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Eliminating Underfill Voids X-ray Inspection MEMS Update Temperature Sensors 2005 APA Recognition Section Forward
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Heavy Wire Bonder Heavy Wire Bonder 66000 G5
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Innovative Technology Defines The Future of Heavy Wire Bonding Today Uniting flexibility, bond process control, speed and accuracy
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Heavy Wire Bonder Heavy Wire Bonder 66000 G5
Fin Fi ne Wir ire e Bon onde derr
Gold Bal alll Bon ond der
Innovative Technology Defines The Future of Heavy Wire Bonding Today Uniting flexibility, bond process control, speed and accuracy
• unsurp unsurpass assed ed qualit quality y assurance through patented bond process control, data tracer and post bond inspection • utmos utmostt flexibli flexiblilit lity y with modular component handling • simple simplest st cha change nge-over from heavy to fine wire • latest latest tec techno hnology logy multi-frequency digital US-generator
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It’s It’ s rough rough in the semicondu semiconductor ctor jung jungle… le…
Heraeus is your machete.
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Two of the industry's top three SiP assemblers depend on Heraeus for semiconductor assembly materials that help keep their businesses on competitive ground. Because they know our products can help them cut through their most demanding challenges, including cost, size, performance and lead-free implementation. Heraeus can do the same for you. We have the technical expertise to provide you with the right products and support for your application. Like conductive adhesives, solder pastes, tack fluxes and more – many of them leadleadfree. All designed to perform exactly the way you need them to, from superior quality to consistent performance lot after lot.
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®
PUBLISHER Jay Regan 603-891-9126
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SENIOR VICE PRESIDENT David Janoff COMMUNICATIONS AND OPTOELECTRONICS GROUP DIRECTOR, ATD AUDIENCE Gloria S. Adams DEVELOPMENT ATD PRODUCTION Mari Rodriguez DIRECTOR GROUP ART DIRECTOR Meg Fuschetti ATD BUYERS GUIDE Judy Simers DIRECTOR CORPORATE OFFICES 1421 South Sheridan Road, Tulsa, OK 74112; 918-835-3161 CORPORATE OFFICERS CHAIRMAN Frank T. Lauinger PRESIDENT AND CEO Robert F. Biolchini
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Some people just can’t wait to see the new MRSI-M5™ assembly work cell. There’s a reason people are getting excited. For over 20 years Newport has set the industry standard for complex die bonding solutions. Today we have taken it another step forward with the introduction of the next generation assembly work cell, the new MRSI-M5™. Flexible by design, the MRSI-M5 is the right choice for accuracy, speed and reliability. The MRSI-M5 system has a large work area and is the best solu tion for a variety of die bonding interconnect technologies including eutectic, epoxy die attach and various flip chip processes. And, with Newport you can rest assured that you are working with an industry leader who delivers global support, process experience and manufacturing expertise. To see what all the excitement is about, visit www.newport.com/workcell18 or call 978.667.9449.
©2005 Newport Corporation
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The Carsem MLP Advantage
Carsem’s comprehensive selection of cost-effective MLP solutions gives you the crucial advantage you need for today’s demanding applications. Carsem’s MLP (Micro Leadframe Package) is ideal for the demanding applications requiring near chip-size packages with superior thermal-electrical performance. Our high-density leadframe design concepts, high throughput singulation methods, and innovative technologies allow our MLP to meet the most stringent MSL-1, Pb-free and green requirements, while delivering the most cost-effective solutions you could need. Our patented FCOL™ (Flip Chip on Lead) and COL (Chip on Lead) options provide even greater utilization of package space and enhanced performance for
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CONTENTS S E P T E M B E R
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On The Cover
2 0 0 5 ▼
Voids or air gaps in underfill are a common problem across underfill applications, from the smallest die on flex to the largest BGA. The consequences of having voids in underfilled parts depend on the
FEATURES
package design and use model. Courtesy of Asymtek.
14 Troubleshooting Underfill Void Elimination Methods for Gaining Reliability in Underfill Applications BY ALAN LEWIS
18 IEEE 1451.4 Facilitating Temperature Sensor Success BY CHRIS SEYMOUR
20 MEMS Packaging Update Providing a Foundation for Future Packaging Advancements BY KEN GILLEO
T H E
back-end
PROCES S
24 Building on a Basic X-ray Inspection Platform Configuring an X-ray Inspection System BY UDO E. FRANK
▼
18
DEPARTMENTS
A close-up of
7 Editorial
plug-and-play
BY GAIL FLOWER
technology that links the
8 In the News
application to the calibration
29 Advanced Packaging Awards Special Section
▼
22
51 IMAPS 2005 Product Preview
A top
55 Advertiser Index 56 Editorial Board
lab.
view of a thermoplastic
BY JOSEPH FJELSTAD
cavity package.
▼
24
A diagram of a typical X-ray system for industrial inspection.
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INDUSTRY NEWS UPDATES . NEW PRODUCT HIGHLIGHTS . EDITORIAL COMMENTARY . SEARCHABLE ARTICLE ARCHIVES INDUSTRY ASSOCIATION LINKS . CALENDAR OF EVENTS . TRADE SHOW NEWS . LEAD-FREE WEBINARS
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Flight delayed. Early delivery. Hello Daddy. NuSil Technology.
Precious moments. Shared when you’re not there. All because smaller, more advanced components can rely on packaging that’s durable in even the most demanding circuitry. That’s where you’ll find NuSil. Our customizable, low-outgassing packaging materials are helping opto-electronic systems stay contaminant-free under stressful, heated conditions. While your needs might be very different, from large batches to small, you can count on NuSil to deliver precise, custom formulations and the most complete line of encapsulants, under-fills and die-attach adhesives available. All backed by more than 25 years of packaging materials expertise. What? When? Where? If it’s NuSil, it’s no problem.
What’s your challenge? www.nusil.com Europe +33 (0)4 92 96 93 31 US 805/684-8780
©2005 NuSil Corporation. All rights reserved. AP0205-E
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Editorial G
A
I
L
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L
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R
A Breath of Fresh Air
S
omeone once said that How was ASE’s growth outto do the same thing standing this year? SEMI’s midover and over while year capital equipment consensus expecting a different forecast for the semiconductor result is the definition of insan- industry showed a 12% decline ity. I thought of this while attend- from 2004 figures, ending at a ing SEMICON West on July 12 – predicted $32.6 billion in sales 14 in San Francisco. During each for 2005. SEMI members anticinterview with company leaders, ipated cautious spending this each review of new products, and year, as the expanded capacity in each technical session, I looked 2004 was absorbed. Respondents for what was innovative and a to SEMI’s survey said that the source for new ideas. Original market would grow at a singlethinkers are keeping the back- digit rate in 2006 and reach $44.3 end ahead of the recovery curve billion in 2008. ASE is gaining in the electronics marketplace, market share among SATS proand I was on a mission to talk to viders, and their growth shows a few creative leaders. double digits this year, outpacTien Wu, Ph.D., Advanced ing competitors. Semiconductor Engineering, Wu sees a tightening of capacInc.’s (ASE) president, Americas/ ity in back-end processing, and Europe, presented a fresh perspec- expects 2006 to be especially tive on mostly everything involv- fruitful for this segment of the ing advanced packages. His back- market. Back-end is leading ground — a BSCE degree from the industry, and ASE provides Taiwan University and a MS and back-end services. But there’s Ph.D. in mechanical engineering more to it than being in the right from the University of Pennsylva- market segment. There are lots nia — fits his career choices. Prior of reasons for ASE’s success, acto joining ASE, Wu held several cording to Wu, including: management positions at IBM, · Flexibility of package assemincluding R&D, process developbly services, including bumpment, manufacturing, application ing, bonding, testing, supplying and ASIC design, marketing, and materials, and providing turnsales in the U.S., Europe, and the key or stand-alone assistance. Asia-Pacific region. · Right investments for future
growth. · Willingness to meet present demands or perceive future customer demands. If a customer wants completely lead-free, ASE provides leadfree packages. Cost control is one of the biggest problems with lead-free, according to Wu. The cheapest material that works well is what a customer will use. However, at present, there are no reliable standards of material choices and no recipe. Each bill of materials is different for each OEM. Eventually, lead-free will evolve in the industry, but it will take a few standards and verification of materials used. We asked Wu where he saw the boundary between the frontand back-end. He said that it was much more determined by business than by technology. “Money, not processes, determines the difference between the front- and back-end,” he added. That will be another topic for a future article in Advanced Packaging .
Editor-in-Chief
EDITORIAL ADVISORY BOARD Daniel Baldwin, Ph.D. Engent Corp.
Nasser Grayeli, Ph.D. Intel Corp.
Stephen Kay Ultratech Inc.
Rao R. Tummala, Ph.D. Georgia Institute of Technology
Jeffrey C. Demmin Tessera Technologies
Bruce Hueners Palomar Technologies
George Ri ley, Ph.D. FlipChips Dot Com
Jim Walker Gartner-Dataquest
Joseph Fjelstad SiliconPipe Inc.
R. Wayne Johnson, Ph.D. Auburn University
Michael Steidl Amkor Technology Inc.
