signal. When a single-fiber bidirectional optical module is used, this interface is used as an input/output interface for the GE/FE optical signal.

Electrical module

OUT0 IN0, OUT3 IN3

RJ-45

Input/Output interfaces for GE electrical signals

For details, see 10.5.1 Ethernet Cables.

NOTE The GE SFP interface on the front panel can function as either an optical interface or an electrical interface. When the SFP interface functions as an optical interface, it needs to be used with an optical module; when the SFP interface functions as an electrical interface, it needs to be used with an electrical module.

8.7.2 Functions and Features The AND1EM4F mainly accesses 4 x FE/GE optical signals, and processes the services with the control board. Table 8-32 lists the functions and features of the AND1EM4F. Table 8-32 Functions and features of the AND1EM4F Basic function

Description

Basic function

Supports four FE/GE interfaces (SFP). Supports the hot swappable function. Detects the temperature and voltage of the board.

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Basic function

Description

Interface function

Supports FE optical modules, FE electrical modules, GE optical modules and GE electrical modules. Supports inloops and outloops. Supports the traffic control function. Supports Layer 2 and Layer 3 working modes.

Clock

Supports physical-layer clock synchronization (synchronous Ethernet). Supports IEEE 1588v2 and IEEE 1588 ACR.

NOTE If the SFP interface houses an electrical module, the interface does not support synchronous Ethernet or IEEE 1588v2.

8.7.3 Working Principle and Signal Flow The AND1EM4F mainly consists of the service access module, service processing module, management module, clock module, and power supply module. Figure 8-23 shows the block diagram for the functions of the AND1EM4F. Figure 8-23 Block diagram for the functions of the AND1EM4F 4 x FE/GE optical signals

Back plane Service access module

Management bus

Service signals

Service processing module

Management bus

Management module

Service signals

CXP

Clock signals

Clock module

Clock signals

Management bus

Each module on the board

3.3V 3.0V 2.5V 1.2V

CXP CXP

Power supply module

-48V/-60V

System power supply

-48V/-60V

System power supply

Transmit Direction The service packets from AND1CXPA/AND1CXPB are sent to the service processing module through the backplane-side interface of the EM4F. The service processing module identifies the destination interfaces for the packets, and buffers and schedules the packets. Then, the service processing module sends the processed packets to the service access module, where coding/ Issue 01 (2013-10-31)

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decoding, serial/parallel conversion, and E/O conversion are performed. Finally, the service access module outputs the packets through the GE/FE interfaces on the front panel.

Receive Direction The GE/FE interfaces on the front panel receive GE/FE service signals. Then, the service access module performs O/E conversion, serial/parallel conversion, and coding/decoding on the services, and then sends the services to the service processing module. The service processing module buffers the service packets, schedules the packets, and finally outputs the packets through the backplane-side interface.

Service Access Module This module performs the following functions: l

In the receive direction, this module receives the GE/FE services from the interfaces on the front panel, performs O/E conversion, serial/parallel conversion, and coding/decoding, and then sends the services to the service processing module.

l

In the transmit direction, this module receives the service packets from the service processing module, performs coding/decoding, serial/parallel conversion, and E/O conversion on the packets, and then outputs the packets through the GE/FE interfaces on the front panel.

l

This module extracts the synchronous Ethernet clock.

Service Processing Module This module performs the following functions: l

In the receive direction, this module receives and buffers the service packets from the service access module. Then, this module schedules packets from different interfaces. Finally, this module outputs the packets through the backplane-side interface.

l

In the transmit direction, this module receives service packets from the AND1CXPA/ AND1CXPB, identifies the destination interfaces of the packets, and buffers and schedules the packets. Finally, this module outputs the packets to the service access module.

l

This module extracts and inserts IEEE 1588 V2 packets.

Management Module This module is used with the AND1CXPA/AND1CXPB to manage and control each module on the EM4F.

Clock Module This module performs the following functions: l

Provides the working clock for each module on the EM4F.

l

Supports the synchronous Ethernet and SSM protocols.

l

Supports the IEEE 1588 V2 protocol.

l

Supports the 1588 ACR clock.

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Power Supply Module This module provides the DC power of the following specifications to each module on the EM4F. l

3.3 V

l

3.0 V

l

2.5 V

l

1.2 V

8.7.4 Technical Specifications Technical specifications of the AND1EM4F board include interface specifications and physical specifications. For information about the swappable optical/electrical FE/GE optical modules supported at SFP interfaces on the AND1EM4F board, see Table 8-33, Table 8-34, Table 8-35, and Table 8-36. The interface specifications depend on the optical/electrical modules on the board. For details on the specifications of optical/electrical modules, see 9 Swappable Optical/Electrical Modules. Table 8-33 Information about FE optical modules Code

Optical Module Information

Remarks

S4015755

eSFP, 1310 nm, STM-1, LC, Single-mode, 15 km

S4015715

eSFP, 1310 nm, STM-1, LC, Single-mode, 40 km

Two-fiber bidirectional

34060282

eSFP, 1550 nm, STM-1, LC, Single-mode, 80 km

34060363

eSFP, Tx 1310 nm/Rx 1550 nm, LC, Single-mode, 10 km

34060364

eSFP, Tx 1550 nm/Rx 1310 nm, LC, Single-mode, 10 km

Commercial Single-fiber bidirectional Commercial

Table 8-34 Information about GE optical modules

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Code

Optical Module Information

Remarks

34060286

eSFP, 850 nm, LC, Multi-mode, 0.5 km

34060473

eSFP, 1310 nm, LC, Single-mode, 10 km

Two-fiber bidirectional

S4016954

eSFP, 1310 nm, LC, Single-mode, 40 km

34060360

eSFP, 1550 nm, LC, Single-mode, 80 km

34060483

eSFP, 1471nm, LC, Single-mode, 80 km

34060481

eSFP, 1491nm, LC, Single-mode, 80 km

34060479

eSFP, 1511nm, LC, Single-mode, 80 km

34060482

eSFP, 1521nm, LC, Single-mode, 80 km Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd.

Commercial

Two-fiber bidirectional CWDM Commercial

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Code

Optical Module Information

34060478

eSFP, 1551nm, LC, Single-mode, 80 km

34060476

eSFP, 1571nm, LC, Single-mode, 80 km

34060477

eSFP, 1591nm, LC, Single-mode, 80 km

34060480

eSFP, 1611nm, LC, Single-mode, 80 km

34060475

eSFP, Tx 1490 nm/Rx 1310 nm, LC, Single-mode, 10 km

34060470

eSFP, Tx 1310 nm/Rx 1490 nm, LC, Single-mode, 10 km

34060539

eSFP, Tx 1310 nm/Rx 1490 nm, LC, Single-mode, 40 km

34060540

eSFP, Tx 1490 nm/Rx 1310 nm, LC, Single-mode, 40 km

34060595

eSFP, Tx 1570 nm/Rx 1490 nm, LC, Single-mode, 80 km

34060596

eSFP, Tx 1490 nm/Rx 1570 nm, LC, Single-mode, 80 km

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Remarks

Single-fiber bidirectional Commercial

Table 8-35 Information about FE Electrical Module Code

Electrical Module Information

34100101

100BASE-T, RJ45, SFP Electrical Module, 100 m

Table 8-36 Information about GE Electrical Module Code

Electrical Module Information

34100080

1000BASE-T, RJ45, SFP Electrical Module, 100 m

34100052

1000BASE-T, RJ45, SFP Electrical Module, Auto Negotiate, 100 m

Physical Specifications Board dimensions (mm): 22.86 (H) x 225.75 (D) x 193.80 (W) Weight (kg): 0.44 Power consumption (W, room temperature): 12.0

8.8 AND1EM4C: 4 Channels GE/FE Combo Board The AND1EM4C (EM4C for short) board is a 4 x FE/GE Combo board and its functional version is AND1. The AND1EM4C is housed in any of slots 1 to 4 (when working with the AND1CXPA/ AND1CXPB) and in any of slots 1 to 6 (when working with the AND2CXPA/AND2CXPB/ AND2CXPE). Issue 01 (2013-10-31)

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8.8.1 Front Panel On the front panel of the AND1EM4C (EM4C for short) board, there are indicators and interfaces.

Appearance Figure 8-24 shows the appearance of the front panel of the EM4C board. Figure 8-24 Front panel of the EM4C board

Indicators The following indicators are present on the front panel of the EM4C board: l

STAT indicator, red, green, or orange, which indicates the working status

l

Status indicators (L/A0 to L/A3), green or orange, which indicate the port connection status and data receiving and transmission status

l

LINK indicator, green, which indicates the port connection status

l

ACT indicator, yellow, which indicates the data receiving and transmission status of the port NOTE

There are four LINK indicators and four ACT indicators on the EM4C board. One LINK indicator and one ACT indicator are present above each FE/GE electrical interface (RJ-45).

For the descriptions of the indicators, see 12.1 Indicators.

Interfaces Table 8-37 describes the types and functions of the interfaces on the EM4C board. Table 8-37 Interfaces on the EM4C board Interfaces

Interface Type

Function

Required Cable

OUT0 IN0 to OUT3 IN3

SFP

FE/GE signal input/output interfaces

For details, see 10.6 Optical Fibers.

FE/GE0 to FE/ GE3

RJ-45

FE/GE electrical signal input/ output interfaces

For details, see 10.5.1 Ethernet Cables.

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NOTE

The four SFP interfaces and four electrical interfaces are numbered from 0 to 3. Each SFP interface corresponds to the electrical interface with the same number and the two interfaces are considered as a group (for example, OUT0 IN0 and FE/GE0). The two interfaces in each group cannot be used at the same time.

Table 8-38 SFP interfaces Interface s

Supported Pluggable Modules

Interface Type

Function

OUT0 IN0 to OUT3 IN3

FE optical modules

LC

FE/GE optical signal input/output interfaces

GE optical modules

Table 8-39 Pins of FE/GE electrical interfaces Front View

87654321

Pin

Function

1

Positive of twisted pair 1

2

Negative of twisted pair 1

3

Positive of twisted pair 2

4

Positive of twisted pair 3

5

Negative of twisted pair 3

6

Negative of twisted pair 2

7

Positive of twisted pair 4

8

Negative of twisted pair 4

8.8.2 Functions and Features The AND1EM4C (EM4C for short) board provides four FE/GE SFP interfaces and four FE/GE electrical interfaces, and it works with the system control board to transceive and process 4 x FE/GE services. Table 8-40 describes the functions and features of the EM4C board.

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Table 8-40 Functions and features of the EM4C board Functions and Features

Description

Basic functions

Provides four FE/GE SFP interfaces and four FE/GE electrical interfaces. Supports the hot swappable function. Supports temperature and voltage detection.

Interfaces

FE/GE SFP interfaces support FE optical modules and GE optical modules. FE/GE electrical interfaces support signals at 10 Mbit/s, 100 Mbit/s, and 1000 Mbit/s. Supports inloops and outloops. Supports flow control. Supports Layer 2 and Layer 3 working modes.

Clocks

Supports physical-layer clock synchronization (synchronous Ethernet). Supports IEEE 1588v2 and IEEE 1588 ACR.

NOTE l The four FE/GE SFP interfaces and four FE/GE electrical interfaces are numbered from 0 to 3. Each FE/GE SFP interface corresponds to the FE/GE electrical interface with the same number and the two interfaces are considered as a group (for example, OUT0 IN0 and FE/GE0). The two interfaces in each group cannot be used at the same time. l When using a 10 Mbit/s electrical interface, the board does not support synchronous Ethernet or IEEE 1588v2.

8.8.3 Working Principle and Signal Flow The AND1EM4C (EM4C for short) board consists of interfaces, an ETH module, a logic module, a clock module, and a power module. Figure 8-25 illustrates the working principle of the EM4C board.

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Figure 8-25 Working principle of the EM4C board Backplane

AND1EM4C SFP

ETH Module

SFP SFP

ETH Module

SFP RJ-45

ETH Module

RJ-45 RJ-45

ETH Module

RJ-45

1 x GE CLK 1 x GE CLK 1 x GE

Service logic

4 x GE Signal selection

CXP

CLK

CLK

CXP

1 x GE CLK Control logic

Control

Logic Module Clock Module

Power Module

CXP -48V/-60V PIU -48V/-60V PIU

In the Receive Direction After the EM4C board receives FE/GE services through the SFP or electrical interfaces, the Ethernet processing module performs encoding, decoding, and serial/parallel conversion of the service data, extracts synchronous Ethernet clock signals, and transmits the service data to the logic module. Then the service logic in the logic module buffers and schedules the service data, processes synchronous Ethernet clock signals and IEEE 1588v2 packets, and transmits the processed data to the active and standby system control boards.

In the Transmit Direction After the EM4C board receives the service data from the active system control board, the service logic in the logic module identifies the target interfaces of the service data, buffers and schedules the service data, processes synchronous Ethernet clock signals and IEEE 1588v2 packets, and transmits the processed data to the Ethernet processing module. Then the Ethernet processing module performs encoding, decoding, and serial/parallel conversion of the service data, delivers synchronous Ethernet clock signals downstream, and transmits the processed data through the pre-determined SFP or electrical interfaces on the board.

ETH Module The Ethernet processing module performs the following functions: l

Processes information on physical interfaces.

l

Performs encoding, decoding, and serial/parallel conversion of service data.

l

Extracts synchronous Ethernet clock signals.

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Logic Module The logic module includes a service logic and a control logic. l

The service logic performs the following functions: – Buffers and schedules service data. – Identifies the target interfaces of the service data. – Exchanges service data with the active and standby system control boards using the dual-fed and selective receiving function. – Supports synchronous Ethernet and IEEE 1588v2.

l

The control logic works with the system control boards to manage and control each module on the board.

Clock Module The clock module provides the working clock for each module on the board.

Power Module The power module provides a DC voltage for each module on the board.

8.8.4 Technical Specifications and Standards Compliance Technical specifications of the AND1EM4C (EM4C for short) board include interface specifications and physical specifications.

Interface Specifications l

For the specifications of FE/GE electrical interfaces, see Table 8-41.

l

For information about the swappable FE/GE optical modules supported at FE/GE (SFP) interfaces, see Table 8-42 and Table 8-43. The interface specifications depend on the optical/electrical modules on the board. For details on the specifications of optical/electrical modules, see 9 Swappable Optical/Electrical Modules.

Table 8-41 Specifications of the FE/GE electrical interface Item

Specification Requirement

Interface rate

10 Mbit/s, 100 Mbit/s, 1000 Mbit/s.

RJ-45 electrical interface specification

Complies with IEEE 802.3 and enterprise regulations.

Table 8-42 Information about FE optical modules

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Code

Optical Module Information

Remarks

S4015755

eSFP, 1310 nm, STM-1, LC, Single-mode, 15 km

Two-fiber bidirectional

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Code

Optical Module Information

Remarks

S4015715

eSFP, 1310 nm, STM-1, LC, Single-mode, 40 km

Commercial

34060282

eSFP, 1550 nm, STM-1, LC, Single-mode, 80 km

34060363

eSFP, Tx 1310 nm/Rx 1550 nm, LC, Single-mode, 10 km

34060364

eSFP, Tx 1550 nm/Rx 1310 nm, LC, Single-mode, 10 km

Single-fiber bidirectional Commercial

Table 8-43 Information about GE optical modules Code

Optical Module Information

Remarks

34060286

eSFP, 850 nm, LC, Multi-mode, 0.5 km

34060473

eSFP, 1310 nm, LC, Single-mode, 10 km

Two-fiber bidirectional

S4016954

eSFP, 1310 nm, LC, Single-mode, 40 km

34060360

eSFP, 1550 nm, LC, Single-mode, 80 km

34060483

eSFP, 1471nm, LC, Single-mode, 80 km

34060481

eSFP, 1491nm, LC, Single-mode, 80 km

34060479

eSFP, 1511nm, LC, Single-mode, 80 km

34060482

eSFP, 1521nm, LC, Single-mode, 80 km

34060478

eSFP, 1551nm, LC, Single-mode, 80 km

34060476

eSFP, 1571nm, LC, Single-mode, 80 km

34060477

eSFP, 1591nm, LC, Single-mode, 80 km

34060480

eSFP, 1611nm, LC, Single-mode, 80 km

34060475

eSFP, Tx 1490 nm/Rx 1310 nm, LC, Single-mode, 10 km

34060470

eSFP, Tx 1310 nm/Rx 1490 nm, LC, Single-mode, 10 km

34060539

eSFP, Tx 1310 nm/Rx 1490 nm, LC, Single-mode, 40 km

34060540

eSFP, Tx 1490 nm/Rx 1310 nm, LC, Single-mode, 40 km

34060595

eSFP, Tx 1570 nm/Rx 1490 nm, LC, Single-mode, 80 km

34060596

eSFP, Tx 1490 nm/Rx 1570 nm, LC, Single-mode, 80 km

Commercial

Two-fiber bidirectional CWDM Commercial

Single-fiber bidirectional Commercial

Physical Specifications Dimensions (mm): 20.32 (H) x 193.80 (W) x 225.75 (D) Weight (kg): 0.46 Issue 01 (2013-10-31)

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Power consumption under room temperature (W): 9.4

8.9 AND1EM8F - 8 Channels GE/FE Optical Interface Board The AND1EM8F (EM8F for short) is an eight channels FE/GE optical interface board. The function version of the EM8F is AND1. The AND1EM8F is housed in any of slots 1 to 2.

8.9.1 Front Panel On the front panel of the AND1EM8F, there are indicators and interfaces.

Appearance of the Front Panel Figure 8-26 shows the appearance of the front panel of the AND1EM8F. Figure 8-26 Front panel of the AND1EM8F

Indicator The following indicators are present on the front panel of the AND1EM8F: l

STAT indicator, red, green, or orange, which indicates the working status

l

L/A0 to L/A7 indicators, green or orange, which indicate the port connection status and data transmit/receive status

For details on meanings of indicators, see 12.1 Indicators.

Interface Eight SFP interfaces are present on the EM8F. Table 8-44 lists the types and usage of the interfaces on the EM8F.

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Table 8-44 Types and usage of the interfaces on the AND1EM8F Interface on the Front Panel

Interface Type

Usage

Correspo nding Cable Fiber

Optical interface

LC

When a two-fiber bidirectional optical module is used, this interface is used as an input interface for the GE optical signal.

Refer to 10.6 Optical Fibers.

IN0 to IN7

When a single-fiber bidirectional optical module is used, this interface is not used. OUT0 to OUT7

LC

When a two-fiber bidirectional optical module is used, this interface is used as an output interface for the GE/FE optical signal. When a single-fiber bidirectional optical module is used, this interface is used as an input/output interface for the GE/FE optical signal.

Electrical module

OUT0 IN0, OUT7 IN7

RJ-45

Input/Output interfaces for GE electrical signals

For details, see 10.5.1 Ethernet Cables.

NOTE The GE SFP interface on the front panel can function as either an optical interface or an electrical interface. When the SFP interface functions as an optical interface, it needs to be used with an optical module; when the SFP interface functions as an electrical interface, it needs to be used with an electrical module.

8.9.2 Functions and Features The AND1EM8F mainly accesses 8 x FE/GE optical signals, and processes the services with the AND1CXPA/AND1CXPB. Table 8-45 lists the functions and features of the AND1CXPA/AND1EM8F. Table 8-45 Functions and features of the AND1EM8F Function and Feature

Description

Basic function

Supports eight FE/GE interfaces (SFP). Supports the hot swappable function.

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Function and Feature

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Description Detects the temperature and voltage of the board.

Interface function

Supports FE optical modules, FE electrical modules, GE optical modules and GE electrical modules. Supports inloops and outloops. Supports the traffic control function. Supports Layer 2 and Layer 3 working modes.

Clock

Supports physical-layer clock synchronization (synchronous Ethernet). Supports IEEE 1588v2 and IEEE 1588 ACR.

NOTE If the SFP interface houses an electrical module, the interface does not support synchronous Ethernet or IEEE 1588v2.

8.9.3 Working Principle and Signal Flow The AND1EM8F mainly consists of the service access module, service processing module, management module, clock module, and power supply module. Figure 8-27 shows the block diagram for the functions of the AND1EM8F. Figure 8-27 Block diagram for the functions of the AND1EM8F 8 x FE/GE optical signals

Back plane Service access module

Management bus

Service signals

Service processing module

Management bus

Management module

Service signals

CXP

Clock signals

Clock module

Clock signals

Management bus

Each module on the board

3.3V 3.0V 2.5V 1.8V 1.2V

CXP CXP

Power supply module

-48V/-60V

System power supply

-48V/-60V

System power supply

Transmit Direction The service packets from AND1CXPA/AND1CXPB are sent to the service processing module through the backplane-side interface of the EM8F. The service processing module identifies the destination interfaces for the packets, and buffers and schedules the packets. Then, the service Issue 01 (2013-10-31)

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processing module sends the processed packets to the service access module, where coding/ decoding, serial/parallel conversion, and E/O conversion are performed. Finally, the service access module outputs the packets through the GE/FE interfaces on the front panel.

Receive Direction The GE/FE interfaces on the front panel receive GE/FE service signals. Then, the service access module performs O/E conversion, serial/parallel conversion, and coding/decoding on the services, and then sends the services to the service processing module. The service processing module buffers the service packets, schedules the packets, and finally outputs the packets through the backplane-side interface.

Service Access Module This module performs the following functions: l

In the receive direction, this module receives the GE/FE services from the interfaces on the front panel, performs O/E conversion, serial/parallel conversion, and coding/decoding, and then sends the services to the service processing module.

l

In the transmit direction, this module receives the service packets from the service processing module, performs coding/decoding, serial/parallel conversion, and E/O conversion on the packets, and then outputs the packets through the GE/FE interfaces on the front panel.

l

This module extracts the synchronous Ethernet clock.

Service Processing Module This module performs the following functions: l

In the receive direction, this module receives and buffers the service packets from the service access module. Then, this module schedules packets from different interfaces. Finally, this module outputs the packets through the backplane-side interface.

l

In the transmit direction, this module receives service packets from the AND1CXPA/ AND1CXPB, identifies the destination interfaces of the packets, and buffers and schedules the packets. Finally, this module outputs the packets to the service access module.

l

This module extracts and inserts IEEE 1588 V2 packets.

Management Module This module is used with the AND1CXPA/AND1CXPB to manage and control each module on the EM8F.

Clock Module This module performs the following functions: l

Provides the working clock for each module on the EM8F.

l

Supports the synchronous Ethernet and SSM protocols.

l

Supports the IEEE 1588 V2 protocol.

l

Supports the 1588 ACR clock.

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Power Supply Module This module provides the DC power of the following specifications to each module on the EM8F. l

3.3 V

l

3.0 V

l

2.5 V

l

1.8 V

l

1.2 V

8.9.4 Technical Specifications Technical specifications of the AND1EM8F board include interface specifications and physical specifications.

