50-ME30-PRO-014-O Manufacturing Engineering Equipment and Tooling Buy-Off

50-ME30-PRO-014-O Manufacturing Engineering Equipment & Tool BuyOf Work Instruction

Re v

Designation

Approver

Approval Signature

Sign Date

ME

KC Low

Signed

14-Sep-16

TE

Tue Hieu

Signed

14-Sep-16

IE

Quang Hung

Signed

13-Sep-16

QE

KL Soo

Signed

18-Sep-16

FC

Dat Bui

Signed

13-Sep-16

EHS

Triet Thieu

Signed

13-Sep-16

Release date

Originato

Change Details

r -

F

18-Jul-13

Viet Nguyen

Remove Site document 50-ME40-PRO-014-006 Wave solder pallet design guideline.

-

Follow Global document 00-ME20-1000-008 Global

-

Design of Wave Solder Fixture Add in Item : 8.5 “Inspection Template Buy-off”

-

Rename this document from “Line, Equipment and Tooling Buy-Off” to “Manufacturing Engineering

G

22-Aug-13

Thang Hoang

Equipment & Tool Buy-Off” -

Remove Process Flow,8.6,8.7 and all relevant Line buyoff and Equipment registration instructions

-

Add new Stencil Buy-off requirements in 8.3.4, 8.3.5, 8.3.6, 8.3.7 and 8.3.8.

H

I

19-Feb-14

18-Jul-14

J

8-Aug-14

K

27-Aug-14

Tien Tran

-

Restructure the entire document. Updated 8.4 Wave Fixture Buy-off

-

Added” 50-ME80-PRO-014-012” into 9.0 &10.0

-

Added” 50-ME80-PRO-014-013” into 10.0

-

Added measurement tool calibration-verification

Elwood Gacayan

instruction on 8.2.1 -

Added 50-ME-80-PRO-014-014 into 8.2.2.5, 9.0 & 10.0

-

Modify section 8.2.1. Add in Lead free and leaded

Nguyen Vuong

-

identification requirement. Add 8.3 PCB Assembly Line Equipment Qualification

Nguyen

-

Add 50-ME80-PRO-014-015 PCB Assembly Line

Vuong

Equipment Qualification Template -

Add 50-ME80-PRO-014-016 PCB Assembly Line

Jabil Proprietary and Confidential – All rights reserved Printed copies are Reference only Page 1 of 25

50-ME30-PRO-014-O Manufacturing Engineering Equipment & Tool BuyOf Work Instruction Equipment Qualification Plan Template L

05-Feb-15

flowchart to Section 7

Thang

- Add 8.3.8 PCB Assembly Line Equipment Qualification

Hoang

Instruction -

M

N

10-Apr-15

07-Mar-16

Tam Le

Vu Lai

Move PCB Assembly Line Equipment Qualification

- Add 8.4.7 to clarify the lifespan of new stencil Add in reference document : 00-ME20-00004 Global Design Of Press Fit Fixture in section 5.6.

-

Add in PressFit Tool Buy-off in section 8.5

-

Add Pressfit Tool Buy-off Checklist in section 10. Update section 5

-

Add in ING requirement for section 8.4.4 Update section 2.4

-

Update section 3.0 for SIS700 defination

-

Add in 7.2 Stencil Buy-off and Verification Process

-

Update 8.4.3 to require stencil aperture check during buyoff - Add in VA 50-ME40-PRO-014-023 Stencil Inspection System Operating Instruction

O

22-Sep-16

Vu Lai

Add in 8.4.4 to require stencil aperture check after 30000 or 60000 squeegee times

-

Add in 8.4.5 to require calibration and verification for SIS700

-

Add in section 8.8

for Tool/Jig/Fixture Buy-Off.

+ Create VA 50-ME40-PRO-014-022 Jig And Fixture PM Instruction + Create checklist 50-ME80-PRO-014-023 Jig And Fixture PM Checklist. Update section 9.0, 10.0 to cover 50-ME40-PRO-014-022 and 50-ME80-PRO-014-023 1.0PURPOSE 1.1 The purpose of this work instruction is to define process flow and handling method for new process and equipment buy off before releasing to production. 1.2 To minimize incident and accident that may cause by equipment. 1.3 To reduce risk or hazard to personal safety and health or impact to the environment. Jabil Proprietary and Confidential – All rights reserved Printed copies are Reference only Page 2 of 25