September 2005
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THE
NEWS Intel to Build 300-mm Wafer Factory in Arizona SANTA CLARA, CALIF. — Intel
Corp. plans to build a new 300-mm wafer fabrication facility at its Chandler, Ariz. site, and the $3 billion project’s construction is set to begin immediately. Designated Fab 32, the new factory will begin microprocessor production in late 2007 on 45-nm process technology. “This investment positions our manufacturing network for future growth to support our platform initiatives, and will give us additional supply flexibility across a range of products,” states Paul Otellini, Intel’s CEO. Once completed, Fab 32 will become Intel’s sixth 300-mm wafer facility, and the structure will be about 1 million sq. ft. — 184,000 sq. ft. of which will be cleanroom space. 300-mm wafer manufacturing increases lower-cost semiconductor production ability when compared to 200-mm wafers. Total silicon surface area of a 300mm wafer is 225%, or more than twice that of a 200-mm wafer, and the number of printed die increases to 240%. Larger wafers lower production cost per chip while eliminating overall use of resources — 300-mm wafer manufacturing will use
SEMI has appointed Ed Segal, senior advisor to Metron Technology, as chairman of SEMI’s International Board of Directors. Segal succeeds Tetsuro (Terry) Higashi, chairman and CEO of Tokyo Electron Ltd., who served as chairman for the past year. Also appointed as the Board’s newest member is Michael Splinter, president and CEO of Applied Materials. Archie Hwang, chairman and CEO of Hermes Epitek, succeeds Segal as vice chairman of the board. 8
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Conference Call for Papers PennWell and China Electronics Appliance Corporation (CEAC) will sponsor the 2005 SMT China International Conference on “Emerging Technologies and Lead-free Challenges,” November 2122, 2005. This 3rd annual conference will take place at the Shanghai International Convention Center, Shanghai, China, in conjunction with the CEAC’s 66th China Electronic Fair (CEF). SMT and SMT China magazines, sister publications to Advanced Packaging , announce a call for papers for this conference on topics such as high-density, fine-pitch placement; equipment modular design; process optimization programming; 0201 and 01005 components; chip scale, BGA, flip chip, and 3-D interconnection; nanotechnology; and MEMS; as well as several other SMT, emerging technology, and modern assembly topics. Papers from environmental managers and technical experts are sought on relevant subjects. For a complete list of topics, and for the submission form, please visit www.smtmag. com. Abstracts should be 300 words in length and include an attached abstract submission form and a brief biography. The deadline for abstract submission is September 25, 2005. Presenters will be allotted 40-minute time slots for their presentation and discussion. Simultaneous Mandarin/English interpretation will be provided. Some papers may be grouped together in a forum or panel discussion. Speakers will receive discounted admission to the conference, including a copy of proceedings, and any refreshments and luncheon. For more information on the event, please e-mail Gail Flower at
[email protected]; or Charlie Zeng at
[email protected]. AP SHANGHAI, CHINA —
40% less energy and water per chip than a 200-mm wafer factory. Intel also plans to invest $105 million to convert an existing, inactive wafer fab in New Mexico to a component temporary test facility. The project will provide additional test capacity to the company’s factory network for the next 2 years, resulting in an additional 300 jobs at the New Mexico site during that time. AP
SEMI Appoints New Board Chair, Board Member SAN FRANCISCO, CALIF. —
SMT China International
Segal served as CEO of Metron from July 1995 until its acquisition by Applied Materials in December 2004. Prior to joining Metron, he served as president and CEO of Transpacific Technology Corp., a company he founded in 1982, which later merged with Metron. “SEMI is a unique global trade organization serving the semiconductor equipment and materials industry. In a period when the needs of members are shifting, I am pleased to have the opportunity to serve as chairman AP of the organization,” says Segal.
September 2005
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Lead-Free Webinar Series
ASSEMBLY & MANUFACTURING Wednesday, October 11TH, 12:00 Noon (Central)
Participate in the discussion. Talk to the experts. Register today!
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THE
NEWS News from SEMICON West BY JULIA GOLDSTEIN
Many companies were eager to share their technology and business news with the editors at Advanced Packaging . Here is some of what we saw: Test sockets. Kulicke & Soffa (K&S) SAN FRANCISCO, CALIF. —
introduced a new test socket technology last year that replaces traditional spring-loaded pins with a photolithography-based process. Flexible metal leads are used as the contacts, providing low contact force to minimize pad or bump damage. Oded Lendner, senior VP of
Package Test, explained that K&S now has a product based on this technology, called Quatrix, which is being tested by customers and is expected to go into production at the end of the year. Contactor life has been tested up to 2.5 million cycles, and will be specified at one million cycles for production. Standard metallization is Au over Ni, with a Pd-based alloy as an option for probing lead-free solder bumps. In an effort to improve time-to-market for their standard products, K&S introduced web-based socket selection software that enables customers to input specifications for BGA test sockets and receive a detailed footprint diagram and quote within 24 hours. Gold Technologies has a new product for testing lead-free packages that is based on their spring-loaded Au-plated probes, but includes a proprietary coating on the pins, as well as higher spring force. They have also introduced a socket lid design that can accommodate a range of package heights. Wafer Dicing. Laser dicing technologies are coming to the forefront. One new player in the semiconductor space will be New Wave Research. They introduced a compact laser scribing system for 2- and 3-in. sapphire wafers six months ago, which is now used for high volume production by customers in the LED market. A new system for silicon wafer dicing that can accommodate up to 12-in. wafers is in development and expected to be released in a little over a year. Synova was showcasing their water jet-based laser system. Guiding the laser beam down a 25- to 50-µm-wide water jet allows a much larger working distance than conventional laser dicing methods, and the water automatically cools the area being cut, eliminating the heat-affected zone. CEO Bernold Richerzhagen noted that customers are using the system to cut Si, GaAs, and SiC wafers, as well as to remove edge damage from thinned wafers after backgrinding. Synova’s next focus will be on package dicing, where the variety of materials to continued on page 13
10
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There’s no alternative ! o n l i n e g n i r e t i s e t / t i c k b y r e g m e o m c i . t a S a v e c t r o n i c u d o r p w w w.
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The world’s leading trade show for electronics production 16th International Trade Fair, New Munich Trade Fair Centre PCB manufacturing Components manufacturing MicroNanoWorld Component mount technology
Test and measurement Production logistics Electronic manufacturing services
Your contact in the US: Munich Inter national Trade Fairs German American Chamber of Commerce 12 East 49th Street, 24th Floor New York, NY 10017 Tel. 212-974-1880
[email protected]
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THE
NEWS continued from page 10
be cut poses many challenges. Materials. Honeywell discussed their wafer-thinning materials, announced in April as the first new product line from their Chandler, Ariz. manufacturing facility. By using a bulk etch, a stress relief etch, and a texture etch to enhance adhesion, they are able to completely replace backgrinding and the wafer damage that goes along with it. Polysciences, Inc. has been manufacturing encapsulants and adhesives for OEM customers for decades, but this is the first year they exhibited at SEMICON. One of their products is an encapsulant that is dispensed in a fine line over wire bonds to lock the wires in place. It effectively halves the length of the long wires used in stacked packages. The encapsulant flows down to underlying wires, but does not touch the substrate. Standard overmolding materials and processes can then be used with minimal risk of wire sweep. China or Mexico? Manufacturing in China has been a hot topic in recent years, with much of the emphasis on reducing manufacturing costs. Keynote speaker Tien Wu, President of ASE Americas & Europe, gave an interesting viewpoint. He said, “Why you want to go to China [is] to rule the world,” not to save 20%, but to be well-positioned to sell products to the Chinese. He also noted that the emergence of China could be considered as a “black hole” draining resources from the U.S. or as a new growth engine driving the semiconductor industry. Tien’s advice to companies considering expanding into China is not to go ahead if their only reason is to trim labor costs. Labor costs are rising in China, as Scott Kulicke noted during K&S’s Press Luncheon. High employee turnover, as much as 25%, is a problem, and some technical and managerial expertise is not available in China. Hiring workers from Taiwan and Singapore to fill the gaps increases costs. Still, K&S continues to shift more of its manufacturing to China, and Kulicke said that 90% of its wire bonder sales are to Asian customers. Ron Jones, co-founder of Silicon Border, is looking to greatly expand man-
ufacturing in Mexico and recently announced groundbreaking on a billiondollar industrial and educational complex in Mexicali, Mexico, just south of the U.S. border. Silicon Border has hired two engineering firms, one American and one Mexican, to design and build the infrastructure and provide support to tenants building manufacturing facilities. Jones is in negotiations with po-
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tential tenants — IDMs from the U.S., Europe, and Asia — and expects to sign letters of intent by this fall. The long-term goal is to have manufacturing facilities covering all steps of semiconductor fabrication and assembly, providing a complete supply chain in North America. If the first tenants are successful, it is likely more will come and make Silicon Border a viable alternative to China. AP
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S T O R Y
TROUBLESHOOTING
UNDERFILL V O I D E L I M I N A T I O N
METHODS FOR GAINING RELIABILITY IN UNDERFILL APPLICATIONS BY ALAN LEWIS
V
oids or air gaps in underfill are a common problem across underfill applications, from the smallest die on flex to the largest BGA. The consequences of having voids in underfilled parts depend on the package design and use model. Voids typically result in a loss of reliability. This article explores strategies for troubleshooting void problems. Detecting Voids
If you have determined there is a voiding problem, you probably already have a method of detecting the voids; however, different methods can be useful for troubleshooting. Three of the most common methods for detecting voids are the use of a glass die substrate, ultrasonic imaging, and destructive testing of a cross section or breaking the die off the part. Using a glass die or substrate can be helpful. This method provides instant feedback during testing and can be used to help understand flow patterns to optimize underfill speed. Using underfill materials of different colors can also help visualize the flow. The disadvantage of this method is that flow and voiding behavior may be slightly different for glass parts than actual production parts. 14
ADVANCED PACKAGING
Advanced
Ultrasonic acoustic imaging is a powerful tool. It allows the user to detect voids in the underfill material on the actual production part before or after cure. The size of the void to be detected can be limited depending on the package and equipment used, so there is a need to check with the equipment makers to understand what size void can be detected. These tools are also useful in reliability testing to detect delaminating and interconnect failures. Figure 1 shows an image of a void in an underfilled package taken with an acoustic microscope. Destructive testing uses a cross-section saw or breaks the die or package away from the underfill. These methods can be useful to better understand the three-dimensional shape and position of the void. The primary disadvantage of this method is that it cannot be used on uncured parts. Causes of Voids
There are several potential root causes of voids. Describing them and their root causes helps devise tests to troubleshoot them. Some causes include: • Flow pattern voids. There are several sub-categories here, but all of these voids occur during the time the material is flowing un-
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C O V E R der the die or package. The leading edge of the wave front traps a pocket of air. • Mois Moisture ture voids voids.. This type of void occurs during curing when moisture from the substrate outgases. This commonly occurs in organic substrates. • Voids caused by bubbles in the fluid . This is rare in fluids that materials suppliers packaged, as most suppliers are careful about packaging materials air-free. However, mishandling the fluid or repackaging after receipt from the suppler can introduce bubbles. In some cases, suppliers provide samples or experimental fluids that may not be properly de-gassed. If not configured properly, some automated dispensing equipment can also induce bubbles in the fluid path during dispense. • Contamination voids. voids. Contamination of excess flux or other sources of contamination can occur in a variety of ways. Void Characteristics
Void characteristics can help match them up with their root causes. These include: • Shape — Are the voids round or some other shape? • Size — Voids Voids are usually described describe d as the area they cover in the plane of the die. • Frequency Frequenc y — Do you get about one void void per 10 parts, or 10 voids per part? Do voids voi ds occu occurr duri during ng speci specific fic time times, s, all the time, or randomly? • Location — Do the voids appear in one place of the die or randomly? Do they appear attached to interconnect bumps? What is the relationship of the void to the dispense pattern?