Interface Specifications For information about the swappable FE/GE optical/electrical modules supported at SFP interfaces on the AND1EM8F board, see Table 8-46, Table 8-47, Table 8-48, and Table 8-49. The interface specifications depend on the optical/electrical modules on the board. For details on the specifications of optical/electrical modules, see 9 Swappable Optical/Electrical Modules. Table 8-46 Information about FE optical modules Code

Optical Module Information

Remarks

S4015755

eSFP, 1310 nm, STM-1, LC, Single-mode, 15 km

S4015715

eSFP, 1310 nm, STM-1, LC, Single-mode, 40 km

Two-fiber bidirectional

34060282

eSFP, 1550 nm, STM-1, LC, Single-mode, 80 km

34060363

eSFP, Tx 1310 nm/Rx 1550 nm, LC, Single-mode, 10 km

34060364

eSFP, Tx 1550 nm/Rx 1310 nm, LC, Single-mode, 10 km

Commercial Single-fiber bidirectional Commercial

Table 8-47 Information about GE optical modules

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Code

Optical Module Information

Remarks

34060286

eSFP, 850 nm, LC, Multi-mode, 0.5 km

34060473

eSFP, 1310 nm, LC, Single-mode, 10 km

Two-fiber bidirectional

S4016954

eSFP, 1310 nm, LC, Single-mode, 40 km

34060360

eSFP, 1550 nm, LC, Single-mode, 80 km

34060483

eSFP, 1471nm, LC, Single-mode, 80 km

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Code

Optical Module Information

Remarks

34060481

eSFP, 1491nm, LC, Single-mode, 80 km

CWDM

34060479

eSFP, 1511nm, LC, Single-mode, 80 km

34060482

eSFP, 1521nm, LC, Single-mode, 80 km

34060478

eSFP, 1551nm, LC, Single-mode, 80 km

34060476

eSFP, 1571nm, LC, Single-mode, 80 km

34060477

eSFP, 1591nm, LC, Single-mode, 80 km

34060480

eSFP, 1611nm, LC, Single-mode, 80 km

34060475

eSFP, Tx 1490 nm/Rx 1310 nm, LC, Single-mode, 10 km

34060470

eSFP, Tx 1310 nm/Rx 1490 nm, LC, Single-mode, 10 km

34060539

eSFP, Tx 1310 nm/Rx 1490 nm, LC, Single-mode, 40 km

34060540

eSFP, Tx 1490 nm/Rx 1310 nm, LC, Single-mode, 40 km

34060595

eSFP, Tx 1570 nm/Rx 1490 nm, LC, Single-mode, 80 km

34060596

eSFP, Tx 1490 nm/Rx 1570 nm, LC, Single-mode, 80 km

Commercial

Single-fiber bidirectional Commercial

Table 8-48 Information about FE Electrical Module Code

Electrical Module Information

34100101

100BASE-T, RJ45, SFP Electrical Module, 100 m

Table 8-49 Information about GE Electrical Module Code

Electrical Module Information

34100080

1000BASE-T, RJ45, SFP Electrical Module, 100 m

34100052

1000BASE-T, RJ45, SFP Electrical Module, Auto Negotiate, 100 m

Physical Specifications Board dimensions (mm): 22.86 (H) x 225.75 (D) x 193.80 (W) Weight (kg): 0.46 Power consumption (W, room temperature): 18.7

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8.10 AND1EX1 - 1 Channel 10 GE Optical Interface Board The AND1EX1 (EX1 for short) is a one channel 10 GE optical interface board. The function version of the EX1 is AND1. The AND1EX1 is housed in any of slots 5 to 6 (when working with the AND1CXPA), in any of slots 3 to 6 (when working with the AND1CXPB), and in any of slots 1 to 6 (when working with the AND2CXPA/AND2CXPB/AND2CXPE).

8.10.1 Front Panel On the front panel of the AND1EX1, there are indicators and an interface.

Appearance of the Front Panel Figure 8-28 shows the appearance of the front panel of the AND1EX1. Figure 8-28 Front panel of the AND1EX1

Indicator The following indicators are present on the front panel of the AND1EX1: l

STAT indicator, red, green, or orange, which indicates the working status

l

L/A indicators, green or orange, which indicate the port connection status and data transmit/ receive status

For details on meanings of indicators, see 12.1 Indicators.

Interface One SFP interface is present on the AND1EX1. Table 8-50 lists the types and usage of the interfaces on the AND1EX1. Table 8-50 Types and usage of the interfaces on the AND1EX1

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Interface on the Front Panel

Interface Type

Usage

Correspo nding Fiber

Optical interface

IN

LC

Input interface for the 10GE optical signal

OUT

LC

Output interface for the 10GE optical signal

Refer to 10.6 Optical Fibers.

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8.10.2 Functions and Features The AND1EX1 mainly accesses one channel of 10 GE signal, and processes the services with the control board. Table 8-51 lists the functions and features of the AND1EX1. Table 8-51 Functions and features of the AND1EX1 Function and Feature

Description

Basic function

Supports one 10GE interfaces (XFP). Supports the hot swappable function. Detects the temperature and voltage of the board.

Interface function

Supports 10GE optical modules. Supports inloops and outloops. Supports the traffic control function. Supports Layer 2 and Layer 3 working modes.

Clock

Supports physical-layer clock synchronization (synchronous Ethernet). Supports IEEE 1588v2 and IEEE 1588 ACR.

8.10.3 Working Principle and Signal Flow AND1EX1 mainly consists of the service access module, service processing module, management module, clock module, and power supply module Figure 8-29 shows the block diagram for the functions of the AND1EX1. Figure 8-29 Block diagram for the functions of the AND1EX1 Back plane 1 x 10GE signal

Service access module

Management bus

Service signals

Service processing module

Management bus

Management module

Service signals

CXP

Clock signals

Clock module

Clock signals

Management bus

Each module on the board

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5.0V 3.3V 1.8V 1.2V

CXP CXP

Power supply module

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-48V/-60V

System power supply

-48V/-60V

System power supply

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Transmit Direction The service packets from AND1CXPA/AND1CXPB are sent to the service processing module through the backplane-side interface of the EX1. The service processing module buffers and schedules the packets. Then, the service processing module sends the processed packets to the service access module, where coding/decoding, and serial/parallel conversion are performed. Finally, the service access module outputs the packets through the 10 GE interface on the front panel.

Receive Direction The 10 GE interface on the front panel receives 10 GE service signals. Then, the service access module performs serial/parallel conversion, and coding/decoding on the services, and then sends the services to the service processing module. The service processing module buffers and schedules the service packets, and finally outputs the packets through the backplane-side interface.

Service Access Module This module performs the following functions: l

In the receive direction, this module receives the 10 GE services from the interfaces on the front panel, performs serial/parallel conversion, and coding/decoding, and then sends the services to the service processing module.

l

In the transmit direction, this module receives the service packets from the service processing module, performs coding/decoding, and serial/parallel conversion on the packets, and then outputs the packets through the 10 GE interfaces on the front panel.

l

This module extracts the synchronous Ethernet clock.

Service Processing Module This module performs the following functions: l

In the receive direction, this module receives and buffers the service packets from the interface conversion module. Then, this module schedules packets based on the access capability of the EX1 and the access bandwidth settings at the interface. Finally, this module outputs the packets through the backplane-side interface.

l

In the transmit direction, this module receives service packets from the AND1CXPA/ AND1CXPB, buffers and schedules the packets. Finally, this module outputs the packets to the service access module.

l

This module extracts and inserts IEEE 1588 V2 packets.

Management Module This module is used with the AND1CXPA/AND1CXPB to manage and control each module on the EX1.

Clock Module This module performs the following functions: Issue 01 (2013-10-31)

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l

Provides the working clock for each module on the EX1.

l

Supports the synchronous Ethernet and SSM protocols.

l

Supports the IEEE 1588 V2 protocol.

l

Supports the 1588 ACR clock.

8 ATN 950B Boards

Power Supply Module This module provides the DC power of the following specifications to each module on the EX1. l

5.0 V

l

3.3 V

l

1.8 V

l

1.2 V

8.10.4 Technical Specifications Technical specifications of the AND1EX1 board include interface specifications and physical specifications.

Interface Specifications For information about the swappable optical modules supported at XFP interfaces on the AND1EX1 board, see Table 8-52. The interface specifications depend on the optical modules on the board. For details on the specifications of optical modules, see 9 Swappable Optical/ Electrical Modules. Table 8-52 Information about 10GE optical modules

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Code

Optical Module Information

Remarks

S4015772

XFP, 1310 nm, LC, Singlemode, 10 km

S4015776

XFP, 1550 nm, LC, Singlemode, 40 km

Two-fiber bidirectional

S4015794

XFP, 1550 nm, LC, Singlemode, 80 km

34060547

XFP, 1471 nm, LC, Singlemode, 70 km

34060548

XFP, 1491 nm, LC, Singlemode, 70 km

34060549

XFP, 1511 nm, LC, Singlemode, 70 km

34060550

XFP, 1531 nm, LC, Singlemode, 70 km

34060551

XFP, 1551 nm, LC, Singlemode, 70 km

34060552

XFP, 1571 nm, LC, Singlemode, 70 km

34060553

XFP, 1591 nm, LC, Singlemode, 70 km

34060554

XFP, 1611 nm, LC, Singlemode, 70 km

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Code

Optical Module Information

Remarks

34060568

TXFP, 1529.163 nm to 1560.606 nm (wavelength tunable), LC, Singlemode, 40 km

Two-fiber bidirectional

34060532

XFP, 1529.55 nm, LC, Singlemode, 80 km

34060515

XFP, 1530.33 nm, LC, Singlemode, 80 km

34060504

XFP, 1531.12 nm, LC, Singlemode, 80 km

34060503

XFP, 1531.90 nm, LC, Singlemode, 80 km

34060534

XFP, 1532.68 nm, LC, Singlemode, 80 km

34060628

XFP, 1533.47 nm, LC, Singlemode, 80 km

34060627

XFP, 1534.25 nm, LC, Singlemode, 80 km

34060626

XFP, 1535.04 nm, LC, Singlemode, 80 km

34060531

XFP, 1548.51 nm, LC, Singlemode, 80 km

34060514

XFP, 1549.32 nm, LC, Singlemode, 80 km

34060502

XFP, 1550.12 nm, LC, Singlemode, 80 km

34060501

XFP, 1550.92 nm, LC, Singlemode, 80 km

34060533

XFP, 1551.72 nm, LC, Singlemode, 80 km

34060625

XFP, 1552.52 nm, LC, Singlemode, 80 km

34060624

XFP, 1553.33 nm, LC, Singlemode, 80 km

34060623

XFP, 1554.13 nm, LC, Singlemode, 80 km

DWDM Commercial

Physical Specifications Board dimensions (mm): 22.86 (H) x 225.75 (D) x 193.80 (W) Weight (kg): 0.42 Power consumption (W, room temperature): 13.1

8.11 AND2CQ1B - 4 Channels Channelized OC-3c/STM-1c POS Optical Interface Board This section describes the AND2CQ1B, a 4 channels channelized OC-3c/STM-1c POS optical interface board, in terms of the overview, functions, features, working principle, front panel, and technical specifications.

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8.11.1 Front Panel On the front panel of the AND2CQ1B board, there are indicators and interfaces.

Appearance of the Front Panel Figure 8-30 shows the front panel of the AND2CQ1B board. Figure 8-30 Front panel of the AND2CQ1B board

Indicator The following indicators are present on the front panel of the AND2CQ1B board: l

STAT indicator, red, green, or orange, which indicates the working status

l

LOS1 to LOS4 indicators, red or green, which indicate the port status

For details on meanings of the indicators, see 12.1 Indicators.

Interfaces Four SFP interfaces are present on the front panel of the AND2CQ1B board. Table 8-53 lists the types and usage of the interfaces. For details on fiber connections to these interfaces, see 10.6 Optical Fibers. Table 8-53 Types and usage of the interfaces on the AND2CQ1B board Interface on the Front Panel

Interface Type

Usage

IN0 to IN1

LC

Input interface for STM-1 (VC12) optical signals

OUT0 to OUT1

LC

Output interface for STM-1 (VC12) optical signals

NOTE The SFP interface should be used with an optical module. l When a two-fiber bidirectional optical module is used, two LC interfaces are provided on the left and right sides of the optical module. Each interface uses one fiber, which is used to transmit or receive service signals. l When a single-fiber bidirectional optical module is used, only one LC interface is provided on the left side of the optical module. This optical interface uses only one fiber, which is used to transmit and receive service signals at the same time.

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8.11.2 Functions and Features When working with the main control board, the AND2CQ1B board receives and processes 4 channels STM-1(VC12) signals. Table 8-54 lists the functions and features of the AND2CQ1B. Table 8-54 Functions and features of the AND2CQ1B Function and Feature

Remarks

Basic function

Provides four channelized STM-1 optical interfaces. Supports the hot swappable function. Detects the temperature and voltage of the board.

CPOS interface function

The CPOS interface supports FE optical modules. The CPOS interface supports inloops and outloops. The E1 channel supports the PRBS test. The E1 channel supports inloops and outloops. The E1 channel supports the master/slave clock modes. The E1 channel supports the serial interface in the E1 and CE1 modes. The serial interface supports the ATM, TDM, and PPP protocols.

CPOS-Trunk interface

Number of CPOS-Trunk member interfaces

2

The E1 channel supports the serial interface in the E1 and CE1 modes. The Trunk-serial interface supports the TDM and PPP protocols.

ATM

Supports the APS protocol.

1+1 unidirectional protection

Number of supported ATM E1 services

252

Number of supported IMA groups

128

Maximum number of E1 links supported by each IMA group

32

Encapsulates ATM VPC/VCC service to the PWE3 in the N-to-1 (N ≤32) or 1-to-1 format. Supports the ATM bundle function. Number of supported PVCs/PVPs Issue 01 (2013-10-31)

1024

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Function and Feature

TDM

PPP

8 ATN 950B Boards

Remarks Number of supported local ATM CCCs

128

Number of supported remote ATM PWE3s

256

Supports CES services in CESoPSN and SAToP modes. Number of supported local TDM CCCs

126

Number of supported remote TDM PWE3s

252

Number of supported PPP links

252

Number of supported MLPPP groups

64

Maximum number of links supported by each ML-PPP group

16

Number of supported global MP groups

64

Maximum number of links supported by each global MP group

16

8.11.3 Working Principle and Signal Flow The AND2CQ1B board consists of an SDH processing module, a logic processing module, a data processing module, a management module, a clock module, and a power supply module. Figure 8-31 shows the functional block diagram of the AND2CQ1B board.

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Figure 8-31 Functional block diagram of the AND2CQ1B board Backplane 4 xSTM-1(VC12)signals

SDH processing module

Service signal

Logic processing module

Management bus

Service signal

Service signals

Data processing module

Management bus

Clock module Power supply module

CXP B

Management bus Management bus

Management module

3.3 V 3.0 V 2.5 V 1.5V 1.2 V 1.0 V 0.75 V

CXP A Service signals

CXP

System clock signals

-48 V/-60 V -48 V/-60 V

CXP

PIU PIU

Upstream Direction In the receive direction, the SDH processing module accesses 4 x channelized STM-1 services through the interface on the front panel. This module decapsulates the VC-12 timeslots from the STM-1 signals, recovers the E1 signals, processes the overhead bytes, pointers, and alarm signals, and sends the processed signals to the logic processing module. Then, the logic processing module rearranges the E1 frames, processes the rearranged signals, and sends the signals to the data processing module for PWE3 encapsulation and PW scheduling. Finally, the signals are sent to the main control board through the interface on the backplane.

Transmit Direction In the transmit direction, the data processing module receives the signals from the the main control board, identifies the signals, performs the PWE3 decapsulation, and then sends the signals to the logic processing module. The logic processing module processes various signals, schedules queues, and sends the processed signals to the SDH processing module. The SDH processing module maps the E1 signals to the VC-12 timeslots, multiplexes the VC-12 timeslots to the STM-1 signals, adds the overhead bytes and pointers, processes the alarm signals, and sends out the STM-1 signals through the interface on the front panel.

SDH Processing Module This module performs the following functions: l

In the receive direction, this module recovers clock or data from the received 4 channels STM-1(VC12) signals, align frames, descrambles signals, processes SOHs, adjusts pointers, processes POHs. Then it sends the signals to the logic processing module over a bus for further processing.

l

In the transmit direction, this module receives service signals from the logic processing module, reframes VC-3 or VC-4 signals, adds overheads and pointers, processes alarms,

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and sends 4 channels STM-1(VC12) signals to other boards through the interfaces on the front panel. l

This module performs LMSP protection switching to protect services against failures.

l

This module extracts and recovers the line clock.

logic Processing Module This module performs the following functions: l

In the receive direction, this module receives the signals from the SDH processing module, rearranges the frames of the E1 signals, performs processing and suppression of timeslots of the CES services. Then, the processed signals are sent to the data processing module.

l

In the transmit direction, this module receives the signals from the data processing module, and sends the processed signals to the SDH processing module.

Data Processing Module This module performs the following functions. l

In the receive direction, this module obtains PW information about the service, encapsulates signals in PWE3, schedules PWs, and sends the signals to main control board through the backplane-side interfaces.

l

In the transmit direction, this module receives service signals from main control board, determines the service signal type, decapsulates PWE3 signals, and schedules the signals.

Management Module This module works with main control board to manage and control other modules on the board.

Clock Module This module performs the following functions: l

Processes the line clock.

l

Receives the system clock from main control board and provides the working clock for each module on the board.

l

Supports the synchronization status message (SSM) protocol.

Power Supply Module This module provides required voltages for other modules on the board. l

3.3 V

l

3.0 V

l

2.5 V

l

1.5 V

l

1.2 V

l

1.0 V

l

0.75 V

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8.11.4 Technical Specifications The technical specifications of the AND1CQ1B board cover interface specifications, board dimensions, weight, and power consumption.

Interface Specifications For information about the swappable optical modules supported by SFP interfaces on the AND2CQ1B board, see Table 8-55. The interface specifications depend on the optical modules on the board. For details on the optical modules, see 9 Swappable Optical/Electrical Modules. Table 8-55 Information about FE optical modules Code

Optical Module Information

Remarks

S4015755

eSFP, 1310 nm, STM-1, LC, Single-mode, 15 km

S4015715

eSFP, 1310 nm, STM-1, LC, Single-mode, 40 km

Two-fiber bidirectional

34060282

eSFP, 1550 nm, STM-1, LC, Single-mode, 80 km

34060363

eSFP, Tx 1310 nm/Rx 1550 nm, LC, Single-mode, 10 km

34060364

eSFP, Tx 1550 nm/Rx 1310 nm, LC, Single-mode, 10 km

Commercial Single-fiber bidirectional Commercial

Other Specifications Board dimensions (mm): 20.32 (H) x 193.80 (W) x 225.75 (D) Weight (kg): 0.47 Power consumption (W): 11.50

8.12 AND2PQ1: 4 Channels OC-3/STM-1 POS Optical Interface Board The AND2PQ1 (PQ1 for short) board is a 4 x OC-3/STM-1 POS optical interface board and its functional version is AND2. It is configured in any of slots 1 to 6 in a chassis.

8.12.1 Front Panel On the front panel of the AND2PQ1 (PQ1 for short) board, there are indicators and four optical interfaces.

Appearance Figure 8-32 shows the appearance of the front panel of the PQ1 board. Issue 01 (2013-10-31)

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Figure 8-32 Front panel of the PQ1 board

Indicators The following indicators are present on the front panel of the PQ1 board: l

STAT indicator, red, green, or orange, which indicates the working status

l

LOS0, LOS1, LOS2, and LOS3, red or green, which indicate the port status

For the descriptions of the indicators, see 12.1 Indicators.

Interfaces There are four SFP interfaces on the PQ1 board. Table 8-56 describes the types and functions of the interfaces. For details on the required optical fibers, see 10.6 Optical Fibers. Table 8-56 Interfaces on the PQ1 board Interfaces

Interface Type

Function

IN0 to IN3

LC

STM-1 optical signal input interfaces

OUT0 to OUT3

LC

STM-1 optical signal output interfaces

NOTE The SFP interface should be used with an optical module. l When a two-fiber bidirectional optical module is used, two LC interfaces are provided on the left and right sides of the optical module. Each interface uses one fiber, which is used to transmit or receive service signals. l When a single-fiber bidirectional optical module is used, only one LC interface is provided on the left side of the optical module. This optical interface uses only one fiber, which is used to transmit and receive service signals at the same time.

8.12.2 Functions and Features The AND2PQ1 (PQ1 for short) board works with the system control board to transceive and process 4 x STM-1 (POS) data services. Table 8-57 describes the functions and features of the PQ1 board.

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Table 8-57 Functions and features of the PQ1 board Functions and Features

Description

Basic functions

Provides four POS optical interfaces. Supports the hot swappable function. Supports temperature and voltage detection.

Interfaces

Supports FE optical modules. Supports the Point-to-Point Protocol (PPP). Supports the master clock mode (unconfigurable). Supports inloops and outloops.

8.12.3 Working Principle and Signal Flow The AND2PQ1 (PQ1 for short) board consists of interfaces, an SDH processing module, a logic module, a data processing module, a clock module, and a power module. Figure 8-33 illustrates the working principle of the PQ1 board. Figure 8-33 Working principle of the PQ1 board Backplane

AND2PQ1

SFP

STM-1 STM-1

4 x VC4

SDH STM-1 Module SFP STM-1 SFP

Service logic

4 x VC4

Data Module

Control logic

Issue 01 (2013-10-31)

1 x GE

CXP

Control

Logic Module Clock Module

Signal selection

SFP

Power Module

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CXP

-48V/-60V

PIU -48V/-60V PIU

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In the Receive Direction The SDH processing module receives 4 x channelized STM-1 services through the interface on the front panel, processes STM-1 section and channel overheads, pointers, and alarms, and transmits the scrambled signals to the logic module. The service logic of the logic module transparently transmits VC-4 services. Then the data processing module encapsulates the service signals into frames and transmits the frames to the active and standby system control boards through GE channels.

In the Transmit Direction The PQ1 board receives service data from the active system control board, decapsulates the service data, and transmits the processed data to the logic module. The service logic of the logic module transparently transmits VC-4 services. Then the SDH processing module encapsulates the service signals into STM-1 signals, adds overheads and pointers to the signals, processes alarms, and transmits the STM-1 signals through the interfaces on the front panel.

SDH Processing Module The SDH processing module processes STM-1 section and channel overheads, pointers, and alarms.

Logic Module The service logic of the logic module transparently transmits VC-4 services. The control logic works with the system control boards to manage and control each module on the board.

Data Processing Module The data processing module performs the following functions. l

Encapsulates and decapsulates VC-4 service signals.

l

Dually transmits and selectively receives data from/to the active and standby system control boards.

Clock Module The clock module provides the working clock for each module on the board.

Power Module The power module provides a DC voltage for each module on the board.

8.12.4 Technical Specifications and Standards Compliance Technical specifications of the AND2PQ1 (PQ1 for short) board include interface specifications, board dimensions, weight, and power consumption.