50-ME30-PRO-014-O Manufacturing Engineering Equipment & Tool BuyOf Work Instruction 2.0 SCOPE 2.1 This work instruction covers to buy-off all ME, IE equipment & tools, directly or indirectly used to produce a product in Jabil Vietnam. 2.2 This work instruction NOT cover to Jig/Fixture and equipment buy-off for Testing Engineering Department (such as: ICT, FVT, AOI…). 2.3 For Test equipment and test fixture refer to # 50-TE30-INS-002 Test Equipment and Fixture Work Instruction. 2.4 This document shall not be altered without the approval from the following affected functions/work cells: QE, IE, TE, ME, Facilities. 3.0

DEFINITION/ TERMINOLOGY

3.1 Equipment (machine) is defined as any structure consisting of a framework and various fixed and moving parts, for which is doing some kind of mechanism. 3.2 Equipment (machine) owner is defined as any engineer or officer who request and has responsibility over the machine operation. 3.3 NRE

Non Recurring Expenses

3.4 Jabil Own

Own Purchase/ Fabricate by Jabil Vietnam or Transfer from another site.

3.5 Assessment Team - Work cell member, Safety Officer, ESD Coordinator, PM coordinator 3.6 EOL

End of Line

3.7 DCC

Document Control Center

3.8 QACA Quality Assurance Calibration Administrator 3.9 Tools

Include as: Jig, Fixture use for SMT or Box build area, SMT, Wave, Wash

pallet, inspection template, plastic tool / mold & metal tool/ stamping and another equipment support production. 3.10Stencil

Refers to the entire assembly consisting of frame, metal mask, and

polyester mounting mesh. 3.11

ME

Manufacturing Engineering.

3.12

IE

Industrial Engineering.

3.13

PM

Preventive Maintenance.

3.14

Cleaning operators who will perform cleaning, check tension for stencil and do PM for

pallet . 3.15 4.0

SIS700

Stencil Inspection System 700

TRAINING Jabil Proprietary and Confidential – All rights reserved Printed copies are Reference only Page 3 of 25

50-ME30-PRO-014-O Manufacturing Engineering Equipment & Tool BuyOf Work Instruction 4.1

Required all employees in ME,IE departments should be trained to this document.

4.2

This document should be trained upon hire and subsequent revision change.

5.0

REFERENCE DOCUMENTS

5.1 50-QE30-PRO-020 50-ME30-PRO-011

-

Site ESD Control Process Site Equipment Control

5.3 00-MT20-1000-008

-

Jabil Production Part Approval process

5.4 00-ME20-1000-008

-

Global Design of Wave Solder Fixture

5.5 00-ME20-00004

-

Global Design Of Press Fit Fixture

5.6 00-ME20-00003

-

Global PCB Assembly Line Equipment Qualification

5.7 EX-IG-105

-

Stencil & Stencil Aperture Management SAP Guidelinesv3

6.0

RESPONSIBILITY

6.1 It is the responsibility of the Manager or Engineer who takes the ownership of the equipment for ensuring that it is safe to operate as well as meet the requirement. 6.2 It is the responsibility of the equipment/ tool owner to ensure the equipment/ tool has been properly set up, fully operational and has been approved by the assessment team before release for production use. QE Workcell and WCM is responsibility to validate new line setup and approve before run production. 6.3 The relevant owner of the equipment/tool shall be required to adhere to the decision made by the Assessment Team taking necessary steps or precautions to achieve the best safety, health and environment standards and benefits for the company and the employees. 6.4 Equipment/tool owner shall prepare the document to buy-off. Equipment/tool owner also shall evaluate the performance of the equipment/tool. 6.5 QACA shall verify all documents buy-off provided by owner with full people signed and issue stamp “Accepted for use” for equipment/tool. 6.6 QACA shall ensure the equipment/ tool performed PM/Calibration on time. 6.7 It shall be the responsibility of Facility Engineer to supply utilities for effective operation of equipment/ tool. These include light, electricity, ventilation, air conditioning, and heated DI water. 7.0 PROCESS FLOW 7.1

PCB Assembly Line Equipment Qualification Flowchart

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50-ME30-PRO-014-O Manufacturing Engineering Equipment & Tool BuyOf Work Instruction

7.1

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50-ME30-PRO-014-O Manufacturing Engineering Equipment & Tool BuyOf Work Instruction 7.2

Stencil Buy-of and Verification Process

Start

No New Stencil or Stencil reached 30000 or 60000 squeegee times

Yes

Stencil set up on SIS700

Select vision magnification

Perform aperture check

No Quarantine stencil for ME disposition

Pass?