F
S T O R Y
Flow-pattern Voids
Figure 1. Image taken with acoustic
tomograph shows void in underfilled package. Photo courtesy of Hitachi Kenki FineTech.
ate a void. If the voids are present with the same characteristics before and after cure, it is a good indication that some flow pattern during the underfill process caused the void. If the number of voids changes after cure, there could be more than one root cause. In some cases, contamination can cause two different types of voids; they can create an obstruction during flow, then outgas during cure.
Two or more flow fronts meeting to trap Two a pocket of air cause flow-pattern voids. One cause of this can be the dispense pattern. Dispensing on multiple sides of a BGA or die can improve the speed of the flow, but increases the probability of trapping a void. Experimentation with various dispense patter patterns ns or parts with a quartz die or transparent substrate is the most direct method of understanding how the voids are formed and how to eliminate them. The use of underfill materials with different die colors for various dispense passes (Figure 2) can be a good tool to visualize flow. Temperature can affect the flow front of the material. Temperature variations on the part can also affect material crosslinking during flow, speed of flow, and flow speed. Therefore, it is prudent to consider this variable in testing. Often, multiple dispense passes are used to reduce fillet size, but can also increase the probability of trapping voids if timing between the passes is not carefully planned and controlled. The use of jetting
Cool Off. Precisely. High thermal conductivity multilayer aluminum nitride packages from AdTech Ceramics are manufactured to achieve position tolerances better than +/- 0.2%, hermetic vias and flatness less than 0.001"/". These features allow for thin film of the external surfaces with increased density for high performance microwave microwave applications. Metal components may also be added as required. The AdTech process has provided high quality, 100% dense AlN ceramic with up to 40 layers in complexity for over 15 years. This, along with 30+ years of HTCC production, makes AdTech AdTech Ceramics your prime source for custom ceramic packages.
Test Strategies
The first step is to determine if the voids occur before or after curing. This can be helpful in eliminating some root causes. If the voids are not present after dispensing, but are present after curing, flow f low pattern voids,, or voids caused by bubbles voids bubbles in the fluid, can be eliminated as a root cause. At this point, it would be good to look for moisture problems, contamination problems, some source of outgassing during cure, or problems with cure profiles. Most underfill materials are designed to shrink during cure to create compressive stress on the interconnect bumps to improve reliability. reliability. This shrinking can give any outgassing source the ability to cre-
.002" top surface lines and spaces .001"/" flatness
+/- .2% via position tolerance Up to 40 layers Straight through hermetic vias
AdTech Ceramics ISO 9001:2000 Certified
Meeting your advanced ceramic needs with experience, communication and technology. September 2005
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Advanced Technical Ceramics Company 511 Manufacturers Rd. • Chattanooga, TN 37405 Tel (423) 755-5400 • Fax (423) 755-5438 Internet: www.AdTechCeramics.com Internet: www.AdTechCeramics.com Email:
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S T O R Y
technology, instead of needle dispensing, to control fillet size can help reduce the number of passes.1 Figure 3 shows jet dispensing of underfill. Material flowing to other board features (passive components or vias), leaving the underfill material short, can also cause flow-pattern voids. The use of jetting technology can help control the placement of the underfill fluid. Moisture Voids
Moisture in the substrate can outgas during cure, creating a void during the cure process. These voids are often random in placement and can have finger- or snakelike shapes. They usually are seen in packages using organic substrates. To test if voids are caused by mois-
Figure 2. Use of glass and two colors of underfill can help visualize flow and formation of flow-pattern voids.
ture, one can pre-bake the parts for several hours at temperatures above 100°C, then dispense immediately on the parts. Once it has been established that moisture is the root cause, further testing to establish optimal pre-bake times, temperatures, and storage protocols protocols can be designed. A good metric for water content is to track weight gain of a part with a precision analytic balance. Note that some flux contamination issues can be remedied with a pre-bake procedure and act like moisture-induced problems. It is easy to test for the difference. Moisture-induced problems will recur if the part is exposed to humidity; flux contamination problems problems will not. Contamination Contaminat ion issues caused by excess flux often create irregular or random flow variations, variatio ns, particularly at the inter interconconnect bumps. If the voids that are occurring during flow show this characteristic, it would be prudent to investigate cleaning or sources of contamination. In some cases, flux contamination can show up after cure in a series of small bubbles on the side of the die opposite the dispense side.
Figure 3. Jet dispensing the underfill, rather than needle dispensing, can avoid some causes of voiding under the die.
Apparently, fluid flow carries the flux to the far side of the die. Material Bubble Voids
As mentioned earlier, most material suppliers are very careful about packaging underfill material with air bubbles. Improper handling, repackaging, or dispensing technology can induce these issues. If air bubbles in the material are suspected, there is a straightforward way to inspect for this. Dispense the material from the syringe through a fine needle and draw a fine line in a long pattern, then inspect for gaps in the dispensed line. If bubbles in the material have been confirmed, contact your material supplier about proper handling and storage of the fluid. If no bubbles are found, this test can be be repeated with the valve, pump, or jet attached to the syringe. If voids occur during this test, and no voids were present when dispensing directly from the syringe, then the equipment induced the bubbles. In this case, contact your equipment supplier about proper setup and equipment use. Conclusion
Underfill voids can be a vexing production problem. Understanding the characteristics of various root causes, and how to test for them, can help engineers resolve the issues. AP References
1. Babiarz, Alec J., Paradigm Shift in Applying Underfill, Pan Pacific Microelectronics Symposium,
SMTA, 2005. ALAN LEWIS, director of application engineering, may be contacted at Asymtek, 2762 Loker Ave.
West, Carlsbad, CA 92010; 760/930-3379; e-mail:
[email protected].