Interface Specifications For information about the swappable optical modules supported at SFP interfaces on the AND2PQ1 board, see Table 8-58. The interface specifications depend on the optical modules Issue 01 (2013-10-31)

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on the board. For details on the specifications of optical modules, see 9 Swappable Optical/ Electrical Modules. Table 8-58 Information about FE optical modules Code

Optical Module Information

Remarks

S4015755

eSFP, 1310 nm, STM-1, LC, Single-mode, 15 km

S4015715

eSFP, 1310 nm, STM-1, LC, Single-mode, 40 km

Two-fiber bidirectional

34060282

eSFP, 1550 nm, STM-1, LC, Single-mode, 80 km

34060363

eSFP, Tx 1310 nm/Rx 1550 nm, LC, Single-mode, 10 km

34060364

eSFP, Tx 1550 nm/Rx 1310 nm, LC, Single-mode, 10 km

Commercial Single-fiber bidirectional Commercial

Other Specifications Dimensions (mm): 20.32 (H) x 193.80 (W) x 225.75 (D) Weight (kg): 0.47 Power consumption (W): 11.50

8.13 AND1ML1/AND1ML1A - 16 Channels E1 Electrical Interface Board The functional version of the AND1ML1/AND1ML1A is AND1.. NOTE

The AND1ML1 and AND1ML1A have the same functions and features except for the matched impedance (AND1ML1: 75 ohms E1; AND1ML1A: 120 ohms E1).

8.13.1 Front Panel On the front panel of the AND1ML1/AND1ML1A, there are indicators and interfaces.

Appearance of the Front Panel Figure 8-34 shows the appearance of the front panel of the AND1ML1. Figure 8-34 Front panel of the AND1ML1

Figure 8-35 shows the appearance of the front panel of the AND1ML1A. Issue 01 (2013-10-31)

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Figure 8-35 Front panel of the AND1ML1A

Indicators The following indicators are present on the front panel of the AND1ML1/AND1ML1A: l

STAT indicator, red, green, or orange, which indicates the working status

For details on meanings of indicators, see 12.1 Indicators.

Interfaces There is one Anea 96 interface on the front panel of the AND1ML1/AND1ML1A. Table 8-59 lists the type and usage of the interface. For cables corresponding to the interfaces, see 10.5.4 75-Ohm 16 x E1 Cables and 10.5.5 120-Ohm 16 x E1 Cables. Table 8-59 Type and usage of the interface on the front panel of the ML1 Interface on the Front Panel

Interface Type

Usage AND1ML1

AND1ML1A

1 - 16

Anea 96

75-ohm interface, which is used to transmit or receive the first to sixteenth channels of E1 services.

120-ohm interface, which is used to transmit or receive the first to sixteenth channels of E1 services.

Table 8-60 lists the pins of the Anea 96 interface. Table 8-60 Pins of the Anea 96 interface Front View

Connector Pin

Usage

Connector Pin

Usage

1

Rx0

25

Tx0

2 3

26 Rx1

4 5 6 Issue 01 (2013-10-31)

27

Tx1

28 Rx2

29

Tx2

30

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Front View

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Connector Pin

Usage

Connector Pin

Usage

7

Rx3

31

Tx3

8 9

32 Rx4

10 11

Rx5

Rx6

Rx7

Rx8

Rx9

R x 10

R x 11

R x 12

R x 13

56

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43

Tx9

45

T x 10

47

T x 11

73

T x 12

75

T x 13

76 R x 14

54 55

Tx8

74

52 53

41

48

50 51

Tx7

46

24 49

39

44

22 23

Tx6

42

20 21

37

40

18 19

Tx5

38

16 17

35 36

14 15

Tx4

34

12 13

33

77

T x 14

78 R x 15

79

T x 15

80

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8.13.2 Functions and Features The AND1ML1 is a 75-ohm E1 board and the AND1ML1A is a 120-ohm E1 board. The AND1ML1/ML1A can access a maximum of 16 x E1 signals, supports flexible configuration of different services on each port, and is hot swappable. Table 8-61 lists functions and features of the AND1ML1/AND1ML1A. Table 8-61 Functions and features of the AND1ML1/AND1ML1A Function and Feature

Remarks

Basic function

Provides 16 E1 interfaces. Supports the hot swappable function. Detects the temperature and voltage of the board.

Interface function

Impedance supported by the interface

AND1ML1: 75 ohm AND1ML1A: 120 ohm

Supports the E1 and CE1 modes. Supports the master clock mode (unconfigurable). Supports the HDB3 line coding (unconfigurable). Supports inloops and outloops. Supports the PRBS function in framed or unframed mode of an E1 interface in the receive/transmit direction. ATM

Number of supported ATM E1 services

16

Number of supported IMA groups

16

Maximum number of E1 links in each IMA group

16

Encapsulates ATM VPC/VCC service to the PWE3 in the Nto-1 (N≤32) or 1-to-1 format. Supports the ATM bundle function.

TDM Issue 01 (2013-10-31)

Number of supported PVCs/ PVPs

256

Number of supported local ATM CCCs

32

Number of supported remote ATM PWE3s

64

Supports CES services in CESoPSN and SAToP modes. Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd.

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Remarks Supports the timeslot compression function. For services in CESoPSN mode, a minimum of 2 timeslots can be bundled during serial port configuration. Supports the fractional E1. Different timeslots of an E1 can be bound to different CES PWs.

PPP

Clock

Number of supported local TDM CCCs

8

Number of supported remote TDM PWE3s

16

Number of supported PPP links

16

Number of supported MLPPP groups

8

Maximum number of links supported by each ML-PPP group

16

Supports physical-layer clock synchronization.

8.13.3 Working Principle and Signal Flow The AND1ML1/AND1ML1A mainly consists of the control module, line-side processing module, system-side processing module, backplane interface module, clock module, and power supply module. Figure 8-36shows the block diagram for the working principle of the AND1ML1/AND1ML1A.

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Figure 8-36 Block diagram for the working principle of the AND1ML1/AND1ML1A Backplane 1.2 V To each module

16 x E1 signals

Line-side processing module

Service bus

-48 V/-60 V

1.26 V

System-side

Service bus

processing module

Backplane interface module

Management bus Management bus

To each module

Clock signals

-48 V/-60 V

Power supply module

2.5 V 3.3 V

Control module

Clock module

3.3 V

Service bus Service bus

Serial management bus

Active CXP Standby CXP

CXP

Clock signals CXP

In Transmit Direction The AND1ML1/AND1ML1A first distributes the signals in Ethernet packets from the backplane to different protocol processing chips according to the service types. The system-side processing module decapsulates the concatenated services and buffers the services in queues. Then, this module schedules the egress queues according to the service types, processes and converts the services, and finally sends the services to the line-side processing module. The line-side processing module performs coding, dejitter, pulse shaping, and line driving for the services, and finally sends the services to E1 interfaces.

In Receive Direction The line processing module performs impedance match, signal equalization, signal level conversion, clock data recovery, dejitter, and decoding for the accessed E1 signals. Then, the signals are sent into the system-side processing module, which frames the signals, encapsulates the IMA, CES, and ML-PPP services in PWE3, and schedules PWs. Finally, this module sends the signals in Ethernet packets to the backplane interface module.

Line-Side Processing Module In the receive channel, this module performs impedance match, signal equalization, electrical level conversion, clock data recovery, dejitter, and decoding to signals. In the transmit channel, this module performs encoding, dejitter, pulse shaping, and line driving to signals.

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System-Side Processing Module This module frames 16 x E1 signals, runs the CES, IMA, and ML-PPP protocols, and performs PWE3 encapsulation.

Backplane Interface Module The service bus receives or transmits service signals.

Control Module This module controls the reading and writing on the chip, resets the chip, and detects faults in the chip. When used with the control board, this module controls the board.

Clock Module This module provides various clock signals for the board to operate normally, detects clocks, and selects the line recovery clock.

Power Supply Module This module converts the -48 V DC/-60 V DC voltage to DC voltages required by each module on the board.

8.13.4 Specifications The technical specifications of the AND1ML1/AND1ML1A include the interface specifications, dimensions, weight, and power consumption. Table 8-62 lists the specifications of the interfaces on the AND1ML1/AND1ML1A. Table 8-62 Specifications of the interfaces on the AND1ML1/AND1ML1A Item

Specification Requirement

Nominal bit rate (kbit/s)

2048

Interface impedance

75 ohms (AND1ML1) 120 ohms (AND1ML1A)

Issue 01 (2013-10-31)

Interface code

HDB3

Pulse waveform at the output interface

Complies with ITU-T G.703

Attenuation tolerance of the input interface at the point with a frequency of 1024 kHz (dB)

0 to 6

Anti-interference capability of the input interface

Complies with ITU-T G.703

Input jitter tolerance

Complies with ITU-T G.823

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Item

Specification Requirement

Output jitter

Complies with ITU-T G.823

Board dimensions (mm): 20.32 (H) x 225.75 (D) x 193.80 (W)(0.80 in.×8.89 in.×7.63 in.) Weight (kg): 0.56(1.23 lb) Power consumption (W, room temperature): 13.1

8.14 AND3ML1A/AND3ML1B - 16 Channels E1 Interface Board The AND3ML1A/AND3ML1B (ML1A/ML1B for short) is a 16 channels E1 interface board. The function version of the ML1A/ML1B is AND3. The AND3ML1A/AND3ML1B is housed in slots 1 to 6. NOTE

The mapping impedance of an interface on the AND3ML1A is 75 ohm, and the mapping impedance of an interface on the AND3ML1B is 120 ohm. Except the difference of mapping impedance, the functions and features of the AND3ML1A and AND3ML1B are the same.

8.14.1 Front Panel On the front panel of the AND3ML1A/AND3ML1B, there are indicators and interfaces.

Appearances of the Front Panel Figure 8-37 and Figure 8-38 show the appearances of the front panel of the AND3ML1A/ AND3ML1B. Figure 8-37 Front panels of the AND3ML1A

Figure 8-38 Front panels of the AND3ML1B

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Indicators The following indicators are present on the front panel of the AND3ML1A/AND3ML1B: l

STAT indicator, red, green, or orange, which indicates the working status

For details on meanings of indicators, see 12.1 Indicators.

Interfaces There is one Anea 96 interface on the front panel of the AND3ML1A/AND3ML1B. Table 8-63 lists the type and usage of the interfaces. 10.5.4 75-Ohm 16 x E1 Cables and 10.5.5 120Ohm 16 x E1 Cables list the cables corresponding to the interfaces. Table 8-63 Type and usage of the interfaces on the front panel of the AND3ML1A/AND3ML1B Interface on the Front Panel

Interface Type

Usage AND3ML1A

AND3ML1B

0 - 15

Anea 96

75-ohm interface, which is used to transmit or receive the zero to fifteenth channels of E1 services.

120-ohm interface, which is used to transmit or receive the zero to fifteenth channels of E1 services.

Table 8-64 lists the pins of the Anea 96 interface. Table 8-64 Pins of the Anea 96 interface Front View

Connector Pin

Usage

Connector Pin

Usage

1

Rx0

25

Tx0

2 3

26 Rx1

4 5

Rx2

Rx3

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Tx2

31

Tx3

32 Rx4

10 11

29 30

8 9

Tx1

28

6 7

27

33

Tx4

34 Rx5

35

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Front View

Connector Pin

8 ATN 950B Boards

Usage

12 13

Rx6

Rx7

Rx8

Rx9

R x 10

R x 11

R x 12

R x 13

56

Tx9

45

T x 10

47

T x 11

73

T x 12

75

T x 13

76 R x 14

54 55

43

74

52 53

Tx8

48

50 51

41

46

24 49

Tx7

44

22 23

39

42

20 21

Tx6

40

18 19

37 38

16 17

Usage

36

14 15

Connector Pin

77

T x 14

78 R x 15

79

T x 15

80

8.14.2 Functions and Features AND3ML1A is a 75-ohm E1 board and the AND3ML1B is a 120-ohm E1 board. The AND3ML1A/AND3ML1B must be used with the system control board to access and process 16 channels of E1 services. Services at interfaces on the AND3ML1A/AND3ML1B can be flexibly configured, and protocols such as ATM E1, IMA, CES, and ML-PPP are supported. Table 8-65 lists the functions and features of the AND3ML1A/AND3ML1B.

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Table 8-65 Functions and features of the AND3ML1A/AND3ML1B Function and Feature

Remarks

Basic function

Provides 16 E1 interfaces. Supports the hot swappable function. Detects the temperature and voltage of the board.

Interface function

Impedance supported by the interface

AND3ML1A: 75 ohm AND3ML1B: 120 ohm

Supports the E1 and CE1 modes. Supports the master/slave clock mode. Supports the HDB3 line coding (unconfigurable). Supports inloops and outloops. Supports the PRBS function in framed or unframed mode of an E1 interface in the receive/transmit direction. ATM

Number of supported ATM E1 services

16

Number of supported IMA groups

16

Maximum number of E1 links in each IMA group

16

Encapsulates ATM VPC/VCC service to the PWE3 in the Nto-1 (N≤32) or 1-to-1 format. Supports the ATM bundle function.

TDM

Number of supported PVCs/ PVPs

256

Number of supported local ATM CCCs

32

Number of supported remote ATM PWE3s

64

Supports CES services in CESoPSN and SAToP modes. Supports the timeslot compression function. For services in CESoPSN mode, a minimum of 1 timeslots can be bundled during serial port configuration. Supports the fractional E1. Different timeslots of an E1 can be bound to different CES PWs.

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Function and Feature

PPP

Clock

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Remarks Number of supported local TDM CCCs

8

Number of supported remote TDM PWE3s

16

Number of supported PPP links

16

Number of supported MLPPP groups

8

Maximum number of links supported by each ML-PPP group

16

Supports physical-layer clock synchronization.

8.14.3 Working Principle and Signal Flow The AND3ML1A/AND3ML1B mainly consists of the service access module, service processing module, management module, clock module, and power supply module. Figure 8-39 shows the functional block diagram of the AND3ML1A/AND3ML1B. Figure 8-39 Functional block diagram of the AND3ML1A/AND3ML1B Backplane 16 x E1

Service access module

Service signal Management bus

Line clocks

3.3V . . .

1V

Service signal CXP

Management bus

Management module

Clock module

Service processing module

. . .

Power supply module

-48V/-60V

System power supply

-48V/-60V

System power supply

System clocks Line clocks

CXP

CXP CXP

Transmit Direction The service signals from the control board are sent to the service processing module. The service processing module performs PWE3 decapsulation and PW scheduling for the service signals, processes the service signals based on the IMA/ATM, CES, and ML-PPP protocols, performs Issue 01 (2013-10-31)

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the E1 framing function, and sends the service signals to the service access module. The service access module performs encoding and line drive for the signals and outputs the signals through the backplane-side interfaces.

Receive Direction The board accesses service signals through the backplane-side interfaces, and then the signals are sent to the service access module. The service access module performs interference isolation, lightning-proof, impedance matching, level conversion, signal balancing, decoding, and then sends the processed signals to the service processing module. The service processing module performs E1 framing, processes service signals based on the IMA/ATM, CES, and ML-PPP protocols, implements PWE3 encapsulation and PW scheduling, and sends the signals to the control board through the backplane-side interfaces.

Service Access Module This module performs the following functions: l

In the receive direction, this module isolates common mode interference, protects circuits against transient failures, matches the impedance in the receive direction with the internal impedance, and performs level conversion, balancing, and decoding for the service signals. Finally, this module sends the processed signals to the service processing module.

l

In the transmit direction, this module receives the service signals from the service processing module, encodes the signals, drives the line, and outputs the service signals through the backplane-side interfaces.

l

This module recovers the line clock.

Service Processing Module This module performs the following functions: l

In the receive direction, this module receives the signals from the service access module and performs E1 framing. This module also identifies protocol types of the service signals, processes the service signals based on the IMA/ATM, CES, and ML-PPP protocols (for example, addition and deletion of IMA group members, VP/VC switching and concatenation of ATM cells, vacant slot compression of CES services, and setup of MLPPP groups). Then, this module performs PWE3 encapsulation and PW scheduling, Finally, this module converts the processed signals to high-rate signals, and then sends the signals to the control board through the backplane-side interfaces.

l

In the transmit direction, this module receives the high-rate signals from the control board through the backplane-side interfaces and recovers low-rate service signals. Then, this module performs PWE3 decapsulation, identifies different protocols and processes the service signals, and completes E1 framing. Finally, this module sends the processed signals to the service access module.

Management Module This module manages and controls each module on the board.

Clock Module This module performs the following functions: Issue 01 (2013-10-31)

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l

When used with the control board, processes the recovered line clock.

l

Provides the working clock for each module on the board.

Power Supply Module This module converts the input DC voltage into various DC voltages required by each module on the board.

8.14.4 Technical Specifications The technical specifications of the AND3ML1A/AND3ML1B include the interface specifications and physical specifications.

Interface Specifications Table 8-66 lists the specifications of the interfaces on the AND3ML1A/AND3ML1B. Table 8-66 Specifications of the interfaces on the AND3ML1A/AND3ML1B Item

Specification Requirement

Nominal bit rate (kbit/s)

2048

Interface impedance

75 ohm (ML1A) 120 ohm (ML1B)

Interface code

HDB3

Pulse waveform at the output interface

Complies with ITU-T G.703

Attenuation tolerance of the input interface at the point with a frequency of 1024 kHz (dB)

0 to 6

Anti-interference capability of the input interface

Complies with ITU-T G.703

Input jitter tolerance

Complies with ITU-T G.823

Output jitter

Complies with ITU-T G.823

Physical Specifications Board dimensions (mm): 20.32 (H) x 225.75 (D) x 193.80 (W)(0.80 in.×8.89 in.×7.63 in.) Weight (kg): 0.44(0.97 lb) Power consumption (W, room temperature): 9.5

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8.15 AND2MD1A/AND2MD1B - 32 Channels E1 Interface Board The AND2MD1A/AND2MD1B (MD1A/MD1B for short) is a 32 channels E1 interface board. The function version of the MD1A/MD1B is AND2. The AND2MD1A/AND2MD1B is housed in slots 1 to 6. NOTE

The mapping impedance of an interface on the AND2MD1A is 75 ohm, and the mapping impedance of an interface on the AND2MD1B is 120 ohm. Except the difference of mapping impedance, the functions and features of the AND2MD1A and AND2MD1B are the same.

8.15.1 Front Panel On the front panel of the AND2MD1A/AND2MD1B, there are indicators and interfaces.

Appearances of the Front Panel Figure 8-40 shows the appearances of the front panel of the AND2MD1A/AND2MD1B. Figure 8-40 Front panels of the AND2MD1A/AND2MD1B

Indicators The following indicators are present on the front panel of the AND2MD1A/AND2MD1B: l

STAT indicator, red, green, or orange, which indicates the working status

For details on meanings of indicators, see 12.1 Indicators.

Interfaces There are two Anea 96 interfaces on the front panel of the AND2MD1A/AND2MD1B. Table 8-67 lists the type and usage of the interfaces. 10.5.4 75-Ohm 16 x E1 Cables and 10.5.5 120Ohm 16 x E1 Cables list the cables corresponding to the interfaces.

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Table 8-67 Type and usage of the interfaces on the front panel of the AND2MD1A/AND2MD1B Interfac e on the Front Panel

Interfac e Type

Usage AND2MD1A

AND2MD1B

0 to 15

Anea 96

75-ohm interface, which is used to transmit or receive the zero to fifteenth channels of E1 services.

120-ohm interface, which is used to transmit or receive the zero to fifteenth channels of E1 services.

16 to 31

Anea 96

75-ohm interface, which is used to transmit or receive the sixteenth to thirty-first channels of E1 services.

120-ohm interface, which is used to transmit or receive the sixteenth to thirty-first channels of E1 services.

Table 8-68 lists the pins of the Anea 96 interface. Table 8-68 Pins of the Anea 96 interface Front View

Connector Pin

Usage

Connector Pin

Usage

1

Rx0

25

Tx0

2 3

26 Rx1

4 5

Rx2

Rx3

Rx4

Rx5

16

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Tx3

33

Tx4

35

Tx5

36 Rx6

14 15

31

34

12 13

Tx2

32

10 11

29 30

8 9

Tx1

28

6 7

27

37

Tx6

38 Rx7

39

Tx7

40

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Front View

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Connector Pin

Usage

Connector Pin

Usage

17

Rx8

41

Tx8

18 19

42 Rx9

20 21

R x 10

R x 11

R x 12

R x 13

T x 11

73

T x 12

75

T x 13

76 R x 14

54 55

47

74

52 53

T x 10

48

50 51

45 46

24 49

Tx9

44

22 23

43

77

T x 14

78 R x 15

56

79

T x 15

80

8.15.2 Functions and Features The AND2MD1A is a 75-ohm E1 board and the AND2MD1B is a 120-ohm E1 board. The AND2MD1A/AND2MD1B must be used with the system control board to access and process 32 channels of E1 services. Services at interfaces on the AND2MD1A/AND2MD1B can be flexibly configured, and protocols such as ATM E1, IMA, CES, and ML-PPP are supported. Table 8-69 lists the functions and features of the AND2MD1A/AND2MD1B. Table 8-69 Functions and features of the AND2MD1A/AND2MD1B Function and Feature

Remarks

Basic function

Provides 32 E1 interfaces. Supports the hot swappable function. Detects the temperature and voltage of the board.

Interface function

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Impedance supported by the interface

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Remarks AND2MD1B: 120 ohm Supports the E1 and CE1 modes. Supports the master/slave clock mode. Supports the HDB3 line coding (unconfigurable). Supports inloops and outloops. Supports the PRBS function in framed or unframed mode of an E1 interface in the receive/transmit direction.

ATM

Number of supported ATM E1 services

32

Number of supported IMA groups

32

Maximum number of E1 links in each IMA group

16a

Encapsulates ATM VPC/VCC service to the PWE3 in the Nto-1 (N≤32) or 1-to-1 format. Supports the ATM bundle function.

TDM

Number of supported PVCs/ PVPs

512

Number of supported local ATM CCCs

64

Number of supported remote ATM PWE3s

128

Supports CES services in CESoPSN and SAToP modes. Supports the timeslot compression function. For services in CESoPSN mode, a minimum of 1 timeslots can be bundled during serial port configuration. Supports fractional E1. Different timeslots of an E1 can be bound to different CES PWs.

PPP

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Number of supported local TDM CCCs

16

Number of supported remote TDM PWE3s

32

Number of supported PPP links

32

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Function and Feature

Clock

8 ATN 950B Boards

Remarks Number of supported MLPPP groups

16

Maximum number of links supported by each ML-PPP group

16b

Supports physical-layer clock synchronization.

NOTE a: In the case of the AND2MD1A/AND2MD1B, the links corresponding to the former 16 and latter 16 E1 ports cannot be bundled to an IMA group. b: In the case of the AND2MD1A/AND2MD1B, the links corresponding to the former 16 and latter 16 E1 ports cannot be bundled to an ML-PPP group.

8.15.3 Working Principle and Signal Flow The AND2MD1A/AND2MD1B mainly consists of the service access module, service processing module, management module, clock module, and power supply module. Figure 8-41 shows the functional block diagram of the AND2MD1A/AND2MD1B. Figure 8-41 Functional block diagram of the AND2MD1A/AND2MD1B Backplane 32 x E1

Service access module

Service signal Management bus

Line clocks

Clock module

. .

1V

Service signal CXP

Management bus

Management module

3.3V .

Service processing module

. . .