Yes

Record in eStencil and Endorse for production use

END Jabil Proprietary and Confidential – All rights reserved Printed copies are Reference only Page 6 of 25

50-ME30-PRO-014-O Manufacturing Engineering Equipment & Tool BuyOf Work Instruction 8.0

INSTRUCTION

8.1 Set-up for equipment/tool 8.1.1

Engineer is responsible for receive the equipment/ tool from vendor through purchase, transfer from another site or lent/ consigned to the site by customer.

8.1.2

Equipment/tool owner shall be labeled with the “Under Engineering Evaluation” or Under Set up” sign and remove only when all of that is completed.

8.1.3

Engineers responsible for the set-up equipment/tool correctly the location and notify to Facility engineer supply correct the electric power, air pressure, ventilation.

8.2 Equipment/ tool buy-off 8.2.1

Equipment/ tool owners shall ensure technical and safety requirement for the process and ensure buy-off process has been implemented. Equipment/Tool shall be subject for PM, Verification or Calibration. Customized fabricated measuring tools such as slip gauge and go no go jigs and same purpose tooling, after buy-off are subject for verification every 6 months. Any new equipment / tool brought in should be identified for Lead free or Leaded application & visible markings should be available on the equipment / tool. _Lead Free identification :

8.2.2

Each equipment/tool have required specific technical follow process request but not limited to and if applicable, attach below should be used as acceptance criteria: 8.2.2.1

Equipment Cpk evaluate (Cpk > 1.33) application for all SMT machines (such as: printer, pick &place, Reflow, Wave). And the Cpk data shall attached in evaluation result follow specific format for each equipment/ tool. Evaluation Cpk also need to perform after relocation/re-layout line or moved the machine.

8.2.2.2

Equipment GR&R, strain gauge test(if applicable).

8.2.2.3

Equipment buy-off checklist (50-ME80-PRO-014-003).

8.2.2.4

Tool buy-off Checklist (50-ME80-PRO-014-001).

8.2.2.5

Measurement Tool Verification (50-ME80-PRO-014-014).

8.2.2.6

EH&S Buy-off checklist (50-ME80-PRO-011-006).

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50-ME30-PRO-014-O Manufacturing Engineering Equipment & Tool BuyOf Work Instruction 8.2.3

Equipment/ tool after evaluated need to ensure that it is safe to operate and ESD compliances.

8.2.4

Equipment / tool owner is responsible for trained and qualified personnel should use equipment / tool.

8.2.5

Assessment team for equipment/ tool buy-off- QA Engineer, Production supervisor, ESD coordinator, Safety officer and PM coordinator are responsible verify or precautions to achieve the best safety, health and environment standards, ESD compliances….

8.2.6

Spare part 8.2.6.1

For spare part inventory: after finished equipment / tool buy-off, the equipment/tool owners should be key in ME storecontrol.xlsx file as the link: \\Hcmfile01\1.all_depts\5.ME\ME_Public\01.PLANT\13.ME Store. The spare parts for each equipment/tools control and stock in ME store.

8.2.6.2

For spare part control: Spare part coordinator are responsible for import and export part in ME store. The instruction spare part controls refer to # 50-ME40PRO-014-009 Spare Part Control Guideline.

8.3

PCB Assembly Line Equipment Qualification 8.3.1

Screen Printing Equipment: 8.3.1.1

Solder paste screen printing equipment is used to apply solder paste onto PCBs through a metal stencil cut with a pattern of apertures. Solder paste is a material consisting primarily of the metals and fluxes necessary to create the mechanical and electrical connections between the PCB and components subsequently placed onto a PCB.