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S D R A D N A T S
IEEE 1451.4 FACILITATING TEMPERATURE SENSOR SUCCESS
BY CHRIS SEYMOUR
T
emperature sensors are usually cesses. These developments include the teristics to work. Specifically, four error consigned to supporting roles in use of smart-sensing technology and values, known from sensor calibration, semiconductor manufacturing the development of the IEEE 1451.4 are transferred into a compatible temperand packaging. But, as in mov- smart-sensing technology architecture ature controller during installation. The ies, how supporting roles perform can be standards. Today, many engineers in- controller takes these four offset points, the difference between success and fail- volved in thermal processes are familiar connects them with three straight-line ure. When problems with temperature with both developments, but have only segments, and then performs a high-oraccuracy, repeatability, or stability arise, der curve fit to correct known errors. the spotlight turns and remains fixed on This process improves the sensor’s accutemperature components. racy because it knows the error limitaIn recent years, continuous and rapid tions at specific temperatures and replacadvancements in the semiconductor ines previously assumed tolerance windows dustry have thrust temperature sensors with exact information. The result is less into the spotlight. Traditional sensors process variation, better efficiency, and have struggled to keep pace, and often improved yield. have been the weakest link in new or adThe other development, the IEEE vanced processes. For example, many of 1451.4 standards, is also capturing the today’s applications, such as wafer and attention of the industry. The standards integrated circuit (IC) test and bonding define the parameters for plug-and-play applications, require an extremely tight analog sensors, their interface to existtemperature tolerance, and therefore, ing instrumentation, and the use of an extremely accurate sensor. During embedded transducer electronic data the past decade, the only way to make sheets (TEDS) to convey a sensor’s era sensor more accurate was to rely on ror values automatically. tighter material property controls. Over IEEE 1451.4 standards contribute to the years, this has resulted in the u se of smart sensing as Ford’s assembly line purer and more homogenous elemental eased automotive production. The stanmetals, which are often more costly and dards not only provide a universal forless readily available. This approach has mat for smart-sensing information and only taken the industry so far. Process the hardware it uses, they also propel the drift, unachievable levels of accuracy, quick adoption of smart sensing by elimand increasing costs drove the need inating adaptability concerns — making to abandon this approach and search Figure 1. The plug-and-play technology the technology mainstream. for more effective ways to improve sen- provides linking of the application to the Still, users and potential users of smart sor accuracy. sensors see only half of the technology’s calibration lab. Two recent developments have potential. IEEE 1451.4-compliant inemerged and converged to overcome caught a glimpse of their potential. strumentation offers previously unobthe limitations of traditional sensors, Smart sensors achieve high-level accu- tainable levels of accuracy. But because and perhaps more importantly, to bring racy not through the use of purer mate- the sensors no longer rely on the purity additional options and benefits to pro- rials, but by putting their known charac- or composition of materials to achieve 18
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S T A N D A R D S accuracy, the industry is free and failure prediction. Sensors to use sensors constructed change and degrade in a repeat from virtually any alloy. That able and predictable way. There freedom means alloys can fore, it is simple to enable sensors be selected to achieve other to communicate their status and benefits, such as stability, ro- health, via instrumentation, to bustness, homogeneity, or low operators and maintenance of price and availability. ficials. This function allows us This higher level of smart- ers to “ask” a sensor if it is func sensing technology opens tioning properly before starting the door to an unlimited va- a batch or process, or schedule riety of new sensors — those maintenance and downtime in a that can meet modern design more cost-effective manner. goals. If a smart thermocou ple can carry its entire voltConclusion age table information, and Combined, the benefits of smart this information can be comsensing, especially with IEEE municated to a controller to Table 1. Calibration information increases accuracy. 1451.4 standards offering form correct known errors, it is no and function, are transforming longer forced to be a standard thermo- best accuracy, but also a low-temperature sensors from a limiting factor within new couple, such as Type J or K. Instead, al- rating. Conversely, glass-coated thermis- or advanced processes, to an enabling comternative metals that are more accurate, tors aren’t very accurate, but offer a high- ponent worthy of their own spotlight. AP stable, and available can be used. For temperature rating. Using smart-sensing example, engineers specifying a type of technology allows the engineer to make a CHRIS SEYMOUR served as sensor strategic marketing thermistor may have struggled between glass-coated thermistor as accurate as an manager for Watlow. For more information, please contact Watlow Electric Manufacturing Co., 12001 Lackland epoxy-coated units and glass-coated epoxy-coated thermistor. units. Epoxy-coated thermistors offer the Smart sensing contributes to diagnostics Road., St. Louis, MO 63146; 1-800-4-WATLOW.
Do you need faster, lower cost, better dispensing? It’s called, “Jetting.” Jetting delivers speed increases of 400% over needle dispensing with improved yields and better accuracies with these fluids:
Dispensing problems typically associated with needles such as die clipping, broken wires, bent needles and dripping are eliminated with jetting technology. With jetting, you have fewer problems, higher yields and a better process.
The jet shoots a fluid stream as small as 100µm and achieves wet out areas as small as 250µm — allowing tighter die spacing. Jetting has been proven to deliver higher thoughput compared to needle dispensing for die sizes from under 1 mm to over 20mm.
• • • • •
Underfills Encapsulants Flux Conductive adhesives UV-cure adhesives
Get into production and to the market faster with jetting. FIND OUT MORE NOW:
Americas: Europe: Japan: China: Email:
+1-760-431-1919 +31-43-352-4466 + 81-3-5762-2801 +86-21-5899-1879
[email protected]
www.dispensejet.com
See Asymtek at IMAPS Booth 645 and ATE Booth 5623 September 2005
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MEMS Packaging Update
S M E M
PROVIDING A FOUNDATION FOR FUTURE PACKAGING ADVANCEMENTS BY KEN GILLEO
M
icroelectromechanical systems (MEMS) are “alive” and well in 2005 with a growing market now in the billions of dollars. Motion sensors, today’s fastest-growing commercial segment, continue to see frequent new product launches by both established and new suppliers. While simpler ink-jet chips have more market share because they are disposable (part of the ink-jet cartridge), this is a limited market. Inertial sensors, however, continue to find new applications on a regular basis. While air bag systems are still the main market for sensors, there are many newer applications, such as disk drive free-fall detectors and innovative consumer applications. The most popular MEMS fabrication process is surface machining where sacrificial materials, such as SiO 2, are selectively formed and then etched away to leave 3-D structures typically made of silicon. This process is also compatible with CMOS and allows “intelligence” to be built into the MEMS chip. MEMS inertial devices have moving parts, which equates to special handling and packaging challenges. MEMS parts can be sensitive to mechanical shock, especially in unpackaged form, and are especially vulnerable to particulate contamination, such as residue from wafer sawing. The mechanical motion zone of a MEMS chip must be protected during singulation with a temporary mask, or by wafer-level packaging techniques. However, the most significant packaging challenge is to provide environmental protection that does not restrict 20
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chip-level motion. Electronic devices are readily overmolded and the encapsulant can contact the active side of the chip. But direct contact of the MEMS
require only electrical I/Os. At present, however, inertial devices are being hermetically enclosed with cavity designs so mechanical action is allowed. Therefore,
Figure 1. Packaged MEMS accelerometers.
surface with molding compound or other encapsulant would “freeze” the moving parts. MEMS-specific designs offer the most suitable solutions to these special needs. MEMS Package Requirements
The hermeticity debate continues; do we really need a full-hermetic package for inertial devices like accelerometers and gyroscopes? We should consider that many other types of MEMS products are not packaged in hermetic enclosures because they require access to the outside world, as is the case with ink-jet chips and fluidic-MEMS products. But inertial sensors are somewhat unique and
the first MEMS-package requirement is free space typically achieved with cavity-style packaging. Some devices also require internal atmosphere control because moisture and particle contamination can be damaging. Getters (trapped moisture and particles), lubricants, or anti-stiction agents may also be added to the package to prevent wear, degradation, or stiction. Stiction, a combination of sticking and friction, occurs when smooth, planar surfaces make contact and become locked together permanently by short-range atom forces. Because MEMS devices are so small, these moving parts have a high area-tomass ratio, making stiction likely. More
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M E M S complex MEMS devices, such as gas and fluid analyzers, require selective access to the environment. Commercial Package Designs
MEMS inertial sensors are one of the oldest classes of products and one of the most active areas. Production is expected to exceed 600 million devices for 2005. Cambridge, Mass.-based Analog Devic-
Plastic vs. Ceramic
Electronics have benefited from lowcost plastic non-hermetic packaging materials for the past 50 years. Simple epoxy overmolding adds little cost, especially today, with area or flood-molding techniques that produce hundreds of packages per cycle. The main cost for plastic packaging, however, has been attributed to the platform, or chip carri-
Figure 2. Thermoplastic cavity packages.
es, Inc. (ADI) did much of the pioneering work in this field and enjoys a leadership position in the accelerometer area. ADI reached a milestone earlier this year when they shipped their 200-millionth inertial sensor. But there is substantial competition. Freescale also has a long history in motion sensors and recently has launched 3-axis motion-sensor products. OKI, MemSense, Hitachi, Kionix, and STMicroelectronics have, or soon will offer 3-axis accelerometers. While such devices are useful for the automotive market, other applications include cell phone pedometers, game sensors/ controllers, and a variety of sports products. MEMS can already help improve your golf game or fly-casting skills. Most inertial devices are packaged in small QFN format. The smallest package is 5 × 5 × 1.2 mm, offered by Kionix, but competitors have designs only slightly larger. Figure 1 shows several QFN MEMS packages. Most use ceramic hermetic packages, at least for now. The simple QFN has reduced the cost over earlier ceramic cavity-style packages that had accounted for more than half of the total component cost. But even newer ceramic QFNs are not the lowest-cost packages. The general electronics market enjoys low-cost plastic packaging that reaches as low as $0.05 per assembled package for low I/O QFNs. This is almost an order of magnitude lower than MEMS ceramic QFNs. 22
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er. The QFN has reduced cost by simplifying the platform and eliminating secondary operations, such as solderball attachment, making this the lowest cost design in production. Aware of the cost benefits of plastics, the MEMS industry has been seeking ways to adapt cost-reducing plastics. Because a cavity is required, at least around the mechanical zone, two basic strategies are available. Although epoxy cavity packages are feasible, transfer molding is not the perfect process here. However, injection molding, a more common plasticshaping process outside of the package industry, is ideal for producing 3-D shapes, including cavities. Injection molding uses thermoplastic resins instead of thermosets, and that can be beneficial. There are several commercial high-temperature (>300oC stability) thermoplastics that have better properties than epoxies, especially regarding low moisture absorption. What’s more, materials such as liquid-crystal polymers (LCPs) pass flammability specs without adding flame retardants. Bromine flame retardants are coming under regulatory attack and may be banned, so intrinsic flame retardancy is a plus for packaging materials. Even better, thermoplastics are “no-waste” materials, since they can be remelted and reused. This also means that thermoplastic electronics could be recycled just like many
other thermoplastic products. Analog Devices has been exploring plastic-cavity packages for their MEMS gyroscope family. However, ADI first caps the MEMS device at wafer level so that the motion zone is hermetically enclosed. Now, the device is protected from both particulate contamination and moisture. The bonded-silicon caps are specially singulated so that they are smaller than the chip, allowing bonding pad access. The capped MEMS de vice can now be handled more like an ordinary electronic chip. While some parts can be overmolded with epoxy, chips that are more mechanically sensitive are placed inside injection-molded cavity packages. Overmolding adds stress due to shrinkage that detunes the MEMS sensor, making it undesirable for some products. Once the capped device is attached and wire bonded to the cavity package, a lid is sealed using dispensed adhesive. The capping adds cost, but solves pre-package problems, such as contamination from sawing. However, many MEMS devices cannot be capped and these are candidates for in jection-molded, plastic-cavity packages. These thermoplastic packages have better barrier performance than non-hermetic epoxies, but do not achieve full hermeticity; the term near-hermetic package (NHP) seems appropriate. Figure 2 shows low-cost thermoplastic cavity packages. Future
MEMS will continue to grow at a steady, sustainable rate that will drive low-cost packaging innovation. Plastic packaging is certainly in the future, but ceramic dominates for now. MEMS packaging technology, because of its high versatility, will also provide the foundation for nanoelectronics devices that could emerge within the next 5 years. A paradigm shift is likely within a decade. 1 AP Reference
1. Gilleo, K., MEMS/MOEM Packaging: Concepts, designs, materials and processes, McGraw-Hill, New York, NY June 2005. KEN GILLEO, Ph.D., is a consultant at ET-Trends LLC, 38 Cedar Pond Drive, Suite 6, Warwick, RI 02886; 401/965-8019; e-mail:
[email protected].