Power supply module

-48V/-60V

System power supply

-48V/-60V

System power supply

System clocks Line clocks

CXP

CXP CXP

Transmit Direction The service signals from the control board are sent to the service processing module. The service processing module performs PWE3 decapsulation and PW scheduling for the service signals, processes the service signals based on the IMA/ATM, CES, and ML-PPP protocols, performs the E1 framing function, and sends the service signals to the service access module. The service access module performs encoding and line drive for the signals and outputs the signals through the backplane-side interfaces. Issue 01 (2013-10-31)

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Receive Direction The board accesses service signals through the backplane-side interfaces, and then the signals are sent to the service access module. The service access module performs interference isolation, lightning-proof, impedance matching, level conversion, signal balancing, decoding, and then sends the processed signals to the service processing module. The service processing module performs E1 framing, processes service signals based on the IMA/ATM, CES, and ML-PPP protocols, implements PWE3 encapsulation and PW scheduling, and sends the signals to the control board through the backplane-side interfaces.

Service Access Module This module performs the following functions: l

In the receive direction, this module isolates common mode interference, protects circuits against transient failures, matches the impedance in the receive direction with the internal impedance, and performs level conversion, balancing, and decoding for the service signals. Finally, this module sends the processed signals to the service processing module.

l

In the transmit direction, this module receives the service signals from the service processing module, encodes the signals, drives the line, and outputs the service signals through the backplane-side interfaces.

l

This module recovers the line clock.

Service Processing Module This module performs the following functions: l

In the receive direction, this module receives the signals from the service access module and performs E1 framing. This module also identifies protocol types of the service signals, processes the service signals based on the IMA/ATM, CES, and ML-PPP protocols (for example, addition and deletion of IMA group members, VP/VC switching and concatenation of ATM cells, vacant slot compression of CES services, and setup of MLPPP groups). Then, this module performs PWE3 encapsulation and PW scheduling, Finally, this module converts the processed signals to high-rate signals, and then sends the signals to the control board through the backplane-side interfaces.

l

In the transmit direction, this module receives the high-rate signals from the control board through the backplane-side interfaces and recovers low-rate service signals. Then, this module performs PWE3 decapsulation, identifies different protocols and processes the service signals, and completes E1 framing. Finally, this module sends the processed signals to the service access module.

Management Module This module manages and controls each module on the board.

Clock Module This module performs the following functions: l

When used with the control board, processes the recovered line clock.

l

Provides the working clock for each module on the board.

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Power Supply Module This module converts the input DC voltage into various DC voltages required by each module on the board.

8.15.4 Technical Specifications The technical specifications of the include the interface specifications and physical specifications.

Interface Specifications Table 8-70 lists the specifications of the interfaces on the . Table 8-70 Specifications of the interfaces on the Item

Specification Requirement

Nominal bit rate (kbit/s)

2048

Interface impedance

75 ohm (MD1A) 120 ohm (MD1B)

Interface code

HDB3

Pulse waveform at the output interface

Complies with ITU-T G.703

Attenuation tolerance of the input interface at the point with a frequency of 1024 kHz (dB)

0 to 6

Anti-interference capability of the input interface

Complies with ITU-T G.703

Input jitter tolerance

Complies with ITU-T G.823

Output jitter

Complies with ITU-T G.823

Physical Specifications Board dimensions (mm): 20.32 (H) x 225.75 (D) x 193.80 (W)(0.80 in.×8.89 in.×7.63 in.) Weight (kg): 0.49(1.08 lb) Power consumption (W, room temperature): 12.1

8.16 TND1PIU - Power Interface Board The TND1PIU (PIU for short) is a power interface board. The function version of the PIU is TND1. The PIU is housed in slot 9 or slot 10.

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8.16.1 Front Panel On the front panel of the PIU, there are indicators, power supply interfaces, and a label.

Appearance of the Front Panel Figure 8-42 shows the appearance of the front panel of the PIU. Figure 8-42 Appearance of the front panel of the PIU

Indicators The following indicator is present on the front panel of the PIU. PWR, green, which indicates the power supply status. When PWR is on and green, it indicates that power is accessed. For details on indications of indicators, see 12.1 Indicators.

Interfaces The PIU accesses one power supply. Table 8-71 lists the types of the interfaces on the PIU and their respective usage. For cable corresponding to the interfaces, see 10.1 Power Supply Cables and Ground Cables. Table 8-71 Types and usage of the interfaces on the PIU

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Interface on the Front Panel

Usage

NEG(-)

-48 V power input interface

RTN(+)

BGND power input interface

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Label Operation warning label: indicates the following precautions , which should be taken for removal or insertion of the PIU board.

NOTICE Multiple power supplies are accessed for the equipment. When powering off the equipment, make sure that these power supplies are disabled. Before removing the PIU board, ensure that all power inputs are disconnected from the board.

8.16.2 Functions and Features The PIU, a power interface board, supports the functions and features such as power access, power protection, surge protection detection, and information reporting. Table 8-72 lists functions and features of the PIU. Table 8-72 Functions and features of the PIU Function and Feature

Description

Power access

Each of the two PIU accesses one -48 V DC (or -60 V DC) power supply for the equipment.

Power protection

The PIU protects the power supply against overcurrent and short circuit. In this way, the overcurrent is prevented from shocking board and components on it.

Surge protection

The PIU protects the equipment against lightning and reports an alarm if the protection fails.

Power backup

Two PIUs for a hot backup. One PIU is capable of supplying power for the entire chassis.

8.16.3 Working Principle and Signal Flow The PIU mainly consists of the surge protection and failure detection module, communication unit module, slot ID module, and board in-position module. Figure 8-43 shows the block diagram for the working principle of the PIU.

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Figure 8-43 Block diagram for the working principle of the PIU Backplane -48 V/-60 V

Communication unit module

Each board

Surge protection failure alarm signals

Inter-board Surge protection and failure communication bus detection module

Slot ID module

Board in-position signals

CXP

CXP

Slot ID signals CXP

Board in-position module

Surge Protection and Failure Detection Module This module protects the equipment against lightning and detects the failure of the anti-lightning circuit. If the surge protection fails, the PIU reports the alarm signals to the control board.

Communication Unit Module This module has the function of reporting the board manufacturing information, PCB version information, and alarm signals about the surge protection failure.

Slot ID Module This module reports the slot ID information to the control board.

Board In-Position Module This module reports the board in-position signals to the control board.

8.16.4 Specifications The technical specifications of the PIU cover the board dimensions, weight, power consumption, and input voltage. Table 8-73 lists the technical specifications of the PIU. Table 8-73 Technical specifications of the PIU

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Item

Technical Specification

Board dimensions (mm)

41.4 (H) x 229.9 (D) x 21.0 (W)

Weight (kg)

0.12

Power consumption (W, room temperature)

0.5

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Item

Technical Specification

Input voltage (V)

-38.4 to -72.0

8.17 AND1FAN - Fan Board The AND1FAN (FAN for short) is an FAN board. The function version of the FAN is AND1. The FAN is housed in slot 11.

8.17.1 Front Panel On the front panel of the FAN, there are indicators, ESD wrist strap jack, handle, and labels.

Appearance of the Front Panel Figure 8-44 shows the appearance of the front panel of the FAN. Figure 8-44 Appearance of the front panel

Indicators The following indicators are present on the front panel of the FAN: l

FAN indicator, red or green, which indicates status of fans.

l

CRIT indicator, red, which indicates critical alarms.

l

MAJ indicator, orange, which indicates major alarms.

l

MIN indicator, yellow, which indicates minor alarms.

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The CRIT, MAJ, and MIN indicators on the front panel of the FAN indicate the current alarm severity of the subrack. For details on indications of indicators, see 12.1 Indicators.

ESD Strap Jack The ESD wrist strap should be connected to this jack for proper grounding of the human body.

Handle The handle is used for pushing the FAN into or pulling the FAN out of the chassis during board replacement.

Label The following labels are present on the front panel of the FAN: l

ESD protection label, which indicates that the equipment is static-sensitive.

l

Fan warning label, which says that do not touch the fan leaves before the fan stops rotating.

8.17.2 Functions and Features The FAN is used to adjust the fan rotating speed, detect and report status of fans. The functions and features of the FAN are as follows: l

Accesses two 12 V power supplies for driving six fans.

l

Provides start-delay for the power supply of the fans, protects fans against overcurrent, and filters the lower frequency.

l

Intelligently adjusts the rotating speed of fans to ensure proper heat dissipation of the system.

l

Reports information about the fan rotating speed, environment temperature, alarms, version number, and board in-position information.

l

Provides alarm indicators.

8.17.3 Working Principle and Signal Flow The FAN mainly consists of the combiner/start-delay module, filter module, communication unit module, intelligent fan speed adjustment module, and board in-position module. Figure 8-45 shows the block diagram for the working principle of the FAN.

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Figure 8-45 Block diagram for the working principle of the AND1FAN Fans x 6 12 V 12 V 12 V

Filter module

Start-delay

Combiner

CXP CXP

Combiner/ 12 V soft-start module

12 V 12 V power shut signals Communication unit module

Fan speed reporting module

PWM signals

Inter-board communication bus

CXP

Fan rotating speed signals CXP

PWM driver module

CXP

Intelligent fan speed adjustment module Board in-position module

Fan in-position signals

CXP

Start-delay/Combiner Module This module provides start delay to the combined two 12 V power supplies and protecting fans against overcurrent.

Filter Module This module filters the LC low frequency to enhance the EMC feature of the system.

Communication Unit Module This module reports the board manufacturing information, PCB version, and environment temperature information. In addition, this module provides 12 V power shut signals to the startdelay module.

Intelligent Fan Speed Adjustment Module This module reports information about the fan rotating speed to the control board and adjusts the fan rotating speed according to the pulse-width modulation (PWM) signals received from the control board.

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Board In-Position Module This module reports the board in-position signals to the control board.

8.17.4 Specifications The technical specifications of the FAN cover the board dimensions, weight, power consumption, and input voltage. Table 8-74 lists the technical specifications of the FAN. Table 8-74 Technical specifications of the FAN Item

Technical Specification

Board dimensions (mm)

86.2 (H) x 217.6 (D) x 28.5 (W)

Weight (kg)

0.302

Power consumption (W)

l Low rate: 4.1 l Medium rate: 13.6 l High rate: 29.6

Working voltage (V)

12 V DC power

8.18 Filler Panel A filler panel is used to cover any vacant slot in a chassis.

8.18.1 Appearance and Valid Slots There is no indicator or interface on a filler panel.

Appearance Figure 8-46 shows the appearance of a filler panel. Figure 8-46 Appearance of a filler panel

Valid Slots The filler panel of a control board can be housed in slot 7 or 8 of a chassis and the filler panel of an interface board can be housed in any of slots 1-6 of a chassis. Table 8-75 provides the dimensions of the filler panel for a control board and dimensions of the filler panel for an interface board. Issue 01 (2013-10-31)

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Table 8-75 Filler panel dimensions Type

Dimensions (H x W x D)

Filler panel for a control board

22.86 mm x 193.80 mm x 23.5 mm

Filler panel for an interface board

20.32 mm x 193.80 mm x 23.2 mm

8.18.2 Functions and Features A filler panel can be used to perform electromagnetic shielding, keep out foreign substances, and ensure proper ventilation. Main functions of a filler panel are as follows: l

Performs electromagnetic shielding and ensures that the chassis meets the requirement of electromagnetic radiation.

l

Prevents foreign substances from getting into the chassis.

l

Prevents internal voltage from being exposed.

l

Ensures proper ventilation of cooling current inside the chassis.

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9 Swappable Optical/Electrical Modules

Swappable Optical/Electrical Modules

About This Chapter The ATN device does not provide optical interfaces, whereas the panel provides interfaces for installing optical modules. The optical modules receive and transmit optical signals and convert electrical and optical signals. The interfaces for installing optical modules can also be used for installing electrical modules to transmit electrical signals. 9.1 Overview Optical and electrical modules for ATN devices are hot swappable. Optical modules transmit services using optical signals over fibers and electrical modules transmit services using electrical signals over Ethernet cables. 9.2 FE Optical Module 9.3 GE Optical Module 9.4 10GE Optical Module 9.5 Electrical Module

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9.1 Overview Optical and electrical modules for ATN devices are hot swappable. Optical modules transmit services using optical signals over fibers and electrical modules transmit services using electrical signals over Ethernet cables.

Classification Optical modules for ATN devices can be classified as follows: l

By service and rate: FE, GE, 10GE optical modules

l

By packaging: SFP, eSFP, XFP, TXFP optical modules – SFP optical modules are used to support FE and GE services. eSFP optical modules are enhanced SFP optical modules. They provide the same functions as SFP modules except that eSFP optical modules are added with the performance reporting function. – XFP optical modules are used to support 10GE services. TXFP optical modules are one type of XFP optical modules and support wavelength adjustment.

l

By usage scenario: business and industry modules – If the operating temperature for an ATN device is within the range of -20 °C to +60 ° C, business modules apply. – If the operating temperature for an ATN device is outside the range of -20 °C to +60 ° C, industry modules apply.

l

By WDM application: colorless and colored optical modules – Colorless (or gray) optical modules are common optical modules. They support wavelengths within a specific range. – Colored optical modules support a specific wavelength (with a small tolerance). On them, wavelength conversion can be ignored and the wavelength can be directly added to a multiplexer/demultiplexer board. Colored optical modules are classified into coarse wavelength division multiplexing (CWDM) and dense wavelength division multiplexing (DWDM) optical modules by the wavelength division density.

l

By fiber carrier: two-fiber bidirectional and single-fiber bidirectional optical modules – A single-fiber bidirectional module provides only one LC interface for connecting to one fiber. It receives and sends optical signals in one fiber but over two different wavelengths. – A two-fiber bidirectional module provides two LC interfaces for connecting to two fibers. It receives and sends optical signals in two different fibers.

Electrical modules for ATN devices are all SFP modules, which are used to support FE or GE services.

Appearance Optical and electrical modules have different appearance because they use different packaging and cable interfaces. SFP and eSFP optical modules have the same appearance. Currently eSFP optical modules are used on most of ATN devices. Figure 9-1 shows the eSFP optical module appearance. Issue 01 (2013-10-31)

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Figure 9-1 eSFP optical module appearance

Single-fiber bidirectional

Two-fiber bidirectional

Figure 9-2 shows the SFP electrical module appearance. Figure 9-2 SFP electrical module appearance

Figure 9-3 shows the XFP optical module appearance. Figure 9-3 XFP optical module appearance

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Application An optical or electrical module can be used at an optical interface if its packaging and service rate can match the interface. Packaging: l

SFP optical interfaces use SFP/eSFP optical or electrical modules.

l

XFP optical interfaces use XFP optical modules.

Service rate: l

FE and STM-1 optical interfaces match FE optical or electrical modules.

l

GE optical interfaces match GE optical or electrical modules.

l

FE/GE optical interfaces match FE/GE optical or electrical modules.

l

10GE optical interfaces match 10GE optical modules. NOTE

In most cases, an optical or electrical module can be used at an optical interface if its packaging and service rate can match the interface. Certain boards may not support electrical modules. For information about the modules that a board supports, see the Functions and Features topic for the board.

9.2 FE Optical Module FE Optical Module (commercial) Table 9-1 Technical specifications of the FE optical interface (two-fiber bidirectional)

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Item

Specification

Optical interface type

Two-fiber bidirectional interface 100BASE-FX

100BASE-FX

100BASE-FX

(15 km)

(40 km)

(80 km)

Encapsulation type

eSFP

eSFP

eSFP

Fiber type

Single-mode

Single-mode

Single-mode

Working wavelength range (nm)

1261 to 1360

1263 to 1360

1480 to 1580

Mean launched optical power (dBm)

-15 to -8

-5 to 0

-5 to 0

Receiving sensitivity (dBm)

-28

-34

-34

Minimum overload (dBm)

-8

-10

-10

Minimum extinction ratio (dB)

8.2

10

10

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Item

Specification

Optical module code

S4015755

S4015715

34060282

Table 9-2 Technical specifications of the GE optical interface (single-fiber bidirectional) Item

Specification

Optical interface type

LC, single-fiber bidirectional interface 100BASE-FX

100BASE-FX

STM-1

STM-1

(15 km)

(10 km)

Encapsulation type

eSFP

eSFP

Fiber type

Single-mode

Single-mode

Working wavelength range (nm)

Tx: 1260 to 1360

Tx: 1480 to 1500

Rx: 1480 to 1500

Rx: 1260 to 1360

Mean launched optical power -15 to -8 (dBm)

-15 to -8

Receiving sensitivity (dBm)

-32

-32

Minimum overload (dBm)

-8

-8

Minimum extinction ratio (dB)

8.5

8.5

Optical module code

34060363

34060364

Usage description

Used together.

NOTE

A single-fiber bidirectional module receives and transmits optical signals using different working wavelength ranges over a single optical fiber. The receiving and transmitting working wavelength ranges of single-fiber bidirectional modules at both ends must match. As shown in Table 9-2, 34060363 and 34060364 are used together.

FE Optical Module (industry) Table 9-3 Technical specifications of the FE optical interface

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Item

Specification

Optical interface type

Two-fiber bidirectional interface

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Item

9 Swappable Optical/Electrical Modules

Specification 100BASE-FX

100BASE-FX

100BASE-FX

(15 km)

(40 km)

(80 km)

Encapsulation type

eSFP

eSFP

eSFP

Fiber type

Single-mode

Single-mode

Single-mode

Working wavelength range (nm)

1261 to 1360

1263 to 1360

1480 to 1580

Mean launched optical power (dBm)

-15 to -8

-5 to 0

-5 to 0

Receiving sensitivity (dBm)

-28

-34

-34

Minimum overload (dBm)

-8

-10

-10

Minimum extinction ratio (dB)

8.2

10

10

Optical module code

S4015755

S4015715

34060282

9.3 GE Optical Module FE/GE Optical Module (commercial) Table 9-4 Technical specifications of the FE/GE optical interface (single-fiber bidirectional)

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Item

Specification

Optical interface type

LC, single-fiber bidirectional interface 1000BASE-BX40-U

1000BASE-BX40-D

(40 km)

(40 km)

Encapsulation type

eSFP

eSFP

Fiber type

Single-mode

Single-mode

Working wavelength range (nm)

Tx: 1260 to 1360

Tx: 1480 to 1580

Rx: 1480 to 1580

Rx: 1260 to 1360

Mean launched optical power -3 to 2 (dBm)

-3 to 2

Receiving sensitivity (dBm)

-24

-24

Minimum overload (dBm)

-3

-3

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Item

Specification

Minimum extinction ratio (dB)

8

8

Optical module code

34060638

34060639

Usage description

Used together.

NOTE

A single-fiber bidirectional module receives and transmits optical signals using different working wavelength ranges over a single optical fiber. The receiving and transmitting working wavelength ranges of single-fiber bidirectional modules at both ends must match. As shown in Table 9-4, 34060638 and 34060639 are used together.

GE Optical Module (commercial) Table 9-5 Technical specifications of the GE optical interface (two-fiber bidirectional)

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Item

Specification

Optical interface type

LC, two-fiber bidirectional interface 1000BASESX

1000BASELX

1000BASEVX

1000BASEZX

1000BASECWDM

(0.5 km)

(10 km)

(40 km)

(80 km)

(80 km)

Encapsulatio n type

eSFP

eSFP

eSFP

eSFP

eSFP

Fiber type

Multi-mode

Single-mode

Single-mode

Single-mode

Single-mode

Working wavelength range (nm)

770 to 860

1270 to 1360

1260 to 1360

1500 to 1580

For details, see wavelength allocation of 1000BASECWDM optical interfaces and related optical module code.

Mean launched optical power (dBm)

-9.5 to 0

-11 to -3

-5 to 0

-2 to 5

0 to 5

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Item

Specification

Receiving sensitivity (dBm)

-17

-19

-23

-23

-28

Minimum overload (dBm)

0

-3

-3

-3

-9

Minimum extinction ratio (dB)

9

9

9

9

8.2

Optical module code

34060286

34060473

S4016954

34060360

For details, see wavelength allocation of 1000BASECWDM optical interfaces and related optical module code.

Table 9-6 Wavelength allocation of 1000BASE-CWDM optical interfaces and related optical module code SN

Optical module code

Wavelength (nm)

SN

Optical module code

Wavelength (nm)

1

34060483

1464.5 to 1477.5

5

34060478

1544.5 to 1557.5

2

34060481

1484.5 to 1497.5

6

34060476

1564.5 to 1577.5

3

34060479

1504.5 to 1517.5

7

34060477

1584.5 to 1597.5

4

34060482

1524.5 to 1537.5

8

34060480

1604.5 to 1617.5

Table 9-7 Technical specifications of the GE optical interface (single-fiber bidirectional) Item

Specification

Optical interface type

LC, single-fiber bidirectional interface 1000BASEBX10-U

1000BASEBX10-D

1000BASEBX40-U

1000BASEBX40-D

1000BASEBX

1000BASEBX

(10 km)

(10 km)

(40 km)

(40 km)

(80 km)

(80 km)

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Item

Specification

Encapsulation type

eSFP

eSFP

eSFP

eSFP

eSFP

eSFP

Fiber type

Single-mode

Single-mode

Single-mode

Single-mode

Single-mode

Single-mode

Working wavelength range (nm)

Tx: 1260 to 1360

Tx: 1480 to 1500

Tx: 1260 to 1360

Tx: 1480 to 1500

Tx: 1260 to 1360

Tx: 1480 to 1500

Rx: 1480 to 1500

Rx: 1260 to 1360

Rx: 1480 to 1500

Rx: 1260 to 1360

Rx: 1480 to 1500

Rx: 1260 to 1360

Mean launched optical power (dBm)

-9 to -3

-9 to -3

-3 to 5

-3 to 5

-2 to 4

-2 to 4

Receiving sensitivity (dBm)

-19.5

-19.5

-23

-23

-26

-26

Minimum overload (dBm)

-3

-3

-3

-3

-3

-3

Minimum extinction ratio (dB)

6

6

6

6

9

9

Optical module code

34060470

34060475

34060539

34060540

34060595

34060596

Usage description

Used together.

Used together.

Used together.

NOTE

A single-fiber bidirectional module receives and transmits optical signals using different working wavelength ranges over a single optical fiber. The receiving and transmitting working wavelength ranges of single-fiber bidirectional modules at both ends must match. As shown in Table 9-7, 34060470 and 34060475 are used together, 34060595 and 34060596 are used together, and 34060539 and 34060540 are used together.

GE Optical Module (industry) Table 9-8 Technical specifications of the GE optical interface (two-fiber bidirectional)

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Item

Specification

Optical interface type

LC, two-fiber bidirectional interface

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Item

9 Swappable Optical/Electrical Modules

Specification 1000BASE-LX

1000BASE-VX

1000BASE-ZX

(10 km)

(40 km)

(80 km)

Encapsulation type

eSFP

eSFP

eSFP

Fiber type

Single-mode

Single-mode

Single-mode

Working wavelength range (nm)

1280 to 1350

1260 to 1360

1500 to 1580

Mean launched optical power (dBm)

-11 to -3

-5 to 3

-2 to 5

Receiving sensitivity (dBm)

–19

–23

–23

Minimum overload (dBm)

-3

-3

-3

Minimum extinction ratio (dB)

9

9

9

Optical module code

34060290

34060320

34060324

Table 9-9 Technical specifications of the GE optical interface (single-fiber bidirectional)

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Item

Specification

Optical interface type

LC, single-fiber bidirectional interface 1000BASE-BX10-U

1000BASE-BX10-D

(10 km)

(10 km)

Encapsulation type

eSFP

eSFP

Fiber type

Single-mode

Single-mode

Working wavelength range (nm)

Tx: 1260 to 1360

Tx: 1480 to 1500

Rx: 1480 to 1500

Rx: 1260 to 1360

Mean launched optical power -9 to -3 (dBm)

-9 to -3

Receiving sensitivity (dBm)

-19.5

-19.5

Minimum overload (dBm)

-3

-3

Minimum extinction ratio (dB)

6

6

Optical module code

34060644

34060676

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Item

Specification

Usage description

Used together.