8.3.1.2

Qualifying screen printing equipment entails establishing through objective evidence key aspects of the equipment installation and operation adhere to the manufacturer’s regulatory

approved

requirements.

specifications, This

is

Jabil's

accomplished

requirements

and

by

review

a

careful

local of

manufacturer documentation and Jabil procedures and work instructions. All system operations are to be verified prior to performing a final equipment capability study. 8.3.1.3

The purpose of a screen printer capability study is to ensure the equipment can repeatedly deposit material in the proper location across the range of parameter settings expected during production. The primary measurable identified for determining capability is the registration (X-Y axis) of the print deposits. Additional characteristics include deposit volume, area and average height. These additional characteristics are primarily a function of the stencil, squeegee blades and parameter settings and as such may not directly represent the

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50-ME30-PRO-014-O Manufacturing Engineering Equipment & Tool BuyOf Work Instruction mechanical capability of the screen printer across stencils, etc. The key equipment parameters identified for the basis for the screen printing equipment capability study are: _Squeegee Print Speed _Squeegee Print Force Separation _Speed of the stencil from the PCB 8.3.1.4. The site qualification team may evaluate additional equipment parameters if desired however, baring engineering rational for exclusion, the equipment parameters listed here are to be included. 8.3.1.5

The capability study will evaluate the range including the upper and lower settings, for all three parameters. Most production screen printing program settings should fall within these identified limits. If a particular screen printer is required to function at settings outside of identified limits, then the required high and low settings must be used for the equipment capability study (Ex: parameter settings are to be changed to account for environmental variation.)

8.3.1.6

For screen printing, information gathered in the equipment capability study can be suitable for establishing initial process controls. If Statistical Process Control (SPC) sampling is used in instead of 100% automated inspection, nominal runs from the equipment capability are available as first entries to a proposed SPC chart. The nominal runs used on an SPC chart must be in SPC control for use as baseline data. If the nominal runs are not in SPC control, an investigation must be performed and appropriate action must be based on the results of the investigation. Consult an SPC expert for assistance.

8.3.1.7

There is no requirement for regularly scheduled re-qualifications. Ongoing verification through subsequent inspection/testing or process controls are then required to ensure consistent operation and identify the need to address equipment issues. Qualification is required upon Equipment Qualification Trigger as defined in this document if the process is not fully verified through subsequent inspection or testing. Ongoing verification of screen printing process output can be accomplished by either/or Automated Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), Visual Inspection, X-Ray Inspection and ICT / Functional Evaluation. Process controls require a minimum verification of the first front stroke and first back stroke of each run on a paste inspection system.

8.3.1.8

Refer to Template : 50-ME80-PRO-014-015 PCB Assembly Line Equipment Qualification Template

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50-ME30-PRO-014-O Manufacturing Engineering Equipment & Tool BuyOf Work Instruction 8.3.2

Component Placement Equipment: 8.3.2.1

Component placement equipment is programmed to pick up and place components onto a PCB at predetermined locations. The equipment picks components from different types of carrier media such as reels, trays or a tube containing the component. The equipment then uses an automated camera vision system to align the component (X-Y axis, Theta rotation) and places the component in the desired location.

8.3.2.2

Qualifying component placement equipment entails establishing through objective evidence all key aspects of the equipment installation and operation adhere to the manufacturer’s approved specifications, Jabil's requirements and local regulatory requirements. This is accomplished by a careful review of manufacturer documentation and Jabil procedures and work instructions. All system operations are to be verified prior to performing a final equipment capability study.

8.3.2.3

The purpose of a component placement capability study is to ensure the equipment can repeatedly place components in the proper location across the range of parameter settings expected to be used during production. The primary measurable identified for determining capability is the X-Y axis placement of components. An additional characteristic is the component rotation. Commonly referred to as “Theta”, rotation is most critical for high precision placement of critical components (Ex: fine pitch leaded components, ball grid array component). Thus if the equipment is not identified for high precision placement, Theta rotation may be considered less critical. Rotation information is typically available along with X and Y axis rotation and can be useful to maintain. The key equipment parameters identified for the basis for the component placement equipment capability study are: _Placement Speed (per Component Precision)

8.3.2.4

The site qualification team may evaluate additional equipment parameters if desired however, baring engineering rational for exclusion, the equipment parameters listed here are to be included.

8.3.2.5

The capability study will evaluate the upper speed at which the equipment will run with a representative of the precision of components typically placed using the equipment. The placement speed settings for high precision parts are typically lower than placement speeds for low precision parts. If the equipment will place both low and high precision parts, then representative low precision parts (Ex: 0402 resistors) are to be placed at high speed for low precision parts and a representative high precision parts (Ex: 100 pin TQFP) are to be placed at

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50-ME30-PRO-014-O Manufacturing Engineering Equipment & Tool BuyOf Work Instruction high speed for high precision parts. For either low or high precision part type, the speed setting should test the upper limit seen in production. Most production placement program settings should fall within these equipment speed limits. If particular placement equipment is required to run at settings above the previously indicated component speed limit, then the required high settings must be used for the equipment capability study. 8.3.2.6