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P R O C E S S
Building on a Basic X-ray Inspection Platform Configuring an X-ray Inspection System BY UDO E. FRANK
S
emiconductor components, high-density circuitry, waferreal-time image processing system. level chip scale packages, stacked assemblies, micro-elecThis system provides a basic X-ray imaging capability contromechanical systems (MEMS), and micro-opto-elec- tained within a radiation-secure cabinet with a 1 × 1-m footprint. tromechanical systems (MOEMS) — the advantages of X-ray Additional capabilities can be added to the platform. Instead of inspection are well recognized and understood for such applica- a microfocus tube, a “multifocus” tube can be substituted. This tions. However, selecting the right X-ray system for each appli- tube offers three mode capabilities with a single tube: microfocation can be a challenge. cus, nanofocus and high-power. Instead of A variety of factors come into play, ina four-axes manipulator, a six-axes subasX-ray tube cluding how equipment will be used and sembly can be incorporated. Should the where it will be installed (in a production application warrant additional costs, add line or off-line), feature-size capability rea high-resolution scientific-grade camera, quired, and a host of performance charBGA module, voiding calculation softacteristics, such as contrast, sharpness, ware and direct digital detectors. Sample on X-Y-Z magnification, and acceptable noise level. With such a system, the decision comes manipulator with rotating/tilting Applications also can change. Selecting down to what level of performance is rean X-ray inspection system often means quired. What detail detectability, for inpurchasing equipment that exceeds curstance, is necessary? If above 1 µm, then a rent requirements. microfocus tube will suffice. On the other An alternative, cost-effective aphand, for improved feature recognition, a proach is to purchase a basic system tube with nanofocus capability is required Detector that is configured to meet current perto meet these requirements. The decision formance requirements. What distinwill impact cost, because a microfocus guishes the system is the versatility of Figure 1. Diagram of a typical X-ray system for tube costs less than a multifocus tube with the platform concept, which allows the an additional nanofocus mode. However, a industrial inspection. system’s X-ray inspection capabilities to cost/performance analysis based upon imbe tailored to specific inspection needs. In this case, the basic mediate and near-term application needs could determine that configuration includes: the extra, upfront expense of a multifocus tube. • Open microfocus tube with a transmission target — the tube features an acceleration range up to 160 kV and a detail de- Design and Performance Considerations tectability of 1 µm. The tube also incorporates a design that X-ray systems primarily consist of three subassemblies: an X-ray enables controlled and continuous stable output intensity for source, remote- controlled fixture for holding and manipulatX-ray emission, constant image contrast, and brightness. ing the sample, and a radiation detector (Figure 1). These sub• Geometric magnification up to 2000×. assemblies are contained in a multiple-fused, radiation-shield• 4-axes manipulator capability of accommodating sample sizes ed cabinet. up to 440 × 550 mm (17 × 21 in.). The X-ray source for industrial inspection is a tube, which • 4-in. (102-mm) dual-field image intensifier. may be “sealed” or “open.” An open design usually is a stainless• Digital-imaging chain with a CCD camera. steel tube, in which a continuous vacuum is created, and it can be • A 17" (432-mm) monitor, GUI (graphical user interface) and opened for cleaning and maintenance. However, a sealed tube is 24
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back-end P R O C E S S
one in which the vacuum is introduced Only open tubes can achieve such highat the time of manufacture, and it cannot resolution grades, are capable of higherCathode be opened without destroying it. acceleration voltages than sealed tubes, Grid The manipulator is designed to proand provide higher tube power with vide precise X-Y-Z positioning and rohigher intensities (dose rates). They are tating/tilting of the sample at varied Alignment unit the standard in X-ray microscopy. speeds, depending on whether a quick As seen in Figure 3, the near-puncElectron beam overview of the part at low magnificatiform shape of the focal spot elimition, or a more detailed examination at nates peripheral shadowing in the Xray image almost entirely, achieving a higher magnification, is desired. The Objective function of the detector is to convert nearly infinite in-depth sharpness. The the real-time X-ray data into an image required resolution is important when of visible light that can be seen and exselecting tube types for the application. Objective amined by the human eye. The most The smaller the focal-spot capability, the aperture common detector is a combination higher the tube cost, and vice versa. Target video camera/image intensifier. Other Magnification. All absorbing structypes include high-dynamic scientifictures of the 3-D sample under inspecX-ray beam grade cameras and flat-panel direct digtion are projected as a 2-D shadow image ital detectors (DDDs). onto the entrance field of the detector. To determine the required configura- Figure 2. Microfocus transmission tube showing gen- Geometric magnification depends on tion for a particular application, choices eration of X-ray beam. the position of the sample between the are required in terms of the subassemX-ray source and detector plane on the blies to be installed in the cabinet, such as ball with a void, radiation must penetrate relationship of the focus-to-detector distype of mode required: microfocus, nano- the ball sufficiently to depict the difference tance (FDD) and focus-to-object distance focus, or high-power; most appropriate in absorption between the solid metal and (FOD). Magnification (m) equals FDD ditype of tube: open or sealed; what mo- the less-dense area of the void. Therefore, vided by FOD. Magnification increases sigtion is required of the manipulator; and finding the optimal contrast is a one-pa- nificantly within the last few millimeters what type of imaging system is most suit- rameter task of determining proper accel- toward the focal spot of the X-ray source. able. These are a few of the specific design eration voltage, because all other param- Because of this, the X-ray tube must be questions that should be considered: eters in an X-ray system can be adjusted a transmission-target type, as a transmission target features a thin X-ray window Contrast. X-rays are generated within automatically. a continuously evacuated tube housing. Sharpness. The focal spot, a resolution (250 µm) located practically at the same Electrons are emitted from a cathode, tube generally half the diameter of the fo- level with the focal spot and a thin target accelerated through a high-tension field cal spot, determines image or geometric layer sputtered onto the inner side of the (typically 10 to 225 kV) and focused onto sharpness. Therefore, a microfocus X-ray X-ray window from which X-rays emit. a thin layer of target material, usually tung- tube provides a resolution of about 1 µm. With a typical FDD of 500 mm, maxisten (Figure 2). As electrons colmum geometric magnification a) With punctiform b) With extended lide with target-material particles, of 2000× can be achieved if the FEINFOCUS (conventional) X-ray source X-ray source they are slowed down, and the loss sample to be examined touchX-ray source in kinetic energy is converted into es the outer surface of the XF F Benefit: other types of energy, mostly heat, ray window. This also is called Highest feature but also X-rays. Acceleration volt- recognition “stamp magnification.” capability age determines the velocity and An FOD of 1.25 mm results FOD violence of the collisions with the in a geometric magnification of target material; and therefore, the 400×, while an FOD of 5 mm FDD Object penetration power of the X-rays achieves 100×. For a sample that generated. At 30 kV, more soft rais 5-mm high, total achievable diation, which is highly absorbed geometric magnification can in typical electronics assemblies, vary by a factor of 20. In selectImage plane is generated. At 160 kV, more hard ing a tube design for a particular radiation is generated. The objecapplication, maximum geomettive in selecting acceleration voltric magnification required must age for a particular application is be taken into consideration. Ug to achieve the highest possible abTotal magnification is visible FDD Geometrical unsharpness: Ug = F (m-1) F: Focal spot size Geom. magnification: m = – FOD sorption (or attenuation) differto the operator on the displayence. Thus, in viewing a solder Figure 3. Relationship of focal spot diameter and geometric sharpness. ing media. If, for example, the September 2005
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inspection, noise plays an inferior role because sufficient photons are available. For X-ray inspection, however, the situation is different; X-ray intensity, or dose rate, has a significant influence on noise. The relation of absorption signal to the gray-value noise level (frequently referred to as the signal-to-noise ratio) doubles with quadrupled intensity. The objective in X-ray inspection is to achieve the highest possible intensity. An Isowatt function keeps
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b a c k - e n d P R O C E S S
X-ray image is copied from a monitor screen onto a wall (by an LCD projector), the image on the wall is enlarged visibly compared to that on the screen. However, the resolution remains the same because only the image pixels are displayed larger in size. Noise. In addition to image contrast and sharpness, noise is an important factor in determining image quality because it affects the observed clarity. For optical