NOTE

A single-fiber bidirectional module receives and transmits optical signals using different working wavelength ranges over a single optical fiber. The receiving and transmitting working wavelength ranges of single-fiber bidirectional modules at both ends must match. As shown in Table 9-9, 34060644 and 34060676 are used together.

9.4 10GE Optical Module 10GE Optical Module (commercial) Table 9-10 Technical specifications of the 10GE optical interface

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Item

Specification

Optical interface type

LC, two-fiber bidirectional interface 10GE

10GE

10GE

(10 km)

(40 km)

(80 km)

10GE (CWDM)

10GE (DWDM)

10GE (DWDM)

(70 km)

(40 km)

(80 km)

Encapsulat ion type

XFP

XFP

XFP

XFP

TXFP

XFP

Fiber type

Singlemode

Singlemode

Singlemode

Singlemode

Singlemode

Singlemode

Working wavelengt h range (nm)

1310

1550

1550

For details, see wavelengt h allocation of 10GE (CWDM) optical interfaces and related optical module code.

1529.163 to 1560.606 (waveleng th tunable)

For details, see wavelengt h allocation of 10GE (DWDM) optical interfaces and related optical module code.

Mean launched optical power (dBm)

-6 to -1

-1 to 2

0 to 4

0 to 4

-1 to 2

-1 to 3

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Item

Specification

Receiving sensitivity (dBm)

-14.4

-15

-24

-24

-16

-24

Minimum overload (dBm)

0.5

-1

-7

-9

0

-9

Minimum extinction ratio (dB)

6

8.2

9

8

10.5

8.2

Optical module code

S4015772

S4015776

S4015794

For details, see wavelengt h allocation of 10GE (CWDM) optical interfaces and related optical module code.

34060568

For details, see wavelengt h allocation of 10GE (DWDM) optical interfaces and related optical module code.

Table 9-11 Wavelength allocation of 1000BASE-CWDM optical interfaces and related optical module code

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SN

Optical module code

Wavelength (nm)

SN

Optical module code

Wavelength (nm)

1

34060547

1471

5

34060551

1551

2

34060548

1491

6

34060552

1571

3

34060549

1511

7

34060553

1591

4

34060550

1531

8

34060554

1611

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Table 9-12 Wavelength allocation of 1000BASE-DWDM optical interfaces and related optical module code SN

Optical module code

Wavelength (nm)

SN

Optical module code

Wavelength (nm)

1

34060532

1529.55

9

34060531

1548.51

2

34060515

1530.33

10

34060514

1549.32

3

34060504

1531.12

11

34060502

1550.12

4

34060503

1531.90

12

34060501

1550.92

5

34060534

1532.68

13

34060533

1551.72

6

34060628

1533.47

14

34060625

1552.52

7

34060627

1534.25

15

34060624

1553.33

8

34060626

1535.04

16

34060623

1554.13

9.5 Electrical Module FE Electrical Module (commercial) Table 9-13 Technical specifications of the FE electrical interface Item

Specification

Interface rate

100 Mbit/s

Encapsulation type

SFP

RJ-45 electrical interface specification

Compliance with IEEE 802.3

Electrical module code

34100101

GE Electrical Module (commercial) Table 9-14 Technical specifications of the GE electrical interface

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Item

Specification

Interface rate

1000 Mbit/s

10 Mbit/s, 100 Mbit/s, 1000 Mbit/s

Encapsulation type

SFP

SFP

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Item

Specification

RJ-45 electrical interface specification

Compliance with IEEE 802.3

Compliance with IEEE 802.3

Electrical module code

34100080

34100052

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10

Cables

About This Chapter This chapter describes various optical fibers and cables used on the equipment. 10.1 Power Supply Cables and Ground Cables This section describes power supply cables and ground cables used on the equipment. 10.2 Management Cables On an ATN device, Ethernet cables are used to input and output NM signals. 10.3 Alarm Input/Output Cables On ATN devices, the RJ-45 connectors are used to input the alarm signals from the external equipment and output the local alarm signals to the equipment that monitors all the alarms. 10.4 Clock Cables The clock cables used on ATN devices include external clock cables and 120-to-75-ohm clock cables. 10.5 Service Cables The service cables include Ethernet cables, 75-ohm 16 x E1 cables, and 120-ohm 16 x E1 cables, xDSL cables. 10.6 Optical Fibers On an ATN device, optical fibers are used to input and output Ethernet service signals.

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10.1 Power Supply Cables and Ground Cables This section describes power supply cables and ground cables used on the equipment.

10.1.1 -48 V Power Supply Cable ATN devices use DC power cables to connect to external power supplies. Power cables need to be produced on site. The power cables are made of DC connectors, single cord end terminals, and wires. Figure 10-1 shows the appearance of the power cable intended for a 1 U chassis. Table 10-1 provides the technical specifications of the power cable for a 1 U chassis. Figure 10-2 shows the appearance of the power cable intended for a 2 U chassis. Table 10-2 provides the technical specifications of the power cable for a 2 U chassis. Figure 10-1 Appearance of the power cable intended for a 1 U chassis

Single cord end terminal

1U DC connector

Power cable

Figure 10-2 Appearance of the power cable intended for a 2 U chassis

screwdriver -48V cable (blue)

0 V cable (black)

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2 U DC connector

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Table 10-1 Technical specifications of the power cable intended for a 1 U chassis Item

Wire Related Parameter

Terminal Related Parameter

2.5 mm2 (0.004 in.2) power cable and terminal

Electronic/Electric wire, 450 V/ 750V, H07Z, K, 2.5 mm2(0.004 in.2), blue/black green, fire resistant cable with low smoke and no halogen

Bare crimp terminal, single cord end terminal, 2.5 mm2(0.004 in.2), 12.5 A, tin plating, 8 mm(0.31 in.) deep, blue

Table 10-2 Technical specifications of the power cable intended for a 2 U chassis Item

Wire Related Parameter

Terminal Related Parameter

4 mm2 (0.006 in.2) power cable and terminal

Electronic/Electric wire, 450 V/ 750V, H07Z, K, 4 mm2(0.006 in.2), blue/black green, fire resistant cable with low smoke and no halogen

Bare crimp terminal, single cord end terminal, 4 mm2(0.006 in.2), 20 A, tin plating, 10 mm(0.39 in.) deep, gray

10.1.2 Power Cable ATN devices input external power supplies through AC power cables.

Appearance Figure 10-3 shows an AC input power cable of an ATN device. Figure 10-3 Appearance of the AC input power cable

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Technical Specifications Cable

Item

Description

Power cable for inputting the mains

Cable type

(PI Straight Male)-(227IEC53-1.0^2(3C))(C13 Straight Female)

Technical specifications of the cable

International AC 250 V 10 A-3.00 m-3 x 1.0 mm2-Black

Fireproof class

CM

Note 1: A power cable is named in the format of "Connector 1 Type-Cable Material TypeConnector 2 Type". Note 2: The specifications of power cables for inputting the mains vary in different countries or regions. In this document, the AC power cables complying with international standards are considered as examples.

10.1.3 PGND Cables PGND cables are used to ground the ATN device. PGND cables are made of wires and OT terminals. Figure 10-4 shows the appearance of a PGND cable. The technical specifications of the PGND cable are listed in Table 10-3. Figure 10-4 Appearance of the PGND cable

Table 10-3 Technical specifications of the PGND cable

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Wire Related Parameter

Terminal Related Parameter

Electronic/Electric wire, 450 V/750 V, H07Z, K, 4 mm2(0.006 in.2), yellow green, fire resistant cable with low smoke and no halogen

General terminal, OT, 6 mm2(0.009 in.2), tin plating, pre-insulated ring terminal, 12-10AWG, yellow

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10.2 Management Cables On an ATN device, Ethernet cables are used to input and output NM signals. The management cables for ATN devices include Ethernet cables. Ethernet cables are classified into straight-through cables and crossover cables, and are used for communication between the equipment and the NMS computer. The NM interface on the equipment is adaptive to a straight-through cable or a crossover cable. Figure 10-5 shows an RJ45 connector used at the end of the Ethernet cable. When the cable is connected to the ETH/OAM interface, the pin assignment of the RJ45 connector is as listed in Table 10-4. Table 10-5 lists the technical specifications of the Ethernet cable. Figure 10-5 RJ45 connector PIN#8 PIN#1

Table 10-4 Pin assignment of the RJ45 connector (ETH/OAM)

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Connecto r Pin

Color

Relation

Usage

1

White-orange

Twisted pair

Transmit positive of the NM interface

2

Orange

3

White-green

6

Green

4

Blue

5

White-blue

7

White-brown

8

Brown

Transmit negative of the NM interface Twisted pair

Receive positive of the NM interface Receive negative of the NM interface

Twisted pair

Grounding end of the console interface Receive end of the console interface

Twisted pair

Unspecified Transmit end of the console interface

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Table 10-5 Technical specifications of the Ethernet cable Item

Specification

Connector

Network Interface Connector, 8-Bit 8-Pin, Crystal Plug

Cable type

Twisted-Pair Cable, 100 ohm,Category 5e UTP, 0.51 mm(0.0200 in.), 24AWG, 8 Cores, PANTONE 430U

Number of cores

Eight

10.3 Alarm Input/Output Cables On ATN devices, the RJ-45 connectors are used to input the alarm signals from the external equipment and output the local alarm signals to the equipment that monitors all the alarms. At one end of the alarm input/output cable, the RJ-45 connector is used to connect to the ALMI/ O interface on the equipment; at the other end, a connector (made as required on site) is used to connect to the external equipment or the equipment that monitors all the alarms.

Structure Figure 10-6 shows the structure of the alarm input/output cable. Figure 10-6 Structure of the alarm input/output cable

RJ-45 Connector

Main label W

8 1 X1

Pin Assignment Table 10-6 lists the pin assignment of the alarm input/output alarm cable connector.

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Table 10-6 Pin assignment of the alarm input/output cable connector Connector Pin

Color

Relation

Description

1

White-orange

Twisted pair

Alarm input 1

2

Orange

3

White-green

6

Green

4

Blue

5

White-blue

7

White- brown

8

Brown

Ground for alarm input 1 Twisted pair

Alarm input 2 Ground for alarm input 2

Twisted pair

Alarm input 3 Ground for alarm input 3

Twisted pair

Alarm output positive Alarm output negative

Technical Specifications Table 10-7 lists the technical specifications of the alarm input/output cable. Table 10-7 Technical specifications of the alarm input/output cable Item

Specification

Connector X1

Network Interface Connector, 8-Bit 8PIN, Crystal Model Connector

Cable type

Twisted-Pair Cable, 100 ohm, Category 5e, 0.52 mm, 24AWG, 8 Cores, 4 Pairs, PANTONE 430U

10.4 Clock Cables The clock cables used on ATN devices include external clock cables and 120-to-75-ohm clock cables.

10.4.1 External Clock Cables On the ATN device, the external clock cables with RJ45 connectors are used to input and output the external clock or time signals. The external clock cables can be connected to the CLK0/TOD0, CLK1/TOD1, CLK, and TOD interfaces on an ATN device.

Structure Figure 10-7 shows the structure of the RJ45 connector used on the external clock cable. Issue 01 (2013-10-31)

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Figure 10-7 Structure of the RJ45 Connector PIN#8 PIN#1

Pin Assignment The external clock cables must be made on the equipment installation site. When the CLK0/ TOD0, CLK1/TOD1, CLK, and TOD interfaces are used as external clock interfaces, the pin assignment of the RJ45 connector is as listed in Table 10-8; when the CLK0/TOD0, CLK1/ TOD1, CLK, and TOD interfaces are used as external time interfaces, the pin assignment of the RJ45 connector is as listed in Table 10-9. Table 10-8 Pin assignment of the RJ45 connector (external clock mode) Connector Pin

Color

Relation

Description

1

White-orange

Twisted pair

Receive negative of CLK

2

Orange

3

White-green

6

Green

4

Blue

5

White-blue

7

White- brown

8

Brown

Receive positive of CLK Twisted pair

Unspecified Unspecified

Twisted pair

Transmit negative of CLK Transmit positive of CLK

Twisted pair

Unspecified Unspecified

Table 10-9 Pin assignment of the RJ45 connector (external time mode)

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Connecto r Pin

Color

1

White-orange

2

Orange

3

White-green

Relation

Twisted pair

Twisted pair

Description 1PPS + Time Information Mode

DCLS Mode

Unspecified

Unspecified

Unspecified

Unspecified

Negative of 1PPS signals

Negative of DCLS signals

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Connecto r Pin

Color

6

Green

4

Blue

5

White-blue

7

White-brown

8

Brown

10 Cables

Relation

Twisted pair

Twisted pair

Description 1PPS + Time Information Mode

DCLS Mode

Positive of 1PPS signals

Positive of DCLS signals

Grounding terminal

Grounding terminal

Grounding terminal

Grounding terminal

Negative of time information

Unspecified

Positive of time information

Unspecified

Technical Specifications Table 10-10 and Table 10-11 lists the technical specifications of the external clock cable. Table 10-10 Technical specifications of the external shielded clock cable Item

Specification

Connector

Network Interface Connector,8-Bit 8PIN,Shielded,Crystal Model Connector,24-26AWG,Leads Single Solide Cabl

Cable type

Twisted-Pair Cable,100ohm,Category 5e,FTP,0.52mm(0.0205 in.), 24AWG,8Cores,4Pairs,PANTONE 430U

Number of cores

Eight

Table 10-11 Technical specifications of the external non-shielded clock cable Item

Specification

Connector

Network Interface Connector,8-Bit 8Pin,Non-Shielded,Crystal Plug

Cable type

Twisted-Pair Cable,100ohm,,Category 5e UTP,0.51mm(0.0200 in.), 24AWG,8Cores,PANTONE 430U

Number of cores

Eight

10.4.2 Clock Bridging Cable On an ATN device, the 120-to-75-ohm clock cable is used as the clock bridging cable. Issue 01 (2013-10-31)

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Structure Figure 10-8 shows the structure of the 120-to-75-ohm clock bridging cable. Figure 10-8 Structure of the clock bridging cable

Heat-shrink tube View A

RJ-45 connector

Main label

Label W1

Heat-shrink tube Heat-shrink tube

W5

8 A

120-ohm or 75ohm conversion connector

W2

1

W3

X1 W4

30 m

Pin Assignment Table 10-12 lists the pin assignment of the clock bridging cable connector. Table 10-12 Pin assignment of the clock bridging cable connector 120-Ohm Cable

75-Ohm Cable

Connector Pin

Color

Relation

Core No.

X1.1

Orange

Twisted pair

W1

X1.2

White

X1.4

Blue

Twisted pair

W2

X1.5

White

X1.3

Green

Twisted pair

W3

X1.6

White

X1.7

White

Twisted pair

W4

X1.8

Brown

Technical Specifications Table 10-13 lists the technical specifications of the clock bridging cable.

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Table 10-13 Technical specifications of the clock bridging cable Item

Specification

Cable

Single Cable, 120 ohm To 75 ohm Clock Cable, 30 m, MP8-II, 120CC4P0.4P430U(S)+4*SYV75-2/0.34(S)

Connector X1 type

Network Interface Connector, 8-Bit 8PIN, Crystal Model Connector

120-ohm cable type

Twisted-Pair Cable, 120 ohm, SEYVP, 0.4 mm(0.02 in.), 26AWG, 4Pairs, Pantone 430U

75-ohm cable type

Coaxial Cable, SYV-75-2-2(4.0Z)-1/0.34 mm, OD3.9 mm(0.15 in.), Double-Layer Copper Braid Shielded

10.5 Service Cables The service cables include Ethernet cables, 75-ohm 16 x E1 cables, and 120-ohm 16 x E1 cables, xDSL cables.

10.5.1 Ethernet Cables On an ATN device, Ethernet cables are used to input and output Ethernet service signals. Ethernet cables are also referred to as network cables and can be classified into straight-through cables and crossover cables according to the connection sequence of the copper cores in the cables. A network cable with a shield layer is a shielded cable and that without a shield layer is a nonshielded cable. The Ethernet service interfaces on the equipment are adaptive to the straight-through cables and crossover cables. Hence, you can connect either type of the network cables to the Ethernet service interfaces as required. Ethernet cables need to be made on site.

Structure Figure 10-9 shows the appearance of the shield layer.

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Figure 10-9 Appearance of the shield layer

Figure 10-10 shows the appearance of the non-shielded cable. Figure 10-10 Appearance of the non-shielded cable

RJ45 connectors are used at both ends of a network cable. Figure 10-11 shows an RJ45 connector and Figure 10-12 shows the structure of the network cable. Figure 10-11 RJ45 connector PIN#8 PIN#1

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Figure 10-12 Structure of the network cable RJ-45 network interface connector

Label 1

Main label

Label 2

W

8

8 1

1 X1

X2

NOTE

For a crossover cable, pins 1 and 2 of the RJ45 connector at one end must be cross-connected to pins 3 and 6 of the RJ45 connector at the other end respectively.

Pin Assignment Table 10-14 and Table 10-15 list the pin assignment of the network cable connector. Table 10-14 Pin assignment of the straight-through cable connector straight-through Cable Connector X1 Pin

Connector X2 Pin

Color

Relationship

X1.1

X2.1

White-orange

Twisted pair

X1.2

X2.2

Orange

X1.3

X2.3

White-green

X1.6

X2.6

Green

X1.4

X2.4

Blue

X1.5

X2.5

White-blue

X1.7

X2.7

White-brown

X1.8

X2.8

Brown

Twisted pair

Twisted pair

Twisted pair

Table 10-15 Pin assignment of the crossover cable connector Crossover Cable for FE Interface

Crossover Cable for GE Interface

Connecto r X1 Pin

Connect or X2 Pin

Color

Relation ship

Connector X1 Pin

Connect or X2 Pin

Color

Relation ship

X1.1

X2.3

White-orange

X1.1

X2.3

White-orange

X1.2

X2.6

Orange

Twisted pair

X1.2

X2.6

Orange

Twisted pair

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Crossover Cable for FE Interface

10 Cables

Crossover Cable for GE Interface

Connecto r X1 Pin

Connect or X2 Pin

Color

Relation ship

Connector X1 Pin

Connect or X2 Pin

Color

Relation ship

X1.3

X2.1

White-green

X1.3

X2.1

White-green

X1.6

X2.2

Green

Twisted pair

X1.6

X2.2

Green

Twisted pair

X1.4

X2.4

Blue

X1.4

X2.7

Blue

X1.5

X2.5

White-blue

Twisted pair

X1.5

X2.8

White-blue

X1.7

X2.7

White-brown

X1.7

X2.4

White-brown

X1.8

X2.8

Brown

Twisted pair

X1.8

X2.5

Brown

Twisted pair Twisted pair

Technical Specifications Table 10-16 lists the technical specifications of the shielded cable. Table 10-16 Technical specifications of the shielded cable Item

Specification

Connector X1/X2

Network Interface Connector,8-Bit 8PIN,Shielded,Crystal Model Connector,24-26AWG,Leads Single Solide Cabl

Cable type

Twisted-Pair Cable,100ohm,Category 5e,FTP,0.52mm(0.0205 in.), 24AWG,8Cores,4Pairs,PANTONE 430U

Number of cores

Eight

Table 10-17 lists the technical specifications of the non-shielded cable. Table 10-17 Technical specifications of the non-shielded cable

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Item

Specification

Connector X1/X2

Network Interface Connector,8-Bit 8Pin,Non-Shielded,Crystal Plug

Cable type

Twisted-Pair Cable,100ohm,,Category 5e UTP,0.51mm(0.0200 in.), 24AWG,8Cores,PANTONE 430U

Number of cores

Eight

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10.5.2 75-Ohm 8 x E1 Cables The 75-ohm 8 x E1 cable is used to input and output E1 signals. Use the DB44 connector at one end to connect the cable to the 75-ohm 8 x E1 electrical interface board. Use a connector to connect the other end to the digital distribution frame (DDF). The connector should be made according to the on-site requirements.

Structure Figure 10-13 shows the structure of the 75-ohm 8 x E1 cable. Figure 10-13 Structure of the 75-ohm 8 x E1 cable

Pos.44

A

A-A

Cable connectorD type-44PIN-male

Pos.1

Main label W X

Pin Assignment Table 10-18 lists the pin assignment of the 75-ohm 8 x E1 cable connector. Table 10-18 Pin assignment of the 75-ohm 8 x E1 cable connector Connecto r Pin

Cable Core

Serial No.

38

Ring

1

23

Tip

37

Ring

22

Tip

36

Ring

21

Tip

35

Ring

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Remarks

3

5

7

R0

R1

R2

R3

Connecto r Pin

Cable Core

Serial No.

34

Ring

9

R4

19

Tip

33

Ring

11

R5

18

Tip

32

Ring

13

R6

17

Tip

31

Ring

15

R7

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Remarks

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Connecto r Pin

Cable

20

Tip

15

Ring

30

Tip

14

Ring

29

Tip

13

Ring

28

Tip

12

Ring

27

Tip

Shell

External braid shield layer

Core

Remarks Serial No.

2

T0

4

T1

6

T2

8

T3

10 Cables

Connecto r Pin

Cable

16

Tip

11

Ring

26

Tip

10

Ring

25

Tip

9

Ring

24

Tip

8

Ring

7

Tip

Core

Remarks Serial No.

10

T4

12

T5

14

T6

16

T7

Technical Specifications Table 10-19 Technical specifications of the 75-ohm 8 x E1 cable Item

Specification

Cable

Trunk Cable, 75-ohm, 8E1, 2.2 mm, D44M-I, SYFVZP75-1.2/0.25*16(S)-I, -45 deg Trunk Cable, 75-ohm, 8E1, 2.2 mm, D44M-I, SYFVZP75-1.2/0.25*16(S)-I, +45 deg

Connector

Cable connector-D type-44PIN-male

Cable type

Coaxial Cable, SYFVZP-LC 75-1-1*16, 75–ohm, 13.10 mm, 1.2 mm, 0.254 mm, Pantone Warm Gray 1U

Fireproof class

CM

Number of cores

16

Cover diameterinsulation diameterconductor diameter

13.1 mm - 1.2 mm - 0.254 mm

10.5.3 120-Ohm 8 x E1 Cables The 120-ohm 8 x E1 cable is used to input and output E1 signals. Issue 01 (2013-10-31)

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Use the DB44 connector at one end to connect the cable to the 120-ohm E1 electrical interface board. Use a connector to connect the other end to the DDF. The connector should be made according to the on-site requirements.

Structure Figure 10-14 shows the appearance of the 120-ohm 8 x E1 cable and Figure 10-15 shows the structure of the cable. Figure 10-14 Appearance of the 120-ohm 8 x E1 cable

Figure 10-15 Structure of the 120-ohm 8 x E1 cable A-A

Cable connectorD type-44PIN-male

Pos.1

Pos.44

A

Lable 1

Lable 2

Main lable W1

X W2

Pin assignment Table 10-20 lists the pin assignment of the 120-ohm 8 x E1 cable connector.