For placement equipment, information gathered in the equipment capability study can be suitable for establishing initial process controls. Placement equipment typically have onboard-self monitoring of miss registration on nozzle and miss pickups which are valuable tools to monitor performance trends. Component

registration

monitoring

involves

measurement

typically

best

obtained by Automated Optical Inspection (AOI) systems. If SPC sampling is used instead of 100% automated inspection, nominal runs from the equipment capability are available as first entries to a proposed SPC chart. The nominal runs used on an SPC chart must be in SPC control for use as baseline data. If the nominal runs are not in SPC control, an investigation must be performed and appropriate action must be based on the results of the investigation. Consult an SPC expert for assistance. 8.3.2.7

There is no requirement for regularly scheduled re-qualifications. Ongoing verification through subsequent inspection/testing or onboard equipment process monitoring controls are required to ensure consistent operation and identify the need to address equipment issues. Qualification is required upon Equipment Qualification Trigger as defined in this document if the process is not fully verified through subsequent inspection or testing. Ongoing verification of component placement process output can be accomplished by either/or Automated Optical Inspection (AOI), Visual Inspection, X-Ray Inspection and ICT / Functional Evaluation.

8.3.2.8

Refer to Template : 50-ME80-PRO-014-015 PCB Assembly Line Equipment Qualification Template

8.3.3

Oven Reflow Equipment 8.3.3.1

Reflow ovens follow the end of the surface mount technology process and form electrical connections between the PCB surface terminations and placed electrical components. Prior to reaching the reflow oven, a PCBA receives an application of solder paste to the electrical connection lands. An electrical component, such as a resistor or BGA, is then placed on top of the solder paste. A reflow oven consists of a conveyor system on which the PCBA are moved through multiple heating zones and a final cooling zone. The zones apply

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50-ME30-PRO-014-O Manufacturing Engineering Equipment & Tool BuyOf Work Instruction increasing levels of heat to the populated PCBA. As the temperature rises, solder paste is liquefied and then cooled until the liquid solder is solidified forming a solder joint connection between the PCB land and component termination. 8.3.3.2

Qualifying reflow oven equipment entails establishing through objective evidence key aspects of the equipment installation and operation adhere to the manufacturer’s

approved

specifications,

Jabil's

requirements

and

local

regulatory requirements. This is accomplished by careful review of manufacturer documentation

and

Jabil

procedures

and

work

instructions.

All

system

operations are to be verified prior to performing a final equipment capability study. 8.3.3.3

The purpose of a reflow oven capability study is to ensure the equipment can repeatedly provide a temperature over time profile across the range of parameter settings expected to be used during production. The primary measurable identified to determine capability is the temperature consistency per oven zone. Additional characteristics include temperature slope, soak temperature, peak temperature and Time Above Liquidus (TAL) however these characteristics are unique to a particular product reflow profiles. The key equipment parameters identified for the basis for the reflow oven equipment capability study are: _Conveyor Speed _Zone Temperature

8.3.3.4

The site qualification team may evaluate additional equipment parameters if desired however, baring engineering rational for exclusion, the equipment parameters listed here are to be included.

8.3.3.5

The capability study will evaluate the high and low zone temperatures and conveyor speeds in both a high and low thermal loading scenario. Thermal loading simulates situations where the amount of product within oven at one point of time may affect the environment by lowering zone temperatures. Most production reflow profile settings should fall within the identified study limits. If a particular temperature profile is required to run at settings outside of these limits, then the required profile high and low settings must be used for the equipment capability study.

8.3.3.6

For reflow ovens, information gathered in the equipment capability study can be used for establishing initial process controls. Studies can then be repeated on a consistent basis to monitor performance. If SPC sampling is used instead of 100% onboard monitoring, runs from the equipment capability are available as

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50-ME30-PRO-014-O Manufacturing Engineering Equipment & Tool BuyOf Work Instruction first entries to a proposed SPC chart. The nominal runs used on an SPC chart must be in SPC control for use as baseline data. If the nominal runs are not in SPC control, an investigation must be performed and appropriate action must be based on the results of the investigation. Consult an SPC expert for assistance. Onboard monitoring systems are preferred to sampling as these systems provide data relevant to individual profiles as well as traceability. 8.3.3.7

There is no requirement for regularly scheduled re-qualifications, process control is to be used to ensure consistent operation and identify the need for requalification. Qualification is required upon Equipment Qualification Trigger as defined in this document if the process is not fully verified through subsequent inspection or testing. Ongoing verification of the reflow oven process output can be accomplished by either/or Onboard monitoring systems, X-Ray Inspection and ICT / Functional Evaluation.