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electrical power applied to the target constant and ensures consistent optimal conditions independent of the selected acceleration voltage. A recursion filter also is an efficient tool for reducing noise level without losing realtime impressions of an image. It creates an output image that is the weighted sum of prior images in a time sequence. During imaging, gray values of individual captured images are being added pixel-wise, and averaged. Images that were captured earlier will be less weighted than those captured more recently. Noise reduction can be achieved for an unmoved sample. Should the sample be moved; however, the image would be “smeared.” This can be avoided when reducing the recursion level during movement so the image appears to be noisier, while the sample structures remain clearly discernible during motion. An automatic adjustment of the recursion level to the motion status (“moving noise reduction”) ensures user-friendly operation. FDD also influences X-ray intensity. The relation is an “inverse square.” Therefore, when the FDD is doubled, the captured intensity is reduced to a quarter of the previous amount. For this reason, the sample should be positioned as close to the X-ray tube as possible, while adjusting the FDD to the required magnification grade. This is possible only with systems enabling a variable-detector position. Leaving the pixel number constant where the converted entrance image is imaged results in useful post-magnification effects. This is possible when the detector unit consists of a combination of an image intensifier and camera. The image intensifier converts X-ray waves into visible light and amplifies them. The optical image available at the output field is observed by a camera and displayed onto a computer monitor. The most cost-efficient solution is a video camera (760 × 570 pixels with 256 gray values = 8 bits), which is sufficient for a range of applications. The entrance field of the image intensifier can be set to various sizes electronically. Because the image size in the output field of the image intensifier and the pixel number of the camera image remain constant, magnification grade of the image displayed on the implemented system monitor changes. This fea-
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ture is called post-magnification or imageintensifier zoom. When switching the entrance image of the image intensifier from 4-in. diameter to 2 in., post-magnification grade is doubled while signal-to-noise ratio is decreased to half (“double noise”), because the entrance field of the detector is reduced to a quarter of its size. Using postmagnification effects is particularly useful when geometric magnification cannot be increased further, because the sample already touches the X-ray tube. For higher requirements, a camera with more than 1-M image pixels is recommended in combination with an imageprocessing chain featuring a gray-value resolution of 16 bit = 65,536 gray values. This Scientific Grade Camera (SGC), which also is used with an image intensifier, offers the opportunity to reduce the image repeat frequency of 25 frames/second (real-time) to less than 1 frame/second. The advantage is in the acquisition time. The longer an image is exposed, the longer the X-rays can work in, the more X-ray photons can be captured for the image, and the lower the noise level. For high requirements, a DDD is recommended with the highest pixel amount (1,888 × 1,408 pixels), best contrast resolution (16-bit), and lowest noise level because it enables real-time operation with 30 frames/second, while providing an image quality that can compete with an X-ray film. Moreover, in comparison to an image intensifier/camera combination, the DDD is about ⅛ the height, so the FDD and the maximally achievable magnification of the X-ray system can be increased considerably. The entrance plane of the detector is 24 × 18 cm, so that Eurocard Format (16 × 10 cm) PCBs can be displayed completely at 1.5fold magnification. Because the pixel size of this detector is 127 µm, 85-µm structures can be resolved.
less-than-cost-effective purchase. Another choice is available — the ability to configure a versatile X-ray platform that meets specific inspection needs. The versatile X-ray platform offers a cost-effective approach to purchasing the most suitable system. Tthe decision that must be made is one of determining the basic level of performance required. The type of tube selected represents the most fundamental decision, as it determines resolution and focal-spot
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back-end P R O C E S S
size. Contrast, sharpness, magnification, and noise, as well as imaging requirements for the application, also represent an important set of choices. The advantage of such a system is significant — the likelihood of a more profitable bottom line. AP UDO E. FRANK, Ph.D. has served as director of technology development at FEINFOCUS. For more information, please contact COMET North America Inc., 203/969-2161; e-mail:
[email protected].
For More Details Call 207-781-9603 or Vist www.intertechusa.com/orfid.htm
Organic RFID
2005
The Promise of Printed Electronics with Organic Semiconductors October 19-21 Hilton San Diego Resort
San Diego, CA
Conclusion
Inspection and analysis of electronic assemblies and parts using high-resolution X-ray technology mandates several choices when selecting a system. The tendency is to purchase a system with capabilities that exceed the need because of the minimum level of capability available, or in anticipation of future requirements. The result is a
Supported By:
Dr. Daniel Gamota, Motorola Corporation Dr. Kiyoshi Yase, National Institute of Advanced Industrial Science and Technology
September 2005
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IMAPS 2005 presents The 38th International International Symposium on Microelectronics Pennsylvania Convention Center Philadelphia, PA
Everything in electronics between the chip and the system!
Conference & Events September 25 - 29, 2005 Exhibits September 27 - 29, 2005 To view the Technical Program, Reserve Booth Space or Register as an Attendee, please visit
www.imaps2005.org
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2005 ADVANCED PACKAGING AWARDS Celebrating Product Excellence in Semiconductor Packaging
N O I T C E S L A I C E P S
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F R O M T H E E D I TO R - I N - C H I E F
Advanced Packaging Salutes Innovative Excellence
I
t is with great pleasure that once again, Advanced Packaging Magazine congratulated the participants and winners of the 2005 Advanced Packaging Awards (APAs). This was the 5th annual APA ceremony in a program that has become a leading industry event, as well as a prestigious recognition for companies devoted to innovations in semiconductor packaging. From the beginning, SEMI and Advanced Packaging have worked together to award creative advancements in technology, and the result of our efforts can be seen in the overwhelming support from the packaging industry. This year in San Francisco, during SEMICON West, on July 13, 2005, in the Regency Ballroom, the winners were announced in 20 categories. Judges from a distinguished
created the right balance of elegance — so fitting for this industry celebration. We found it suitable to recognize such an evolving technological industry as ours in such a monumental, timeless building. It reminds us that despite changes in the industry, a firm foundation will keep us steadfast. After the presentations, guests enjoyed hors d’oeuvres and cocktails, and discussed the changes they have seen at SEMICON West throughout the years. For this celebration, Advanced Packaging teamed up with one of its sister publications focused on front-end assembly, Solid State Technology . David Barach, publisher of Solid State Technology , welcomed all attendees, suggesting that this dual celebration become a new, yearly tradition at SEMICON West. Bringing award celebrants from the packaging industry together with a range of semiconductor manufacturing companies was From the beginning, SEMI and Advanced Packaging an enjoyable way to unite a large have worked together to award creative advancements in portion of the electronics manufacturing industry into one room for a technology, and the result of our efforts can be seen in the relaxed evening. In the following pages, you will overwhelming support from the packaging industry. find presentations recognizing the winners of this year’s awards. Take a panel comprising industry experts and members few minutes to read about these creative new prodfrom academia chose the winners. The panel looked ucts and the companies who are behind these investat submissions based on the ability to meet a sigments in R&D. Next year, we invite all companies nificant industry challenge; a creative application involved in the back-end packaging process to submit of a new or existing technology; overall quality and their product or service to the 2006 APAs. Simply fill consistency of performance; economic merits and out the registration form and follow the step-by-step throughput characteristics. Products were judged instructions to be listed on the website (www.apmag. on their innovativeness, cost-effectiveness, qualicom). Then join the winners’ circle as you keep the ty contribution, ease of use, maintainability/repa- spirit of ingenuity alive. rability, technical advancement, speed/throughput Congratulations to this year’s winners. improvements, and environmental responsibility. An APA crystal display was presented to the winning companies. Jay Regan, our publisher, welcomed all attendees to the event. The Regency Ballroom, with its carved Gail Flower wood walls, arches, and ornate suspended lighting Advanced Packaging Editor-in-Chief
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2005
A D V A N C E D PA C K A G I N G A W A R D S
3-D PACKAGING TECHNOLOGY
NOVEL PACKAGE DESIGN
Amkor Technology Inc.
Advanced Interconnect Technologies
PAvfBGA
SUBSTRATE & SUBMOUNT EQUIPMENT & MATERIALS
ASM Technology Ltd.
Etched Leadless Package (ELP)
BP2000
PACKAGE DESIGN SOFTWARE & EQUIPMENT
SURFACE TREATMENT EQUIPMENT & MATERIALS
CAD Design Software
Aqueous Technologies Corp.
Bond Wire Optimizer/3D Design
Focus-Wash
QUALITY ASSURANCE/MANAGEMENT TOOLS
TESTING EQUIPMENT
ASM Technology Ltd. Osprey
KIC
LongLife ATE Socket
DIE ATTACH EQUIPMENT & MATERIALS
Hover-Davis Inc. DDf Ultra
DISPENSING/ENCAPSULATION MOLDING/UNDERFILL EQUIPMENT & MATERIALS
Gryphics Inc.