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Table 10-20 Pin assignment of the 120-ohm E1 cable connector Connector Pin

Cable

Remarks

Connector Pin

Core 15

Blue

30

White

14

Orange

29

White

13

Green

28

White

12

Brown

27

White

11

Grey

26

White

10

Blue

25

Red

9

Orange

24

Red

8

Green

7 Shell

Cable

Remarks

Core R0

38

Blue

23

White

37

Orange

22

White

36

Green

21

White

35

Brown

20

White

34

Grey

19

White

33

Blue

18

Red

32

Orange

17

Red

31

Green

Red

16

Red

External braid shield layer

Shell

External braid shield layer

R1

R2

R3

R4

R5

R6

R7

T0

T1

T2

T3

T4

T5

T6

T7

Technical Specifications Table 10-21 Technical specifications of the 120-ohm 8 x E1 cable Item

Specification

Cable

Trunk Cable, 120-ohm, 8E1, 0.4 mm, D44M-I, 2*120CC8P0.4P430U(S), -45deg Trunk Cable, 120-ohm, 8E1, 0.4 mm, D44M-I, 2*120CC8P0.4P430U(S), 45deg

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Connector

Cable connector-D type-44PIN-male

Cable type

Communication cable-120 ohm-SEYVP-24AWG-16 corePANTONE 430U

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Item

Specification

Number of cores

16 twisted pairs

Inner conductor diameter

0.4 mm(0.02 in.)

Fireproof class

CM

10 Cables

10.5.4 75-Ohm 16 x E1 Cables On an ATN device, Anea96 connectors are used to input and output 75-ohm E1 signals. At one end of the 75-ohm 16 x E1 cable, the Anea96 connector is used to connect the 75-ohm E1 electrical interface on the board; the other end is connected to the digital distribution frame (DDF). Make the connector as required on site. NOTE

The 75-ohm 16 x E1 cable of other types of ATN equipment cannot be used for the ATN 910I. Otherwise, the device cannot correctly identify the impedance.

Structure Figure 10-16 shows the appearance of the 75-ohm 16 x E1 cable and Figure 10-17 shows the structure of the cable. Figure 10-16 Appearance of the 75-ohm 16 x E1 cable

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Figure 10-17 Structure of the 75-ohm 16 x E1 cable

Main label 1 W

A

X1

View A

Pos.96

Cable Connector, Anea, 96PIN, Female Connector

Pos .1

Pin Assignment Table 10-22 lists the pin assignment of the 75-ohm 16 x E1 cable connector. Table 10-22 Pin assignment of the 75-ohm E1 cable connector Connecto r Pin

Cable Core

Serial No.

1

Tip

1

2

Ring

3

Tip

4

Ring

5

Tip

6

Ring

7

Tip

8

Ring

9

Tip

10

Ring

11

Tip

12

Ring

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Remarks

3

5

7

9

11

R0

R1

R2

R3

R4

R5

Connecto r Pin

Cable Core

Serial No.

25

Tip

2

T0

26

Ring

27

Tip

4

T1

28

Ring

29

Tip

6

T2

30

Ring

31

Tip

8

T3

32

Ring

33

Tip

10

T4

34

Ring

35

Tip

12

T5

36

Ring

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Remarks

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Connecto r Pin

Cable

Remarks

Core

Serial No.

13

Tip

13

14

Ring

15

Tip

16

Ring

17

Tip

18

Ring

19

Tip

20

Ring

21

Tip

22

Ring

23

Tip

24

Ring

49

Tip

50

Ring

51

Tip

52

Ring

53

Tip

54

Ring

55

Tip

56

Ring

Shell

External braid shield layer

R6

15

R7

17

R8

19

R9

21

R10

23

R11

25

R12

27

R13

29

R14

31

R15

10 Cables

Connecto r Pin

Cable

Remarks

Core

Serial No.

37

Tip

14

T6

38

Ring

39

Tip

16

T7

40

Ring

41

Tip

18

T8

42

Ring

43

Tip

20

T9

44

Ring

45

Tip

22

T10

46

Ring

47

Tip

24

T11

48

Ring

73

Tip

26

T12

74

Ring

75

Tip

28

T13

76

Ring

77

Tip

30

T14

78

Ring

79

Tip

32

T15

80

Ring

Technical Specifications Table 10-23 Technical specifications of the 75-ohm 16 x E1 cable

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Item

Specification

Cable

Trunk Cable, 75ohm, 16E1, 1.6mm,Anea 96FI,SYFVZP75-1.1/0.26*32(S), +45deg

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Item

Specification

Connector

Cable Connector, Anea, 96PIN, Suite Of Female Connector And Shielding Case, IDC Type, For 28-30 AWG Solid Wire, 1 A

Cable type

Coaxial Cable, SYFVZP-MC 75-1-1*32, 75 ohm, 12.40 mm(0.49 in.), 1.1 mm(0.04 in.), 0.26 mm(0.01 in.), Pantone Warm Gray 1U, Only for OEM

Diameter of the shield layer - diameter of the internal insulation layer - diameter of the internal conductor

12.4 mm(0.49 in.) - 1.6 mm(0.06 in.) - 0.26 mm(0.01 in.)

Number of cores

32

Available length

5 m, 10 m, 15 m, 20 m, 25 m, 30 m, 35 m, 40 m, 45 m, 50 m 16.40 ft.,32.80 ft.,49.21 ft.,65.62 ft.,82.02 ft.,98.42 ft.,114.83 ft., 131.23 ft.147.64 ft.,164.04 ft.

10.5.5 120-Ohm 16 x E1 Cables On an ATN device, Anea96 connectors are used to input and output 120-ohm E1 signals. At one end of the a 120-ohm 16 x E1 cable, the Anea96 connector is used to connect the 120ohm E1 electrical interface on the board; the other end is connected to the DDF. Make the connector as required on site.

Structure Figure 10-18 shows the appearance of the 120-ohm 16 x E1 cable and Figure 10-19 shows the structure of the cable. Figure 10-18 Appearance of the 120-ohm 16 x E1 cable

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Figure 10-19 Structure of the 120-ohm 16 x E1 cable

Main label 1 W

A

X1

View A

Pos.96

Cable Connector, Anea, 96PIN, Female Connector

Pos .1

Pin assignment Table 10-24 lists the pin assignment of the 120-ohm 16 x E1 cable connector. Table 10-24 Pin assignment of the 120-ohm E1 cable connector Connecto r Pin

Cable Core

Bundle

1

White

Blue

2

Blue

3

White

4

Green

5

White

6

Grey

7

Red

8

Orange

9

Red

10

Brown

11

Black

12

Blue

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Remarks

R0

R1

R2

R3

R4

R5

Connecto r Pin

Cable Core

Bundle

25

White

Blue

26

Orange

27

White

28

Brown

29

Red

30

Blue

31

Red

32

Green

33

Red

34

Grey

35

Black

36

Orange

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Remarks

T0

T1

T2

T3

T4

T5

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Connecto r Pin

Cable

13

Black

14

Green

15

Black

16

Grey

17

White

18

Blue

19

White

20

Green

21

White

22

Grey

23

Red

24

Orange

49

Red

50

Brown

51

Black

52

Blue

53

Black

54

Green

55

Black

56

Grey

Shell

External braid shield layer

Core

Remarks Bundle R6

R7

Orange

R8

R9

R10

R11

R12

R13

R14

R15

10 Cables

Connecto r Pin

Cable

37

Black

38

Brown

39

Yellow

40

Blue

41

White

42

Orange

43

White

44

Brown

45

Red

46

Blue

47

Red

48

Green

73

Red

74

Grey

75

Black

76

Orange

77

Black

78

Brown

79

Yellow

80

Blue

Core

Remarks Bundle T6

T7

Orange

T8

T9

T10

T11

T12

T13

T14

T15

Technical Specifications Table 10-25 Technical specifications of the 120-ohm 16 x E1 cable

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Item

Specification

Cable

Trunk Cable, 120 ohm, 16E1, 0.4 mm(0.02 in.), Anea 96F, 120CC32P0.4P430U(S), +45deg

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Item

Specification

Connector

Cable Connector, Anea, 96PIN, Suite Of Female Connector And Shielding Case, IDC Type, For 24-26 AWG Solid Wire - 1 A

Cable type

Twisted-Pair Cable, 120 ohm, SEYVP, 0.4 mm(0.02 in.), 26AWG, 32Pairs, Pantone 430U

Core diameter of the inner conductor

0.4 mm(0.02 in.)

Number of cores

32 twisted pairs

10.5.6 xDSL Cables On an ATN devices, the telephone wires with RJ-11/RJ-45 connectors are used to input and output ADSL and G.SHDSL service signals. The connectors at both ends of the cable applicable to the AND1SHD4, and AND1SHD4I are RJ-11 connectors. The connectors at both ends of the cable applicable to the AND1AVD8A are RJ-45 connectors.

Structure Figure 10-20 shows the structure of the telephone wire used as an xDSL cable. Figure 10-20 Structure of the telephone wire 1

Main label W

6

6

1

1 X1

X2 15 m

1. Telephone wire RJ-11 crystal connector

1

Main label 8

W

8

1

1 X1

X2 15 m

1. Telephone wire RJ-45 crystal connector

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Pin Assignment Table 10-26 lists the pin assignment of the ADSL cable connector and Table 10-27 lists the pin assignment of the G.SHDSL cable connector. Table 10-26 Pin assignment of the ADSL cable connector (RJ-45) Connector X1

Connector X2

Description

X1.1

X2.1

Unspecified

X1.2

X2.2

Unspecified

X1.3

X2.3

Unspecified

X1.4

X2.4

Ring

X1.5

X2.5

Tip

X1.6

X2.6

Unspecified

X1.7

X2.7

Unspecified

X1.8

X2.8

Unspecified

Table 10-27 Pin assignment of the G.SHDSL cable connector Connector X1

Connector X2

Description

X1.1

X2.1

Unspecified

X1.2

X2.2

Unspecified

X1.3

X2.3

Tip

X1.4

X2.4

Ring

X1.5

X2.5

Unspecified

X1.6

X2.6

Unspecified

Technical Specifications Table 10-28 lists the technical specifications of the xDSL cable (telephone wire).

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Table 10-28 Technical specifications of the xDSL cable Item

Specification

RJ-11 Connector X1/ X2

Network Interface Connector, 6-Bit 4PIN, Crystal Model Connector, Matching 26-28AWG

RJ-45 Connector X1/ X2

Network Interface Connector, 8-Bit 8PIN, Shielded, Crystal Model Connector

Cable

Electronic and Power Cable, 150 V,UL20251, 28AWG, Black, 1 A, 2 Cores Telephone Cable

Number of cores

2

10.6 Optical Fibers On an ATN device, optical fibers are used to input and output Ethernet service signals. Indoor optical fibers include single-mode optical fibers and multi-mode optical fibers. The appearances of a single-mode optical fiber and a multi-mode optical fiber are the same, but their colors are different. The single-mode optical fiber is yellow, and the multi-mode optical fiber is orange. Figure 10-21 shows the appearance of a single-mode optical fiber. Figure 10-21 Appearance of a single-mode optical fiber with LC/PC connectors

LC/PC connectors are used at both ends of the optical fiber shown in Figure 10-21. For an optical fiber that connects an optical port on an ATN device to an optical port of another type on the Issue 01 (2013-10-31)

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peer device, an LC/PC connector is used at one end and a connector of another type is used at the other end. Table 10-29 lists the common optical connectors. Table 10-29 Common optical connectors Appearance

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Type

Description

SC/PC connector

Plug-in square fiber connector/ protruding polished

FC/PC connector

Round fiber connector/protruding polished

ST/PC connector

Square fiber connector/protruding polished

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11 Equipment Support

Equipment Support

About This Chapter ATN devices can work with various equipment to implement various applications. 11.1 Cabinet Support This section provides common cabinets that can house ATN devices. 11.2 Power Distribution Equipment This section introduces equipment that supplies power to ATN devices. 11.3 Heater The ATN 910I-TC DC operates at a temperature that ranges from -40ºC to 65ºC. When the temperature falls below -20ºC, the heater starts working.

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11.1 Cabinet Support This section provides common cabinets that can house ATN devices.

11.1.1 APM30H Outdoor Cabinet The APM30H outdoor cabinet supports IP55 protection rating and can be used outdoors. The APM30H is an outdoor cabinet with heat exchangers. It supports AC power supply and DC power distribution, and can provide a 7 U installation space for user devices. Figure 11-1 and Figure 11-2 show the appearance and internal structure of an APM30H outdoor cabinet. Figure 11-1 Appearance of an APM30H outdoor cabinet

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Figure 11-2 Internal structure of an APM30H outdoor cabinet

7U

Table 11-1 lists the technical specifications of the APM30H outdoor cabinet. Table 11-1 Technical specifications of the APM30H outdoor cabinet Item

Specifications

Dimensions (H x W x D)

700 mm x 600 mm x 480 mm

Available installation space

7 U (1 U = 44.45 mm)

Allowable internal heat consumption

≤ 700 W

Protection rating

IP55

11.1.2 IMB Network Cabinet The IMB network cabinet supports the IP31 protection rating, and can be wall mounted indoors, in the corridor, and in the weak current well. A small-sized IMB network cabinet has a compact structure and occupies only a little installation space. In addition, it can be installed on an uneven wall with an undulation smaller than 10 mm, so it has low requirements on site selection. The IMB network cabinet provides a 3 U installation space for user devices. The internal 2 U installation space is for an ATN device and the external 1 U installation space is for a power supply device. Figure 11-3 and Figure 11-4 show the appearance and structure of an IMB network cabinet.

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Figure 11-3 Appearance of an IMB network cabinet

Figure 11-4 Internal structure of an IMB network cabinet

Table 11-2 lists the technical specifications of the IMB network cabinet. Table 11-2 Technical specifications of the IMB network cabinet

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Item

Specifications

Dimensions (H x W x D)

560 mm x 180 mm x 425 mm

Available installation space

3 U (1 U = 44.45 mm)

Allowable internal heat consumption

≤ 300 W

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Item

Specifications

Protection rating

IP31

11.1.3 19-inch Open Rack 19-inch open racks apply to Class-A indoor installation environment. A 19-inch open rack provides a 45 U installation space for user devices. Figure 11-5 shows the appearance of a 19-inch open rack. Figure 11-5 Appearance of a 19-inch open rack

Table 11-3 lists the technical specifications of the 19-inch open rack. Table 11-3 Technical specifications of the 19-inch open rack

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Item

Specifications

Dimensions (H x W x D)

2,200 mm x 600 mm x 600 mm

Available installation space

45 U (1 U = 44.45 mm)

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11.1.4 N63E Cabinet N63E-22 cabinet apply to Class-A indoor installation environment. The N63E-22 cabinet has a height of 2.2 m. Figure 11-6 shows the appearance of a N63E-22 cabinet. Figure 11-6 Appearance of a N63E-22 cabinet

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Table 11-4 lists the technical specifications of the N63E-22 cabinet. Table 11-4 Technical specifications of the N63E-22 cabinet Item

Specifications

Standard compliance

ETSI cabinet (21-inch): ETSI 300 119-3

Weight (empty cabinet)

45 kg

Dimensions (W x D x H)

600 mm x 300 mm x 2200 mm

Distance between mounting bar holes

1 SU = 25 mm. (SU: Standard U.)

Available space

83 SU

Fixing centers

515 mm

11.2 Power Distribution Equipment This section introduces equipment that supplies power to ATN devices.

11.2.1 Power Distribution This section describes power distribution for ATN devices in AC and DC scenarios.

DC Scenario The rated voltage and current of ATN 910 are -48 V/-60 V DC and 4 A, respectively. The rated voltage and current of an ATN 910I DC device are -48 V/-60 V DC and 1.5 A, respectively. NOTE

An ATN 910I AC device using AC power supplies cannot be used in the DC scenario.

The rated voltage and current of ATN 910B are -48 V/-60 V DC and 4 A, respectively. The rated voltage and current of ATN 950B are -48 V/-60 V DC and 8 A, respectively. In DC scenarios, an ATN device can be directly used under the rated voltage of -48 V/-60 V DC or used with a 27S48D power system under the rated voltage of +24 V DC. Figure 11-7 and Figure 11-8 show the power distribution for an ATN device. Figure 11-7 Power distribution for an ATN device under the voltage of -48 V/-60 V DC

-48 V DC/-60 V DC -48 V DC/-60 V DC

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ATN

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NOTE

For the capacity of circuit breakers or fuses on an ATN device, refer to the Quick Installation Guide of the ATN device.

Figure 11-8 Power distribution for an ATN device under the voltage of +24 V DC

+24 V DC +24 V DC

-48 V DC

27S48D -48 V DC

ATN

AC Scenario The input AC voltage of An ATN 910I AC device is from 100 V to 240 V AC and the rated current is 0.6 A.An ATN 910I AC device can be directly used in AC scenarios. Figure 11-9 shows the power distribution for an ATN 910I AC device. Figure 11-9 AC power distribution 220 V AC

ATN

When using AC power supplies, the ATN DC device can be used with an EPS30-4815AF power system. Figure 11-10 shows the power distribution for an ATN DC device. Figure 11-10 AC power distribution -48 V DC

220 V AC

EPS30-4815AF -48 V DC

ATN

-48V DC Lead-acid battery

11.2.2 EPS30-4815AF Power System The EPS30-4815AF external power system converts input 220 V AC power to -53.5 V DC power and supplies power to an ATN device. When the 220 V AC input power supply fails, the EPS30-4815AF automatically supplies to the ATN device the backup power of storage batteries. An EPS30-4815AF power system consists of a rectifier module, monitoring module, and AC/ DC power distribution frame. Issue 01 (2013-10-31)

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Appearance Figure 11-11 and Table 11-5 show the appearance and structure of an EPS30-4815AF, respectively. Figure 11-11 Appearance of an EPS30-4815AF

NOTICE Interfaces on the monitoring module are reserved temporarily. Do not use these interfaces. Otherwise, the power system may be reset or damaged.

Table 11-5 Structure of an EPS30-4815AF

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Component

Description

Rectifier module

Converts AC power to DC power. One or two rectifier modules can be configured in an EPS30-4815AF power system.

Monitoring module

Detects the status of the power system and storage batteries. Two RS232/RS485 communication interfaces and one DB50 interface are reserved on the monitoring module.

AC/DC power distribution frame

Provides AC power input interface, load interfaces, storage battery interface, and replaceable fuses.

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Indicators Indicators for the rectifier and monitoring modules are present on the front panel of the EPS30-4815AF. Table 11-6 and Table 11-7 list the indications of indicators for the rectifier and monitoring modules respectively. Table 11-6 Indicators for the rectifier modules Indicator

Indication

Color

Normal State

Abnormal State

Cause of Exception

RUN

Running indicator

Green

On

Off

The rectifier modules are running normally.

ALM

Protection indicator

Yellow

Off

On

A fault that can be rectified occurs on a rectifier module.

Blinking

Communication on a rectifier module is interrupted.

On

A fault that cannot be rectified occurs on a rectifier module.

FAULT

Fault indicator

Red

Off

Note 1: When a severe fault occurs, the indicator (red) is on and the indicators (yellow and green) are off. The indicators (yellow and green) are on only when the indicator (red) is off. Note 2: The indicator (yellow) is always on when communication on a rectifier module is interrupted, a rectifier module is overheated or endures overcurrent or undercurrent, or a rectifier module is disabled.

Table 11-7 Indicators for the monitoring module Indicat or

Indicatio n

Color

Normal State

Abnorm al State

Cause of Exception

RUN

Running indicator

Green

Blinking regularly

Off

The monitoring module is running abnormally.

Fast blinking

Abnormal communication

On

The EPS30-4815AF reports an alarm.

ALM

Alarm indicator

Red

Off

Interfaces Table 11-8 lists types and usage of the interfaces on the front panel of the EPS30-4815AF.

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Table 11-8 Interfaces on the front panel of the EPS30-4815AF Interface Name

Numb er of Interfa ces

Interface Type

Description

Remarks

AC INPUT

1

-

220 V AC power input interface

-

RS232/RS485

2

RJ-45

RS232/RS485 communication interfaces. The monitoring module communicates with the equipment, reports alarms, and implements remote control through these interfaces.

Reserved interfaces

The interface on the left is the active interface and the interface on the right is the standby interface. The active and standby interfaces cannot be used at the same time. COM

1

DB50

The monitoring module is connected to various sensors through the COM interface.

Reserved interface

LOAD1

1

-

Output interface for load 1

LOAD2

1

-

Output interface for load 2

BATT

1

-

Interface for connecting to the storage batteries

LOAD1 and LOAD2 provide DC power for two PIUs. For how to connect the load interfaces to the PIUs, see the Installation Guide. The pins marked with + and - are connected to the 48V+ and 48Vpoles of the cable connector respectively. Table 11-9 lists the relationships of the load output interfaces, interface for connecting to the storage batteries, and fuses.

Output branch fuses There are three replaceable fuses on the front panel of the EPS30-4815AF. The fuses disable/ enable the load and storage batteries, and provide overload and short-circuit protection for the load and storage batteries.

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Table 11-9 Relationships of the load output interfaces, interface for connecting to the storage batteries, and fuses Output Branch Fuse

Load Branch

FU-1 (10 A)

LOAD1 (10 A)

FU-2 (20 A)

LOAD2 (20 A)

FU-BT (20 A)

BATT (20 A)

DIP Switch There is a DIP switch on the monitoring module of the EPS30-4815AF. Figure 11-12 shows the default setting and location of the DIP switch. Figure 11-12 Default setting and location of the DIP switch

NOTICE Do not change the default setting of the DIP switch. Otherwise, the EPS30-4815AF is affected. The DIP switch indicates eight bits in binary format (on: 1; off: 0). The default value of the eight bits is 00000100. The functions of the eight bits are as follows: l

The first five bits indicate the local and remote power addresses. Bit 5 is the highest bit and bit 1 is the lowest bit.

l

Bit 6 sets the baud rate of communication between the monitoring module and equipment. When bit 6 is 1, the baud rate is 9600 bit/s; when bit 6 is 0, the baud rate is 19200 bit/s.

l

Bits 7 and 8 are reserved.

Technical Specifications Table 11-10 lists the technical specifications of the EPS30-4815AF.

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Table 11-10 Technical specifications of the EPS30-4815AF Item AC input

Battery input

DC output

Specification Rated input voltage

220 (90 to 280) V AC

Maximum input current

10 A

Frequency

50/60 Hz

Rated input voltage

-48 V

Capacity

40 Ah

Number of batteries

4

Rated output voltage

-53.5 V DC

Output current

LOAD1: 10 A (determined by the fuse) LOAD 2: 20 A (determined by the fuse)

Dimensions of the EPS30-4815AF (mounting ears included)

43.6 mm (H) x 482.6 mm (W) x 270 mm (D)

Weight of the EPS30-4815AF

< 10 kg

11.2.3 27S48D Power System The 27S48D power system converts input +24 V DC power to -53.5 V DC power and supplies power to an ATN device.

