16FF_TSMC

Security C – TSMC Secret

TSMC Technology and Innovation Platform for Mobile Computing Henry y Hsieh Director, Field Technical Support November 2012 November,

© 2012 TSMC, Ltd

2

Agenda z TSMC Technology z Open Innovation PlatformTM z Mobile Computing from TSMC+ARM Collaboration

© 2012 2012 TSMC, Ltd Ltd © 2011 TSMC,

Security C – TSMC Secret

3

TSMC Technology Roadmap

High Performance

Security C – TSMC Secret

Technology for SoC and Mobile Computing

CLN65/ CLN65/ 55GP

CLN28HP (HKMG)

CLN40G CLN28HPM (HKMG)

CLN20SOC ( ) (Planar)

CLN16FF (FinFET FinFET))

CLN10FF (FinFET FinFET))

CLN65/55LP

Low P Power

CLN28HPL (HKMG) CLN45/40LP CLN28LP (SiON SiON)) CLN40LPG

Production

2013

2014

Box left edge: risk production. Right edge: no meaning 10nm preliminary subject to change

© 2012 2012 TSMC, Ltd Ltd © 2011 TSMC,

2015

2016

4

Complete p Solutions to Cover Various Product Applications Server Networking

28HPM/HP PC

P Performa ance

Tablet

Game Console DTV

Smartphone

Portable game Wi l Wireless Digital Camera eBook PMP

28LP/HPL Total Power

© 2012 2012 TSMC, Ltd Ltd © 2011 TSMC,

Security C – TSMC Secret

5

N28 Tape Tape-Out Out and Production Status z Fast 28nm adoption p by y tape-out p #

Security C – TSMC Secret

TSMC FAB12

TSMC FAB15

z 28nm volume ramp since Q4’11 Q4 11

© 2012 2012 TSMC, Ltd Ltd © 2011 TSMC,

„

>220K production wafers have been shipped to customers

„

28nm accounted for 13% of total wafer revenues in Q3 Q3’12 12

„

Both F12 and F15 giga-fabs to support 28nm production

6

N20SoC Highlights

Security C – TSMC Secret

z N20SoC: A superior p planar p CMOS for mobile computing p g „

High performance devices with 2nd generation gate-last HKMG

„

Advanced interconnect with 64nm pitch

„

Double Patterning allows 1.9X gate density improvement from 28nm Î 20nm

z Multiple Customers/IPs verified on N20 test chips z On track for risk production with good yield z EDA/Foundation IP ready and available z Open Innovation Platform enabled the same level of scaling as the past nodes

© 2012 2012 TSMC, Ltd Ltd © 2011 TSMC,

7

An Ecosystem for Innovation Customer Product Roadmap

Design Service

Security C – TSMC Secret

Mask Making / OPC

Process Definition

Wafer Fabrication

Design Enablement

Customer Tape-out

Design Productization

EDA Enablement

Backend Service Test Chip Validation IP Enablement

© 2012 2012 TSMC, Ltd Ltd © 2011 TSMC,

Customer Product Launch

8

TSMC’s OIP Makes It Happen

OIP Ecosystem Partners

$1.5B/ Year TSMC Design Enablement Team

© 2012 2012 TSMC, Ltd Ltd © 2011 TSMC,

Security C – TSMC Secret

9

OIP Is In the ARM Connected Community

Security C – TSMC Secret

TSMC Open Innovation Platform (OIP)

ICC Incubation Centers of China

© 2012 2012 TSMC, Ltd Ltd © 2011 TSMC,

10

Better Life Drives Innovation Future PC

Security C – TSMC Secret

Human-Centric

Tablet/Ultrabook DT/NB

Perform mance

>3.5GHz >2.5GHz 2GHz

Future Phone

Smart phone

Basic Phone >2.5G Hz >1.5G Hz 300 MHz

Glassless 3D 4096 x 2048p Full HD 1920 x 1080p CRT TV SD 720 x 480i

1G Hz

40nm 28nm 40nm,

© 2012 2012 TSMC, Ltd Ltd © 2011 TSMC,

2G Hz

20SoC 16FinFET 20SoC,

Mobile

Visual

11

User Experience Drives Ubiquity

Security C – TSMC Secret

Anytime, Anywhere, Any Device Notebook Smart TV

Smartphone

Cloud Computing

CPU/GPU High-end BB/AP Mainstream AP

Tablet Desktop Automotive © 2012 2012 TSMC, Ltd Ltd © 2011 TSMC,

12

Mobile Computing Drives Technology and CPU/GPU C /G Advancement

Security C – TSMC Secret

z Higher speed at fixed power budget z Technology migration to enable a wider product dynamic range

65nm

Tablet + Dock =Notebook

28nm

Power (mW/core))

Tablet

40/45nm

Power Budget 20nm, 16FF

500

Smartphone

© 2012 2012 TSMC, Ltd Ltd © 2011 TSMC,

1,000

1,500

2,000

S Speed d (MHz) (MH )

2,500

3,000

13

Soft-IP Alliance Program g

Security C – TSMC Secret

Now Soft-IP Partners

Past Low Interaction

Soft-IP Partners

• Technology file • Enhanced libs • TSMC9000 QA

Tech Optimized IP

TSMC TSMC

Customer

ARMCustomer joins TSMC’s Soft-IP Alliance. Optimized design Faster Tape-out

z 10+ IP providers have assessed their RTL IP via the TSMC 9000 IP program z Soft-IP Kit 2.0 launched on Oct 16th z ARM jjoins TSMC’s Soft-IP Alliance © 2012 2012 TSMC, Ltd Ltd © 2011 TSMC,

14

ARM Cortex Cortex-A9 A9 POP for TSMC 28HPM

© 2012 2012 TSMC, Ltd Ltd © 2011 TSMC,

Security C – TSMC Secret

15

Maximize Performance Envelope p via TSMC 16FF & ARM V8 Collaboration ARM v8 CPU @ 16FinFET

Relative Perforrmance

2

A15 @ 20SoC

1.5

A9 @ 28HPM

Power Constrained @ 750mW

1

2011

© 2012 2012 TSMC, Ltd Ltd © 2011 TSMC,

2012

2013

Security C – TSMC Secret

16

Long g History y of TSMC+ARM Leadership p

© 2012 2012 TSMC, Ltd Ltd © 2011 TSMC,

Security C – TSMC Secret

17

Summary z Mobile Computing p g drives innovations and advanced technologies z TSMC Open Innovation Platform is the 1st ecosystem for 28nm volume production z Early partnership and co-optimization with ARM and lead customers to improve time to market and maximize the benefits

© 2012 2012 TSMC, Ltd Ltd © 2011 TSMC,

Security C – TSMC Secret