8.3.3.8

Refer to Template : 50-ME80-PRO-014-015 PCB Assembly Line Equipment Qualification Template

8.3.4

Wave Solder Equipment: 8.3.4.1

Wave solder equipment is used to solder through-hole components after the SMT reflow process. Though-hole components, such as connectors, LEDs or large capacitors, have leads which pass though the PCB and within copper barrels know as Plated Through Holes (PTH). The PCB, with the through-hole components inserted, enters the wave solder process on a conveyor. The PCB passes through a flux application unit (spray, foam or prior selective spray) followed by a heating zone. The zones apply increasing levels of heat to the previously populated PCBA. After heating, the PCBA immediately passes over a cascading bath of molten solder. The molten solder then wicks up the protruding leads and copper barrels forming a connection between the component lead and barrel.

8.3.4.2

Qualifying wave solder equipment entails establishing through objective evidence key aspects of the equipment installation and operation adhere to the manufacturer’s

approved

specifications,

Jabil's

requirements

and

local

regulatory requirements. This is accomplished by careful review of manufacturer documentation

and

Jabil

procedures

and

work

instructions.

All

system

operations are to be verified prior to performing a final equipment capability study. If a separate selective flux spray unit is position prior to the solder equipment, the selective spray unit is considered part of the equipment and is not excluded from the wave solder equipment qualification 8.3.4.3

The purpose of a wave solder capability study is to ensure the equipment can

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50-ME30-PRO-014-O Manufacturing Engineering Equipment & Tool BuyOf Work Instruction repeatedly provide flux coverage, temperature over time profiles and consistent solder temperature across the range of parameter settings expected to be used during production. The primary items identified to determine capabilities are the flux spray coverage consistency, conveyor speed, temperature consistency per oven

zone

and

temperature

consistency

of

the

solder

pot.

Additional

characteristics include temperature slope, soak temperature, peak temperature and solder contact time however these characteristics are unique to a particular product wave solder profiles. The key equipment parameters identified for the basis for the wave solder equipment capability study are: _Flux Coverage _Conveyor Speed _Zone Temperature _Solder Pot Temperature 8.3.4.4

The site qualification team may evaluate additional equipment parameters if desired however, baring engineering rational for exclusion, the equipment parameters listed here are to be included.

8.3.4.5

The capability study will evaluate flux coverage, the high and low zone temperatures, conveyor speeds and solder pot temperatures. If a separate selective spray unit is position prior to the solder equipment, the selective spray unit is considered part of the equipment and is not excluded from the selective solder equipment qualification. Most production reflow profile settings should fall within the identified study limits. If a particular temperature profile is required to run at settings outside of these limits, then the required high and low settings must be used for the equipment capability study.

8.3.4.6

For wave solder equipment, information gathered in the equipment capability study can be used for establishing initial process controls. Studies can then be repeated on a consistent basis to monitor performance. If SPC sampling is used, runs from the equipment capability are available as first entries to a proposed SPC chart. The nominal runs used on an SPC chart must be in SPC control for use as baseline data. If the nominal runs are not in SPC control, an investigation must be performed and appropriate action must be based on the results of the investigation. Consult an SPC expert for assistance.

8.3.4.7

There is no requirement for regularly scheduled re-qualifications. Ongoing verification through subsequent inspection/testing or process controls are then required to ensure consistent operation and identify the need to address equipment issues. Qualification is required upon Equipment Qualification Trigger

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50-ME30-PRO-014-O Manufacturing Engineering Equipment & Tool BuyOf Work Instruction as defined in this document if the process is not fully verified through subsequent inspection or testing. Ongoing verification of wave solder process output can be accomplished by either/or Automated Optical Inspection (AOI), Visual Inspection, X-Ray Inspection and ICT / Functional Evaluation 8.3.4.8

Refer to Template : 50-ME80-PRO-014-015 PCB Assembly Line Equipment Qualification Template

8.3.5

Selective Solder Equipment 8.3.5.1

Similar to Wave Solder equipment, selective solder equipment is used to solder through-hole

components

after

the

SMT

reflow

process.