SlimKIC 2000
ENVIRONMENTALLY FRIENDLY MATERIALS
REFLOW EQUIPMENT
THERMAL MANAGEMENT TECHNOLOGY
Aqueous Technologies Corp.
Tamura H.A. Systems Inc.
Dow Corning
Focus-Wash
FLIP - Flat Linear Induction Pump and
TC-5022
FLIP CHIP ATTACH EQUIPMENT & MATERIALS
PRO-MATION Inc.
WAFER DICING/THINNING EQUIPMENT
Pro-8 Laser Soldering System
DEK Printing Machines Ltd.
Datacon Technology AG 8800 FC Smart Line
Galaxy
SEMICONDUCTOR ASSEMBLY & TEST SERVICES (SATS)
HANDLING EQUIPMENT/FIXTURES
Kulicke & Soffa
WAFER-LEVEL PACKAGING EQUIPMENT & MATERIALS
Hover-Davis Inc.
Quatrix
Milara Inc.
DDf Ultra
SemiTouch Wafer Printer System (STW-I)
INSPECTION/IMAGING HANDLING
SPECIALIZED ADVANCED PACKAGING EQUIPMENT & MATERIALS
WIRE BONDING EQUIPMENT
August Technology Corp.
Tyco Electronics Automation Group
ASM Technology Ltd.
3Di All-Surfaces
Tyco RFID Line
Harrier
details available at www.apmag.com September 2005
www.apmag.com
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Two In a Row
for the world's most flexible Reel to Reel RFID Assembly system Tyco Electronics Automation Group has won two of the most prestigious industry awards back to back for their RFID assembly system.
• Throughput up to 9000 cph • Full 20" wide web process capability • 12 micron placement repeatability ± 3 sigma (process dependent) • Passive or active designs • Direct die pick from wafer down to .008" • Positive displacement dispense technology • Modular construction allowing for future capacity expansion • Fully capable of placing ancillary components such as
• Capable of tape and reel die placement • Full closed loop process control of individual thermodes including: • Lower thermode temperature • Upper thermode temperature • Fully adjustable thermode pressure • Fully programmable cycle timer • SPC data capture
batteries.
Technologies for tomorrow...available today. www.automation.tycoelectronics.com Contact us at
[email protected]; Phone: 215-657-6202; Fax: 215-657-6356; Tyco Electronics Corporation, Automation Group, Willow Grove, PA 19090. TYCO is a trademark.
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The Future Offers Choices. Offering Diverse Engineering and Automation Expertise “We are constantly looking for innovative ways to exceed the expectations of our customers” Custom Engineering ● Production Consulting ●
Application Analysis ● Turn-Key Integration ●
APS-1H Hybrid Module Assembly Systems
Flexible Service Agreements
●
Customized Training ● 24 Hour TechSupport ●
Automated PCB Depaneling
SMT Pick and Place Assemblers Tyco Electronics MPS-Series
Powerful SMT Software Solutions
Material Handling Systems The glue that holds it together...
PCB Insertion Equipment
Automated Selective Soldering Systems
Press-Fit Connectors
Discreet Reeled Press-Fit and thru-Hole Products
Mini-Wave & Multiple Wave Configurations
Tyco Electronics Automation Group www.automation.tycoelectronics.com TYCO is a trademark. Other trademarks used are the properties of their respective owners. Tyco Electronics Corporation, Automation Group, Willow Grove, PA 19090; Phone: 215-657-6202; Fax: 215-657-6356; E-mail:
[email protected]
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We Did It Again and again and again ...
...
(and again and again and again and again and again)!
New award-winning focus wash
Aqueous Technologies Corporation 9055 Rancho Park Court Rancho Cucamonga, CA 91730 USA U.S. & Canada: 1.800.218.8128 • World: 1.909.944.7771
[email protected] • www.aqueoustech.com
Aqueous Technologies introduces Focus-Wash, an exclusive (patent pending) spray technology that makes all other spray systems obsolete. Aqueous Technologies’ unique "Focus-Wash" spray system directs cleaning solution to all areas of the boards, including between and under components. The unique (patent pending) oscillating board rack and asymmetrical spray nozzle design produce millions of overlapping spray patterns, virtually eliminating shadowing. Focus-Wash produces more than five times the impact pressure of former models. The SMT Series cleaners are designed for fine-pitch, high density SMT assemblies. Focus-Wash is standard on all SMT-Series automatic de-fluxing systems
Aqueous Technologies has won an unpresidented 8 awards in 2 years—a record in this industry.
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WHY CUSTOMERS CHOOSE AQUEOUS TECHNOLOGIES Inline Format De-Fluxing Systems 4 Models to Choose From
2003 SMT Vision Award Winner
2003 AP Award Winner and 2003 SMT Vision Award Winner
Batch Format De-Fluxing Systems Nine Models to Choose From
UltraSonic Stencil Cleaning Systems Six Models to Choose From (Semi-Automatic and Fully Automatic)
Cleanliness Testing Systems Zero-Ion
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TWO AWARDS ARE ALWAYS BETTER THAN ONE
Hover-Davis wins two awards for their DDf Ultra direct die feeders Introducing our NEW DDf technology Active package-less SMDs at the wafer level are now a reality. Eliminate the cost associated with packaging trays and embossed tapes with a new form of component packaging: NONE! Recurring cumulative costs associated with high-volume packaging of components is staggering. The Hover-Davis DDf makes this cost a thing of the past! The new DDf technology from Hover-Davis crosses the threshold of a new era in electronics manufacturing. The DDf enables you to introduce wafer-level devices to your placement equipment and eliminate the costs associated with packaging. Imagine being able to deliver thousands of die per hour to your placement machine, while only three to four feeder slots are consumed.
Die-Attach Equipment & Materials Handling Equipment/Fixtures
World Leader in Component Delivery Systems © 2005, Hover-Davis. Hover-Davis and Direct Die Feeder are trademarks.
Visit us at www.hoverdavis.com/go/ddf for more information
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Amkor proudly accepts the 2005 Advanced Packaging Award for our innovative PSvfBGA package, which is an integral component of Package-on-Package (PoP) technology. PSvfBGA Amkor's PSvfBGA is a high-density logic-IC package that resides at the bottom of the PoP stack. The package reduces the routing density and component area required in the underlying motherboard, and thus forms an interconnect foundation for the entire PoP stack. The top of Amkor's package has a standard surface mount pad interface between the base logic and top memory components. The standard interface is designed to support a broad range of memory device combinations required for current and next generation products.
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8/26/05 1:06:18 PM
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36 years of assembly & test leadership Five million square feet of manufacturing space Turnkey solutions for wirebond and flip chip Factories strategically located throughout Asia Supporting the world’s leading semiconductor companies with • world class operational scope • the industry’s largest package design staff • an extensive portfolio of packaging and test technology • a worldwide sales and support organization
Enabling a Microelectronic World® www.amkor.com
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the new world of advanced packaging
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member of Besi group
Datacon Technology GmbH Innstr. 16, 6240 Radfeld, Austria Tel.: +43 5337 600-0, Fax: +43 5337 600-660
[email protected], www.datacon.at
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8/26/05 1:06:48 PM
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TECHNOLOGY WINS A WARDS
MILARA
WINS 4 V ISION A WARDS IN 2 Y EARS FOR THEIR SUPERIOR PRINTING TECHNOLOGY MILARA takes its combined system technology practice one step further with the development of the new SemiTouch Wafer Printer System (STW-1). Capable of both wafer stencil printing and bumping within a single system, the STW-1 is molded after Milara's standard SemiTouch printer but offers significant advantages, such as converting from wafter bumper to stencil printer in just seconds, at the press of a button. For ultra-fine-pitching printing (down to 70 m), STW-1 uses a new vision system with accuracies of 12 m and patented vibration squeegee technology that has proven viablity in wafter bumping. STW-1 offers 100 perfect printing reliability (no missed apertures on wafers with excess of 25,000 per print) and unsurpassed solder brick geometry.
MILARA HAS A MACHINE FOR ALL YOUR PCB AND PACKAGING APPLICATIONS
Milara Inc. 4 Marc Rd., Medway, MA, 02053 Contact Stephen Brodeur 508.533.5322 • Fax: 508.533.8686 • Email:
[email protected]
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PRINT AND BUMP WITH THE AWARD WINNING
MILARA SEMITOUCH WAFER PRINTING SYSTEM Milara now takes its combined system technology practice one step further with the development of the new SemiTouch Wafer Printer system (STW-1).The system is capable of both wafer stencil printing and bumping within a single system.The STW-1 is molded after Milara’s standard SemiTouch printer, but offers significant advantages. One important advantage is that by pressing a single button, the system converts itself from a wafer bumper to stencil printer in seconds. Milara has incorporated a new vision system with accuracies of 12 µm that yields capabilities of ultra-finepitch printing. Utilizing their patented vibration squeegee technology, which has proven viability in wafer bumping, the STW-1 employs the same technology to accomplish ultra-fine pitch-printing (down to 70 µm) with 100 percent printing reliability (no missed apertures on wafers with excess of 25,000 per print) in conjunction with unsurpassed solder brick geometry. MILARA HAS A MACHINE FOR ALL YOUR PCB AND PACKAGING APPLICATIONS
71 West Street, Medfield, MA 02652 508-359-2786 • Fax 508-359-5533 • Email:
[email protected]
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2
A D VA N C E D PAC K A G I N G A WA R D S
3-D PACKAGING TECHNOLOGY
Package Stackable BGA Amkor Technology’s Package Stackable very-thin fine-pitch Ball Grid Array (PSvfBGA) is a highdensity bottom package in a new JEDEC family
called Package on Package (PoP). PSvfBGA was developed to address complete product requirements to achieve optimum cost and performance. It eliminates the test, yield, and logistic obstacles with stacked die assembly, provides OEMs with full sourcing and product flexibility, and leads to the reduction of the development required for new device combinations. Amkor Technology, Chandler, Ariz., www.amkor.com.
widths. Features include a compact mold tool or chase, which can be changed frequently, and a pellet bowl feeding system that dispenses various epoxy molding pellet diameters at the turn of a knob. ASM Pacific Technology Ltd., Hong Kong, www.asmpacific.com.