Appearance Figure 11-13 shows the appearance of a 27S48D power system. Figure 11-13 Appearance of a 27S48D power system

Functions The 27S48D power system accepts power in the range of 19 V to 30 V, and outputs -53.5 V rated voltage and 7 A rated current. In terms of electrical performance and structure, the 27S48D power system is divided into two independent -53.5 V/5.6 A power modules. They are separated using an output diode and Issue 01 (2013-10-31)

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installed in the same cabinet. Their currents are combined into a 7 A one through power distribution, and the 7 A current is supplied to equipment. The 27S48D power system provides functions such as short-circuit protection, overcurrent protection, output overvoltage protection, and overheat protection.

Indicator Table 11-11 lists the meaning of each 27S48D power indicator status. Table 11-11 Indicator description Indicator

Color

Normal State

Description

RUN

Green

On

When the module receives 24 V power, the indicator is on and green.

STAND-BY

Yellow

Off

When there is no output power, the indicator is on and yellow.

ALM

Red

Off

When protection is triggered or a fault occurs, the indicator is on and red.

Interface Table 11-12 lists the types and functions of 27S48D power interfaces. Table 11-12 Description of 27S48D power interfaces Interface Name

Quant ity

Description

Remarks

INPUT

2

24 V DC power input interface

Each power module has one input interface to receive power independently.

OUTPUT

6

-48 V DC power output interface

Two terminals are used: NEG(-) and RTN(+). There are altogether six power outputs.

ALM

1

Alarm output terminal

Dry contact output: off (abnormal) or on (normal)

Technical Specifications Table 11-13 lists the technical specifications of the 27S48D power system.

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Table 11-13 Technical specifications of the 27S48D power system Item

Value

DC power supply

DC power supply

Rated input voltage

24 V (19 V to 30 V) DC

Maximum input current

20 A

Rated output voltage

-53.5 V DC

Output current

7A

Dimensions (with mounting ears) (H x W x D)

43.4 mm x 482.6 mm x 244 mm

Weight

< 7 kg

11.2.4 HW-100-48AC14D-1 Power System The HW-100-48AC14D-1 power system receives and converts 110 V or 220 V AC power to -48 V DC power for an ATN device.

Appearance Figure 11-14 shows the appearance of the HW-100-48AC14D-1 power system. Figure 11-14 Appearance of the HW-100-48AC14D-1 power system

Functions The HW-100-48AC14D-1 power system supports AC power ranging from 90 V to 264 V, and outputs -48 V DC power in natural heat dissipation mode. The output power is 100 W. This Issue 01 (2013-10-31)

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power system supports protection against output overcurrent, output undervoltage, output short circuit, and overtemperature.

Technical Specifications Table 11-14 provides the technical specifications of the HW-100-48AC14D-1 power system. Table 11-14 Technical specification of the HW-100-48AC14D-1 power system Item

Specifications

AC power input

DC output

Rated input voltage

100/220 V (100 V to 240 V) AC

Maximum input current

2A

Rated output voltage

-48 V DC

Rated output power

100 W

Dimensions (H x W x D)

40 mm x 171 mm x 72 mm

Weight

< 1 kg

Ambient temperature

-20 °C to +40 °C

11.2.5 Lead-Acid Battery An ATN device uses valve regulated lead-acid batteries to provide backup power.

Appearance Figure 11-15 shows the appearance of a lead-acid battery. Figure 11-15 Appearance of a lead-acid battery

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NOTE

The appearance, dimensions, and weight of lead-acid batteries are provided only for reference and those of the delivered batteries prevail.

Technical Specifications Table 11-15 shows the technical specifications of the lead-acid battery. Table 11-15 Technical specifications of the lead-acid battery Item

Specifications

Rated working voltage (four batteries cascaded in a group)

-48 V DC

Rated capacity (four batteries cascaded in a group)

40 Ah (NP38-12RFR)

Float charging voltage (four batteries cascaded in a group)

-53.5 V DC

Maximum charge current (four batteries cascaded in a group)

9.5 A (NP38-12RFR)

Operating temperature

-15°C to +50°C (NP38-12RFR)

40 Ah (BPL40-12)

12 A (BPL40-12)

-20°C to +50°C (BPL40-12) Weight

≤ 15 kg

11.3 Heater The ATN 910I-TC DC operates at a temperature that ranges from -40ºC to 65ºC. When the temperature falls below -20ºC, the heater starts working. The dimensions of the heater (without mounting ears) are 420 mm (width) x 250 mm (depth) x 41.6 mm (height). Figure 11-16 shows the heater. Figure 11-16 Heater

The technical specifications of the heater are as follows: Issue 01 (2013-10-31)

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l

When the temperature in the cabinet is lower than +1ºC (with ±6ºC offset considered), the heater starts working. When the temperature in the cabinet is higher than +15ºC (with ±3ºC offset considered), the heater stops working.

l

The rated heating power of the heater is 330 W.

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12

Quick Reference

About This Chapter 12.1 Indicators This topic describes the names of various indicators and their indications. 12.2 Dimensions and Weight This chapter lists the dimensions and weight of each board used for an ATN device. 12.3 Power Consumption This chapter lists the power consumption of each board used for ATN devices. 12.4 Interface Specifications This chapter presents the list of Interface Specifications.

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12.1 Indicators This topic describes the names of various indicators and their indications.

Index of Indicators For boards and their indicators, see Boards and Their Indicators. For board status indicators, see: l

Description of the Board Status Indicator (STAT)

l

Description of the Program Running Indicator (PROG)

l

Description of the Synchronization Status Indicator (SYNC)

l

Description of the Service Status Indicator (SRV)

l

Description of the CXP Switching Status Indicator (ACTX)

l

Description of the CXP Control Status Indicator (ACTC)

l

Description of the Power Supply Status Indicator (PWRA/PWRB/PWR)

l

Description of the Fan Status Indicator (FAN)

For service port status indicators, see: l

Description of the Service Port Transmitting/Receiving Status Indicator (ACT)

l

Description of the Ethernet Electrical Interface Connection Status Indicator (LINK)

l

Description of the Ethernet Optical Interface Connection/Data Transmission Status Indicator (L/A or LINK/ACT)

l

Description of the EF8F/EG2 Port Connection Status Indicator (LINK)

l

Description of the CQ1B/PQ1 Port Status Indicator (LOS1 to LOS4)

For system alarm indicators, see: l

Description of the Critical Alarm Indicator (CRIT)

l

Description of the Major Alarm Indicator (MAJ)

l

Description of the Minor Alarm Indicator (MIN)

For combination of indicators in different start statuses on the system control board, see Description of the Start Status Indicator Combination on the System Control Board.

Boards and Their Indicators

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ATN 910 Board Name

Indicator

ANC2CXPI/ANC2CXPL

STAT, PROG, SYNC, SRV, CRIT, MAJ, MIN, L/A0, L/A1, LINK, and ACT

AND1EF8T

STAT, LINK, ACT

AND1EF8F

STAT, LINK0 to LINK7

AND1EG2

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ATN 910 Board Name

Indicator

AND1EG4F

STAT, L/A0 to L/A3

AND1EG4T

STAT

AND1MO1C

STAT

AND1AVD8A/ AND1AVD8B

STAT

AND1SHD4

STAT, LINK0 to LINK3

AND1SHD4I

STAT, LINK0 to LINK3

AND1ML1/ML1A

STAT

AND2ML1A/ML1B

STAT

AND1MD1A/MD1B

STAT

ANC1PIU

PWRA, PWRB

ANC1FAN

FAN

ATN 950B Board Name

Indicator

AND1CXPA/ AND1CXPB/ AND2CXPA/ AND2CXPB/AND2CXPE

STAT, PROG, SYNC, ACTX, and ACTC

AND1EM4T

STAT

AND1EM8T

STAT

AND1EX1

L/A

AND1EM4F

STAT, L/A0 to L/A3

AND1EM8F

STAT, L/A0 to L/A7

AND2CQ1B/AND2PQ1

STAT, LOS0 to LOS3

AND1ML1/ML1A

STAT

AND3ML1A/ML1B

STAT

AND2MD1A/MD1B

STAT

AND1PIU/AND2PIU

PWR

AND1FAN/AND2FAN

CRIT, MAJ, MIN, and FAN

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Description of the Board Status Indicator (STAT) Status

Indication

On (green)

The board is working normally.

On (red)

The board hardware is faulty.

On (orange)

The interface board is not loaded with the logic.

Off

l No power is input. l The board is not running.

Description of the Program Running Indicator (PROG) Status

Indication

On (green)

l The board software is being initialized. l The board software is normally initialized, and the board software is running normally. l The memory self-check fails.

On (red)

l The board software or the logic file is lost. l Loading of the board software fails. On for 100 ms and off for 100 ms alternately (green)

Loading of the board software is in process.

On for 300 ms and off for 300 ms alternately (green)

The BIOS is guiding the upper-layer software.

On for 100 ms and off for 100 ms alternately (red)

The BIOS self-check fails.

Off

No power is input.

Description of the Synchronization Status Indicator (SYNC) Status

Indication

On (green)

l The clock works in free-run mode and the system clock priority list is not set. By default, the system clock priority list contains only internal sources. l The clock works in locked mode and is tracing a clock source other than the internal sources in the priority list. l The system clock is working in time synchronization mode, and the PTP time and system clock are in the tracing state.

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Status

Indication

On (red)

l The system clock priority list is set. All the clock sources, however, are lost except for the internal clock sources. The clock works in holdover mode or free-run mode. l The system clock is working in time synchronization mode, but no synchronization source is available. The system clock and PTP time are working in holdover or free-run mode.

Description of the Service Status Indicator (SRV) This indicator is reserved for later use.

Description of the CXP Switching Status Indicator (ACTX) Status

Indication

On (green)

The board is in the working switching state.

Off

The board is in the protection switching state.

Description of the CXP Control Status Indicator (ACTC) Status

Indication

On (green)

The board is in the working control state.

On for 100 ms and off for 100 ms alternately (green)

The data of the equipment is backed up in batch.

Off

The board is in the protection control state.

Description of the Power Supply Status Indicator (PWRA/PWRB/PWR) Status

Indication

On (green)

Power is accessed.

Off

l No power is accessed. l The power supply poles are inversely connected.

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Description of the Alarm Indicator (ALM) Status

Indication

On (red)

Critical alarms are generated in the equipment.

On (yellow)

Major or minor alarms are generated in the equipment.

Off

No alarms are generated in the equipment.

Description of the Fan Status Indicator (FAN) Status

Indication

On (green)

The fans are working normally.

On (red)

The fans are working abnormally.

Off

The fans are not powered.

Description of the Service Port Transmitting/Receiving Status Indicator (ACT) Status

Indication

Blinking (orange)

The data interface is transmitting or receiving data.

Off

The data interface is not transmitting or receiving data.

Description of the Ethernet Electrical Interface Connection Status Indicator (LINK) Status

Indication

On (green)

The physical port connection is normal.

Off

The physical port connection fails.

Description of the Ethernet Optical Interface Connection/Data Transmission Status Indicator (L/A or LINK/ACT)

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Status

Indication

On (green)

The connection on the physical port is normal.

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Status

Indication

Blinking (orange)

The connection on the physical port is normal, and data is received or transmitted on the port.

Off

The physical connection fails.

Description of the EF8F/EG2 Port Connection Status Indicator (LINK) Status

Indication

On (green)

The physical connection of the port is normal.

Off

The physical connection of the port is faulty.

Description of the CQ1B/PQ1 Port Status Indicator (LOS1 to LOS4) Status

Indication

On (green)

The signal on the port is normal.

On (red)

The signal on the port is lost.

Off

The optical module is offline.

Description of the PoE Status Indicator Status

Indication

On (green)

The PoE port outputs power normally.

On (red)

A PoE power output alarm is generated. The peer is a non-standard PD.

On (orange)

Negotiation with the peer PD is in progress.

Off

No PD is installed at the peer end and the PoE port does not output power.

Description of the Critical Alarm Indicator (CRIT)

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Status

Indication

On (red)

Critical alarms are generated in the equipment.

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Status

Indication

Off

No critical alarms are generated in the equipment.

Description of the Major Alarm Indicator (MAJ) Status

Indication

On (orange)

Major alarms are generated in the equipment.

Off

No major alarms are generated in the equipment.

Description of the Minor Alarm Indicator (MIN) Status

Indication

On (yellow)

Minor alarms are generated in the equipment.

Off

No minor alarms are generated in the equipment.

Description of the Start Status Indicator Combination on the System Control Board Table 12-1 describes the status and meaning of the start status indicator combination of the ATN 910 control board from the time when it is powered on to the time when it is working properly.Table 12-2 describes the status and meaning of the start status indicator combination of the ATN 950B control board from the time when it is powered on to the time when it is working properly. Table 12-1 Start status indicator combination SN

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Status

Indicator STAT

PROG

1

The system control board is not powered on.

Off

Off

2

The BIOS is being started.

Off

Green

3

The BIOS is started, and guides and loads the board software.

Off

Blinking (green)

4

The upper-layer software is being initialized.

Green

Green

5

The upper-layer software initialization is complete, but the system control board is not running.

Green

Green

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SN

6

12 Quick Reference

Status

Indicator

The system control board is running.

STAT

PROG

Green

Green

NOTE The STAT and PROG indicators provide the control board status indication as well as the DCN availability indication. By default, after the ATN is powered on and automatically goes online in DCN mode, The STAT and PROG indicators are both blinking green for 3s, indicating that the ATN has gone online. Then the STAT and PROG indicators restore the control board status indication, and the status indication lasts for 7s. After the DCN availability indication and status indication are alternately displayed for 10 minutes, the STAT and PROG indicators no longer provide the DCN availability indication and only provide the status indication.

Table 12-2 Start status indicator combination for ATN 950B SN

Status

Indicator STAT

PROG

ACTC ACTX

1

The system control board is not powered on.

Off

Off

Off

2

The BIOS is being started.

Off

Green

Off

3

The BIOS is started, and guides and loads the board software.

Off

Blinking (green)

Off

4

The upper-layer software is being initialized.

Green

Green

Off

5

The upper-layer software initialization is complete, but the system control board is not running.

Green

Green

Off

6

The system control board is running.

Green

Green

Off/Green/ Blinking (green) a

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SN

12 Quick Reference

Status

Indicator STAT

PROG

ACTC ACTX

NOTE a: When the system control board is running, the ACTC and ACTX indicators may be off, in green or blinking (green). When services are normal, the indicator is green. For other statuses of the indicator, see Description of the CXP Switching Status Indicator (ACTX) and Description of the CXP Control Status Indicator (ACTC). The STAT and PROG indicators provide the control board status indication as well as the DCN availability indication. By default, after the ATN is powered on and automatically goes online in DCN mode, The STAT and PROG indicators are both blinking green for 3s, indicating that the ATN has gone online. Then the STAT and PROG indicators restore the control board status indication, and the status indication lasts for 7s. After the DCN availability indication and status indication are alternately displayed for 10 minutes, the STAT and PROG indicators no longer provide the DCN availability indication and only provide the status indication.

NOTE

The STAT and ALM indicators on the ATN 910I and ATN 910B provide the system status indication as well as the DCN availability indication. By default, after the ATN is powered on and automatically goes online in DCN mode, The STAT and ALM indicators are both blinking green for 3s, indicating that the ATN has gone online. Then the STAT and ALM indicators restore the system status indication, and the status indication lasts for 7s. After the DCN availability indication and status indication are alternately displayed for 10 minutes, the STAT and ALM indicators no longer provide the DCN availability indication and only provide the status indication.

12.2 Dimensions and Weight This chapter lists the dimensions and weight of each board used for an ATN device. Table 12-3 provides the weight and dimensions of the boards for ATN 910. Table 12-3 ATN 910 board weight and dimensions Board

Weight

Dimensions (H x D x W)

ANC2CXPI

1.08kg

20.3 mm x 226.0 mm x 388.4 mm 0.80 in. x 8.90 in. x 15.29 in.

ANC2CXPL

1.08kg

20.3 mm x 226.0 mm x 388.4 mm 0.80 in. x 8.90 in. x 15.29 in.

AND1EF8T

0.53 Kg (1.17 lb)

20.32 mm x 225.75 mm x 193.80 mm 0.80 in. x 8.89 in. x 7.63 in.

AND1EF8F

0.55 Kg (1.21 lb)

20.32 mm x 225.75 mm x 193.80 mm 0.80 in. x 8.89 in. x 7.63 in.

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Board

Weight

Dimensions (H x D x W)

AND1EG2

0.52 Kg (1.15 lb)

20.32 mm x 225.75 mm x 193.80 mm 0.80 in. x 8.89 in. x 7.63 in.

AND1EG4F

0.50 Kg (1.10 lb)

20.32 mm x 225.75 mm x 193.80 mm 0.80 in. x 8.89 in. x 7.63 in.

AND1ML1/AND1ML1A

0.56 Kg (1.23 lb)

20.32 mm x 225.75 mm x 193.80 mm 0.80 in. x 8.89 in. x 7.63 in.

AND1EG4T

0.50 Kg (1.10 lb)

20.32 mm x 225.75 mm x 193.80 mm 0.80 in. x 8.89 in. x 7.63 in.

AND2ML1A/AND2ML1B

0.44 Kg (0.97 lb)

20.32 mm x 225.75 mm x 193.80 mm 0.80 in. x 8.89 in. x 7.63 in.

AND1MD1A/AND1MD1B

0.49 Kg (1.08 lb)

20.32 mm x 225.75 mm x 193.80 mm 0.80 in. x 8.89 in. x 7.63 in.

AND1MO1C

0.59 Kg (1.30 lb)

20.32 mm x 225.75 mm x 193.80 mm 0.80 in. x 8.89 in. x 7.63 in.

AND1AVD8A AND1AVD8A

0.50 Kg (1.10 lb)

AND1SHD4

0.60 Kg (1.32 lb)

20.32 mm x 225.75 mm x 193.80 mm 0.80 in. x 8.89 in. x 7.63 in. 20.32 mm x 225.75 mm x 193.80 mm 0.80 in. x 8.89 in. x 7.63 in.

AND1SHD4I

0.6 Kg (1.32 lb)

20.32 mm x 225.75 mm x 193.80 mm 0.80 in. x 8.89 in. x 7.63 in.

TNC1PIU

0.12 Kg (0.26 lb)

41.4 mm x 224.8 mm x 21.0 mm 1.63 in. x 8.85 in. x 0.83 in.

ANC1FAN

0.12 Kg (0.26 lb)

42.0 mm x 217.6 mm x 28.5 mm 1.65 in. x 8.57 in. x 1.12 in.

Table 12-4 provides weight and dimensions of the boards for ATN 950B. Table 12-4 ATN 950B board weight and dimensions Board

Weight

Dimensions (H x D x W)

AND1CXPA/AND1CXPB

0.68 Kg (1.50 lb)

22.86 mm x 225.75 mm x 193.80 mm 0.90 in. x 8.89 in. x 7.63 in.

AND2CXPA/AND2CXPB/ AND2CXPE

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0.68 Kg (1.50 lb)

22.86 mm x 225.75 mm x 193.80 mm 0.90 in. x 8.89 in. x 7.63 in.

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Board

Weight

Dimensions (H x D x W)

AND1EM4T

0.44 Kg (0.97 lb)

20.32 mm x 225.75 mm x 193.80 mm 0.80 in. x 8.89 in. x 7.63 in.

AND1EM8T

0.46 Kg (1.01 lb)

20.32 mm x 225.75 mm x 193.80 mm 0.80 in. x 8.89 in. x 7.63 in.

AND1EX1

0.42 Kg (0.93 lb)

20.32 mm x 225.75 mm x 193.80 mm 0.80 in. x 8.89 in. x 7.63 in.

AND1EM4F

0.44 Kg (0.97 lb)

20.32 mm x 225.75 mm x 193.80 mm 0.80 in. x 8.89 in. x 7.63 in.

AND1EM8F

0.46 Kg (1.01 lb)

20.32 mm x 225.75 mm x 193.80 mm 0.80 in. x 8.89 in. x 7.63 in.

AND2CQ1BAND2PQ1

0.47 Kg (1.04 lb)

20.32 mm x 225.75 mm x 193.80 mm 0.80 in. x 8.89 in. x 7.63 in.

AND1ML1/AND1ML1A

0.56 Kg (1.23 lb)

20.32 mm x 225.75 mm x 193.80 mm 0.80 in. x 8.89 in. x 7.63 in.

AND3ML1A/AND3ML1B

0.44 Kg (0.97 lb)

20.32 mm x 225.75 mm x 193.80 mm 0.80 in. x 8.89 in. x 7.63 in.

AND2MD1A/AND2MD1B

0.49 Kg (1.08 lb)

20.32 mm x 225.75 mm x 193.80 mm 0.80 in. x 8.89 in. x 7.63 in.

TND1PIU

0.12kg

41.4 mm x 229.9 mm x 21.0 mm 1.63 in. x 9.05 in. x 0.83 in.

AND1FAN

0.30kg

86.2 mm x 217.6 mm x 28.5 mm 3.39 in. x 8.57 in. x 1.12 in.

Table 12-5 provides the ATN 910I weight and dimensions. Table 12-5 ATN 910I weight and dimensions Model/ Silkscreen

Powe r Suppl y

Interface

Weight

Dimensions (H x D x W)

ATN 910I AC

AC

4GE(O)+4GE/FE(O)+4GE/FE(E)

ATN 910I-C AC

AC

4GE(O)+4GE/FE(O)+4GE/FE(E) +16E1

3 Kg (6.61 lb)

1U x 220 mm x 442 mm, 1U=44.45 mm (1.75 in.)

ATN 910I DC

DC

4GE(O)+4GE/FE(O)+4GE/FE(E)

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1U x 8.66 in. x 17.40 in.

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ATN 910I-TC DC

Powe r Suppl y

Interface

DC

4GE(O)+4GE/FE(O)+4GE/FE(E) +16E1

DC

4GE(O)+4GE/FE(O)+4GE/FE(E) +16E1

12 Quick Reference

Weight

Dimensions (H x D x W)

NOTE

ATN 910I boards are not swappable. Table 12-5 provides the weight and dimensions of an integrated ATN 910I chassis.

Table 12-6 provides the ATN 910B weight and dimensions. Table 12-6 ATN 910B weight and dimensions Model/ Silkscreen

Powe r Suppl y

Interface

Weight

Dimensions (H x D x W)

ATN 910B

DC

2x10GE(O)+8GE/FE(O)+8FE/GE(E) +16E1

3 Kg (6.61 lb)

1U x 220 mm x 442 mm, 1U=44.45 mm (1.75 in.)

ATN 910B

DC

2x10GE(O)+16GE/FE(O)+8FE/GE (E)

1U x 8.66 in. x 17.40 in.

NOTE

ATN 910B boards are not swappable. Table 12-6 provides the weight and dimensions of an integrated ATN 910B chassis.