Though-hole

components, such as connectors, LEDs or large capacitors, have leads which pass though the PCB and within PTH’s. The PCB, with the through hole components inserted, enters the selective solder process on a conveyor. The PCB passes through a spray flux application unit followed by a heating zone. Upon leaving the heating zone, a small solder pot with a nozzle travels to preprogrammed locations and applies a fountain of molten solder. The molten solder then wicks up the protruding leads and copper barrels forming a connection between the component lead and barrel. There may be multiple solder pots within the equipment to qualify. In addition, units may employ a multi-chimney which simultaneously solders multiple locations. 8.3.5.2

Qualifying selective solder equipment entails establishing through objective evidence key aspects of the equipment installation and operation adhere to the manufacturer’s

approved

specifications,

Jabil's

requirements

and

local

regulatory requirements. This is accomplished by careful review of manufacturer documentation

and

Jabil

procedures

and

work

instructions.

All

system

operations are to be verified prior to performing a final equipment capability study. If a separate selective spray unit is position prior to the solder equipment, the selective spray unit is considered part of the equipment and is not excluded from the selective solder equipment qualification. 8.3.5.3

The purpose of a selective solder capability study is to ensure the equipment can repeatedly provide flux coverage, temperature over time profiles and consistent solder temperature across the range of parameter settings expected to be used during production. The primary items identified to determine capabilities

are

the

flux

spray

coverage

consistency,

the

temperature

consistency per oven zone and temperature consistency of the solder pot. Additional characteristics include temperature slope and peak temperature however these characteristics are unique to a particular product selective solder profiles. The key equipment parameters identified for the basis for the selective Jabil Proprietary and Confidential – All rights reserved Printed copies are Reference only Page 15 of 25

50-ME30-PRO-014-O Manufacturing Engineering Equipment & Tool BuyOf Work Instruction solder equipment capability study are: _Flux Coverage _Zone Temperature _Solder Pot Temperature _Dwell Time 8.3.5.4

The site qualification team may evaluate additional equipment parameters if desired however, baring engineering rational for exclusion, the equipment parameters listed here are to be included.

8.3.5.5

The capability study will evaluate flux coverage, evaluate the high and low zone temperatures, solder pot temperatures, and dwell time over nozzle. Dwell time over nozzle is a function of preprogrammed time as well as X-Y axis alignment. Most production reflow profile settings should fall within the identified study limits. If a particular temperature profile is required to run at settings outside of these limits, then the required high and low settings must be used for the equipment capability study.

8.3.5.6

For selective solder equipment, information gathered in the equipment capability study can be used for establishing initial process controls. Studies can then be repeated on a consistent basis to monitor performance. If SPC sampling is used, runs from the equipment capability are available as first entries to a proposed SPC chart. The nominal runs used on an SPC chart must be in SPC control for use as baseline data. If the nominal runs are not in SPC control, an investigation must be performed and appropriate action must be based on the results of the investigation. Consult an SPC expert for assistance.

8.3.5.7

There is no requirement for regularly scheduled re-qualifications. Ongoing verification through subsequent inspection/testing or process controls are then required to ensure consistent operation and identify the need to address equipment issues. Qualification is required upon Equipment Qualification Trigger as defined in this document if the process is not fully verified through subsequent inspection or testing. Ongoing verification of wave solder process output can be accomplished by either/or Automated Optical Inspection (AOI), Visual Inspection, X-Ray Inspection and ICT / Functional Evaluation

8.3.5.8

Refer to Template : 50-ME80-PRO-014-015 PCB Assembly Line Equipment Qualification Template

8.3.6

Inline Wash Equipment: 8.3.6.1

Inline wash equipment is typically placed at the end of automated PCB assembly lines in order to remove flux residues prior to evaluations such as functional test

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50-ME30-PRO-014-O Manufacturing Engineering Equipment & Tool BuyOf Work Instruction and further mechanical additions. PCBAs travel through the wash on a conveyor belt and are pressure sprayed by temperature controlled jets of de-ionized water with cleaning medium. After leaving the wash zones of the equipment, PCBs pass under high pressure air driers to remove the majority of water. Failure of an inline wash process has lead to latent field failures via dendritic growth 8.3.6.2

Qualifying inline wash

equipment

entails establishing through objective

evidence key aspects of the equipment installation and operation adhere to the manufacturer’s

approved

specifications,

Jabil's

requirements

and

local

regulatory requirements. This is accomplished by careful review of manufacturer documentation

and

Jabil

procedures

and

work

instructions.