ENVIRONMENTALLY FRIENDLY MATERIALS/SURFACE TREATMENT EQUIPMENT & MATERIALS
Batch Washer Focus-Wash is a combination of several wash methods that “focuses” the wash solution into
dispensing system, with needles for small dies and a shower head for large dies, offers fast, precise adhesive application, with two online cameras that monitor exact substrate adjustment and check for correct adhesive application. The dualhead flip chip bonding system ensures 8500-uph throughput with 25-µm at 3 ∑ process accura-
cy. The adhesive cures with a multi-thermode bond head, guaranteeing quick pitch change between 9.5 and 14.25 mm. Fully automatic covertape handling prevents thermode contamination by adhesive. Datacon Technology AG, Radfeld, Austria, www.datacon.at.
INSPECTION/IMAGING EQUIPMENT
Surface Inspection System
DIE ATTACH EQUIPMENT & MATERIALS/ HANDLING EQUIPMENT/FIXTURES
3Di All-Surfaces combines high accuracy and speed to increase bump yields. The system is able to inspect the front surface of wafers for patterned area 2-D defects such as passivation, excess residue, and missing, damaged, or satel-
Die Feeder The DDf Ultra feeds a wide range of bare die and flip chips with high throughput, and is mountable to most placement machines. As a complement to the DDf, the performance of DDf Ultra is optimized around the handling of small flip chips. The DDf Ultra is capable of feeding die down to 0.5 mm sq. with a throughput exceeding 6,000 die/ hour — with smaller die sizes and higher throughputs planned. Hover-Davis Inc., Rochester, N.Y., www.hover davis.com .
DISPENSING/ENCAPSULATION/ MOLDING/UNDERFILL EQUIPMENT & MATERIALS
FLIP CHIP ATTACH EQUIPMENT & MATERIALS
Molding System
The 8800 FC Smart Line interlinks three machine modules: the 8800 FC Smart Line Flip Chip Bonder with integrated dispenser, a curing station with integrated electrical testing, and an optical inspection and reject-marking unit. A dual-head
The Osprey system is fully programmable, eliminating product-related part (PRP) conversion. The robust, highly flexible indexing technology can handle 90- to 300-mm leadframe 46
ADVANCED PACKAGING
Advanced
smaller, higher-impact areas. Capabilities include a spray system with a 15° spray angle, increasing flow rate by approximately 60% to better reach between boards, and a spray arm that uses 10 nozzles arranged to create 10 concentric spray patterns. An oscillating board rack eliminates “blind spots” by creating infinite impingement angles. Multi-stage, high-performance spray pump designs optimize the pump/nozzle design to provide increased pump performance and efficiency. Aqueous Technologies Corp., Rancho Cucamonga, Calif., www.aqueoustech.com.
lite bumps. The system reports 3-D bump height at production speeds, and is able to measure the roughness of copper, gold, and solder bumps for morphology. It combines high throughput and high-accuracy bump and wafer inspection in one system. August Technology Corp., Bloomington, Minn., www.augusttech.com.
Flip Chip Production Line NOVEL PACKAGE DESIGN
Etched Leadless Package The etched leadless package, or ELP, package family is based on a patented technology that includes tight integration for an increased I/O
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A D VA N C E D PA C K AG I N G A W A R D S
count, reduced footprint to optimize board space, and features that enable electrical and thermal performance. It offers singulation that increases reliability at the die to package interconnects, improves saw blade life, and provides pre-singulation strip testing. The new package family has no exposed metal on the package sides, and the half-pattern leadframes ensure a robust assembly process. Advanced Interconnect Technologies, Sunnyvale, Calif., www.aitsales.com.
REFLOW EQUIPMENT
Induction Pump The flat linear induction pump (FLIP) solder bath for lead-free wave soldering solutions features linear induction pumping technology, in which three phases of AC current flow through induction coils to induce horizontal magnetic fields inside a solder bath. The magnetic fields generate vertical force (F) per Fleming’s left-
gy uses a single plane of contacts without moving parts to offer repeatable dimensional placement tolerance and electrical performance in meeting the most aggressive roadmaps for package tests. Advanced photolithography techniques result in precise, flexible contact geometries with 3- to 4µm repeatability. With lower touchdown force between the contacts and the package, Quatrix test sockets eliminate problems associated with
PACKAGE DESIGN SOFTWARE & EQUIPMENT
Bond Wire Software Tool The Bond Wire Optimizer is a stand-alone tool that calculates clearances of bond wires based on bond-wire profiles and X and Y die placement
hand law. The force moves molten solder upward through nozzles, which flows down by gravity. Tamura H.A. Systems Inc., Beaverton, Ore., www.tamura-ha.com. tolerances. Advanced features include capillary sequencing and capillary clearance checking tools. These tools are for pre-manufacturing error checking tools on the PC. CAD Design Software, Los Gatos, Calif., www.cad-design.com.
QUALITY ASSURANCE/ MANAGEMENT TOOLS
Process Development Tool The SlimKIC 2000 is designed to handle the higher process temperatures required by leadfree assemblies, protecting product quality as it is processed through the reflow process. The kit includes a stainless-steel thermal barrier that offers heat protection up to 350ºC, and medium
temperature thermocouples rated up to 400ºC. The optional KIC Auto-Focus provides the best “first guess” and automatic optimized oven setup for difficult lead-free applications. KIC, San Diego, Calif., www.kicthermal.com.
Laser Soldering System The PRO-8 inline soldering station features a 60W diode laser with a 10,000-hour life, a 4-axis Cartesian robot, a fiducial recognition system, an air knife and fume extraction on the soldering lens, an automated solder feeder, and an optional Micro Camera interfaced into a high-resolution panel for real-time viewing. The laser can be precisely controlled and is highly repeatable, providing a highly focused heating zone. Its process speed results yield solder-grain size reduction and intermetallic oxide formation. PRO-MATION Inc., Kenosha, Wis., www.pro-mation-inc.com.
SEMICONDUCTOR ASSEMBLY & TEST SERVICES (SATS)
Package Test Technology Developed as an alternative to traditional contactor methods using spring pins for test sockets, the Quatrix photolithographic package test technolo-
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SPECIALIZED ADVANCED PACKAGING EQUIPMENT & MATERIALS
RFID Assembly System Reel-to-reel RFID assembly system includes throughput up to 9,000 cph, a full, 20” wide Web process capability, and 12-µm placement repeatability at ± 3 sigma. The system offers
either passive or active design, direct die pick from wafers down to 0.008”, and positive displacement dispense technology. The system features modular construction, allowing for future capacity expansion. It is fully capable of placing ancillary components, such as batteries, and it also is capable of tape-and-reel die placement. It uses complete closed loop process control on the thermal compression station to ensure consistency of performance and high quality. The cure station also provides pressure control of each thermode, and real-time feedback pro-
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the high combined forces encountered in highpin-count applications for chips with high-density I/O. Kulicke & Soffa Industries Inc., Willow Grove, Pa., www.kns.com.
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user interface, IP-based access to DEK’s knowledge servers through Interactiv, and HawkEye on-board 100% print verification technology, it enables next-generation manufacturing, maximizes uptime, and reduces cost of ownership. DEK Printing Machines Ltd., Flemington, N.J., www.dek.com.
SUBSTRATE & SUBMOUNT EQUIPMENT & MATERIALS
Ball Placement System BP2000 provides dual motorized cameras attached to the pin transfer head, resulting in PR alignments on two fiducial marks of the BGA substrate before both flux and ball placement, so it will not severely affect cycle time. With alignment calculation, both the pin transfer head and
ball transfer head can correct its position with respect to the substrate position in the X, Y, and theta directions. ASM Pacific Technology Ltd., Hong Kong, www.asmpacific.com.
TESTING EQUIPMENT
Test Socket The new Long Life ATE Socket was designed and developed by Gryphics to provide a lower cost, yet high performance alternative to existing Test Sockets used for QFN, QFP, or SO style devices in an Automated High Volume Production environment. The unique design incorporates a polymer substrate populated wit high frequency test contacts snapped into place, facilitating easy removal and replacement of the contacts individually or as a group. Special features on the contacts have been designed to address the unique effects of lead free solders. Gryphics Inc., Plymouth, Minn., www.gryphics.com.
WAFER-LEVEL PACKAGING EQUIPMENT & MATERIALS
Wafer Printing System The SemiTouch wafer printer system (STW-1) is capable of both wafer stencil printing and bumping within a single system. One important
between the microprocessor package and its device-cooling heatsink and highly efficient transfer of heat away from the processor. It allows manufacturers to achieve low thermal resistance (0.07 cm2C/W) with thin bond lines (