12.3 Power Consumption This chapter lists the power consumption of each board used for ATN devices. Table 12-7 provides the power consumption of each board on ATN 910. Table 12-7 ATN 910 board power consumption

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Board

Power Consumption

ANC2CXPI

28.0 W

ANC2CXPL

29.5 W Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd.

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Board

Power Consumption

AND1EF8T

9.0 W

AND1EF8F

12.9 W

AND1EG2

6.1 W

AND1EG4F

13.2 W

AND1ML1/AND1ML1A

13.1 W

AND1EG4T

10.0 W

AND2ML1A/AND2ML1B

9.5 W

AND1MD1A/AND1MD1B

12.1 W

AND1MO1C

10.6 W

AND1AVD8A/AND1AVD8B

19.6 W

AND1SHD4

7.4 W

AND1SHD4I

7.5 W

TNC1PIU

0.5 W

ANC1FAN

l Low rate: 2.3 W l Medium rate: 6.1 W l High rate: 17 W

Table 12-8 provides the power consumption of each board on ATN 950B. Table 12-8 ATN 950B board power consumption

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Board

Power Consumption

AND1CXPA/AND1CXPB

27.3 W

AND21CXPA

23.6 W

AND21CXPB/AND21CXPE

28.5 W

AND1EM4T

10.4 W

AND1EM8T

21.1 W

AND1EX1

13.1 W

AND1EM4F

12.0 W

AND1EM8F

18.9 W

AND2CQ1BAND2PQ1

11.50 W

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Board

Power Consumption

AND1ML1/AND1ML1A

13.1 W

AND3ML1A/AND3ML1B

9.5 W

AND2MD1A/AND2MD1B

12.1 W

TND1PIU

0.5 W

AND1FAN

l Low rate: 4.1 W l Medium rate: 13.6 W l High rate: 30 W

Table 12-9 provides the power consumption of ATN 910I. Table 12-9 Power consumption Model/Silkscreen

Power Supply

Interface

Power Consumption

ATN 910I AC

AC

4GE(O)+4GE/FE(O)+4GE/FE(E)

28.0 W

ATN 910I-C AC

AC

4GE(O)+4GE/FE(O)+4GE/FE(E)+16E1

32.8 W

ATN 910I DC

DC

4GE(O)+4GE/FE(O)+4GE/FE(E)

27.6 W

DC

4GE(O)+4GE/FE(O)+4GE/FE(E)+16E1

32.5 W

DC

4GE(O)+4GE/FE(O)+4GE/FE(E)+16E1

32.2 W

ATN 910I-TC DC

NOTE

ATN 910I boards are not swappable. Table 12-9 provides the power consumption of an integrated ATN 910I chassis.

Table 12-10 provides the power consumption of ATN 910B. Table 12-10 ATN 910B power consumption Model/Silkscreen

Power Supply

Interface

Power Consumption

ATN 910B-A

DC

2x10GE(O)+8GE/FE(O)+8FE/GE(E)+16E1

52.1 W

ATN 910B-B

DC

2x10GE(O)+16GE/FE(O)+8FE/GE(E)

49.8 W

NOTE

ATN 910B boards are not swappable. Table 12-10 provides the power consumption of an integrated ATN 910B chassis.

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12.4 Interface Specifications This chapter presents the list of Interface Specifications. NOTE

An ATN device does not directly provide optical interfaces. Instead, it provides optical modules, which support optical interfaces. Therefore, the optical interface specifications actually refer to the specifications of interfaces on optical modules on an ATN device.

12.4.1 Specifications of STM-1 Optical Interfaces FE Optical Module (commercial) Table 12-11 Technical specifications of the FE optical interface (two-fiber bidirectional) Item

Specification

Optical interface type

Two-fiber bidirectional interface 100BASE-FX

100BASE-FX

100BASE-FX

(15 km)

(40 km)

(80 km)

Encapsulation type

eSFP

eSFP

eSFP

Fiber type

Single-mode

Single-mode

Single-mode

Working wavelength range (nm)

1261 to 1360

1263 to 1360

1480 to 1580

Mean launched optical power (dBm)

-15 to -8

-5 to 0

-5 to 0

Receiving sensitivity (dBm)

-28

-34

-34

Minimum overload (dBm)

-8

-10

-10

Minimum extinction ratio (dB)

8.2

10

10

Optical module code

S4015755

S4015715

34060282

Table 12-12 Technical specifications of the GE optical interface (single-fiber bidirectional)

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Item

Specification

Optical interface type

LC, single-fiber bidirectional interface

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Item

12 Quick Reference

Specification 100BASE-FX

100BASE-FX

STM-1

STM-1

(15 km)

(10 km)

Encapsulation type

eSFP

eSFP

Fiber type

Single-mode

Single-mode

Working wavelength range (nm)

Tx: 1260 to 1360

Tx: 1480 to 1500

Rx: 1480 to 1500

Rx: 1260 to 1360

Mean launched optical power -15 to -8 (dBm)

-15 to -8

Receiving sensitivity (dBm)

-32

-32

Minimum overload (dBm)

-8

-8

Minimum extinction ratio (dB)

8.5

8.5

Optical module code

34060363

34060364

Usage description

Used together.

NOTE

A single-fiber bidirectional module receives and transmits optical signals using different working wavelength ranges over a single optical fiber. The receiving and transmitting working wavelength ranges of single-fiber bidirectional modules at both ends must match. As shown in Table 12-12, 34060363 and 34060364 are used together.

FE Optical Module (industry) Table 12-13 Technical specifications of the FE optical interface

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Item

Specification

Optical interface type

Two-fiber bidirectional interface 100BASE-FX

100BASE-FX

100BASE-FX

(15 km)

(40 km)

(80 km)

Encapsulation type

eSFP

eSFP

eSFP

Fiber type

Single-mode

Single-mode

Single-mode

Working wavelength range (nm)

1261 to 1360

1263 to 1360

1480 to 1580

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Item

Specification

Mean launched optical power (dBm)

-15 to -8

-5 to 0

-5 to 0

Receiving sensitivity (dBm)

-28

-34

-34

Minimum overload (dBm)

-8

-10

-10

Minimum extinction ratio (dB)

8.2

10

10

Optical module code

S4015755

S4015715

34060282

12.4.2 Specifications of FE Optical Interfaces FE Optical Module (commercial) Table 12-14 Technical specifications of the FE optical interface (two-fiber bidirectional)

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Item

Specification

Optical interface type

Two-fiber bidirectional interface 100BASE-FX

100BASE-FX

100BASE-FX

(15 km)

(40 km)

(80 km)

Encapsulation type

eSFP

eSFP

eSFP

Fiber type

Single-mode

Single-mode

Single-mode

Working wavelength range (nm)

1261 to 1360

1263 to 1360

1480 to 1580

Mean launched optical power (dBm)

-15 to -8

-5 to 0

-5 to 0

Receiving sensitivity (dBm)

-28

-34

-34

Minimum overload (dBm)

-8

-10

-10

Minimum extinction ratio (dB)

8.2

10

10

Optical module code

S4015755

S4015715

34060282

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Table 12-15 Technical specifications of the GE optical interface (single-fiber bidirectional) Item

Specification

Optical interface type

LC, single-fiber bidirectional interface 100BASE-FX

100BASE-FX

STM-1

STM-1

(15 km)

(10 km)

Encapsulation type

eSFP

eSFP

Fiber type

Single-mode

Single-mode

Working wavelength range (nm)

Tx: 1260 to 1360

Tx: 1480 to 1500

Rx: 1480 to 1500

Rx: 1260 to 1360

Mean launched optical power -15 to -8 (dBm)

-15 to -8

Receiving sensitivity (dBm)

-32

-32

Minimum overload (dBm)

-8

-8

Minimum extinction ratio (dB)

8.5

8.5

Optical module code

34060363

34060364

Usage description

Used together.

NOTE

A single-fiber bidirectional module receives and transmits optical signals using different working wavelength ranges over a single optical fiber. The receiving and transmitting working wavelength ranges of single-fiber bidirectional modules at both ends must match. As shown in Table 12-15, 34060363 and 34060364 are used together.

FE Optical Module (industry) Table 12-16 Technical specifications of the FE optical interface

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Item

Specification

Optical interface type

Two-fiber bidirectional interface 100BASE-FX

100BASE-FX

100BASE-FX

(15 km)

(40 km)

(80 km)

Encapsulation type

eSFP

eSFP

eSFP

Fiber type

Single-mode

Single-mode

Single-mode

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Item

Specification

Working wavelength range (nm)

1261 to 1360

1263 to 1360

1480 to 1580

Mean launched optical power (dBm)

-15 to -8

-5 to 0

-5 to 0

Receiving sensitivity (dBm)

-28

-34

-34

Minimum overload (dBm)

-8

-10

-10

Minimum extinction ratio (dB)

8.2

10

10

Optical module code

S4015755

S4015715

34060282

12.4.3 Specifications of GE Optical Interfaces FE/GE Optical Module (commercial) Table 12-17 Technical specifications of the FE/GE optical interface (single-fiber bidirectional)

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Item

Specification

Optical interface type

LC, single-fiber bidirectional interface 1000BASE-BX40-U

1000BASE-BX40-D

(40 km)

(40 km)

Encapsulation type

eSFP

eSFP

Fiber type

Single-mode

Single-mode

Working wavelength range (nm)

Tx: 1260 to 1360

Tx: 1480 to 1580

Rx: 1480 to 1580

Rx: 1260 to 1360

Mean launched optical power -3 to 2 (dBm)

-3 to 2

Receiving sensitivity (dBm)

-24

-24

Minimum overload (dBm)

-3

-3

Minimum extinction ratio (dB)

8

8

Optical module code

34060638

34060639

Usage description

Used together.

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NOTE

A single-fiber bidirectional module receives and transmits optical signals using different working wavelength ranges over a single optical fiber. The receiving and transmitting working wavelength ranges of single-fiber bidirectional modules at both ends must match. As shown in Table 12-17, 34060638 and 34060639 are used together.

GE Optical Module (commercial) Table 12-18 Technical specifications of the GE optical interface (two-fiber bidirectional)

Issue 01 (2013-10-31)

Item

Specification

Optical interface type

LC, two-fiber bidirectional interface 1000BASESX

1000BASELX

1000BASEVX

1000BASEZX

1000BASECWDM

(0.5 km)

(10 km)

(40 km)

(80 km)

(80 km)

Encapsulatio n type

eSFP

eSFP

eSFP

eSFP

eSFP

Fiber type

Multi-mode

Single-mode

Single-mode

Single-mode

Single-mode

Working wavelength range (nm)

770 to 860

1270 to 1360

1260 to 1360

1500 to 1580

For details, see wavelength allocation of 1000BASECWDM optical interfaces and related optical module code.

Mean launched optical power (dBm)

-9.5 to 0

-11 to -3

-5 to 0

-2 to 5

0 to 5

Receiving sensitivity (dBm)

-17

-19

-23

-23

-28

Minimum overload (dBm)

0

-3

-3

-3

-9

Minimum extinction ratio (dB)

9

9

9

9

8.2

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Item

Specification

Optical module code

34060286

34060473

S4016954

34060360

For details, see wavelength allocation of 1000BASECWDM optical interfaces and related optical module code.

Table 12-19 Wavelength allocation of 1000BASE-CWDM optical interfaces and related optical module code SN

Optical module code

Wavelength (nm)

SN

Optical module code

Wavelength (nm)

1

34060483

1464.5 to 1477.5

5

34060478

1544.5 to 1557.5

2

34060481

1484.5 to 1497.5

6

34060476

1564.5 to 1577.5

3

34060479

1504.5 to 1517.5

7

34060477

1584.5 to 1597.5

4

34060482

1524.5 to 1537.5

8

34060480

1604.5 to 1617.5

Table 12-20 Technical specifications of the GE optical interface (single-fiber bidirectional) Item

Specification

Optical interface type

LC, single-fiber bidirectional interface 1000BASEBX10-U

1000BASEBX10-D

1000BASEBX40-U

1000BASEBX40-D

1000BASEBX

1000BASEBX

(10 km)

(10 km)

(40 km)

(40 km)

(80 km)

(80 km)

Encapsulation type

eSFP

eSFP

eSFP

eSFP

eSFP

eSFP

Fiber type

Single-mode

Single-mode

Single-mode

Single-mode

Single-mode

Single-mode

Working wavelength range (nm)

Tx: 1260 to 1360

Tx: 1480 to 1500

Tx: 1260 to 1360

Tx: 1480 to 1500

Tx: 1260 to 1360

Tx: 1480 to 1500

Rx: 1480 to 1500

Rx: 1260 to 1360

Rx: 1480 to 1500

Rx: 1260 to 1360

Rx: 1480 to 1500

Rx: 1260 to 1360

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Item

Specification

Mean launched optical power (dBm)

-9 to -3

-9 to -3

-3 to 5

-3 to 5

-2 to 4

-2 to 4

Receiving sensitivity (dBm)

-19.5

-19.5

-23

-23

-26

-26

Minimum overload (dBm)

-3

-3

-3

-3

-3

-3

Minimum extinction ratio (dB)

6

6

6

6

9

9

Optical module code

34060470

34060475

34060539

34060540

34060595

34060596

Usage description

Used together.

Used together.

Used together.

NOTE

A single-fiber bidirectional module receives and transmits optical signals using different working wavelength ranges over a single optical fiber. The receiving and transmitting working wavelength ranges of single-fiber bidirectional modules at both ends must match. As shown in Table 12-20, 34060470 and 34060475 are used together, 34060595 and 34060596 are used together, and 34060539 and 34060540 are used together.

GE Optical Module (industry) Table 12-21 Technical specifications of the GE optical interface (two-fiber bidirectional)

Issue 01 (2013-10-31)

Item

Specification

Optical interface type

LC, two-fiber bidirectional interface 1000BASE-LX

1000BASE-VX

1000BASE-ZX

(10 km)

(40 km)

(80 km)

Encapsulation type

eSFP

eSFP

eSFP

Fiber type

Single-mode

Single-mode

Single-mode

Working wavelength range (nm)

1280 to 1350

1260 to 1360

1500 to 1580

Mean launched optical power (dBm)

-11 to -3

-5 to 3

-2 to 5

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Item

Specification

Receiving sensitivity (dBm)

–19

–23

–23

Minimum overload (dBm)

-3

-3

-3

Minimum extinction ratio (dB)

9

9

9

Optical module code

34060290

34060320

34060324

Table 12-22 Technical specifications of the GE optical interface (single-fiber bidirectional) Item

Specification

Optical interface type

LC, single-fiber bidirectional interface 1000BASE-BX10-U

1000BASE-BX10-D

(10 km)

(10 km)

Encapsulation type

eSFP

eSFP

Fiber type

Single-mode

Single-mode

Working wavelength range (nm)

Tx: 1260 to 1360

Tx: 1480 to 1500

Rx: 1480 to 1500

Rx: 1260 to 1360

Mean launched optical power -9 to -3 (dBm)

-9 to -3

Receiving sensitivity (dBm)

-19.5

-19.5

Minimum overload (dBm)

-3

-3

Minimum extinction ratio (dB)

6

6

Optical module code

34060644

34060676

Usage description

Used together.

NOTE

A single-fiber bidirectional module receives and transmits optical signals using different working wavelength ranges over a single optical fiber. The receiving and transmitting working wavelength ranges of single-fiber bidirectional modules at both ends must match. As shown in Table 12-22, 34060644 and 34060676 are used together.

Issue 01 (2013-10-31)

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12.4.4 Specifications of 10GE Optical Interfaces 10GE Optical Module (commercial) Table 12-23 Technical specifications of the 10GE optical interface

Issue 01 (2013-10-31)

Item

Specification

Optical interface type

LC, two-fiber bidirectional interface 10GE

10GE

10GE

(10 km)

(40 km)

(80 km)

10GE (CWDM)

10GE (DWDM)

10GE (DWDM)

(70 km)

(40 km)

(80 km)

Encapsulat ion type

XFP

XFP

XFP

XFP

TXFP

XFP

Fiber type

Singlemode

Singlemode

Singlemode

Singlemode

Singlemode

Singlemode

Working wavelengt h range (nm)

1310

1550

1550

For details, see wavelengt h allocation of 10GE (CWDM) optical interfaces and related optical module code.

1529.163 to 1560.606 (waveleng th tunable)

For details, see wavelengt h allocation of 10GE (DWDM) optical interfaces and related optical module code.

Mean launched optical power (dBm)

-6 to -1

-1 to 2

0 to 4

0 to 4

-1 to 2

-1 to 3

Receiving sensitivity (dBm)

-14.4

-15

-24

-24

-16

-24

Minimum overload (dBm)

0.5

-1

-7

-9

0

-9

Minimum extinction ratio (dB)

6

8.2

9

8

10.5

8.2

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Item

Specification

Optical module code

S4015772

S4015776

12 Quick Reference

S4015794

For details, see wavelengt h allocation of 10GE (CWDM) optical interfaces and related optical module code.

34060568

For details, see wavelengt h allocation of 10GE (DWDM) optical interfaces and related optical module code.

Table 12-24 Wavelength allocation of 1000BASE-CWDM optical interfaces and related optical module code SN

Optical module code

Wavelength (nm)

SN

Optical module code

Wavelength (nm)

1

34060547

1471

5

34060551

1551

2

34060548

1491

6

34060552

1571

3

34060549

1511

7

34060553

1591

4

34060550

1531

8

34060554

1611

Table 12-25 Wavelength allocation of 1000BASE-DWDM optical interfaces and related optical module code

Issue 01 (2013-10-31)

SN

Optical module code

Wavelength (nm)

SN

Optical module code

Wavelength (nm)

1

34060532

1529.55

9

34060531

1548.51

2

34060515

1530.33

10

34060514

1549.32

3

34060504

1531.12

11

34060502

1550.12

4

34060503

1531.90

12

34060501

1550.92

5

34060534

1532.68

13

34060533

1551.72

6

34060628

1533.47

14

34060625

1552.52

7

34060627

1534.25

15

34060624

1553.33

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SN

Optical module code

Wavelength (nm)

SN

Optical module code

Wavelength (nm)

8

34060626

1535.04

16

34060623

1554.13

12.4.5 Specifications of GE and FE Electrical Interfaces An ATN device supports GE and FE electrical interfaces. This section provides specifications of GE and FE electrical interfaces for quick reference. Table 12-26 and Table 12-27 list specifications of GE and FE electrical interfaces, respectively. Table 12-26 Specifications of the GE electrical interface Item

Specifications

Interface rate

10 Mbit/s, 100 Mbit/s and 1000 Mbit/s.

RJ-45 electrical interface

Complies with IEEE 802.3.

Table 12-27 Specifications of the FE electrical interface Item

Specifications

Interface rate

10 Mbit/s and 100 Mbit/s.

RJ-45 electrical interface

Complies with IEEE 802.3.

12.4.6 Specifications of E1 Electrical Interfaces Table 12-28 lists the specifications of the E1 interfaces. Table 12-28 Specifications of E1 interfaces Item

Specification

Nominal bit rate (kbit/s)

2048

Interface impedance

75 ohms 120 ohms

Issue 01 (2013-10-31)

Interface code

HDB3

Pulse waveform at the output interface

Complies with ITU-T G.703

Attenuation tolerance of the input interface at the point with a frequency of 1024 kHz (dB)

0 to 6

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Item

Specification

Anti-interference capability of the input interface

Complies with ITU-T G.703

Input jitter tolerance

Complies with ITU-T G.823

Output jitter

Complies with ITU-T G.823

12.4.7 Specifications of T1 Electrical Interfaces Table 12-29 lists the interface specifications of the T1. Table 12-29 Interface specifications of the T1 Item

Specification

Nominal bit rate

1544 kbit/s

Interface impedance

100 ohm

Code

B8ZS

Pulse shape at output port

Compliant with ITU-T G.703

Anti-interference capability of input port

Compliant with ITU-T G.703

Input jitter tolerance

Compliant with ITU-T G.824

Output jitter

Compliant with ITU-T G.824

12.4.8 Specifications of the ADSL2+ Interface Table 12-30 lists the specifications of the ADSL2+ interface. Table 12-30 Specifications of the ADSL2+ interfaces Interface

Max. Uplink Rate

Max. Downlink Rate

Max. Transmission Distance

ADSL2+

2.5 Mbit/s

24 Mbit/s

6.5 km

12.4.9 Specifications of the VDSL2 Interface Table 12-31 lists the specifications of the ADSL2+ interface. Issue 01 (2013-10-31)

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Table 12-31 Specifications of the VDSL2 interfaces Interface

Max. Uplink Rate

Max. Downlink Rate

Max. Transmission Distance

VDSL2

50 Mbit/s

100 Mbit/s

3.5 km

12.4.10 Specifications of the G.SHDSL Interface Table 12-32 and Table 12-33 list the specifications of the G.SHDSL interface. Table 12-32 Specifications of the interfaces on the AND1SHD4 Interface

Max. Upstream Rate

Max. Downstream Rate

Max. Four-Line Bundling Rate

Max. Transmission Distance

G.SHDSL

5.7 Mbit/s

5.7 Mbit/s

23 Mbit/s

5.25 km

Table 12-33 Specifications of the interfaces on the AND1SHD4I

Issue 01 (2013-10-31)

Interface

Max. Upstream Rate (Mbit/s)

Max. Downstream Rate (Mbit/s)

Max. Rate of Four Bundled Interfaces (Mbit/s)

Max. Transmission Distance (km)

G.SHDSL

2.3

2.3

9.2

5.25

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A

A Acronyms and Abbreviations

Acronyms and Abbreviations

A AC

Alternating Current

ADSL

Asymmetric Digital Subscriber Line

ADSL2+

Asymmetric Digital Subscriber Line 2 Plus

APS

Automatic Protection Switching

ATM

Asynchronous Transfer Mode

B BFD

Bidirectional Forwarding Detection

BITS

Building Integrated Timing Supply

C CAR

Committed Access Rate

CBR

Constant Bit Rate

CC

Continuity Check

CES

Circuit Emulation Service

D

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DC

Direct Current

DCN

Data Communication Network

DDF

Digital Distribution Frame

DIP

Dual In-line Package

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A Acronyms and Abbreviations

E EFM

Ethernet in the First Mile

ESD

ElectroStatic Discharge

eSFP

Enhanced Small Form-factor Pluggable

ETSI

European Telecommunications Standards Institute

F FE

Fast Ethernet

G GE

Gigabit Ethernet

GND

Ground

GRE

Generic Routing Encapsulation

H HDB3

High Density Bipolar of order 3 code

I IEEE

Institute of Electrical and Electronics Engineers

IMA

Inverse Multiplexing over ATM

IMB

Indoor Mini Box

IP

Internet Protocol

ITU-T

International Telecommunication Union-Telecommunication standardization sector

L L3VPN

Layer 3 Virtual Private Network

M

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MLPPP

Multi-Link Point-to-Point Protocol

MPLS

MultiProtocol Label Switching

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A Acronyms and Abbreviations

N NCP

Network Control Protocol

NNI

Network Node Interface

NQA

Network Quality Analysis

NTP

Network Time Protocol

O OAM

Operation, Administration and Maintenance

ODF

Optical Distribution Frame

P PW

Pseudo Wire

PWE3

Pseudo Wire Emulation Edge-to-Edge

R rt-VBR

real-time Variable Bit Rate

S SDH

Synchronous Digital Hierarchy

SFP

Small Form-factor Pluggable

SHDSL

Single-pair High-speed Digital Subscriber Line

STM-1

Synchronous Transport Module level 1

U UBR

Unspecified Bit Rate

UBR+

Unspecified Bit Rate plus

UNI

User Network Interface

X xDSL

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x Digital Subscriber Line

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