All

system

operations are to be verified prior to performing a final equipment capability study 8.3.6.3

The purpose of an inline wash capability study is to ensure the equipment can repeatedly provide a temperature over time profile across the range of parameter settings expected to be used during production. The primary measurable identified to determine capability is the temperature consistency per

wash

zone.

Additional

characteristics

include

contamination

levels,

temperature slope, soak temperature however these characteristics are unique to a particular incoming contamination levels or product wash profiles. The key equipment parameters identified for the basis for the Inline Wash equipment capability study are: _Conveyor Speed _Zone Temperature 8.3.6.4

The site qualification team may evaluate additional equipment parameters if desired however, baring engineering rational for exclusion, the equipment parameters listed here are to be included.

8.3.6.5

The capability study will evaluate the high and low zone temperatures and conveyor speeds. Most production wash profile settings should fall within the identified study limits. If a particular wash profile is required to run at settings outside of these limits, then the required high and low settings must be used for the equipment capability study.

8.3.6.6

Ionic Contamination meter data does not provide sufficient information to justify equipment capability. Ionic Contamination meters provide a reading of the surface contamination only, not contamination trapped under low profile parts. Alternative approaches include the use of ionic chromatography testing or Conductivity Testing of C3 extractions. Ion chromatography data may be used to

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50-ME30-PRO-014-O Manufacturing Engineering Equipment & Tool BuyOf Work Instruction characterize

the

wash

Conductivity

Testing.

process

Where

and

followed

with

process

control

via

contamination level analysis is additionally

evaluated during wash qualification, be aware the product/process itself may not produce sufficient contamination to alarm to a malfunctioning or inadequate wash process. Refer to the PCB Assembly Line Equipment Qualification Template 8.3.6.7

For inline wash equipment, information gathered in the capability study can be used for establishing initial process controls. Studies can then be repeated on a consistent basis to monitor performance. If SPC data sampling is used, runs from the equipment capability are available as first entries to a proposed equipment SPC chart. The nominal runs used on an SPC chart must be in SPC control for use as baseline data. If the nominal runs are not in SPC control, an investigation must be performed and appropriate action must be based on the results of the investigation. Consult an SPC expert for assistance. Alternatively, product may be monitored using ionic contamination meters (or similar) to measure the outgoing cleanliness with results charted.

8.3.6.8

There is no requirement for regularly scheduled re-qualifications. Ongoing verification through subsequent inspection/testing or process controls are then required to ensure consistent operation and identify the need to address equipment issues. Qualification is required upon Equipment Qualification Trigger as defined in this document if the process is not fully verified through subsequent inspection or testing. Ongoing verification of inline wash process output can be accomplished by cleanliness measurements

8.3.6.8

Refer to Template : 50-ME80-PRO-014-015 PCB Assembly Line Equipment Qualification Template

8.3.7

Qualification Hypothesis Decision Guideline

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50-ME30-PRO-014-O Manufacturing Engineering Equipment & Tool BuyOf Work Instruction

8.3.8

PCB Assembly Line Equipment Qualification Instruction: 50-ME40-PRO-014-017

Wave Machine Qualification Instruction

50-ME40-PRO-014-018

Printing Machine Qualification Instruction

50-ME40-PRO-014-019

SPI Machine Qualification Instruction

50-ME40-PRO-014-020

Pick and place Machine Qualification Instruction

50-ME40-PRO-014-021

Reflow Machine Qualification Instruction

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50-ME30-PRO-014-O Manufacturing Engineering Equipment & Tool BuyOf Work Instruction 8.4.

Stencil Buy-off 8.4.1

ME Engineer have to contact stencil vendor during the stencil fabrication (send them correct the gerber file_ last version, check plot, aperture opening and step up/step down, special requirement …).

8.4.2 The instruction of stencil fabrication refer to #: 50-ME40-PRO-014-007 Stencil Fabrication guideline. 8.4.3

When receive stencil from stencil vendor shall implemented buy-off (follow checklist: 50ME80-PRO-014-004). 8.4.3.1 Perform aperture check on critical locations as define by customer and/or ME. As general requirement shall be checked sample measurement locations on: BGA aperture, QFN aperture, fine pitch locations (Fine pitch location is define as = or